| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438760000 | Utilizing reflow (e.g., planarization, etc.) | 7 |
| 20090203220 | Method for Reducing an Unevenness of a Surface and Method for Making a Semiconductor Device - In order to reduce an unevenness of a surface of a body, a sacrificial layer is applied to the surface, a chemical-mechanical polishing of the sacrificial layer and material of said body is performed to reduce the unevenness of the surface, and a remainder of the sacrificial layer, if any, may be removed. | 08-13-2009 |
| 20110212627 | Low Temperature Dielectric Flow Using Microwaves - Semiconductor devices and methods for making such devices are described. The semiconductor devices contain dielectric layers that have been deposited and/or flowed by the application of microwave energy (“MW dielectric layers”). The dielectric layers can be made by providing a substrate in a reaction chamber, flowing a precursor gas mixture (containing atoms that react to form a dielectric material) in the reaction chamber, and then subjecting the gas mixture to microwave energy at a frequency and power density sufficient to cause the atoms of the precursor gas mixture to react and deposit to form a dielectric layer on the substrate. As well, the devices can be made by applying microwave energy to an already-deposited dielectric film at a frequency and power density sufficient to cause the atoms of the deposited dielectric material to flow. Using microwave energy permits the dielectric layer to be formed using low temperature processing, providing several benefits to the semiconductor device along with process flow efficiency and low cost. Other embodiments are described. | 09-01-2011 |
| 20130196514 | OFF-ANGLED HEATING OF THE UNDERSIDE OF A SUBSTRATE USING A LAMP ASSEMBLY - Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed. | 08-01-2013 |
| 20140273509 | Method and Apparatus for Planarization of Substrate Coatings - Disclosed herein is a method of forming a coating, comprising applying a first coating to a substrate having a plurality of topographical features, planarizing a top surface of the first coating, and drying the coating after planarizing the top surface of the first coating. The first coating may be applied over the plurality of topographical features, and substantially liquid during application. The first coating may optionally be a conformal coating over topographical features of the substrate. The conformal coating may be dried prior to planarizing the top surface of the first coating and a solvent applied to the conformal coating, with the top surface of the conformal coating being substantially planar after application of the solvent. The coating may have a planar surface prior to the drying the first coating and the first coating may be dried without substantial spin-drying by modifying an environment of the first coating. | 09-18-2014 |
| 20160111275 | COMPOSITIONS OF LOW-K DIELECTRIC SOLS CONTAINING NONMETALLIC CATALYSTS - A sol composition for producing a porous low-k dielectric material is provided. The composition can include at least one silicate ester, a polar solvent, water, an acid catalyst for silicate ester hydrolysis, an amphiphilic block copolymer surfactant, and a nonmetallic catalyst that reduces dielectric constant in the produced material. The composition can further include a metallic ion at a lower parts-per-million concentration than the nonmetallic catalyst, and/or the composition can further include a cosolvent. A method of preparing a thin film on a substrate using the sol composition is also provided. | 04-21-2016 |
| 20180023192 | COMPOSITIONS AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAINING FILMS | 01-25-2018 |
| 20180025908 | MONOLAYER FILM MEDIATED PRECISION FILM DEPOSITION | 01-25-2018 |
