Class / Patent application number | Description | Number of patent applications / Date published |
438157000 | Plural gate electrodes (e.g., dual gate, etc.) | 79 |
20080206937 | WRAP-AROUND GATE FIELD EFFECT TRANSISTOR - A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces. | 08-28-2008 |
20080213950 | Array substrate for a liquid crystal display and method for fabricating thereof - An array substrate for a liquid crystal display device includes a substrate, a plurality of thin film transistors formed on the substrate, each thin film transistor includes a gate electrode, a first gate insulation layer, a second gate insulation layer, an active layer, an ohmic contact layer, a source electrode and a drain electrode, a plurality of gate lines, a plurality of data lines disposed orthogonal to the plurality of gate lines, a plurality of pixel electrodes disposed at pixel regions defined by intersections of the plurality of gate lines and the plurality of data lines, each pixel electrode electrically contacting each drain electrode of the plurality of thin film transistors, and a plurality of storage capacitors each including a portion of each gate line as a first capacitor electrode, the first gate insulation layer as a dielectric layer, and a capacitor electrode electrically communicating with each pixel electrode and functioning as a second capacitor electrode with a portion of each pixel electrode. | 09-04-2008 |
20080305588 | Nand-type semiconductor storage device and method for manufacturing same - According to this invention, there is provided a NAND-type semiconductor storage device including a semiconductor substrate, a semiconductor layer formed on the semiconductor substrate, a buried insulating film selectively formed between the semiconductor substrate and the semiconductor layer in a memory transistor formation region, diffusion layers formed on the semiconductor layer in the memory transistor formation region, floating body regions between the diffusion layers, a first insulating film formed on each of the floating body regions, a floating gate electrode formed on the first insulating film, a control electrode on a second insulating film formed on the floating gate electrode, and contact plugs connected to ones of the pairs of diffusion layers which are respectively located at ends of the memory transistor formation region, wherein the ones of the pairs of diffusion layers, which are located at the ends of the memory transistor formation region, are connected to the semiconductor substrate below the contact plugs. | 12-11-2008 |
20090017584 | PROCESS FOR FINFET SPACER FORMATION - A process for finFET spacer formation generally includes depositing, in order, a conformnal liner material, a conformal spacer material, and a conformal capping material onto the finFET structure; tilt implanting dopant ions into portions of the capping layer about the gate structure; selectively removing undoped capping material about the source and drain regions; selectively removing exposed portions of the spacer material; selectively removing exposed portions of the capping material; anisotropically removing a portion of the spacer material so as to expose a top surface of the gate material and isolate the spacer material to sidewalls of the gate structure; and removing the oxide liner from the fin to form the spacer on the finFET structure. | 01-15-2009 |
20090061572 | NONPLANAR SEMICONDUCTOR DEVICE WITH PARTIALLY OR FULLY WRAPPED AROUND GATE ELECTRODE AND METHODS OF FABRICATION - A nonplanar semiconductor device and its method of fabrication is described. The nonplanar semiconductor device includes a semiconductor body having a top surface opposite a bottom surface formed above an insulating substrate wherein the semiconductor body has a pair laterally opposite sidewalls. A gate dielectric is formed on the top surface of the semiconductor body on the laterally opposite sidewalls of the semiconductor body and on at least a portion of the bottom surface of semiconductor body. A gate electrode is formed on the gate dielectric, on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of semiconductor body and beneath the gate dielectric on the bottom surface of the semiconductor body. A pair source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode. | 03-05-2009 |
20090075439 | MICROELECTRONIC STRUCTURE BY SELECTIVE DEPOSITION - A finFET structure includes a semiconductor fin located over a substrate. A gate electrode is located traversing the semiconductor fin. The gate electrode has a spacer layer located adjoining a sidewall thereof. The spacer layer does not cover completely a sidewall of the semiconductor fin. The gate electrode and the spacer layer may be formed using a vapor deposition method that provides for selective deposition upon a sidewall of a mandrel layer but not upon an adjoining surface of the substrate so that the spacer layer does not cover completely the sidewall of the semiconductor fin. Other microelectronic structures may be fabricated using the lateral growth methodology. | 03-19-2009 |
20090081835 | Non-Volatile Memory Devices and Methods of Forming the Same - A non-volatile memory device includes an upwardly protruding fin disposed on a substrate and a control gate electrode crossing the fin. A floating gate is interposed between the control gate electrode and the fin and includes a first storage gate and a second storage gate. The first storage gate is disposed on a sidewall of the fin, and the second storage gate is disposed on a top surface of the fin and is connected to the first storage gate. A first insulation layer is interposed between the first storage gate and the sidewall of the fin, and a second insulation layer is interposed between the second storage gate and the top surface of the fin. The second insulation layer is thinner than the first insulation layer. A blocking insulation pattern is interposed between the control gate electrode and the floating gate. | 03-26-2009 |
20090148986 | METHOD OF MAKING A FINFET DEVICE STRUCTURE HAVING DUAL METAL AND HIGH-K GATES - A method of making a FinFET device structure, includes: providing a semiconductor-on-insulator (SOI) substrate having a semiconductor layer on an insulating layer on a base (e.g., semiconductor) layer; forming a cap layer (e.g., silicon nitride) on the SOI substrate; forming, on the insulating layer, first and second semiconductor fins with a first cap layer on the first fin and a second cap layer on the second fin; providing a first high-k dielectric layer across the first and the second cap layers and the first and second fins; providing a first metal layer onto the first high-k dielectric layer; providing a first semiconductor layer onto the first metal layer; removing the first semiconductor layer, the first metal layer, and the first high-k dielectric layer from the second cap layer, the second fin and from regions adjacent to the second fin; providing a second high-k dielectric layer onto the second cap layer, the second fin and a portion of the first metal layer; providing a second metal layer onto the second high-k dielectric layer, the second metal layer having a composition different than the first metal layer; providing a second semiconductor layer onto the second metal layer in a region above the second cap layer and into the regions adjacent to the second fin; removing the second semiconductor layer from the second metal layer in the region above the second cap layer, from adjoining regions and from the regions adjacent to the second fin; removing the second metal layer and the second high-k dielectric layer from a region above the first cap layer and from adjoining regions above the first semiconductor layer; removing the first metal layer, the first high-k dielectric layer, the first semiconductor layer, the second metal layer, the second high-k dielectric layer and the second semiconductor layer from regions above a plane containing top surfaces of the first and the second cap layers; forming first and second gates; forming respective source and drain regions within portions of the first and the second fins adjacent to the first and second gates, and then removing portions of the first and the second semiconductor layers, the first and the second high-k dielectric layers and the first and the second metal layers from a medial region between the first and the second fins. | 06-11-2009 |
20090162981 | THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME - A thin film transistor and a method of manufacturing the same are provided. The thin film transistor includes a substrate; a buffer layer formed on the substrate; a source and a drain spaced apart from each other on the buffer layer; a channel layer formed on the buffer layer to connect the source and the drain with each other; and a gate formed on the buffer layer to be spaced apart from the source, the drain and the channel layer. | 06-25-2009 |
20090191672 | Method for production of thin-film semiconductor device - Disclosed herein is a method for production of a thin-film semiconductor device which includes, a first step to form a gate electrode on a substrate, a second step to form a gate insulating film of silicon oxynitride on the substrate in such a way as to cover the gate electrode, a third step to form a semiconductor thin film on the gate insulating film, and a fourth step to perform heat treatment in an oxygen-containing oxidizing atmosphere for modification through oxygen binding with oxygen-deficient parts in the silicon oxynitride film constituting the gate insulating film. | 07-30-2009 |
20090239342 | Thin Film Transistor Substrate of Horizontal Electric Field Type Liquid Crystal Display Device and Fabricating Method Thereof - A thin film transistor substrate of horizontal electric field type includes: a gate line and a first common line formed on a substrate to be in parallel to each other; a data line crossing the gate line and the first common line with a gate insulating film therebetween to define a pixel area; a second common line crossing the first common line having the gate insulating film therebetween; a thin film transistor connected to the gate line and the data line; a common electrode extending from the second common line in said pixel area; a pixel electrode that is parallel to the common electrode and the second common line; a protective film for covering the thin film transistor; a gate pad having a lower gate pad electrode connected to an upper gate pad electrode through a first contact hole; a common pad having a lower common pad electrode connected to an upper common pad electrode through a second contact hole; and a data pad having a lower data pad electrode connected to an upper data pad electrode provided within a third contact hole. | 09-24-2009 |
20100075473 | Transistor Forming Methods - A transistor forming method includes forming a dielectric spacer in a trench surrounding an active area island, forming line openings through the spacer, and forming a gate line extending through the line openings, over opposing sidewalls, and over a top of the fin. Source/drain regions are in the fin. Another method includes forming an interlayer dielectric over areas of the fin intended for source/drain regions, forming contact openings through the interlayer dielectric, and forming a source/drain plug in contact with an exposed portion of the spacer and in electrical connection with the top, one of opposing endwalls, and both of the opposing sidewalls of the fin. | 03-25-2010 |
20100136754 | THIN FILM TRANSISTOR AND METHOD OF FABRICATING THIN FILM TRANSISTOR SUBSTRATE - Provided are a thin film transistor (TFT) capable of increasing ON current and decreasing OFF current values, a TFT substrate having the polysilicon TFT, a method of fabricating the polysilicon TFT, and a method of fabricating a TFT substrate having the polysilicon TFT. The polysilicon TFT substrate includes a gate line and a data line defining a pixel region, a pixel electrode formed in the pixel region, and a TFT including a gate electrode connected to the gate line, a source electrode connected to the data line, a drain electrode connected to the pixel electrode, and a polysilicon active layer forming a channel between the source and drain electrodes. The polysilicon active layer includes a channel region on which the gate electrode is superposed, source and drain regions connected to the source and drain electrode, respectively, and at least two lightly doped drain (LDD) regions y formed between the source region and the channel region and between the drain region and the channel region. The LDD regions have an impurity concentration different from each other. | 06-03-2010 |
20100159651 | METHOD OF FORMING NANOCRYSTALS - Nanocrystals are formed over an insulating layer by depositing a semiconductor layer over the insulating layer. The semiconductor layer is annealed to form a plurality of globules from the semiconductor layer. The globules are annealed using oxygen. Semiconductor material is deposited on the plurality of globules to add semiconductor material to the globules. After depositing the semiconductor material, the globules are annealed to form the nanocrystals. The nanocrystals can then be used in a storage layer of a non-volatile memory cell, especially a split-gate non-volatile memory cell having a select gate over the nanocrystals and a control gate adjacent to the select gate. | 06-24-2010 |
20100167475 | SEMICONDUCTOR DEVICE AND PRODUCING METHOD THEREOF - A semiconductor device manufacturing method includes forming a fin region over a substrate, forming a dummy gate electrode over the fin region, forming a first insulating film over the dummy gate electrode and the fin region, polishing the first insulating film until the dummy gate electrode is exposed, removing part of the exposed dummy gate electrode to form a trench, forming a gate insulator over the surface of the fin region exposed in the trench, and forming a gate electrode over the gate insulator. | 07-01-2010 |
20100184261 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - There is provided a semiconductor device including: convex semiconductor layers formed on a semiconductor substrate via an insulating film; gate electrodes formed on a pair of facing sides of the semiconductor layers via a gate insulating film; a channel region formed of silicon between the gate electrodes in the semiconductor layers; a source extension region and a drain extension region formed of silicon germanium or silicon carbon on both sides of the channel region in the semiconductor layers; and a source region formed of silicon so as to adjoin to the opposite side of the channel region in the source extension region, and a drain region formed of silicon so as to adjoin to the opposite side of the channel region in the drain extension region in the semiconductor layers. | 07-22-2010 |
20100323481 | SYSTEMS AND DEVICES INCLUDING MULTI-GATE TRANSISTORS AND METHODS OF USING, MAKING, AND OPERATING THE SAME - Disclosed are methods of forming transistors. In one embodiment, the transistors are formed by forming a plurality of elliptical bases in a substrate and forming fins form the elliptical bases. The transistors are formed within the fin such that they may be used as access devices in a memory array. | 12-23-2010 |
20110111565 | DUAL GATE FINFET - A circuit has a fin supported by a substrate. A source is formed at a first end of the fin and a drain is formed at a second end of the fin. A pair of independently accessible gates are laterally spaced along the fin between the source and the drain. Each gate is formed around approximately three sides of the fin. | 05-12-2011 |
20110171792 | BACK-GATED FULLY DEPLETED SOI TRANSISTOR - A fully depleted semiconductor-on-insulator (FDSOI) transistor structure includes a back gate electrode having a limited thickness and aligned to a front gate electrode. The back gate electrode is formed in a first substrate by ion implantation of dopants through a first oxide cap layer. Global alignment markers are formed in the first substrate to enable alignment of the front gate electrode to the back gate electrode. The global alignment markers enable preparation of a virtually flat substrate on the first substrate so that the first substrate can be bonded to a second substrate in a reliable manner. | 07-14-2011 |
20110318888 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device comprises the steps of forming a seed over the insulating film by introducing hydrogen and a deposition gas into a first treatment chamber under a first condition and forming a microcrystalline semiconductor film over the seed by introducing hydrogen and the deposition gas into a second treatment chamber under a second condition: a second flow rate of the deposition gas is periodically changed between a first value and a second value; and a second pressure in the second treatment chamber is higher than or equal to 1.0×10 | 12-29-2011 |
20120021570 | METHOD FOR FORMING MICROCRYSTALLINE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A seed crystal including mixed phase grains having high crystallinity with a low grain density is formed under a first condition, and a microcrystalline semiconductor film is formed over the seed crystal under a second condition which allows the mixed phase grains in the seed crystal to grow to fill a space between the mixed phase grains. In the first condition, the flow rate of hydrogen is 50 times or greater and 1000 times or less that of a deposition gas containing silicon or germanium, and the pressure in a process chamber is greater than 1333 Pa and 13332 Pa or less. In the second condition, the flow rate of hydrogen is 100 times or greater and 2000 times or less that of a deposition gas containing silicon or germanium, and the pressure in the process chamber is 1333 Pa or greater and 13332 Pa or less. | 01-26-2012 |
20120064677 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device with fewer masks and in a simple process. A gate electrode is formed. A gate insulating film, a semiconductor film, an impurity semiconductor film, and a conductive film are stacked in this order, covering the gate electrode. A source electrode and a drain electrode are formed by processing the conductive film. A source region, a drain region, and a semiconductor layer, an upper part of a portion of which does not overlap with the source region and the drain region is removed, are formed by processing the upper part of the semiconductor film, while the impurity semiconductor film is divided. A passivation film over the gate insulating film, the semiconductor layer, the source region, the drain region, the source electrode, and the drain electrode are formed. An etching mask is formed over the passivation film. At least the passivation film and the semiconductor layer are processed to have an island shape while an opening reaching the source electrode or the drain electrode is formed, with the use of the etching mask. The etching mask is removed. A pixel electrode is formed over the gate insulating film and the passivation film. | 03-15-2012 |
20120100674 | SEMICONDUCTOR STRUCTURE AND METHODS OF MANUFACTURE - FinFET end-implanted-semiconductor structures and methods of manufacture are disclosed herein. The method includes forming at least one mandrel on a silicon layer of a substrate comprising an underlying insulator layer. The method further includes etching the silicon layer to form at least one silicon island under the at least one mandrel. The method further includes ion-implanting sidewalls of the at least one silicon island to form doped regions on the sidewalls. The method further includes forming a dielectric layer on the substrate, a top surface of which is planarized to be coplanar with a top surface of the at least one mandrel. The method further includes removing the at least one mandrel to form an opening in the dielectric layer. The method further includes etching the at least one silicon island to form at least one fin island having doped source and drain regions. | 04-26-2012 |
20120115284 | METHOD FOR MANUFACTURING MULTI-GATE TRANSISTOR DEVICE - A method for manufacturing a multi-gate transistor device includes providing a semiconductor substrate having a first patterned semiconductor layer formed thereon, sequentially forming a gate dielectric layer and a gate layer covering a portion of the first patterned semiconductor layer on the semiconductor substrate, removing a portion of the first patterned semiconductor layer to form a second patterned semiconductor layer, and performing a selective epitaxial growth process to form an epitaxial layer on a surface of the second patterned semiconductor layer. | 05-10-2012 |
20120115285 | METHOD FOR FORMING MICROCRYSTALLINE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A seed crystal which includes mixed phase grains including an amorphous silicon region and a crystallite which is a microcrystal that can be regarded as a single crystal is formed on an insulating film by a plasma CVD method under a first condition that enables mixed phase grains having high crystallinity and high uniformity of grain sizes to be formed at a low density, and then a microcrystalline semiconductor film is formed to be stacked on the seed crystal by a plasma CVD method under a second condition that enables the mixed phase grains to grow to fill a space between the mixed phase grains. | 05-10-2012 |
20120129303 | METHODS FOR MANUFACTURING PASSIVATION LAYER AND THIN FILM TRANSISTOR ARRAY SUBSTRATE - The present invention provides methods for manufacturing a passivation layer and a thin film transistor (TFT) array substrate. The method for manufacturing the passivation layer comprises the following steps: placing a substrate in a vacuum process chamber; providing an ammonia gas and a nitrogen gas into the vacuum process chamber; forming plasma and evaporating water vapor; and forming the passivation layer on the substrate. The method for manufacturing the passivation layer can be applicable to the method for manufacturing the TFT array substrate. The present invention can enhance the quality of the passivation layer. | 05-24-2012 |
20120129304 | FIN-TYPE FIELD EFFECT TRANSISTOR - Disclosed herein are improved fin-type field effect transistor (FinFET) structures and the associated methods of manufacturing the structures. In one embodiment FinFET drive current is optimized by configuring the FinFET asymmetrically to decrease fin resistance between the gate and the source region and to decrease capacitance between the gate and the drain region. In another embodiment device destruction at high voltages is prevented by ballasting the FinFET. Specifically, resistance is optimized in the fin between the gate and both the source and drain regions (e.g., by increasing fin length, by blocking source/drain implant from the fin, and by blocking silicide formation on the top surface of the fin) so that the FinFET is operable at a predetermined maximum voltage. | 05-24-2012 |
20120184073 | PROGRAMMABLE HIGH-K/METAL GATE MEMORY DEVICE - A method of fabricating a memory device is provided that may begin with forming a layered gate stack atop a semiconductor substrate and patterning a metal electrode layer stopping on the high-k gate dielectric layer of the layered gate stack to provide a first metal gate electrode and a second metal gate electrode on the semiconductor substrate. In a next process sequence, at least one spacer is formed on the first metal gate electrode atop a portion of the high-k gate dielectric layer, wherein a remaining portion of the high-k gate dielectric is exposed. The remaining portion of the high-k gate dielectric layer is etched to provide a first high-k gate dielectric having a portion that extends beyond a sidewall of the first metal gate electrode and a second high-k gate dielectric having an edge that is aligned to a sidewall of the second metal gate electrode. | 07-19-2012 |
20120238061 | Methods Of Forming Transistors, And Methods Of Forming Memory Arrays - Some embodiments include methods of forming vertical transistors. A construction may have a plurality of spaced apart fins extending upwardly from a semiconductor substrate. Each of the fins may have vertical transistor pillars, and each of the vertical transistor pillars may have a bottom source/drain region location, a channel region location over the bottom source/drain region location, and a top source/drain region location over the channel region location. Electrically conductive gate material may be formed along the fins while using oxide within spaces along the bottoms of the fins to offset the electrically conductive gate material to be above the bottom source/drain region locations of the vertical transistor pillars. The oxide may be an oxide which etches at a rate of at least about 100 Å/minute with dilute HF at room temperature. In some embodiments the oxide may be removed after the electrically conductive gate material is formed. | 09-20-2012 |
20120329217 | Nanowire Field Effect Transistors - A method for forming a nanowire field effect transistor (FET) device including forming a first silicon on insulator (SOI) pad region, a second SOI pad region, a third SOI pad region, a first SOI portion connecting the first SOI pad region to the second SOI pad region, and a second SOI portion connecting the second SOI pad region to the third SOI pad region on a substrate, patterning a first hardmask layer over the second SOI portion, forming a first suspended nanowire over the semiconductor substrate, forming a first gate structure around a portion of the first suspended nanowire, patterning a second hardmask layer over the first gate structure and the first suspended nanowire, removing the first hardmask layer, forming a second suspended nanowire over the semiconductor substrate, forming a second gate structure around a portion of the second suspended nanowire, and removing the second hardmask layer. | 12-27-2012 |
20130023092 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method of manufacturing a semiconductor device including forming a first SiGe layer on an insulating film, processing the first SiGe layer to have an island shape which includes a first region and a second region, the first region having a width larger than a width of the second region in a direction perpendicular to a connecting direction of the second region, subjecting the first SiGe layer having the island shape to thermal oxidation, thereby increasing Ge composition of the first and second region, and setting the Ge composition of the second region to be higher than the Ge composition of the first region, melting the second region having the increased Ge composition by heat treatment, and recrystallizing the melted second region from an interface between the first and second region. | 01-24-2013 |
20130095616 | METHOD FOR MANUFACTURING MULTI-GATE TRANSISTOR DEVICE - A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer. | 04-18-2013 |
20130102116 | HYBRID INTEGRATED SEMICONDUCTOR TRI-GATE AND SPLIT DUAL-GATE FINFET DEVICES AND METHOD FOR MANUFACTURING - A method for making a tri-gate FinFET and a dual-gate FinFET includes providing a semiconductor on insulator (SOI) wafer having a semiconductor layer over an insulator layer. The method further includes forming a hard mask on the semiconductor layer and patterning the hard mask to form first and second cap portions. The method also includes etching the semiconductor layer to form first and second fins using the first and second cap portions as an etch mask. The method also includes removing the second cap portion to expose the top surface of the second fin and forming a gate dielectric layer on the first and second fins. The method further includes forming a conductive layer over the gate dielectric layer, selectively etching the conductive layer to form first and second gate structures, forming an interlayer dielectric layer over the gate structures, and planarizing the interlayer dielectric layer using the first cap portion as a polish stop. | 04-25-2013 |
20130178022 | METHOD FOR FABRICATING TRANSISTOR WITH RECESSED CHANNEL AND RAISED SOURCE/DRAIN - A method is provided for fabricating a transistor. According to the method, a second semiconductor layer is formed on a first semiconductor layer, and a dummy gate structure is formed on the second semiconductor layer. A gate spacer is formed on sidewalls of the dummy gate structure, and the dummy gate structure is removed to form a cavity. The second semiconductor layer beneath the cavity is removed. A gate dielectric is formed on the first portion of the first semiconductor layer and adjacent to the sidewalls of the second semiconductor layer and sidewalls of the gate spacer. A gate conductor is formed on the first portion of the gate dielectric and abutting the second portion of the gate dielectric. Raised source/drain regions are formed in the second semiconductor layer, with at least part of the raised source/drain regions being below the gate spacer. | 07-11-2013 |
20130230949 | EMBEDDED DRAM FOR EXTREMELY THIN SEMICONDUCTOR-ON-INSULATOR - A node dielectric and a conductive trench fill region filling a deep trench are recessed to a depth that is substantially coplanar with a top surface of a semiconductor-on-insulator (SOI) layer. A shallow trench isolation portion is formed on one side of an upper portion of the deep trench, while the other side of the upper portion of the deep trench provides an exposed surface of a semiconductor material of the conductive fill region. A selective epitaxy process is performed to deposit a raised source region and a raised strap region. The raised source region is formed directly on a planar source region within the SOI layer, and the raised strap region is formed directly on the conductive fill region. The raised strap region contacts the raised source region to provide an electrically conductive path between the planar source region and the conductive fill region. | 09-05-2013 |
20130309820 | Floating Body Cell Structures, Devices Including Same, and Methods for Forming Same - Floating body cell structures including an array of floating body cells disposed on a back gate and source regions and drain regions of the floating body cells spaced apart from the back gate. The floating body cells may each include a volume of semiconductive material having a channel region extending between pillars, which may be separated by a void, such as a U-shaped trench. The floating body cells of the array may be electrically coupled to another gate, which may be disposed on sidewalls of the volume of semiconductive material or within the void therein. Methods of forming the floating body cell devices are also disclosed. | 11-21-2013 |
20140017859 | METHOD FOR FABRICATING TRANSISTOR WITH RECESSED CHANNEL AND RAISED SOURCE/DRAIN - A method is provided for fabricating a transistor. According to the method, a second semiconductor layer is formed on a first semiconductor layer, and a dummy gate structure is formed on the second semiconductor layer. A gate spacer is formed on sidewalls of the dummy gate structure, and the dummy gate structure is removed to form a cavity. The second semiconductor layer beneath the cavity is removed. A gate dielectric is formed on the first portion of the first semiconductor layer and adjacent to the sidewalls of the second semiconductor layer and sidewalls of the gate spacer. A gate conductor is formed on the first portion of the gate dielectric and abutting the second portion of the gate dielectric. Raised source/drain regions are formed in the second semiconductor layer, with at least part of the raised source/drain regions being below the gate spacer. | 01-16-2014 |
20140065774 | EMBEDDED PLANAR SOURCE/DRAIN STRESSORS FOR A FINFET INCLUDING A PLURALITY OF FINS - Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins. | 03-06-2014 |
20140087526 | MULTI-GATE FIELD EFFECT TRANSISTOR DEVICES - A method for fabricating a field effect transistor device includes patterning a semiconductor fin on a substrate insulator layer, the substrate insulator layer arranged on a substrate, patterning a dummy gate stack over a portion of the fin, forming spacers adjacent to the dummy gate stack, removing the dummy gate stack to form a cavity that exposes portions of the substrate insulator layer and the fin, removing exposed portions of the substrate insulator layer to increase a depth of the cavity, removing a region of the substrate insulator layer from beneath the fin to suspend a portion of the fin above the substrate insulator layer, forming a gate stack in the cavity, removing a portion of the gate stack in the cavity to expose a portion of a dielectric layer arranged on the fin, and depositing an insulator material in the cavity. | 03-27-2014 |
20140094004 | Printed Dopant Layers - A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands. | 04-03-2014 |
20140193955 | Hybrid Fin Field-Effect Transistor Structures and Related Methods - Semiconductor-on-insulator structures facilitate the fabrication of devices, including MOSFETs that are at least partially depleted during operation and FinFETs including bilayer fins and/or crystalline oxide. | 07-10-2014 |
20140256093 | FinFET Device Structure and Methods of Making Same - Embodiments of the present disclosure are a method of forming a semiconductor device and a method of forming a FinFET device. An embodiment is a method of forming a semiconductor device, the method including forming a first dielectric layer over a substrate, forming a first hardmask layer on the first dielectric layer, and patterning the first hardmask layer to form a first hardmask portion with a first width. The method further includes forming a second dielectric layer on the first dielectric layer and the first hardmask portion, forming a third dielectric layer on the second dielectric layer, and etching the third dielectric layer and a portion of the second dielectric layer to form a first and second spacer on opposite sides of the first hardmask portion. | 09-11-2014 |
20140273360 | FACETED SEMICONDUCTOR NANOWIRE - Selective epitaxy of a semiconductor material is performed on a semiconductor fin to form a semiconductor nanowire. Surfaces of the semiconductor nanowire include facets that are non-horizontal and non-vertical. A gate electrode can be formed over the semiconductor nanowire such that the faceted surfaces can be employed as channel surfaces. The epitaxially deposited portions of the faceted semiconductor nanowire can apply stress to the channels. Further, an additional semiconductor material may be added to form an outer shell of the faceted semiconductor nanowire prior to forming a gate electrode thereupon. The faceted surfaces of the semiconductor nanowire provide well-defined charge carrier transport properties, which can be advantageously employed to provide a semiconductor device with well-controlled device characteristics. | 09-18-2014 |
20140295627 | METHOD FOR ADJUSTING THE THRESHOLD VOLTAGE OF LTPS TFT - The N-type poly-silicon is applied in the LTPS productions. The LTPS productions comprise an N-type poly-silicon and a P-type poly-silicon. The N-type poly-silicon, from bottom to top, successively includes a substrate layer, a SiO | 10-02-2014 |
20140335665 | LOW EXTENSION RESISTANCE III-V COMPOUND FIN FIELD EFFECT TRANSISTOR - A gate stack including a gate dielectric and a gate electrode is formed over at least one compound semiconductor fin provided on an insulating substrate. The at least one compound semiconductor fin is thinned employing the gate stack as an etch mask. Source/drain extension regions are epitaxially deposited on physically exposed surfaces of the at least one semiconductor fin. A gate spacer is formed around the gate stack. A raised source region and a raised drain region are epitaxially formed on the source/drain extension regions. The source/drain extension regions are self-aligned to sidewalls of the gate stack, and thus ensure a sufficient overlap with the gate electrode. Further, the combination of the source/drain extension regions and the raised source/drain regions provides a low-resistance path to the channel of the field effect transistor. | 11-13-2014 |
20140377917 | SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN FORMED ON BULK AND GATE CHANNEL FORMED ON OXIDE LAYER - A semiconductor device having a doped well area includes a doped substrate layer formed on a substrate portion of the semiconductor device. The doped substrate layer extends along a first direction to define a length and a second direction perpendicular to the first direction to define a width. A plurality of fins is formed on the doped substrate layer and an oxide substrate layer is formed between each fin. At least one gate is formed on the oxide substrate layer and extends across at least one fin among the plurality of fins. | 12-25-2014 |
20150037942 | METHODS OF FORMING MEMORY CELLS, MEMORY CELLS, AND SEMICONDUCTOR DEVICES - A memory device and method of making the memory device. Memory device may include a storage transistor at a surface of a substrate. The storage transistor comprises a body portion between first and second source/drain regions, wherein the source/drain regions are regions of a first conductivity type. The storage transistor also comprises a gate structure that wraps at least partially around the body portion in at least two spatial planes. A bit line is connected to the first source/drain region and a word line is connected to the gate structure. | 02-05-2015 |
20150044826 | METHOD OF INTRODUCING LOCAL STRESS IN A SEMICONDUCTOR LAYER - The disclosure concerns a method of stressing a semiconductor layer comprising: forming, over a silicon on insulator structure having a semiconductor layer in contact with an insulating layer, one or more stressor blocks aligned with first regions of said semiconductor layer in which transistor channels are to be formed, wherein said stressor blocks are stressed such that they locally stress said semiconductor layer; and deforming second regions of said insulating layer adjacent to said first regions by temporally decreasing, by annealing, the viscosity of said insulator layer. | 02-12-2015 |
20150044827 | METHOD OF LOCALLY STRESSING A SEMICONDUCTOR LAYER - The disclosure concerns a method of stressing a semiconductor layer comprising: depositing, over a semiconductor on insulator (SOI) structure having a semiconductor layer in contact with an insulating layer, a stress layer; locally stressing said semiconductor layer by forming one or more openings in said stress layer, said openings being aligned with first regions of said semiconductor layer in which transistor channels are to be formed; and deforming second regions of said insulating layer adjacent to said first regions by temporally decreasing, by annealing, the viscosity of said insulator layer. | 02-12-2015 |
20150064854 | SPACERLESS FIN DEVICE WITH REDUCED PARASITIC RESISTANCE AND CAPACITANCE AND METHOD TO FABRICATE SAME - A structure includes a substrate having an insulator layer and a plurality of elongated semiconductor fin structures disposed on a surface of the insulator layer. The fin structures are disposed substantially parallel to one another. The structure further includes a plurality of elongated sacrificial gate structures each comprised of silicon nitride. The sacrificial gate structures are disposed substantially parallel to one another and orthogonal to the plurality of fin structures, where a portion of each of a plurality of adjacent fin structures is embedded within one of the sacrificial gate structures leaving other portions exposed between the sacrificial gate structures. The structure further includes a plurality of semiconductor source/drain (S/D) structures disposed over the exposed portions of the fin structures between the sacrificial gate structures. The embodiments eliminate a need to form a conventional spacer on the fin structures. A method to fabricate the structure is also disclosed. | 03-05-2015 |
20150064855 | FINFET WITH DIELECTRIC ISOLATION BY SILICON-ON-NOTHING AND METHOD OF FABRICATION - An improved finFET and method of fabrication using a silicon-on-nothing process flow is disclosed. Nitride spacers protect the fin sides during formation of cavities underneath the fins for the silicon-on-nothing (SON) process. A flowable oxide fills the cavities to form an insulating dielectric layer under the fins. | 03-05-2015 |
20150064856 | SEMICONDUCTOR STRUCTURE WITH DEEP TRENCH THERMAL CONDUCTION - Diodes and resistors for integrated circuits are provided. Deep trenches (DTs) are integrated into the diodes and resistors for the purposes of thermal conduction. The deep trenches facilitate conduction of heat from a semiconductor-on-insulator substrate to a bulk substrate. Semiconductor fins may be formed to align with the deep trenches. | 03-05-2015 |
20150072483 | Thin Film Transistor Substrate and Method for Manufacturing the Same and Organic Light Emitting Device Using the Same - Disclosed is a thin film transistor substrate which facilitates to improve output and transfer characteristics of thin film transistor, wherein the thin film transistor substrate comprises a thin film transistor comprising a lower gate electrode on a substrate, an active layer on the lower gate electrode, source and drain electrodes on the active layer, and an upper gate electrode on the source electrode, drain electrode and active layer, the upper gate electrode for covering a channel region defined by the source and drain electrodes; and a contact portion for electrically connecting the lower gate electrode with the upper gate electrode. | 03-12-2015 |
20150079737 | JUNCTIONLESS SEMICONDUCTOR DEVICE HAVING BURIED GATE, APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - A junctionless semiconductor device having a buried gate, a module and system each having the same, and a method for forming the semiconductor device are disclosed. A source, a drain, and a body of a semiconductor device having a buried gate are doped with the same type of impurities, so that the junctionless semiconductor device does not include a PN junction between the source and the body or between the body and the drain. As a result, a leakage current caused by GIDL is reduced so that operation characteristics of the semiconductor device are improved and the size of a current-flowing region is increased, resulting in an increased operation current. | 03-19-2015 |
20150118805 | METHOD OF FORMING STRESSED SEMICONDUCTOR LAYER - The invention concerns a method of forming a semiconductor layer having uniaxial stress including: forming, in a semiconductor structure having a stressed semiconductor layer, one or more first isolation trenches in a first direction for delimiting a first dimension of at least one transistor to be formed in said semiconductor structure; forming, in the semiconductor structure, one or more second isolation trenches in a second direction for delimiting a second dimension of the at least one transistor, the first and second isolation trenches being at least partially filled with an insulating material; and before or after the formation of the second isolation trenches, decreasing the viscosity of the insulating material in the first isolation trenches by implanting atoms of a first material into the first isolation trenches, wherein atoms of the first material are not implanted into the second isolation trenches. | 04-30-2015 |
20150126004 | Method for Keyhole Repair in Replacement Metal Gate Integration Through the Use of a Printable Dielectric - A method of fabricating a FET device is provided that includes the following steps. A wafer is provided. At least one active area is formed in the wafer. A plurality of dummy gates is formed over the active area. Spaces between the dummy gates are filled with a dielectric gap fill material such that one or more keyholes are formed in the dielectric gap fill material between the dummy gates. The dummy gates are removed to reveal a plurality of gate canyons in the dielectric gap fill material. A mask is formed that divides at least one of the gate canyons, blocks off one or more of the keyholes and leaves one or more of the keyholes un-blocked. At least one gate stack material is deposited onto the wafer filling the gate canyons and the un-blocked keyholes. A FET device is also provided. | 05-07-2015 |
20150311320 | FIN FORMATION IN FIN FIELD EFFECT TRANSISTORS - A method of forming a semiconductor device that includes forming a silicon including fin structure and forming a germanium including layer on the silicon including fin structure. Germanium is then diffused from the germanium including layer into the silicon including fin structure to convert the silicon including fin structure to silicon germanium including fin structure. | 10-29-2015 |
20150311321 | Novel Fin Structure of FinFet - A fin structure disposed over a substrate and a method of forming a fin structure are disclosed. The fin structure includes a mesa, a channel disposed over the mesa, and a convex-shaped feature disposed between the channel and the mesa. The mesa has a first semiconductor material, and the channel has a second semiconductor material different from the first semiconductor material. The convex-shaped feature is stepped-shaped, stair-shaped, or ladder-shaped. The convex-shaped feature includes a first isolation feature disposed between the channel and the mesa, and a second isolation feature disposed between the channel and the first isolation feature. The first isolation feature is U-shaped, and the second isolation feature is rectangular-shaped. A portion of the second isolation feature is surrounded by the channel and another portion of the second isolation feature is surrounded by the first isolation feature. | 10-29-2015 |
20150318219 | STRAINED GATE-ALL-AROUND SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES - Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer. | 11-05-2015 |
20150325672 | GRAPHENE DEVICES WITH LOCAL DUAL GATES - An electronic device comprises an insulator, a local first gate embedded in the insulator with a top surface of the first gate being substantially coplanar with a surface of the insulator, a first dielectric layer formed over the first gate and insulator, and a channel. The channel comprises a bilayer graphene layer formed on the first dielectric layer. The first dielectric layer provides a substantially flat surface on which the channel is formed. A second dielectric layer formed over the bilayer graphene layer and a local second gate formed over the second dielectric layer. Each of the local first and second gates is capacitively coupled to the channel of the bilayer graphene layer. The local first and second gates form a first pair of gates to locally control a first portion of the bilayer graphene layer. | 11-12-2015 |
20150332977 | ELECTRICALLY ISOLATED SiGe FIN FORMATION BY LOCAL OXIDATION - A silicon germanium alloy layer is formed on a semiconductor material layer by epitaxy. An oxygen impermeable layer is formed on the silicon germanium alloy layer. The oxygen impermeable layer and the silicon germanium alloy layer are patterned to form stacks of a silicon germanium alloy fin and an oxygen impermeable cap. A shallow trench isolation structure is formed by deposition, planarization, and recessing or an oxygen permeable dielectric material. An oxygen impermeable spacer is formed around each stack of a silicon germanium alloy fin and an oxygen impermeable cap. A thermal oxidation process is performed to convert a lower portion of each silicon germanium alloy fin into a silicon germanium oxide. During the thermal oxidation process, germanium atoms diffuse into unoxidized portions of the silicon germanium alloy fins to increase the germanium concentration therein. | 11-19-2015 |
20150333157 | GRAPHENE NANORIBBONS AND CARBON NANOTUBES FABRICATED FROM SiC FINS OR NANOWIRE TEMPLATES - Semiconductor structures including parallel graphene nanoribbons or carbon nanotubes oriented along crystallographic directions are provided from a template of silicon carbide (SiC) fins or nanowires. The SiC fins or nanowires are first provided and then graphene nanoribbons or carbon nanotubes are formed on the exposed surfaces of the fin or the nanowires by annealing. In embodiments in which closed carbon nanotubes are formed, the nanowires are suspended prior to annealing. The location, orientation and chirality of the graphene nanoribbons and the carbon nanotubes that are provided are determined by the corresponding silicon carbide fins and nanowires from which they are formed. | 11-19-2015 |
20150348851 | METHOD FOR THE FORMATION OF A FINFET DEVICE HAVING PARTIALLY DIELECTRIC ISOLATED FIN STRUCTURE - A semiconductor material is patterned to define elongated fins insulated from an underlying substrate. A polysilicon semiconductor material is deposited over and in between the elongated fins, and is patterned to define elongated gates extending to perpendicularly cross over the elongated fins at a transistor channel. Sidewall spacers are formed on side walls of the elongated gates. Portions of the elongated fins located between the elongated gates are removed, along with the underlying insulation, to expose the underlying substrate. One or more semiconductor material layers are then epitaxially grown from the underlying substrate at locations between the elongated gates. The one or more semiconductor material layers may include an undoped epi-layer and an overlying doped epi-layer. The epitaxial material defines a source or drain of the transistor. | 12-03-2015 |
20150364382 | BACK BIASED TRANSISTOR AND CURRENT SOURCE BIASING - A semiconductor chip device may include a silicon on insulator (SOI) base, a first transistor, and a voltage device. The SOI base may include a semiconductor substrate having a first doped layer and a second doped layer directly on the first doped layer, a buried oxide layer directly on the second doped layer, and a first moat electrically isolating a first bias region of the second doped layer. The first bias region may be electrically coupled to a current source. The first transistor may be formed above the buried oxide layer and the first bias region. The first transistor may include a first drain a first source a first body a first gate and a first back gate. The voltage device may be electrically coupled to the first back gate and the first gate and configured to maintain a voltage difference between the first gate and the first back gate. | 12-17-2015 |
20160064529 | METHOD FOR FABRICATING MULTI-GATE STRUCTURE DEVICE WITH SOURCE AND DRAIN HAVING QUASI-SOI STRUCTURE - A method for fabricating a multi-gate structure device with a source and a drain having a quasi-SOI structure, comprising forming an active region in a shape of a fin bar, forming an oxide isolation layer for shallow trench isolation (STI), forming a polysilicon dummy gate, forming source and drain extension regions, forming the source and the drain with the quasi-SOI structure, and forming a high-K metal gate. Solution(s) consistent with the present innovations may be achieved by using a process method compatible with the conventional bulk silicon CMOS processes and can be easily integrated into the process flow. Moreover, innovations here may provide a small leakage current even in a case of having a short channel length, thereby reducing the power consumption of the device. | 03-03-2016 |
20160071772 | METHOD FOR THE FORMATION OF A FINFET DEVICE WITH EPITAXIALLY GROWN SOURCE-DRAIN REGIONS HAVING A REDUCED LEAKAGE PATH - Elongated fins of a first semiconductor material are insulated from and formed over an underlying substrate layer (of either SOI or bulk type). Elongated gates of a second semiconductor material are then formed to cross over the elongated fins at channel regions, and the gate side walls are covered by sidewall spacers. A protective material is provided to cover the underlying substrate layer and define sidewall spacers on side walls of the elongated fins between the elongated gates. The first semiconductor material and insulating material of the elongated fins located between the protective material sidewall spacers (but not under the elongated gates) is removed to form trenches aligned with the channel regions. Additional semiconductor material is then epitaxially grown inside each trench between the elongated gates to form source-drain regions adjacent the channel regions formed by the elongated fins of the first semiconductor material located under the elongated gates. | 03-10-2016 |
20160079397 | PARTIAL FIN ON OXIDE FOR IMPROVED ELECTRICAL ISOLATION OF RAISED ACTIVE REGIONS - A semiconductor fin suspended above a top surface of a semiconductor layer and supported by a gate structure is formed. An insulator layer is formed between the top surface of the semiconductor layer and the gate structure. A gate spacer is formed, and physically exposed portions of the semiconductor fin are removed by an anisotropic etch. Subsequently, physically exposed portions of the insulator layer can be etched with a taper. Alternately, a disposable spacer can be formed prior to an anisotropic etch of the insulator layer. The lateral distance between two openings in the dielectric layer across the gate structure is greater than the lateral distance between outer sidewalls of the gate spacers. Selective deposition of a semiconductor material can be performed to form raised active regions. | 03-17-2016 |
20160086962 | Method Of Making Embedded Memory Device With Silicon-On-Insulator Substrate - A method of forming a semiconductor device starts with a substrate of silicon, a first insulation layer on the silicon, and a silicon layer on the first insulation layer. The silicon layer and the insulation layer are removed just from a second substrate area. A second insulation layer is formed over the silicon layer in the substrate first area and over the silicon in the second substrate area. A first plurality of trenches is formed in the first substrate area that each extends through all the layers and into the silicon. A second plurality of trenches is formed in the second substrate area that each extends through the second insulation layer and into the silicon. An insulation material is formed in the first and second trenches. Logic devices are formed in the first substrate area, and memory cells are formed in the second substrate area. | 03-24-2016 |
20160093720 | EPITAXIAL GROWTH OF MATERIAL ON SOURCE/DRAIN REGIONS OF FINFET STRUCTURE - A method for producing a semiconductor structure, as well as a semiconductor structure, that uses a partial removal of an insulating layer around a semiconductor fin, and subsequently epitaxially growing an additional semiconductor material in the exposed regions, while maintaining the shape of the fin with the insulating layer. | 03-31-2016 |
20160099341 | HIGH BREAKDOWN VOLTAGE LDMOS DEVICE - A multi-region ( | 04-07-2016 |
20160111294 | USE OF ION BEAM ETCHING TO GENERATE GATE-ALL-AROUND STRUCTURE - Various embodiments herein relate to methods and apparatus for performing anisotropic ion beam etching to form arrays of channels. The channels may be formed in semiconductor material, and may be used in a gate-all-around device. Generally speaking, a patterned mask layer is provided over a layer of semiconductor material. Ions are directed toward the substrate while the substrate is positioned in two particular orientations with respect to the ion trajectory. The substrate switches between these orientations such that ions impinge upon the substrate from two opposite angles. The patterned mask layer shadows/protects the underlying semiconductor material such that the channels are formed in intersecting shadowed regions. | 04-21-2016 |
20160111322 | FINFET SEMICONDUCTOR DEVICE HAVING LOCAL BURIED OXIDE - There is set forth herein in one embodiment a FinFET semiconductor device having a fin extending from a bulk silicon substrate, wherein there is formed wrapped around a portion of the fin a gate, and wherein proximate a channel area of the fin aligned to the gate there is formed a local buried oxide region aligned to the gate. In one embodiment, the local buried oxide region is formed below a channel area of the fin. | 04-21-2016 |
20160111525 | FIN FORMATION IN FIN FIELD EFFECT TRANSISTORS - A method of forming a semiconductor device that includes forming a silicon including fin structure and forming a germanium including layer on the silicon including fin structure. Germanium is then diffused from the germanium including layer into the silicon including fin structure to convert the silicon including fin structure to silicon germanium including fin structure. | 04-21-2016 |
20160118482 | METHOD FOR FORMING SEMICONDUCTOR NANOWIRE TRANSISTORS - A method for forming a semiconductor device includes forming a semiconductor substrate having at least one fin structure on an insulator on a substrate. The fin structure includes a semiconductor layer overlying a sacrificial layer. The method also includes forming a patterned dummy gate on the substrate, forming a first spacer on both sides of the dummy gate, and using the dummy gate and the first spacer as a mask to remove a portion of the semiconductor layer and the sacrificial layer. Then the sacrificial layer is etched to form recessed regions on both sides of the sacrificial layer, and a second spacer is formed to cover both sides of the sacrificial layer and expose both sides of the semiconductor layer. The method also includes performing epitaxial growth on both sides of the semiconductor layer to form source and drain regions. | 04-28-2016 |
20160181164 | FIN FORMATION ON AN INSULATING LAYER | 06-23-2016 |
20160197154 | III-V NANOWIRE FET WITH COMPOSITIONALLY-GRADED CHANNEL AND WIDE-BANDGAP CORE | 07-07-2016 |
20160379867 | SILICON GERMANIUM-ON-INSULATOR FINFET - A method of making a structurally stable SiGe-on-insulator FinFET employs a silicon nitride liner to prevent de-stabilizing oxidation at the base of a SiGe fin. The silicon nitride liner blocks access of oxygen to the lower corners of the fin to facilitate fabrication of a high-concentration SiGe fin. The silicon nitride liner is effective as an oxide barrier even if its thickness is less than about 5 nm. Use of the SiN liner provides structural stability for fins that have higher germanium content, in the range of 25-55% germanium concentration. | 12-29-2016 |
20160380103 | Novel Fin Structure of FinFet - A fin structure disposed over a substrate and a method of forming a fin structure are disclosed. The fin structure includes a mesa, a channel disposed over the mesa, and a convex-shaped feature disposed between the channel and the mesa. The mesa has a first semiconductor material, and the channel has a second semiconductor material different from the first semiconductor material. The convex-shaped feature is stepped-shaped, stair-shaped, or ladder-shaped. The convex-shaped feature includes a first isolation feature disposed between the channel and the mesa, and a second isolation feature disposed between the channel and the first isolation feature. The first isolation feature is U-shaped, and the second isolation feature is rectangular-shaped. A portion of the second isolation feature is surrounded by the channel and another portion of the second isolation feature is surrounded by the first isolation feature. | 12-29-2016 |
20160380218 | SELF-ALIGNED CARBON NANOTUBE TRANSISTOR INCLUDING SOURCE/DRAIN EXTENSIONS AND TOP GATE - A carbon nanotube semiconductor device includes at least one carbon nanotube disposed on an insulator portion of a substrate. The at least one carbon nanotube includes a non-doped channel portion interposed between a first doped source/drain portion and a second doped source/drain portion. A first source/drain contact stack is disposed on the first doped source/drain portion and an opposing second source/drain contact stack is disposed on the second doped source/drain portion. A replacement metal gate stack is interposed between the first and second source/drain contact stacks, and on the at least one carbon nanotube. The first and second doped source/drain portions are each vertically aligned with an inner edge of the first and second contact stacks, respectively. | 12-29-2016 |