| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438001000 | HAVING BIOMATERIAL COMPONENT OR INTEGRATED WITH LIVING ORGANISM | 15 |
| 20080199974 | Method for Functionalizing Biosensor Chips - A met4hod is disclosed for functionalizing biosensors. The biosensors are based on semiconductor chips mounted on a finished processed wafer. They are provided with sensor fields placed thereupon, which are arranged in any array, and, to be precise, for carrying out a functionalization, for example, with organic molecules such as nucleic acids like DNA, RNA and PNA or with their derivatives, proteins, sugar molecules, or antibodies. | 08-21-2008 |
| 20080213923 | DNA-Based Memory Device and Method of Reading and Writing Same - The present invention is directed to a memory device having very high storage density capability. In general, the memory device includes an array of individual memory cells which store information that is assigned a value based on the molecular contents of the memory cell. In a preferred embodiment, the molecules utilized for storing information in the memory cells may be single-strand polynucleotides, for instance single-strand oligonucleotides of between about 5 and about 20 monomer units. The present invention is also directed to methods and systems useful for writing and reading the molecular-based memory devices. In particular, the devices may be written and read via modified atomic force microscopy processes. | 09-04-2008 |
| 20080220541 | Process for structuring a surface layer - A process for structuring a surface layer of an object includes applying bio-components to the surface of the object that carry away surface material. The bio-components are contained in at least one of a nutrient and osmotic protective medium. The at least one of a nutrient and osmotic protective medium having the bio-components contained therein is removed after the surface material is carried away from the object surface. | 09-11-2008 |
| 20090305437 | FABRICATION OF INORGANIC MATERIALS USING TEMPLATES WITH LABILE LINKAGE - A method of forming an integrated circuit layer material is described, comprising depositing a layer of templates on a substrate, said template including a first binding site having an affinity for the substrate, a second binding site having an affinity for a target integrated circuit material and a protecting material coupled to the second binding site via a labile linkage to prevent the binding site from binding to the target integrated circuit material; exposing the template to an external stimulus to degrade the labile linkage; removing the protecting material; and binding the integrated circuit material to the second binding site. | 12-10-2009 |
| 20100124791 | METHOD TO FABRICATE A CHIP FOR THE DETECTION OF BIOLOGICAL ELEMENTS - Improved method to fabricate a microelectronic device provided with at least one circuit to detect biological elements, comprising the steps of:
| 05-20-2010 |
| 20100279434 | Functionalized Nitride Nanomaterials for Electrochemistry and Biosensor Applications - This invention refers to surface modification/functionalization of Nitride nanomaterials and electrochemistry and optical measurement based upon such functionalized Nitride materials. With this invention a variety of bio-molecules such as DNA, protein, and antigens can be immobilized on the surface for measurement to realize ultra-sensitive chemical- and bio-sensing applications. | 11-04-2010 |
| 20110207239 | BICOMPATIBLE ELECTRODES - A biocompatible electrode is manufactured by depositing filling metal | 08-25-2011 |
| 20120129273 | PHOTOLITHOGRAPHICALLY DEFINED CONTACTS TO CARBON NANOSTRUCTURES - Methods for the fabrication of nanostructures, including nanostructures comprised of carbon nanotubes, and the nanostructures, devices, and assemblies prepared by these methods, are described. | 05-24-2012 |
| 20120322167 | SURFACE TREATMENT METHOD BY USING THE NH3 PLASMA TREATMENT TO MODIFY THE SENSING THIN-FILM | 12-20-2012 |
| 20140073063 | METHODS AND SYSTEMS FOR SCAFFOLDS COMPRISING NANOELECTRONIC COMPONENTS - The present invention generally relates to nanoscale wires and tissue engineering. Systems and methods are provided in various embodiments for preparing cell scaffolds that can be used for growing cells or tissues, where the cell scaffolds comprise nanoscale wires. In some cases, the nanoscale wires can be connected to electronic circuits extending externally of the cell scaffold. Such cell scaffolds can be used to grow cells or tissues which can be determined and/or controlled at very high resolutions, due to the presence of the nanoscale wires, and such cell scaffolds will find use in a wide variety of novel applications, including applications in tissue engineering, prosthetics, pacemakers, implants, or the like. This approach thus allows for the creation of fundamentally new types of functionalized cells and tissues, due to the high degree of electronic control offered by the nanoscale wires and electronic circuits. | 03-13-2014 |
| 20140273281 | METHOD FOR FORMING BIOCHIPS AND BIOCHIPS WITH NON-ORGANIC LANDINGS FOR IMPROVED THERMAL BUDGET - The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates. | 09-18-2014 |
| 20150011021 | Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget - The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates. | 01-08-2015 |
| 20150372245 | MICROELECTRONIC COMPONENTS AND ELECTRONIC NETWORKS COMPRISING DNA - Microelectronic network devices and components are fabricated by binding or complexing at least one electronically functional substance to a molecular fiber, such as a nucleic acid fiber. The devices and components can be combined by interconnecting the complexed fibers to provide microelectronic circuits or networks. Assembly processes involve interactions of various combinations of the fibers and substances used in fabrication. | 12-24-2015 |
| 20160079005 | METHOD FOR FABRICATING A HIGH EFFICIENCY BIO-PHOTOVOLTAIC CELLS BY USING PLASMONIC SILVER NANOPARTICLES AND NATURAL EXTRACTED GRAMINOIDS - Disclosed is a technique for fabricating a bio-photovoltaic cell which includes coupling graminoids extracted from natural grasses to a semiconductor electron acceptor, on which plasmonic silver nanoparticles are aligned, by using an organic ligand material. More particularly, disclosed is a technique for fabricating a new renewable energy generation device useable for fabrication of high efficiency bio-photovoltaic cells by improving a photo-electron generation rate of graminoids through a surface plasmon effect of silver nanoparticles and increasing an effective photo-electron amount transferred to the electron acceptor due to optimized bonding between a photo sensitizer and an electron acceptor | 03-17-2016 |
| 20160086824 | BIO-IMPLANTABLE HERMETIC INTEGRATED ULTRA HIGH DENSITY DEVICE - An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact. | 03-24-2016 |
