| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 427990200 | With posttreatment of coating or coating material | 16 |
| 20080254204 | DIELECTRIC APPARATUS AND ASSOCIATED METHODS - In an embodiment of the invention, an amorphous phase dielectric material is selectively formed over a substrate. The amorphous phase dielectric material is then converted into a crystalline phase dielectric material. | 10-16-2008 |
| 20080305249 | USE OF CONDUCTOR COMPOSITIONS IN ELECTRONIC CIRCUITS - Use of a composition comprising finely divided particles of (a) an electrically-conductive material; (b) one or more inorganic binders; and (c) zinc, wherein components (a), (b) and (c) are dispersed in a liquid vehicle, in the manufacture of an electrically-conductive pattern on a substrate for the purpose of increasing the resistivity of said electrically-conductive pattern. | 12-11-2008 |
| 20090004369 | Conductor paste for ceramic substrate and electric circuit - A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi | 01-01-2009 |
| 20090232972 | Method for the production of a metal-ceramic substrate - Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer is applied to at least one face of a ceramic substrate or a ceramic layer by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately. | 09-17-2009 |
| 20100178420 | METHOD OF PREPARING CONDUCTIVE INK COMPOSITION FOR PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD - Disclosed are a method of preparing a conductive ink composition for a flexible printed circuit (FPC) and a method of producing a printed circuit board using the conductive ink composition. This method includes preparing a first solution by mixing a Ag-containing compound and a fatty acid dispersion stabilizer in a polar solvent; preparing a second solution including Ag nanoparticles reduced from the Ag-containing compound by adding a reducing agent to the first solution; phase-transitioning the Ag nanoparticles into a nonpolar solvent by adding a phase-transition agent and a nonpolar solvent to the second solution including the Ag nanoparticles; and separating the nonpolar solvent including the Ag nanoparticles therefrom. | 07-15-2010 |
| 20100215843 | METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SURFACES - An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments. | 08-26-2010 |
| 20100316794 | ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE USING THE SAME - A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance. | 12-16-2010 |
| 20110143021 | CONFORMAL COATING SYSTEM AND METHOD - A conformal coating system and method for coating a printed circuit board (PCB) is provided. The system comprises a coating station configured to coat the PCB with a coating material and without cleaning the PCB with a saponifier. A surface energy of the PCB is maintained above a target surface energy at least through the cleaning station to promote adhesion of the coating material. | 06-16-2011 |
| 20110236565 | ELECTROLESS PALLADIUM PLATING SOLUTION AND METHOD OF USE - An electroless palladium plating solution includes a polar solvent, at least one palladium salt, at least one non-nitrogenated complexing agent, an alkaline adjusting agent that adjusts the plating solution to a pH of at least 8.0, and a reducing agent. The plating solution, which is used for forming a layer of palladium on a surface of a substrate, yields a substantially pure palladium deposit on the substrate. Precipitation of reduced palladium in the plating solution is substantially prevented. | 09-29-2011 |
| 20110274830 | METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION - A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure. | 11-10-2011 |
| 20130323410 | POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WITH CAP LAYERS - One embodiment of the present invention is a method of fabricating an integrated circuit. The method includes providing a substrate having a metal and dielectric damascene metallization layer and depositing substantially on the metal a cap. After deposition of the cap, the substrate is cleaned with a solution comprising an amine to provide a pH for the cleaning solution of 7 to about 13. Another embodiment of the presented invention is a method of cleaning substrates. Still another embodiment of the present invention is a formulation for a cleaning solution. | 12-05-2013 |
| 427990300 | Planarization | 1 |
| 20100034965 | Direct Metallization Process - An improved method of providing a carbon dispersion coating on surfaces of a substrate in a direct metallization process, wherein the substrate comprises conductive and non-conductive portions. The method comprises the steps of contacting the substrate with the carbon dispersion to coat the substrate with the carbon-containing dispersion and at least one of moving a non-absorbent roller over at least a portion of a substantially planar surface of the substrate to remove excess carbon dispersion from the substantially planar surface of the substrate and passing the substrate through a vacuum extraction chamber to extract excess carbon dispersion remaining on surfaces of the substrate. The method provides cleaner copper surfaces to minimize the microetch requirement and also prevents the carbon dispersion from undesirably redepositing on surfaces of the substrate. | 02-11-2010 |
| 427990400 | Polymer deposited | 4 |
| 20090181165 | Curable adhesive compositions, Process, and applications - The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent. | 07-16-2009 |
| 20100003398 | ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH - An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix. | 01-07-2010 |
| 20100239750 | LOW POLARITY NANOPARTICLE METAL PASTES FOR PRINTING APPLICATION - A composition that may be used to form an electronic circuit element includes metal nanoparticles in a metal nanoparticle solution, at least a low-polarity additive and a solvent. The low-polarity additive is either a styrenated terpene resin or a polyterpene resin. The composition may be used to form conductive features on a substrate by depositing the composition onto a substrate, and heating the deposited composition on the substrate to a temperature from about 80° C. to about 200° C. to form conductive features on the substrate. | 09-23-2010 |
| 20120244275 | FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND FLEXIBLE PRINT WIRING BOARD - A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film. The process includes coating a varnish containing a polyamic acid and a solvent onto the metal foil, holding the coated film, drying in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and forming the resin in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating up to the resin film-forming are adjusted based on a target for the content of metal elements in the resin film. | 09-27-2012 |
