| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361739000 | With particular material | 9 |
| 20090059540 | SHIELDED HIGH-FREQUENCY CIRCUIT MODULE - A shielded high-frequency circuit module includes a conductive frame electrically coupled to a top surface of a printed circuit board and a lid. The conductive frame includes inner walls, which define a circuit region, at least a portion of which includes a circuit on the top surface of the printed circuit board. The shielded high-frequency circuit module also includes a connector for interfacing the circuit region with high-frequency signals outside the conductive frame, at least a portion of the connector being electrically coupled to the conductive frame. The inner walls of the conductive frame, the top surface of the printed circuit board and the lid define a shield surrounding the circuit region. | 03-05-2009 |
| 20100039779 | Wireless Telemetry Electronic Circuit Board for High Temperature Environments - A circuit assembly ( | 02-18-2010 |
| 20120075811 | ELECTRONIC MODULE FOR VEHICLE - An electronic module ( | 03-29-2012 |
| 20130077262 | MODULE BOARD AND MANUFACTURING METHOD THEREOF - In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin. | 03-28-2013 |
| 20130163210 | INTEGRATED FLEX TAIL CIRCUIT PACKAGING - An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board. | 06-27-2013 |
| 20130176689 | COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN MODULE - A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other. | 07-11-2013 |
| 20130235535 | COMPOSITE SUBSTRATE, MODULE, AND COMPOSITE-SUBSTRATE PRODUCTION METHOD - A composite substrate includes a ceramic substrate including, on at least one surface, a circuit wire on which an electronic component is to be mounted, a plurality of external connection terminals provided on one surface of the ceramic substrate, and a resin layer provided on the one surface of the ceramic substrate. The external connection terminals have a cross sectional area that decreases with increasing distance from the one surface of the ceramic substrate, and end surfaces of the external connection terminals opposite to end surfaces connected to the ceramic substrate are partially or entirely exposed from the resin layer. | 09-12-2013 |
| 20140085834 | DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE - In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities. | 03-27-2014 |
| 20150055306 | CIRCUIT BOARD, PARTICULARY FOR A POWER-ELECTRONIC MODULE, COMPRISING AN ELECTRICALLY-CONDUCTIVE SUBSTRATE - The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate. | 02-26-2015 |
