| Entries |
| Document | Title | Date |
|---|
| 20080198557 | HEAT-DISSIPATING MODULE - A heat-dissipating module includes a circuit board, an electronic component and a heat-dissipating device. The circuit board includes at least a hollow portion and at least a contact portion. The electronic component includes at least a pin connected to the contact portion of the circuit board. The heat-dissipating device is embedded into the hollow portion of the circuit board and interposed between the electronic component and an inner surface of the covering body, thereby providing a heat-transfer path along the heat-conducting device to the covering body to remove the heat generate from the electronic component | 08-21-2008 |
| 20080205005 | Circuit board testing jig - A circuit board testing jig for testing a circuit board and dissipating heats generated by a heat-generating electronic element of the circuit board is provided. The circuit board testing jig includes a fixing frame, a platform, and a displacement mechanism. The fixing frame and the platform are respectively used to support the circuit board and a heatsink module. The displacement mechanism enables the platform to move between a ready position and an attached position. When the platform is located at the ready position, the heatsink module on the platform is separated from the heat-generating electronic element; when the platform is located at the attached position, the heatsink module is pressed onto the heat-generating electronic element, for dissipating the heats generated by the heat-generating electronic element. | 08-28-2008 |
| 20080212289 | Easily disassembling cooling apparatus - An easily disassembling cooling apparatus is assembled onto a circuit board. The circuit board has an electronic element. The cooling apparatus includes a pair of fastening blocks, one or two heat conducting blocks, a heat pipe, a fastening plate, and a plurality of locking elements. The fastening blocks are fastened onto the circuit board and each has a track slot. The heat conducting block is installed between the fastening blocks and contacts the electronic element. One end of the heat pipe is installed with the heat conducting block. The fastening plate is installed in the track slots of the fastening blocks, and has a flexible arm that flexibly presses onto the heat pipe. Each of the locking elements respectively is combined with the fastening block. Thereby, the welding process is not required in the assembling process. The electronic element is reliably cooled, and the assembling time is reduced. | 09-04-2008 |
| 20080232068 | HEAT DISSIPATION DEVICE HAVING A FIXING BASE - A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges. | 09-25-2008 |
| 20080239677 | Heat Sink Mounting Systems and Methods - In some embodiments, a heat sink is pressed down on a heat source such as an integrated circuit by rotating a cam to press down a set of springs over a loading arm, which is in turn positioned over a heat sink base. A cam shaft is placed in a hinge opening of a mounting frame secured to a printed circuit board (PCB). The mounting frame encloses a heat sink positioned over an IC. The hinge opening defines a hinge axis parallel to the PCB plane. A loading arm includes spring wells for holding coil springs, which are compressed between the mounting frame and the bottoms of the spring wells when the cam is rotated. The mounting frame and loading arm may include mating, self-locking sections including hinge protrusions having cross-sections shaped as a circle sectioned linearly off-center. | 10-02-2008 |
| 20080239678 | SPRING LOADED HEAT SINK RETENTION MECHANISM - Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described. | 10-02-2008 |
| 20080239679 | HEAT DISSIPATION DEVICE HAVING METAL DIE-CASTING COMPONENT AND METAL-EXTRUSION COMPONENT - A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion. | 10-02-2008 |
| 20080253093 | PRINTED CIRCUIT BOARD EMPLOYING HEAT SINK RETAINING APPARATUS AND METHOD OF USE - A printed circuit board employing a heat sink retaining apparatus and method of use is disclosed. In one form of the disclosure, a heat sink apparatus can include a heat sink operable to be coupled to a first portion of a printed circuit board having an integrated circuit, and a retaining mechanism operably coupled along a first surface of the heat sink. The retaining mechanism can be coupled to a second portion of the printed circuit board to produce a tension between the first surface of the heat sink and the second portion of the printed circuit board. | 10-16-2008 |
| 20080259572 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-23-2008 |
| 20080266810 | Heat management system for a power switching device - A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion. | 10-30-2008 |
| 20080273310 | HOLDING DEVICE FOR A HEAT SINK - A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of the fixing posts being surrounded with a spring. The frame member provides a plurality of corners with a support leg vertically extending from the corners respectively and a first flat fixing ear horizontally extending outward from the corners. The first fixing ear has a first elongated hole with a first end part for being pierced by the fixing post and a second end part for fitting with the neck recess. The first elongated hole extends from the first end part to the second end part in a way of allowing the frame member being moved along a direction before the second end part fitting with neck recess. | 11-06-2008 |
| 20080278918 | ELECTRONIC CONTROL APPARATUS - An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink. | 11-13-2008 |
| 20080291638 | Electrical connector with clip mechanism - Provided a clip set ( | 11-27-2008 |
| 20080291639 | COMMUNICATION MODULE PACKAGE ASSEMBLY - A communication module package assembly includes a main board having grounding pads, a communication module package electrically bonded on the main board and having notches corresponding in location to the grounding pads respectively, and a metal cover covering the communication module package and having mounting legs passing through the notches and electrically connected to the grounding pads respectively. The communication module package is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer sandwiched between and in contact with the thermal conductive layer and the main board. | 11-27-2008 |
| 20080291640 | Electronic device with a base plate - A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece and the material in the surface region of the cooling plate and of the spacer elements being the same and formed in the same process. | 11-27-2008 |
| 20080310118 | CPU Heat Sink Mounting Method And Apparatus - A system and method for mounting a heat sink associated with an electronics component are disclosed. The disclosure provides a method including connecting a CPU support bracket to a board using one or more support bracket connectors, mounting a CPU to the CPU support bracket, and mounting a heat sink assembly to the CPU support bracket using one or more heat sink connectors configured to mate with the one or more support bracket connectors. | 12-18-2008 |
| 20080310119 | Clip on heat sink - A heat sink according to an embodiment of the present invention can be attached to any device without printed circuit board (PCB) modification. The heat sink may clamp on device edges, which does not stress solder balls between the device and heat sink. The heat sink may be configured to be installed to or removed from the device without special tools. The heat sink may be extruded, machined, or die cast aluminum or other material to reduce part and tooling cost, and may be black anodized to be electrically non-conductive. A single-piece embodiment eliminates a need for a separate clip, thereby increasing heat transfer by as much as twenty-five percent or more over heat sinks employing clips. Further, wavy fins or other heat dissipation configurations may increase heat transfer by at least eleven percent, for a total heat transfer improvement of at least thirty-six percent over a two-part heat sink. | 12-18-2008 |
| 20090021917 | METHOD AND APPARATUS FOR SECURING A MICROPROCESSOR AND HEAT SINK USING FEWER MOUNTING HOLES - Adapter module securable to a socket frame, integrated circuit module assembly and method for securing a heat dissipation device in direct thermal communication with an integrated circuit module. The socket frame is positioned over a substrate having a land grid array and the frame is secured to the substrate. The frame defines a well for selectively receiving the integrated circuit module in electronic communication with the land grid array. The adapter module is secured to the frame and extends outside the perimeter of the frame. The adapter provides a feature outside the perimeter of the frame for fastening the heat dissipation device. Furthermore, the adapter body is secured to the frame without adding holes through the substrate, such as by extending under the frame to be secured between the frame and substrate, or by extending over the frame to be secured between the frame and fasteners. | 01-22-2009 |
| 20090046433 | HEAT SINK FOR LED LAMP - A heat dissipation device ( | 02-19-2009 |
| 20090059538 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights. | 03-05-2009 |
| 20090080161 | HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARD - A heat dissipation device for dissipating heat generated by an electronic component mounted on an add-on card includes a first heat dissipation unit, a second heat dissipation unit, a third heat dissipation unit and a heat pipe. The heat pipe has an evaporating portion thermally connecting with the electronic component via the first dissipation unit, and two oppositely extending condensing portions extending through and thermally connecting with the second and third heat dissipation units. The second and third heat dissipation units are positioned at a common lengthwise side of the graphics card and separated from each other. The second and third heat dissipation units each have an L-shaped configuration. The heat pipe has two connection portions connecting the evaporating portion with the condensing portions, respectively. The connecting portions together with the evaporating portion form a U-shaped configuration. | 03-26-2009 |
| 20090097209 | DRIVER MODULE STRUCTURE - A driver module structure includes a flexible circuit board ( | 04-16-2009 |
| 20090103269 | HEAT DISSIPATING DEVICE FOR MEMORY CARD - A heat dissipating device for a memory card includes a first dissipation element and a second dissipation element. The first dissipation element is attached to one side of the memory card for dissipating heat generated by the memory card. The first dissipation element defines a hole at an end thereof. The second dissipation element is attached to the other side of the memory card for dissipating heat generated by the memory card. The second dissipation element includes a hook at an end thereof corresponding to the hole, for hooking the hole to allow the second dissipation element to rotatably connected to the first dissipation element. | 04-23-2009 |
| 20090103270 | APPARATUS FOR SECURING HEAT SINKS TO A DEVICE UNDER TEST - Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together. | 04-23-2009 |
| 20090116197 | METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, POWER SEMICONDUCTOR MODULE AND ITS JUNCTION METHOD - A power semiconductor module includes first and second insulating substrates, a power semiconductor device joined directly or through another element to opposite sides of the first and second insulating substrates and first and second heat spreaders joined with joining material having fluidity upon joining so as to put the first and second insulating substrates between the first and second heat spreaders. When the power semiconductor module is fabricated, the first and second insulating substrates are joined to the first and second heat spreaders, respectively, in the state that weight bearing on joining material is reduced by means of resilient member. | 05-07-2009 |
| 20090122493 | OPTOELECTRONIC SUBASSEMBLY WITH INTEGRAL THERMOELECTRIC COOLER DRIVER - Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC) thermally coupled to the substrate, the TEC being mounted within the housing; an optical component structurally mounted on the substrate, wherein the optical component is thermally coupled to the TEC; and a TEC driver electrically coupled to the TEC, wherein the TEC driver is configured to electrically drive the TEC, the TEC driver being mounted within the housing. | 05-14-2009 |
| 20090129029 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT - A method for manufacturing an integrated circuit is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board. | 05-21-2009 |
| 20090147480 | Heat sink and electronic apparatus using the same - A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member combines the hooking member, the elastic member, and the fin structure; wherein the hooking member may secure the heat sink onto an electronic component, and the adjustable positioning member may be used to adjust the tightness between the heat sink and the electronic component. | 06-11-2009 |
| 20090154110 | HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening assemblies. Each of the first and second heat sinks comprises an elongated base and a plurality of fins mounted on the base. The base extends beyond the fins at two lateral sides of the fins to form a first shoulder and a second shoulder located above the first shoulder in a manner such that the second shoulder of the first heat sink is superposed on the first shoulder of the second heat sink. The fastener assembly extends through the superposed first and second shoulders of the first and second heat sinks to assemble the first and second heat sinks on the printed circuit board. | 06-18-2009 |
| 20090154111 | RETICULATED HEAT DISSIPATION - Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation. | 06-18-2009 |
| 20090154112 | PACKAGING STRUCTURE OF POWER MODULE - A power module includes a substrate, a power converter and a plurality of bond pads. The substrate includes a top surface and a bottom surface. The power converter is disposed on the substrate and includes at lease one semiconductor chip package. The semiconductor chip package is disposed on the top surface of the substrate. The bond pads are disposed on the bottom surface of the substrate, wherein at least some of the bond pads are electrically connected to the power converter and the plurality of bond pads have substantially identical area. | 06-18-2009 |
| 20090161321 | MOUNTING APPARATUS FOR SECURING HEAT DISSIPATION MODULE TO CIRCUIT BOARD - A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat dissipation module, and a plurality of support devices. Each support device comprises an enlarged flange portion, a support portion extending up from an upper surface of the flange portion, and a coupling portion extending down from a lower surface of the flange portion and detachably installable to a corresponding post, thereby suspending the heat dissipation module over the socket. A plurality of sleeve bodies is for respectively receiving the posts, and configured for being sandwiched between the corresponding flange portions and the circuit board. A plurality of fasteners extending from the mounting frame is engagable with the support portions respectively. | 06-25-2009 |
| 20090168365 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a circuit board ( | 07-02-2009 |
| 20090185351 | MOUNTING APPARATUS FOR HEAT SINK - A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board. | 07-23-2009 |
| 20090213555 | HEAT DISSIPATION DEVICE - A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation device has at least one coil and at least one vibrating sheet. The coil is used to receive the intermittent power source to produce a magnetic field. One end of the vibrating sheet is fixed, and the other end is suspended over the coil. The suspended end flutters periodically under the magnetic force of the intermittent magnetic field, so as to produce an airflow. | 08-27-2009 |
| 20090244850 | THERMAL INTERFACE MATERIAL FOR COMBINED REFLOW - A combined thermal interface material and second layer interconnect reflow material and method are disclosed. | 10-01-2009 |
| 20090244851 | MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT - A mounting device ( | 10-01-2009 |
| 20090257196 | Methods and Apparatus for Heat Transfer for a Component - Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops configured to limit a bond line distance between the rigid body and the heat source. A thermal interface material may be disposed in the bond line between the heat source and the lid. The thermal interface material may be adapted to provide a thermally conductive adhesive bond between the lid and the heat source. | 10-15-2009 |
| 20090268410 | FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while live circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 10-29-2009 |
| 20090296354 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent. | 12-03-2009 |
| 20090310313 | Semiconductor module - A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member. | 12-17-2009 |
| 20100002399 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls. | 01-07-2010 |
| 20100008049 | BACK PLATE ASSEMBLY - A back plate assembly is compatible with mainboards having different specification. The back plate assembly includes a back plate and a plurality of fasteners engaging with the back plate. The back plate defines a plurality of sets of mounting holes. Each set of mounting holes is used to align with through holes in mainboard with a corresponding specification. The mounting holes are spaced from each other and each includes a first receiving hole and a second receiving hole located at a lower portion of the first receiving hole. The fasteners are interferentially fitted in a corresponding set of the mounting holes of the back plate. Each fastener includes a baffling portion received in the first receiving hole of the mounting hole, and a connecting portion extending downwardly from the baffling portion of the fastener and received in the second receiving hole of the mounting hole. | 01-14-2010 |
| 20100008050 | PLASMA DISPLAY DEVICE - A plasma display device includes a circuit board on which a driving circuit is to be mounted and a first heat sink fastened to one side surface of a semiconductor device, the first heat sink being disposed spaced apart from the circuit board, and the semiconductor device being disposed between the first heat sink and the circuit board. By improving the heat dissipation characteristics of a plasma display panel, a more stable display device can be provided and the thickness of the plasma display device can be reduced. Further, rocking of the semiconductor device can be decreased, and the possibility of damage can be reduced. | 01-14-2010 |
| 20100014254 | Printed circuit board unit and semiconductor package - A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism. | 01-21-2010 |
| 20100020503 | LID EDGE CAPPING LOAD - A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive. After the thermal interface material has and adhesive have cured, the method removes the force from near the distal ends of the lid or substrate to cause the center portion of the lid to return to a position closer to the semiconductor chip, creating a residual compressive stress in the thermal interface material thus improving thermal performance and thermal reliability. | 01-28-2010 |
| 20100027223 | SEMICONDUCTOR INTEGRATED CIRCUIT HAVING HEAT RELEASE PATTERN - Provided are a semiconductor integrated circuit having a heat release pattern in a chip so as to release heat generated inside the chip and a system board having a heat release unit used to release heat generated inside the semiconductor integrated circuit. The semiconductor integrated circuit includes: one or more output pads directly connected to an output terminal having a heat release pattern; a power supply pad supplying power; and one or more dummy pads connected to a metal line for supplying power or an internal output terminal of an internal function block, wherein the heat release pattern includes a plurality of unit contacts at the output terminal or a plurality of strip contacts having an area of about or larger than the sum of two or more of the unit contacts. | 02-04-2010 |
| 20100097768 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board contained in the housing, an integrated-circuit component mounted on the circuit board, a member for heat radiation opposed to the integrated-circuit component and thermally connected to the integrated-circuit component, a sheet metal member which fixes the member for heat radiation, and an electronic component mounted on the circuit board. The sheet metal member includes a main part opposed to the member for heat radiation, and a plurality of leg parts fixed to the circuit board. One leg part of the plurality of leg parts extends from the main part over the electronic component, and is fixed to the circuit board at a position which is farther from the integrated-circuit component than the electronic component is. | 04-22-2010 |
| 20100142155 | Preferentially Cooled Electronic Device - Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes. | 06-10-2010 |
| 20100157543 | TELEPHONY AND DIGITAL MEDIA SERVICES DEVICE - An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing. | 06-24-2010 |
| 20100165578 | Heat Sink Mount for Providing Non-Rigid Support of Overhanging Portions of Heat Sink - A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount. | 07-01-2010 |
| 20100165579 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies. | 07-01-2010 |
| 20100172105 | Heatsink Assembly - A heatsink assembly includes a heatsink having a base board which includes fins extending from a top thereof and a recessed area defined in an underside thereof. The recessed area of the heatsink is adapted for engagement with a chip set. A positioning device includes a rectangular frame that is mounted to the heatsink and includes two side plates extending downward from two opposite sides thereof. Each side plate has a hook extending from an inside thereof so as to hook the chip set. Two flexible rods extend from the two opposite sides of the rectangular frame and each flexible rod has a pressing portion which presses on the top of the base board of the heatsink. | 07-08-2010 |
| 20100172106 | Heatsink Assembly - A heatsink assembly includes a heatsink which has a base board and fins extending from a top thereof. The heatsink is directly put on the chip set. A positioning device includes a rectangular frame which is mounted to the heatsink and includes two first extensions and two second extensions extending from two pairs of opposite sides thereof. Each first extension has a hook extending from an inside thereof so as to hook the circuit board and the second extensions each have a first inclined surface engaged with the inclined surface defined in a periphery of the chip. Two flexible rods extend from the two opposite sides of the rectangular frame and each flexible rod has a pressing portion which presses on the top of the base board of the heatsink. | 07-08-2010 |
| 20100188820 | METHOD FOR ASSEMBLING MEMORY MODULE WITH HEAT DISSIPATING SHEET AND APPARATUS THEREOF - A method for assembling memory module with heat dissipating sheet includes the flowing steps: providing a heat dissipating sheet; providing a memory module having a circuit board and at least one chip arranged on the circuit board; arranging the circuit board perpendicularly on the heat dissipating sheet; and folding at least a part of the heat dissipating sheet toward the chip and adhering the part of the heat dissipating sheet to the chip by the glue. Besides, an apparatus which the method of the present invention could perform on is also provided. | 07-29-2010 |
| 20100226097 | DOUBLE BONDED HEAT DISSIPATION - Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation. | 09-09-2010 |
| 20100232114 | Solid state relay with internal heat sink - A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system. | 09-16-2010 |
| 20100246139 | SEMICONDUCTOR APPARATUS AND HEAT CONDUCTIVE SHEET - A semiconductor apparatus is comprising a circuit board with a semiconductor device surface-mounted on one surface thereof. A heatsink is disposed and fixed with a connection member and separated with a predetermined distance on one side of the circuit board opposite to the surface where the semiconductor device is mounted. A heat conductive sheet is provided between the circuit board and the heatsink and thermally connecting the semiconductor device and the heatsink through the circuit board. The heat conductive sheet is constituted as a laminate of a first member and a second member and one of the first and second members is a ceramic board whereas the other is a resin sheet material having highly heat conductive fillers mixed therein. | 09-30-2010 |
| 20100290194 | MOUNTING ASSEMBLY FOR HEAT SINK - A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes a pair of securing legs at two corners of the heat sink, and a pair of securing members. Each securing leg defines a securing hole thereon. Each securing member includes a spring thereon positioned between the corresponding securing legs and the circuit board. The securing members are secured in the corresponding securing holes to secure the heat sink to the circuit board. | 11-18-2010 |
| 20100309635 | STRUCTURE FOR MOUNTING SEMICONDUCTOR PACKAGE - A mounting structure, in which semiconductor package | 12-09-2010 |
| 20110058338 | ELECTRIC CONNECTING APPARATUS - Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity. | 03-10-2011 |
| 20110149521 | THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING COMPOSITE FILM AND STACK CHIP PACKAGE STRUCTURE UTILIZING THE SAME - Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously. | 06-23-2011 |
| 20110188208 | HEAT DISSIPATING SYSTEM - A heat dissipating system includes a circuit board, a chip module, a first clamping member, a second clamping member, and a plurality of stress adjusting members. The circuit board includes a top surface and a bottom surface opposite to the top surface. The chip module includes a base portion located on the top surface of the circuit board via solder balls and a chip disposed on the base portion. The first clamping member abuts the chip. The second clamping member abuts the bottom surface of the circuit board. The stress adjusting members extend through the second clamping member and engage with the first clamping member. | 08-04-2011 |
| 20110249407 | POWER SEMICONDUCTOR MODULE - A power semiconductor module comprises: a heat dissipation plate; an insulating wiring board having an upper electrode and a lower electrode, the lower electrode joined to the heat dissipation plate via a first solder; a semiconductor chip joined to the upper electrode via a second solder; a first low-dielectric film coating sides of the lower electrode and the first solder; a second low-dielectric film coating sides of the semiconductor chip and the second solder; a case on the heat dissipation plate and surrounding the insulating wiring board and the semiconductor chip; and an insulator filled in the case and coating the insulating wiring board, the semiconductor chip, and the first and second low-dielectric films. | 10-13-2011 |
| 20110292612 | ELECTRONIC DEVICE HAVING ELECTRICALLY GROUNDED HEAT SINK AND METHOD OF MANUFACTURING THE SAME - An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink. A method of manufacturing an electronic device includes connecting an IC package to a substrate, coupling a heat sink to the IC package and depositing a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink. | 12-01-2011 |
| 20110304991 | THERMALLY ENHANCED ELECTRONIC PACKAGE - A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages. | 12-15-2011 |
| 20110310567 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis. | 12-22-2011 |
| 20120020028 | STACKED INTERCONNECT HEAT SINK - An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core. | 01-26-2012 |
| 20120075807 | STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT - A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture. | 03-29-2012 |
| 20120113599 | HEAT SPREADER FOR IC PACKAGE, AND IC PACKAGE CLAMPER HAVING THE HEAT SPREADER - According to one aspect of the present invention, there is provided a heat spreader to be mounted on an IC package, the IC package including: a circuit board; an IC chip mounted on one surface of the circuit board; and a plurality of connection terminals formed on the other surface of the circuit board, the heat spreader including: a top wall formed into a rectangular shape; a circumferential wall formed continuously from the top wall, the circumferential wall and the top wall defining a block-like cavity for enclosing the IC chip when the heat spreader is mounted on the IC package; and ear portions formed at lengthwise central portions of a facing pair of side walls of the circumferential wall so to extend outwardly from bottom edges of the facing pair of side walls, respectively. | 05-10-2012 |
| 20120127669 | DEVICE MOUNTING SYSTEMS AND METHODS - A device mounting system is provided. The device | 05-24-2012 |
| 20120162922 | COOLING OF COPLANAR ACTIVE CIRCUITS - In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses. | 06-28-2012 |
| 20120162923 | THERMAL LOADING MECHANISM - Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket, the package including a substrate, a die, and a heat spreader, the die positioned between the substrate and the heat spreader. The assembly also includes a load plate positioned on the heat spreader, the load plate covering a majority of the heat spreader, the load plate applying a force to the heat spreader that couples the package to the socket. Other embodiments are described and claimed. | 06-28-2012 |
| 20120162924 | Integrated Semiconductor Outline Package - A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing. | 06-28-2012 |
| 20120182695 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls. | 07-19-2012 |
| 20120195006 | Method and system for cooling of integrated circuits - A system of motherboard, socket and convective cooling cells is providing cooling of both sides—top and bottom—of an integrated circuit, which keeps the temperature deviation inside circuit up to 4 times lower and is up to 4 times more efficient than at the cooling of the same circuit from only one of its side. | 08-02-2012 |
| 20120201007 | SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE - A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad. | 08-09-2012 |
| 20120224328 | INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF - An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity. | 09-06-2012 |
| 20120236506 | PASSIVE, LOW-PROFILE HEAT TRANSFERRING SYSTEM - A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel. | 09-20-2012 |
| 20130003312 | PACKAGE/HEATSINK SYSTEM FOR ELECTRONIC DEVICE - An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin. | 01-03-2013 |
| 20130003313 | SYSTEM WITH STABILIZED HEATSINK - An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface. | 01-03-2013 |
| 20130003314 | MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR - Provided is a substrate wherein wiring layers laminated onto the top and bottom surfaces of a core layer are connected to each other by a simple means. Also provided is a method for manufacturing said substrate. In the provided substrate ( | 01-03-2013 |
| 20130016477 | Electronic Assembly Including Die on Substrate With Heat Spreader Having an Open Window on the DieAANM Yokoya; SatoshiAACI NiceAACO FRAAGP Yokoya; Satoshi Nice FRAANM Simmons-Matthews; Margaret RoseAACI RichardsonAAST TXAACO USAAGP Simmons-Matthews; Margaret Rose Richardson TX US - An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader having an inner open window is on the bottomside of the TSV die. Bonding features are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top of the heat spreader that allows a top die to be bonded thereto. | 01-17-2013 |
| 20130016478 | ELECTRONIC PACKAGE WITH THERMAL VIAS, AND FABRICATION PROCESSAANM Gagnieux; JeanAACI MontaudAACO FRAAGP Gagnieux; Jean Montaud FRAANM Pailhes; MaximeAACI La BuisseAACO FRAAGP Pailhes; Maxime La Buisse FR - An electronic package includes at least one heat-transfer element interposed between a front side of an integrated-circuit chip and a back side of a heat-transfer plate. An encapsulation block has a portion lying between the front side of the integrated-circuit chip and the back side of the heat-transfer plate. The portion embeds the heat-transfer element. Another heat transfer element is interposed between a front side of a electrical-connection support plate and a rim portion of the heat-transfer plate. | 01-17-2013 |
| 20130016479 | SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE - The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite. | 01-17-2013 |
| 20130077256 | HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE - Disclosed is a heat dissipation structure of dissipating heat through a heat dissipation sheet disposed between a cover member and an IC chip, which is a heat-generating element, mounted on a substrate. Specifically disclosed is a heat dissipation structure of an electronic device that can ensure that the heat dissipation sheet is reliably disposed between the IC chip and the cover member without falling off upon being attached to the IC chip and that dissipates heat sufficiently, thereby improving reliability of the electronic device. In order to achieve this heat dissipation structure, a heat dissipation sheet ( | 03-28-2013 |
| 20130083488 | SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS - A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board. | 04-04-2013 |
| 20130083489 | ELECTRONIC SYSTEM FOR REFLOW SOLDERING - An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering. | 04-04-2013 |
| 20130100614 | ELECTRONIC DEVICE USING FASTENER FOR FIXING - An electronic device includes a circuit board, a communication chip, a ceramic heat sink and an elastic fastener. The circuit board has first and second fixing members. The communication chip is disposed on the circuit board. The ceramic heat sink disposed on the communication chip has first and second lateral sides. The elastic fastener includes a first extension portion, a second extension portion and a clamping portion. The first extension portion extending to the first fixing member from the first lateral side is engaged with the first fixing member to generate a first fastening force. The second extension portion extending to the second fixing member from the second lateral side is engaged with the second fixing member to generate a second fastening force. The clamping portion applies a force on the ceramic heat sink to tightly press the ceramic heat sink on the communication chip. | 04-25-2013 |
| 20130107463 | ELECTRONIC DEVICE AND DISPLAY DEVICE | 05-02-2013 |
| 20130128463 | HEAT SINK ASSEMBLY - A heat sink assembly is for attachment to a chip of a printed circuit board. The heat sink assembly includes a heat sink, a frame and a plurality of fasteners. The heat sink is attached on the chip, and includes a base and a plurality of fins. The fins define a plurality of cutouts. The frame includes beams, locking portions, and extensions. The locking portions extend from the beams. The extensions perpendicularly extend from the locking portions, and are received in the cutouts. The fasteners extend through the extensions to hold the base against the chip. | 05-23-2013 |
| 20130141872 | HEAT SWITCH ARRAY FOR THERMAL HOT SPOT COOLING - A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity. | 06-06-2013 |
| 20130176683 | ELECTRONIC ASSEMBLY - An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern. | 07-11-2013 |
| 20130182392 | ELECTRONIC DEVICE WITH HEAT DISSIPATING AND ELECTROMAGNETIC SHIELDING MASK - An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel. | 07-18-2013 |
| 20130194752 | SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM - In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature. | 08-01-2013 |
| 20130242507 | HEAT-DISSIPATING ASSEMBLIES AND METHODS OF ASSEMBLING HEAT-DISSIPATING ASSEMBLIES - Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs. | 09-19-2013 |
| 20130286595 | THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE - A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink. | 10-31-2013 |
| 20130314877 | SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT - A semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a heat conductor that has a body section joined to the semiconductor chip via a metal joining material and a leg section that surrounds the semiconductor chip, the leg section extending from the body section to the package substrate and having an end bonded to the package substrate; and stress reducing members configured to reduce stress exerted on the metal joining material located on the semiconductor chip, the stress reducing members being disposed on the package substrate at positions corresponding to corners of the semiconductor chip inside the leg section and joined to the package substrate and the body section. | 11-28-2013 |
| 20130335923 | PCB for LCD Device and LCD Device - The invention relates to the field of LCDs, and more particularly to a PCB for an LCD device and an LCD device. The PCB includes a front face and a back face; the front face of the PCB is a face for densely arranging components, and the back face is a face without densely arranged components; the back face of the PCB is provided with a jumper wire for dissipating heat, and the jumper wire is connected with a terminal of the component. The heat of the component is transmitted to the jumper wire by the terminal, and the jumper wire is used for auxiliarily strengthening heat dissipation. Because the back face of the PCB is the face without densely arranged components, the temperature of the back face is lower than that of the front face of the PCB, and the temperature difference between the jumper wire and the environmental of the back face of the PCB is large. Thus, the heat is rapidly transmitted, and the heat dissipating effect is significantly improved. | 12-19-2013 |
| 20130343003 | HEAT DISSIPATION DEVICE WITH FASTENER AND FLANGE - A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base. | 12-26-2013 |
| 20140002999 | ELECTRONIC ASSEMBLY WITH FLEXIBLE FIXTURES FOR SPREADING LOAD | 01-02-2014 |
| 20140063744 | Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance - A power FET ( | 03-06-2014 |
| 20140078677 | Heat Sinking and Electromagnetic Shielding Structures - An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat. | 03-20-2014 |
| 20140126156 | CIRCUIT MODULE - In a circuit module, a multilayer substrate has a core layer made of a metal, a filter device is stored in a storage portion of the core layer, the filter device and a power amp IC are arranged such that a parallel projection region of the filter device is completely covered by a parallel projection region of the power amp IC, and the power amp IC is connected to the upper surface (one surface in the thickness direction) of the core layer through a plurality of thermal vias provided in the multilayer substrate. | 05-08-2014 |
| 20140146480 | DEVICES FOR COOLING AND POWER - Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials. | 05-29-2014 |
| 20140160684 | COOLING FOR ELECTRONIC COMPONENTS - Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board). | 06-12-2014 |
| 20140168902 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat. | 06-19-2014 |
| 20140233188 | MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE USING SUCH STRUCTURE - A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive. | 08-21-2014 |
| 20140254103 | ELECTRONIC CONTROL UNIT - A substrate of an electronic control unit has a control region on which a control component is disposed and a power region on which a power component is disposed. Substrate-fixing portions of a housing project from a bottom portion, and the substrate is fixed to the substrate-fixing portions. A heat radiating portion extends from the bottom portion. Semiconductor modules are fixed to a first outer surface and a second outer surface of the heat radiating portion, the first outer surface being on a side opposite to the power component. The heat radiating portion is located between the semiconductor modules and the power component. Therefore, heat interference between the semiconductor modules and the power component is reduced, and a heat radiation performance improves. | 09-11-2014 |
| 20140268577 | CHIP PACKAGE CONNECTOR ASSEMBLY - This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly. | 09-18-2014 |
| 20140268578 | Electronic Device With Heat Dissipating Electromagnetic Interference Shielding Structures - An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate. | 09-18-2014 |
| 20140268579 | ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY INSULATING COMPOSITION - Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition. | 09-18-2014 |
| 20140321062 | HEAT SINK - A heat sink that is suitable for mounting on a printed circuit board (PCB) and dissipating heat from an integrated chip (IC). | 10-30-2014 |
| 20140321063 | Directly Cooled Substrates for Semiconductor Modules and Corresponding Manufacturing Methods - A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided. | 10-30-2014 |
| 20140355214 | ELECTRONIC DEVICE - An electronic device for dissipating heat generated from an electronic component includes a heat dissipation tape affixed on a heat transfer path that receives transferred heat generated from the electronic component. The heat dissipation tape has at least one heat dissipation fin formed by folding back a portion of the heat dissipation tape. | 12-04-2014 |
| 20140376189 | INTERPOSER, METHOD FOR MANUFACTURING INTERPOSER, AND SEMICONDUCTOR DEVICE - Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members. | 12-25-2014 |
| 20150016064 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - The purpose is to provide a fin-integrated type semiconductor device that is a simple structure and has a high heat dissipating characteristic, and to provide a manufacturing method therefor. The semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first plane and a bulge portion formed thereon to encircle the plurality of fins; an insulation layer formed on the second major plane of the base plate; a circuit pattern fixed to the insulation layer; a semiconductor element connected to the circuit pattern; and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins. | 01-15-2015 |
| 20150043167 | HEAT SINKS WITH INTERDIGITATED HEAT PIPES - A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions). | 02-12-2015 |
| 20150043168 | Winged Heat Sink - A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board. | 02-12-2015 |
| 20150062825 | Overmolded substrate-chip arrangement with heat sink - An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate. | 03-05-2015 |
| 20150077944 | MULTICHIP MODULE WITH STIFFENING FRAME AND ASSOCIATED COVERS - A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings. | 03-19-2015 |
| 20150085446 | SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME - In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer. | 03-26-2015 |
| 20150124410 | POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE - In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste. | 05-07-2015 |
| 20150131234 | CIRCUIT BOARD AND HEAT DISSIPATION DEVICE THEREOF - A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device. | 05-14-2015 |
| 20150327397 | SEMICONDUCTOR DEVICE, HEAT CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation component arranged on the wiring substrate. The heat dissipation component includes a cavity that accommodates the semiconductor element and includes an inner surface opposing the wiring substrate. The semiconductor element is located between the inner surface of the cavity and the wiring substrate. A heat conductor is bonded to the semiconductor element and to the inner surface of the cavity. The heat conductor includes linear heat conductive matters arranged between the semiconductor element and the heat dissipation component. A first alloy layer bonded to the semiconductor element covers lower ends of the heat conductive matters. The heat dissipation component includes a through hole extending through the heat dissipation component toward the heat conductor from a location outside of the heat conductor in a plan view. | 11-12-2015 |
| 20150348867 | TRANSISTOR, HEAT SINK STRUCTURE THEREOF AND METHOD FOR MANUFACTURING SAME - A transistor is provided, which includes: a semiconductor growth substrate and a semiconductor thermoelectric effect device, wherein the semiconductor thermoelectric effect device contains a semiconductor compound layer, a metal layer, a heat conducting layer, a thermocouple heat conducting device and a heat sink layer, the semiconductor compound layer is grown on the semiconductor growth substrate, the metal layer is grown on the semiconductor compound layer, the heat conducting layer is grown on the metal layer, the thermocouple heating conducting device is grown on the heat conducting layer, and the heat sink layer is grown on the other side surface of the thermocouple heat conducting device opposite to the heat conducting layer. The thermocouple heating conducting device may further contain power supply arms which are grown on the heat conducting layer and are electrically connected with the thermocouple heat conducting device. | 12-03-2015 |
| 20150364399 | CHIP PACKAGE ASSEMBLY AND METHOD TO USE THE ASSEMBLY - A chip package assembly and its use for mounting and demounting of at least one semiconductor chip that includes a flange and a substrate, where the at least one chip and the substrate are arranged on one side of the flange, and where the flange is composed of an electrical and thermally conducting material. | 12-17-2015 |
| 20160027715 | SEMICONDUCTOR PACKAGE - A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device. | 01-28-2016 |
| 20160035642 | APPARATUS, SYSTEMS AND METHODS FOR LIMITING TRAVEL DISTANCE OF A HEAT SINK - A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked. | 02-04-2016 |
| 20160037692 | SHIELD TO IMPROVE ELECTROMAGNETIC INTERFERENCE (EMI) SUPPRESSION CAPABILITY - An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material. | 02-04-2016 |
| 20160043017 | PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING CONDUCTIVE HEAT TRANSFER - A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material. | 02-11-2016 |
| 20160135281 | ASSEMBLIES AND METHODS FOR DIRECTLY CONNECTING INTEGRATED CIRCUITS TO ELECTRICALLY CONDUCTIVE SHEETS - An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed. | 05-12-2016 |
| 20160143179 | ELECTRICAL ASSEMBLY WITHIN A CONNECTOR HOUSING - An electrical assembly configured to be fixed in a housing of an electrical connector includes an electrical package disposed on a substrate and electrically connected to the substrate. The electrical assembly also includes a conductor terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package. | 05-19-2016 |
| 20160150662 | Electrical Circuit and Method for Producing an Electrical Circuit for Activating a Load - The current embodiments provide an electrical circuit for controlling an electric motor for a vehicle. The electrical circuit may have a circuit board with a first surface and a second surface opposite the first surface, an intermediate circuit capacitor arranged on the first surface, and a power semiconductor arranged on the second surface and electrically connected with the intermediate circuit capacitor for providing electrical energy to the electric motor. The intermediate circuit capacitor and the power semiconductor may be arranged opposite to each other with respect to the circuit board. | 05-26-2016 |
| 20160159037 | HEAT DISSIPATING SHEET AND HEAT DISSIPATING STRUCTURAL BODY USING SAME - A heat dissipation sheet includes a thermally conductive resin sheet plastically deformable at 25° C., and a thermally conductive film bonded to the thermally conductive resin sheet and having a higher thermal conductivity than the thermally conductive resin sheet. The heat dissipation sheet has excellent heat dissipation characteristics. | 06-09-2016 |
| 20160174416 | ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER | 06-16-2016 |
| 20160183374 | CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES | 06-23-2016 |
| 20160183375 | SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS | 06-23-2016 |
