| Entries |
| Document | Title | Date |
|---|
| 20080239676 | THERMAL TRANSFER DEVICE - A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an upper surface to the inner surface of the case panel. A cavity and piston in the base and the translating portion may provide complementary guide surfaces to constrain movement of the translational portion generally to a vertical dimension. A biasing element may urge the translational portion upward. The translational portion and the external panel may allow movement of their respective surfaces relative to one another. The cavity may include a port allowing air to pass into and out of the cavity. The upper surface of the translational portion may be tiltable with respect to the base. An adhesive layer may couple the base and the power dissipating device. | 10-02-2008 |
| 20080273309 | RETAINING TOOL FOR A HEAT SINK - A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is angularly lifted for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively. The first elastic part extends curvedly a circular bend outward the heat sink and the second elastic part extending curvedly another bend inward the heat sink and free ends of both the elastic parts are joined to two opposite lateral sides of an engaging part for controlling the engaging force evenly and decreasing plastic deformation. | 11-06-2008 |
| 20080298024 | Heat spreader and method for manufacturing the same, and semiconductor device - On a connection surface | 12-04-2008 |
| 20080316711 | VLSI HOT-SPOT MINIMIZATION USING NANOTUBES - The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area. The heat conductivity of the nanotubes is greater than the heat conductivity of the matrix material, with the distal ends of the nanotubes exposed to present a distal surface comprising the first heat conducting means for direct contact with a medium comprising a cooling fluid. The inventors also disclose processes for manufacturing and using the device and products produced by the processes. | 12-25-2008 |
| 20090016028 | METHOD OF OBTAINING ENHANCED LOCALIZED THERMAL INTERFACE REGIONS BY PARTICLE STACKING - Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces. | 01-15-2009 |
| 20090034206 | WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES - An embodiment of the present invention is a technique to fabricate a package. A heat spreader (HS) array on a HS support substrate is formed. The HS array has a plurality of heat spreaders. A diced wafer supported by a wafer support substrate (WSS) is formed. The diced wafer has a plurality of thin dice. The thin dice in the diced wafer are bonded to the heat spreaders in the HS array to form HS-bonded thin dice between the HS support substrate and the WSS. | 02-05-2009 |
| 20090040732 | PRINTED CIRCUIT BOARD STRUCTURE FOR HEAT DISSIPATION - A printed circuit board structure for heat dissipation of an integrated circuit includes a printed circuit board having an opening, and a thermal conductive material disposed within the opening, wherein the integrated circuit is disposed over the opening and the thermal conductive material is thermally connected to the integrated circuit. The opening can be designed to have a specific shape to allow the opening to be completely filled by the thermal conductive material during a fillet process, therefore obtaining better heat dissipation performance and protecting the integrated circuit from over heating. | 02-12-2009 |
| 20090219698 | Heat Spreader for a multi-chip package - Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed. | 09-03-2009 |
| 20090284932 | Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry - The present invention thermally enhanced package with embedded metal slug and patterned circuitry discloses a thermal enhanced package with an embedded metal slug that can be easy directly assembled to the printed circuit board to significantly improve package's thermal dissipation efficiency through the assistance of metal traces in the application board. | 11-19-2009 |
| 20100002398 | Multimode signaling on decoupled input/output and power channels - A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point. | 01-07-2010 |
| 20100033935 | Method for Direct Heat Sink Attachment - A system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink's mechanical motion while simultaneously allowing for thermal expansion of the heat sink. | 02-11-2010 |
| 20100039777 | MICROELECTRONIC PACKAGE WITH HIGH TEMPERATURE THERMAL INTERFACE MATERIAL - A microelectronic package is provided. The microelectronic package includes a substrate, a die coupled to a top surface of the substrate and a integrated heat spreader thermally coupled to the die, wherein the integrated heat spreader comprises integrated heat spreader walls. The microelectronic package also includes a thermal interface material disposed between the die and the integrated heat spreader and an underfill material disposed between the integrated heat spreader and the substrate, wherein the underfill material is disposed within gaps between the integrated heat spreader walls, the die and the thermal interface material. | 02-18-2010 |
| 20100091463 | COOLING BODY - The invention relates to a cooling body for power electronic modules or for semiconductor elements having a flat metal heat dissipation plate, wherein the heat dissipation plate on the side facing the power electronic module or the semiconductor element comprises a surface structured in the manner of a matrix and having protruding elevations, wherein the heat dissipation plate and surface structured in the manner of a matrix are made out of one piece. | 04-15-2010 |
| 20100284153 | Twist-Secured Assembly of a Power Semiconductor Module Mountable on a Heat Sink - A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N | 11-11-2010 |
| 20100321896 | ELECTRICAL POWER COMPONENT ATTACHED TO CHASSIS OF AN ELECTRICAL POWER APPARATUS - There is provided an electrical power component attached to a chassis of an electrical power apparatus, including a semiconductor element constituting an electronic circuit, and cooling unit having a planar shape which cools the semiconductor element and serves as a reinforcing material for increasing strength of the chassis. | 12-23-2010 |
| 20100328899 | VLSI HOT-SPOT MINIMIZATION USING NANOTUBES - The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area. The heat conductivity of the nanotubes is greater than the heat conductivity of the matrix material, with the distal ends of the nanotubes exposed to present a distal surface comprising the first heat conducting means for direct contact with a medium comprising a cooling fluid. The inventors also disclose processes for manufacturing and using the device and products produced by the processes. | 12-30-2010 |
| 20110007477 | ENHANCEMENT OF THERMAL INTERFACE CONDUCTIVITIES WITH CARBON NANOTUBE ARRAYS - A method of forming a well-anchored carbon nanotube (CNT) array, as well as thermal interfaces that make use of CNT arrays to provide very high thermal contact conductance. A thermal interface is formed between two bodies by depositing a continuous array of carbon nanotubes on a first of the bodies so that, on mating the bodies, the continuous array is between surface portions of the first and second bodies. The thermal interface preferably includes a multilayer anchoring structure that promotes anchoring of the continuous array of carbon nanotubes to the first body. The anchoring structure includes a titanium bond layer contacting the surface portion of the first body, and an outermost layer with nickel or iron catalytic particles from which the continuous array of carbon nanotubes are nucleated and grown. Additional thermal interface materials (TIM's) can be used in combination with the continuous array of carbon nanotubes. | 01-13-2011 |
| 20110085304 | Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias - A thermally conductive heat spreader is disclosed comprising one or more electrically isolated through-hole vias to provide, for instance, one or more thermal management layers having one or more electrically insulated and electrically conductive through-hole vias in a microelectronic module for the rerouting of one or more electrical signals to one or more layers in a stack of integrated circuit chip layers. | 04-14-2011 |
| 20110096507 | Microelectronic thermal interface - An improved thermal interface between an integrated circuit chip and a heat sink comprises a copper grid embedded in a layer of a solder material that has a fusion temperature higher than the maximum operating temperature of the semiconductor chip, and bonds to the semiconductor chip and the heat sink when heated to the fusion temperature of the solder material in the presence of a soldering flux. The copper grid has high thermal conductivity so that the amount of solder material needed for an efficient thermal interface is reduced and solder materials with less expensive components may be used. The copper grid also tends to mitigate local hot spots by enhancing lateral heat transfer, and inhibits solder spreading during formation of the thermal interface. | 04-28-2011 |
| 20110157835 | Heat sink assembly - A heat sink assembly is provided. The heat sink assembly comprises a heat sink and a clip. The heat sink comprises a heat-dissipating baseboard and a plurality of heat-dissipating plates. The heat-dissipating baseboard is adapted to a heating element. The heat-dissipating plates are formed perpendicularly on the heat-dissipating baseboard and parallel to each other. The clip comprises a central portion, two winding portions and two locking portions. The central portion is placed in a containing space between two of the heat-dissipating plates and is riveted on the heat-dissipating baseboard. The length of the central portion is substantially the same as the length of the heating element. The winding portions are connected to the two ends of the central portion respectively and aren't contacted to the heat-dissipating baseboard. The locking portions are formed substantially perpendicularly on the two winding portions and each has a hook stretching out in opposite directions. | 06-30-2011 |
| 20110211314 | High-density integrated circuit module structure - A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs. | 09-01-2011 |
| 20110228484 | ELECTRICAL COMPONENT THERMAL MANAGEMENT - Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink. | 09-22-2011 |
| 20110310566 | FLUX-FREE DETACHABLE THERMAL INTERFACE BETWEEN AN INTERGRATED CIRCUIT DEVICE AND A HEAT SINK - A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member. | 12-22-2011 |
| 20120008283 | RUGGEDIZED COMPUTER AND ASPECTS THEREOF - A mechanical and thermal assembly adapted to absorb heat from a delicate, heat-producing structure having a planar surface includes a slide plate in thermal contact to said planar surface, and being held in place by a resilient system that permits, but gently resists, movement perpendicular to said planar surface and a thermal mass, suspended over said slide plate, but in thermal contact to said slide plate, so that said delicate, heat-producing structure is not damaged due to force applied from said thermal mass through said slide plate to said structure. | 01-12-2012 |
| 20120014069 | POWER MODULE - A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced. | 01-19-2012 |
| 20120020027 | Tiered Integrated Circuit Assembly and a Method for Manufacturing the Same - A tiered integrated circuit (IC) assembly includes stacks of a limited number of ICs coupled to each other and arranged in a first direction across a base tier and a second tier. The base tier includes ICs and a data bridge. Each of the ICs includes a respective array of through silicon vias (TSVs) arranged in parallel with the first direction. The data bridge includes submicron metal interconnects (densely spaced electrical conductors) arranged in a plane that is substantially orthogonal to the first direction. The second tier is adjacent to the base tier and includes respective high-performance ICs different from the ICs of the base tier. The TSVs provide power and ground paths to the ICs in the second tier. In an example embodiment, the ICs in the second tier support one or more data bridges for connecting adjacent stacks. | 01-26-2012 |
| 20120033384 | GRAPHITE WRAPPED HEAT SPREADING PILLOW - A cooling device and method for dissipating heat from a heat-generating component to a surface or object with high heat capacity, thereby reducing the formation of localized temperature buildup, is disclosed. In one embodiment, the cooling device includes a highly conductive and flexible graphite sheet wrapped around a core of flexible material like an elastomer or foam. The pillow thus formed is thereafter placed between the heat-generating component and heat spreading metal surface, such that the two flat wide surfaces of the pillow contact the flat surfaces of those two objects. Due to the high thermal conductivity of the graphite sheet along its surface, the heat transferred from the heat generating component travels along the sheet, curving around the foam sheet and traveling to the opposite side, which is in contact with the heat sinking surface, thus conducting the heat away from the source. | 02-09-2012 |
| 20120044650 | DISPLAY APPARATUS - The present invention relates to a display apparatus, which comprises: a display panel; a front filter which is arranged on the front side of a display module, wherein the display panel and the front filter are spaced from each other at an interval of 3 mm or less. | 02-23-2012 |
| 20120063096 | SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG - To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug. | 03-15-2012 |
| 20120069525 | ASSEMBLED STRUCTURE OF ELECTRONIC COMPONENT AND HEAT-DISSIPATING DEVICE - An assembled structure includes an electronic component, a heat-dissipating device and a stepped isolation member. The electronic component has a first perforation. The heat-dissipating device has a second perforation corresponding to the first perforation of the electronic component. The stepped isolation member includes a first segment, a second segment and a third segment. The outer diameter of the first segment is smaller than the outer diameter of the second segment, and the outer diameter of the second segment is smaller than the outer diameter of the third segment. The first segment is partially accommodated within the first perforation of the electronic component, the second segment is arranged between the first segment and the third segment and engaged with the second perforation of the heat-dissipating device, and the third segment is contacted with the heat-dissipating device. | 03-22-2012 |
| 20120170223 | ORGANIC ELECTROLUMINESCENCE DISPLAY MODULE - An organic electroluminescence display module includes a display panel including a display region and a pad region, a mold frame supporting the display panel and including a recess in a region corresponding to the pad region, and an accommodation guide hole in an edge of the recess, a driving integrated circuit chip disposed between the display panel and the accommodation guide hole, and a cover installed over the recess, a metal member being inserted in the cover. A portion of the metal member contacts the driving integrated circuit chip, and another portion of the metal member is exposed to an outside of the organic electroluminescence display module. | 07-05-2012 |
| 20120218718 | LOWER PROFILE HEAT DISSIPATING SYSTEM EMBEDDED WITH SPRINGS - A heat dissipating system adapted to dissipate heat generated from an electrical package mounted onto a socket connector, comprises a clip defining a downward lower pressing portion; and a heat dissipating device disposed under the clip, being adapted to in contact with a surface of the electrical package and embedded with a number of springs evenly disposed on an upper surface thereof adapted to be pressed by the pressing portion. | 08-30-2012 |
| 20120327605 | HEAT-DISSIPATING MODULE AND ASSEMBLED STRUCTURE OF HEAT-DISSIPATING MODULE AND INTEGRATED CIRCUIT CHIPSET - An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset. | 12-27-2012 |
| 20130003310 | CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS - A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip. | 01-03-2013 |
| 20130003311 | SYSTEM WITH SHARED HEATSINK - First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached. | 01-03-2013 |
| 20130063899 | HEAT DISSIPATING STRUCTURE OF ELECTRONIC APPARATUS - Disclosed is a heat dissipation structure of an electronic device that has an IC chip that is a heat generating element mounted on a substrate and a heat dissipation sheet disposed between the IC chip and a cover member so as to dissipate heat. In such a heat dissipation structure, even if variation in a gap between the IC chip and the cover member is generated, the heat dissipation sheet can come in contact with the IC chip and with the cover member with appropriate pressure. This way, heat is sufficiently dissipated, and therefore, reliability of the electronic device can be improved. A heat dissipation sheet ( | 03-14-2013 |
| 20130148305 | DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP - An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer. | 06-13-2013 |
| 20130250522 | HEAT SINK PROFILE FOR INTERFACE TO THERMALLY CONDUCTIVE MATERIAL - A heat sink employs a scalloped surface profile to facilitate interface to thermally conductive materials. The scalloped surface profile reduces the surface area initially as the thermally conductive material is compressed for assembly. The reduced surface area allows the required compression force to be decreased, which helps reduce the risk of damages to the heat generating devices due to excessive force. The scalloped surface profile increases the final surface area in contact with the thermally conductive material after assembly. The increased final surface area helps improve the transfer capacities of the heat sink. | 09-26-2013 |
| 20130294032 | THROUGH-HOLE MOUNTING SYSTEM WITH HEAT SINKING ELEMENTS CLAMPED TO ONE ANOTHER AGAINST INSULATING BODY - An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device. | 11-07-2013 |
| 20130308277 | TWO-PHASE HEAT TRANSFER ASSEMBLIES AND POWER ELECTRONICS MODULES INCORPORATING THE SAME - A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter. | 11-21-2013 |
| 20140016271 | ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER - An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure. | 01-16-2014 |
| 20140022733 | Storage Device - A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device. | 01-23-2014 |
| 20140043768 | PACKAGE RETENTION FRAME - The present invention provides embodiments of a package retention frame. One embodiment of the package retention frame is configured for deployment adjacent a top surface of an integrated circuit package. A grid of contacts is on a bottom surface of the integrated circuit package. The package retention frame when deployed substantially maintains alignment of the grid of contacts with a grid of pins in a socket. An outer boundary of the package retention frame is substantially encompassed by an outer boundary of the socket. | 02-13-2014 |
| 20140078676 | Display Device - The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected with the driving chip to dissipate the heat generated by the driving chip. Through the said method, the display device according to the present invention is provided with the heatsink connected with the driving chip to dissipate the heat generated by the driving chip, which improves the stability and reliability of the driving chip. | 03-20-2014 |
| 20140334106 | BULK AMORPHOUS ALLOY HEAT SINK - Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink. | 11-13-2014 |
| 20160027717 | INTEGRATED THERMOELECTRIC COOLING - Embodiments of the present disclosure describe techniques and configurations for integrated thermoelectric cooling. In one embodiment, a cooling assembly includes a semiconductor substrate, first circuitry disposed on the semiconductor substrate and configured to generate heat when in operation and second circuitry disposed on the semiconductor substrate and configured to remove the heat by thermoelectric cooling. Other embodiments may be described and/or claimed. | 01-28-2016 |
