| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361716000 | Plural | 18 |
| 20090052141 | System and Method for Supporting One or More Heat-Generating Electrical Devices - An apparatus and method for supporting a plurality of components, at least one of which is a heat-generating electrical device such as a power semiconductor device, are disclosed. In some embodiments, the apparatus includes a first structure having a first surface on one side of the structure configured for interfacing a first of the plurality of components and a second surface on another side of the structure, and also includes a second structure capable of receiving the first structure, where one of the second surface and an additional surface of the second structure includes a tip that is in contact with the other of those surfaces. The apparatus further includes at least one component configured to assist in retaining the first and second structures relative to one another, where notwithstanding the at least one component the first structure is capable of pivoting relative to the second structure about the tip. | 02-26-2009 |
| 20090284931 | NESTED FIN INTEGRAL HEAT SINK ASSEMBLY FOR MULTIPLE HIGH POWER ELECTONIC CIRCUIT BOARD MODULES - A method and apparatus for heat sinking for multiple high power circuit board modules, is provided. One implementation involves providing a compact nested fin integral heat sink assembly for each high power circuit board module, and positioning fin sections on the heat sink assembly such that a plurality of nested fin sections emanate from each board side heat spreader plate of the assembly, thereby providing efficient airflow gap, pressure drop, and heat sink base spreading performance. The fin section can be placed essentially directly over high power components on each board module to minimize spreading resistance in a heat sink base of the assembly. The fin sections on each board module side provide channel depth without extending from an opposite side heat sink base, thereby increasing fin surface area for each local region of fins from either heat sink base. | 11-19-2009 |
| 20100265664 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 10-21-2010 |
| 20110069457 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 03-24-2011 |
| 20120002372 | COMPOSITE COMPONENT AND METHOD FOR PRODUCING A COMPOSITE COMPONENT - A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer. | 01-05-2012 |
| 20120069524 | COOLED ELECTRIC UNIT - An electric unit, having at least one cooler structure and at least one electric module with at least one electric element on a metal-ceramic substrate. | 03-22-2012 |
| 20120229985 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 09-13-2012 |
| 20120250259 | COOLING SYSTEM FOR AN ELECTRONIC RACK - The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis. | 10-04-2012 |
| 20120327604 | MODULAR DIRECT-CURRENT POWER CONVERSION SYSTEM AND DIRECT-CURRENT POWER CONVERSION MODULE THEREOF - A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal. | 12-27-2012 |
| 20130077255 | SEMICONDUCTOR CONTROL DEVICE - A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space. | 03-28-2013 |
| 20130301223 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES - Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe. | 11-14-2013 |
| 20140104790 | Power Modules and Power Module Arrays Having a Modular Design - Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader. | 04-17-2014 |
| 20140362537 | Power Modules and Power Module Arrays Having A Modular Design - Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader. | 12-11-2014 |
| 20150062824 | SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE - A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module. | 03-05-2015 |
| 20150138732 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 05-21-2015 |
| 20150382508 | SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES - A system includes an electrical enclosure, a first electrical unit, a first electrical module, a first heat spreader, and a heat sink. The first electrical unit is removably disposed within the electrical enclosure, and the first electrical unit includes a first surface opposite to a second surface. The first electrical module is removably disposed within the first electrical unit, and the first electrical module is inserted into the first electrical unit in a first direction from the first surface to the second surface. The first heat spreader is coupled to the first electrical module, and the first heat spreader comprises a first tapered coupling. The heat sink includes a second tapered coupling. The second tapered coupling is couples with the first tapered coupling of the first heat spreader to form a physical thermal connection that facilitates heat transfer between the first electrical module and the heat sink. | 12-31-2015 |
| 20160037671 | MODULAR POWER DEVICE - A modular power device is used for mounting on a main plate. The modular power device includes a first substrate, a driving module, and a converting module. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction. The driving module is located on one side of the first substrate, the converting module is located on the other side of the first substrate, and includes a second substrate parallel to the main plate, wherein two opposite sides of the first substrate are inserted into the main plate and the second substrate. A length of the converting module is equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 02-04-2016 |
| 20160198586 | DIFFERENT THERMAL ZONES IN AN OPTO-ELECTRONIC MODULE | 07-07-2016 |
