Entries |
Document | Title | Date |
20080278917 | HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME - A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB. | 11-13-2008 |
20080291637 | SMALL-SIZED COMMUNICATION MODULE PACKAGE - A small-sized communication module package mountable on a main board is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer in contact with the thermal conductive layer for enhancing heat dissipation. | 11-27-2008 |
20080298023 | ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THEREOF - An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate. | 12-04-2008 |
20090002951 | SYSTEM HAVING A HEAT TRANSFER APPARATUS - A system including a heat transfer apparatus is disclosed. One embodiment provides for an electronic device and a heat transfer apparatus including a heat distribution plate with a first surface being at least in part in thermal communication with the electronic device. The thermal conductivity of the heat distribution plate is higher in a direction substantially parallel to the first surface than in a direction perpendicular to the first surface. | 01-01-2009 |
20090067135 | Semiconductor Package Having Socket Function, Semiconductor Module, Electronic Circuit Module and Circuit Board with Socket - Disclosed is a semiconductor package | 03-12-2009 |
20090091892 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first output unit disposed thereon; and a controller configured to control the output units. | 04-09-2009 |
20090129027 | INTEGRATED NON-ISOLATED VRM AND MICROPROCESSOR ASSEMBLY - The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter high 1″×1″ regulator. Such regulators could be populated as QFP ICs are on all system boards. The present invention is based on a single VRM chip, PBGA multilayer board with processor signal pads and power points. The multilayer board periphery has SMD components such as ceramic capacitors, ICs, MOSFETs and a rectangular metal heat sink along with ferrite cores which sandwich the multilayer board and SMDs to form inductors for the multiphase solution. | 05-21-2009 |
20090129028 | Power module and method of fabricating the same - Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other. | 05-21-2009 |
20090135565 | Assembly Device and Assembly Method for a Cooling Element - A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts. | 05-28-2009 |
20090284930 | MODULAR HEATSINK MOUNTING SYSTEM - In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system. | 11-19-2009 |
20090323288 | Heat sink slack storage and adaptive operation - Optical Network Terminals (ONTS) receive and transmit fiber optic data signals to a premises, such as a home or office, and generate heat, which must be dissipated. An outdoor installation may introduce additional heat loads over an indoor installation. An ONT designed for outdoor use may be overbuilt for indoor use and an ONT designed for indoor use may overheat in an outdoor location. Making separate ONTs for indoor and outdoor use is expensive. A heat sink according to an embodiment of the present invention is attachable to an exterior portion of an ONT and provides extra heat dissipation capability in hotter environments. Other embodiments place the heat sink in a fiber optic cable slack storage region. Other embodiments include interchangeable, different-capacity, heat sinks, and the ONT determines the capacity of the heat sink and operates at a power level appropriate for the heat sink capacity, i.e., thermal dissipation capability. | 12-31-2009 |
20100027222 | Module for an automation device - A module for an automation device with a plurality of adjacent modules is provided. The module includes a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. Further, an automation device including the module is provided. One of the side walls of the modules is embodied as being thermally conductive and that the other side wall is embodied as being thermally insulated. | 02-04-2010 |
20100124026 | HEAT DISSIPATING MODULE - A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base. | 05-20-2010 |
20100134981 | Heat sink assembly having interdigitated cooling fins - A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner. | 06-03-2010 |
20100134982 | MEMORY HEAT DISSIPATING STRUCTURE AND MEMORY DEVICE HAVING THE SAME - A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is attached to an internal side of the heat dissipating plate, and the second surface of the uniform temperature plate is attached to the memory module. At least one heat dissipating body is installed on the memory module and clamped between the two heat dissipating plates and the two uniform temperature plates. The heat dissipating body includes a base and heat dissipating fins extended from the base. The base forms a straight section attached onto the second surface of the uniform temperature plate. The two heat dissipating plates are clamped and fixed by fixing elements. The structure of the invention can improve the heat dissipating effect of the memory module. | 06-03-2010 |
20100134983 | ELECTRIC MEMORY MODULE WITH COOLING BODIES - An electric memory module is disclosed with at least two capacitors that are interconnected by an electrically conductive connection device. The memory module includes an electric insulation which electrically insulates the memory module, and the memory module includes a cooling body. According to at least one embodiment of the invention, the cooling body forms the connecting device and the electric insulation is applied to the outside of the cooling body. | 06-03-2010 |
20100265663 | ELECTRONIC COMPONENT MODULE - Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate. | 10-21-2010 |
20100277872 | INSULATING SHEET AND METHOD FOR PRODUCING IT, AND POWER MODULE COMPRISING THE INSULATING SHEET - An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet. | 11-04-2010 |
20100284152 | CARD GUIDE AND HEATSINK ASSEMBLIES FOR PLUGGABLE ELECTRO-OPTIC MODULES - In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage. | 11-11-2010 |
20100302740 | Methods of cooling semiconductor dies - The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages. | 12-02-2010 |
20100321895 | MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 12-23-2010 |
20110032679 | SEMICONDUCTOR MODULE - A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line. | 02-10-2011 |
20110044006 | HEAT MANAGEMENT IN AN ELECTRONIC MODULE - In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide. | 02-24-2011 |
20110069456 | SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE - A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources. | 03-24-2011 |
20110110047 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages. | 05-12-2011 |
20110222245 | ELECTRONIC MODULE WITH CENTER MOUNTING FASTENERS - An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at opposed ends of the module, and the at least one interiorly positioned fastener, wherein the base is capable of accepting electronic components and further includes at least one layer, and wherein the at least one interiorly positioned fastener is interposed between the at least two peripheral fasteners. | 09-15-2011 |
20110235278 | CIRCUIT MODULE - A circuit module includes a plurality of electronic components including at least one heat-generating electronic component and constituting an electric circuit are spaced from each other on a circuit board. Regions of one or both sides of the circuit board, including regions around the plurality of electronic components, are covered with a heat-dissipating member. A surface of the heat-dissipating member facing the circuit board includes irregularities. An end surface of a protrusion in the facing surface of the heat-dissipating member is in contact with a circuit board surface between the electronic components, directly or with a heat-dissipating sheet interposed therebetween. A wall surface of a recess in the facing surface of the heat-dissipating member is in surface-contact with the heat-generating electronic component within the recess, directly or with the heat-dissipating sheet interposed therebetween. Thus, heat from the heat-generating electronic component and heat from the circuit board heated by the heat from the heat-generating electronic component are dissipated outside through the heat-dissipating member. | 09-29-2011 |
20110310565 | HEAT SINK FOR MEMORY MODULE - A heat sink for memory module includes two heat-sink plates and two fastening members. Each heat-sink plate defines two through holes. The through holes of one heat-sink plate are coaxial to the through holes of the other heat-sink plate. Each fastening member includes a first head portion and a second head portion. The first head portion is elastic and is allowed to be pushed to pass through the through holes. The two heat-sink plates are locked between the first head portion and the second head portion. | 12-22-2011 |
20120039047 | GUIDE SYSTEM FOR A CARD MODULE - A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall. | 02-16-2012 |
20120106086 | SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AN INSERT - A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing. | 05-03-2012 |
20120113598 | BASE FOR POWER MODULE - A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate. | 05-10-2012 |
20120127668 | POWER MODULE - A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity. | 05-24-2012 |
20120140420 | SEMICONDUCTOR MODULE AND HEAT RADIATION MEMBER - The characteristics of a heat radiation member used in a semiconductor module are improved. | 06-07-2012 |
20120147563 | IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY - A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip. | 06-14-2012 |
20120182694 | Lid Design for Reliability Enhancement in Flip Chip Package - In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening. | 07-19-2012 |
20120268895 | ELECTRONIC POWER MODULE, AND METHOD FOR MANUFACTURING SAID MODULE - Said electronic power module ( | 10-25-2012 |
20120293962 | TRENCH-ASSISTED THERMOELECTRIC ISOTHERMALIZATION OF POWER SWITCHING CHIPS - One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate. | 11-22-2012 |
20120300407 | PLUGGABLE MODULE AND METHOD OF INSERTING ELECTRONIC MODULE - A pluggable module, includes: an insertion gate through which an electronic module is inserted and removed; a guide rail, including a spring support unit provided with a spring unit and a bearing unit located near the insertion gate, to guide the electronic module; and a heat sink plate, including, at one end portion, a fulcrum bar to be inserted into the bearing unit so as to move in a pressing direction of the spring unit, the heat sink plate being pushed up at the other end portion by a leading end of the electronic module so as to be pressed against the electronic module. | 11-29-2012 |
20120314372 | Power Semiconductor Package with Double-Sided Cooling - According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element. | 12-13-2012 |
20120314373 | Seabed Pressure Bottle Thermal Management - A subsea electronics module or pressure bottle with greatly enhanced capabilities for conducting heat away from internal electronics boards by means of an adjustable heat conduction wedge system. | 12-13-2012 |
20120320530 | VERTICALLY MOUNTED MULTI-HYBRID MODULE AND HEAT SINK - A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board. | 12-20-2012 |
20130003309 | HALF-BRIDGE ELECTRONIC DEVICE WITH COMMON AUXILIARY HEAT SINK - An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package. | 01-03-2013 |
20130021755 | SYSTEMS AND METHODS FOR HEAT EXTRACTION IN A POWER SUPPLY - Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference. | 01-24-2013 |
20130027888 | POWER MODULE PRODUCTION METHOD, AND POWER MODULE PRODUCED THEREBY - There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module | 01-31-2013 |
20130050949 | CIRCUIT MODULE - A circuit module can include a substrate, photonic conversion units placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion units and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion units. The plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material. | 02-28-2013 |
20130077253 | HEAT TRANSFER USING A DURABLE LOW-FRICTION INTERFACE - A system includes a removable module to process data when installed in the system, where the module includes a first surface via which heat, that is generated by the module, is transferred. The system also includes a port into which the module is installed; and a heat sink, associated with the port, to dissipate the heat received from the first surface, where the heat sink includes a second surface on which a material is applied, and where the material makes contact with the first surface when the module is installed that allows the heat to be received from the first surface, conforms to an American Society for Testing Materials (ASTM)-B607-91 standard or a United States military specification-C-26074, and transfers the heat to the second surface that allows the module to operate at a temperature that is less than a threshold. | 03-28-2013 |
20130077254 | COMMUNICATION MODULE ASSEMBLY WITH HEAT SINK AND METHODS OF MANUFACTURE - A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system. | 03-28-2013 |
20130215576 | Microwave Module - The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board. | 08-22-2013 |
20130235530 | ELECTRICAL POWER CIRCUIT ASSEMBLY - An electrical power circuit assembly includes a heat sink having a first surface portion and a second surface portion, a power semiconductor module being in thermal contact with the first surface portion of the heat sink for dissipating heat from the power semiconductor module to the heat sink via the first heat sink surface portion, and a capacitor having an axis. The capacitor is arranged with its axis essentially parallel to the second heat sink surface portion and with a circumferential surface portion being in thermal contact with the second surface portion of the heat sink for dissipating heat from the capacitor to the heat sink via the second heat sink surface portion. | 09-12-2013 |
20130258602 | POWER CONVERSION APPARATUS - In a power conversion apparatus including a rectifying module mounted with a power conversion device, an inverter module, and a direct-current reactor, a rectifying module and an inverter module | 10-03-2013 |
20130265724 | Power Module and Power Conversion Device Using Power Module - A power module includes a power unit equipped with plural power semiconductor devices, heat sinks, and a housing case. The power unit includes the power semiconductor devices, lead frames, and a sealing resin. The lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin. The housing case includes a housing base and a housing cover. The housing base, heat sink, power unit, heat sink, and housing cover are layered in that order. Assuming that S | 10-10-2013 |
20130342999 | SEMICONDUCTOR MODULE - A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink. | 12-26-2013 |
20140002997 | SIDE LOCK ASSEMBLY FOR HEAT SINK AND MEMORY MODULES | 01-02-2014 |
20140118950 | ELECTICAL CONNECTION ASSEMBLY - An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket. | 05-01-2014 |
20140126155 | BRAZING MATERIAL, BRAZING MATERIAL PASTE, CERAMIC CIRCUIT SUBSTRATE, CERAMIC MASTER CIRCUIT SUBSTRATE, AND POWER SEMICONDUCTOR MODULE - To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90. | 05-08-2014 |
20140133104 | LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB - A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s). | 05-15-2014 |
20140140011 | Signal Transmission Device - Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink. | 05-22-2014 |
20140192486 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities. | 07-10-2014 |
20140247563 | DRIVER ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion. | 09-04-2014 |
20140268575 | IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUATION OUTBOARD OF HEATSINK FOOTPRINT - A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module. | 09-18-2014 |
20140268576 | LINE REPLACEABLE UNIT WITH UNIVERSAL HEAT SINK RECEPTACLE - A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader for any standard or custom COM Express module so that the line replaceable unit may be efficiently reconfigured with different COM Express modules if needed. | 09-18-2014 |
20140293546 | Thermal Conductivity Improved Composition with Addition of Nano Particles Used for Interface Materials - A ternary particle size filler composition with addition of nano particles is provided to formulate thermally conductive interface materials such as soft gel having a high thermal conductivity, a relative low viscosity, and a low complex storage modulus. The thermally conductive material containing thermal particle composition and polymer matrix is used to create a thermal transfer path between the electronic component and the heat dissipation member. The composition is a mixture of a ternary particle size fillers constituted of the same or different chemical compounds in a predefined size ranges and volume ratios in terms of low viscosity and thermal interface nominal size. A silicone based polymer used as filler bonding matrix contains base resin, dispersant, cross-linker and polymerization catalyst. Thermal conductivity of the soft gel varied according to the change of volume percentage, particle size, and chemical compound of individual thermal particles. | 10-02-2014 |
20140293547 | CIRCUIT SUBSTRATE, SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING THE SAME - A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here. | 10-02-2014 |
20140293548 | ELECTRIC POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME - An electric power semiconductor device includes a power module and a heat dissipating member connected to the power module through a heat-conductive insulating resin sheet in which a mold resin part included in the power module has a protruding part in its peripheral part to prevent the heat-conductive insulating resin sheet from expanding in a planar direction. The heat-conductive insulating resin sheet is slightly thicker than the protruding part and has a resin exuding part exuded from a small gap between the protruding part and the heat dissipating member while the power module and the heat dissipating member are heated and pressurized to be bonded. | 10-02-2014 |
20140328023 | SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIPATION FUNCTION - A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate. | 11-06-2014 |
20150029671 | Electric Device - An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing. | 01-29-2015 |
20150029672 | POWER CONVERSION APPARATUS - Provided is a power conversion apparatus, including: a power module; a base section including a cooler; a second substrate; a first bus bar; a second bus bar; a smoothing capacitor; and a first substrate. The power module is placed on an upper surface of the base section. The first bus bar, the smoothing capacitor, and the first substrate are sequentially stacked on an upper side of the power module. The second substrate is arranged in an upright direction with respect to the base section and is fixed to the power module and the first substrate. | 01-29-2015 |
20150055303 | POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE WITH HEAT SINK - This power module substrate with a heat sink includes a power module substrate having a circuit layer disposed on one surface of an insulating layer, and a heat sink bonded to the other surface of this power module substrate, wherein the bonding surface of the heat sink and the bonding surface of the power module substrate are each composed of aluminum or an aluminum alloy, a bonding layer ( | 02-26-2015 |
20150103491 | UNPACKED STRUCTURE FOR POWER DEVICE OF RADIO FREQUENCY POWER AMPLIFICATION MODULE AND ASSEMBLY METHOD THEREFOR - An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat dissipating plate is arranged below the power device and the printed circuit board; the power device includes a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat dissipating plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires. | 04-16-2015 |
20150124409 | COMPOSITE MODULE - A wireless LAN module as a composite module according to the present invention includes a first substrate | 05-07-2015 |
20150131233 | INVERTER DEVICE - An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface, a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module, an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module, and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module. | 05-14-2015 |
20150325494 | POWER SEMICONDUCTOR MODULE WITH SWITCHING DEVICE AND ASSEMBLY - A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device. | 11-12-2015 |
20150341066 | SNAP-MOUNTED AND PLUGGABLE OPTOELECTRONIC MODULE - An example embodiment includes a snap-mountable optoelectronic module. The module includes a frame, a cover, and a module latch. The frame includes two or more post blocks that each defines a module latch receiver. The cover is configured to at least partially enclose an inner assembly and includes a module latch recess. The module latch includes pivots and a latch portion. The pivots are received in the module latch receivers such that the module latch is configurable in an unlatched position and in a latched position. In the unlatched position, the latch portion is disengaged from the module latch recess. In the latched position, the latch portion is engaged with the module latch recess to retain the cover relative to the frame. | 11-26-2015 |
20150355689 | DISPLAY DEVICE - A display device according to one embodiment of the present invention includes a display module, and a heat dissipation unit which is coupled to a rear side of the display module. The heat dissipation unit includes a core part including a plurality of hollow polygonal columns extending in a front/back direction, a front sheet which is coupled to a front portion of the core part, and a rear sheet which is coupled to a rear portion of the core part. The core part has a thickness of about 40% to about 60% in the front/back direction with respect to a total thickness of the heat dissipation unit in the front/back direction. | 12-10-2015 |
20160066476 | RADIAL FIN HEAT SINK FOR REMOTE RADIO HEADS AND THE LIKE - In one embodiment, an apparatus includes three remote radio heads (RRHs) mounted on a pole using one or more triangular brackets, each RRH connected to a corresponding antenna. Each RRH includes an electronics module, a heat sink mounted on the electronics module, and a cover attached to the heat sink. The heat sink comprises a base, a plurality of attached forward-facing fins, and a pair of backward-facing fins. Each forward-facing fin and backward-facing fin comprises a proximal end attached to the base and an opposite distal end. The proximal ends of the plurality of forward-facing fins are collinear. The distal ends of the plurality of forward-facing fins and the backward-facing fins define an arc of an ellipse. | 03-03-2016 |
20160135326 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - Provided is a printed circuit board including a first conductive layer including a first conductive layer including a recessed portion, a protruding portion disposed at a higher level than that of the recessed portion, and a connecting portion connecting the recessed portion with the protruding portion. A second conductive layer is disposed above the recessed portion of the first conductive layer. A core layer is disposed between the first conductive layer and the second conductive layer. An upper solder resist layer is disposed on the second conductive layer. The upper solder resist layer exposes at least a portion of the protruding portion. A lower solder resist layer is disposed below the first conductive layer. | 05-12-2016 |
20160143187 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions. | 05-19-2016 |
20160150673 | Communication Module - A communication module is mounted on a mother board provided in an electronic device and is thermally connected to a heat sink provided on the mother board. The communication module includes: a housing having a heat-dissipating surface thermally connected to a heat-absorbing surface of the heat sink; an elastic piece that presses the housing to the heat-absorbing surface; a module substrate accommodated in the housing; a plug connector protruding from the housing and inserted into and removed from a receptacle connector on the mother board; and a support member that supports the module substrate inside the housing. The module substrate is not in contact with the housing and is swingably supported with the support member as a support point. | 05-26-2016 |
20160165749 | POWER MODULE AND METHOD FOR MANUFACTURING THE SAME - A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly. | 06-09-2016 |
20160174415 | RECEPTACLE ASSEMBLY AND TRANSCEIVER MODULE ASSEMBLY | 06-16-2016 |
20160255745 | ELECTRIC MODULE, ELECTRICAL SYSTEM COMPRISING SUCH AN ELECTRIC MODULE, AND CORRESPONDING PRODUCTION METHODS | 09-01-2016 |
20160381785 | MOLDING TYPE POWER MODULE - A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device. | 12-29-2016 |
20190146167 | Transceiver Module | 05-16-2019 |