| Entries |
| Document | Title | Date |
|---|
| 20080205000 | HEAT DISSIPATION DEVICE - A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output unit. The input interface is used for receiving an input signal, which is determined by a temperature of the computer system. The counter unit is used for generating a high level signal on counting to a predetermined value. The controller unit is used for generating a switch signal on receiving the high level signal, and sending a clear signal to the counter unit for clearing the counter unit. The output unit is used for being switched on or off according to the switch signal, and sending a control signal to the first heat sink. The control signal is able to drive the cooling end of the first heat sink to cool down. | 08-28-2008 |
| 20080205001 | Blower and air conditioner for vehicle - A blower includes a casing for defining an air passage through which air is blown into a compartment, a fan located in the casing to generate an air flow in the casing, a motor for driving the fan, a motor control device for controlling a rotation speed of the motor, and a heat sink located to radiate heat of the motor control device to air flowing in the air passage. The heat sink having a radiation fin is exposed into the air passage, and at least one of the motor control device and the heat sink is thermally connected to the yoke of the motor. | 08-28-2008 |
| 20080212279 | Frequency Converter - A frequency converter includes a radiating section having a base and fins for radiating heat from a power semiconductor, a circuit substrate being provided at an opposite side of the fins with respect to the base, a housing that covers the circuit substrate, a guide for flowing air between the housing and the circuit substrate toward a downstream side of the fins, and a fan. The fan flows the air flown to the downstream side of the fins by the guide toward an upstream side of the fins. | 09-04-2008 |
| 20080212280 | ELECTRONIC APPARATUS - The electronic apparatus including the cooling system upon which it is difficult for the temperature of wind flowing in the passage to exert an influence, and yet which enables an efficient cooling accompanied by the generated heat temperature of the electronic part is provided. The electronic apparatus that includes a case, a fan arranged in the case, a plurality of electronic parts arranged in the case, and a heat sink that is mounted for each of desirable electronic parts, out of the electronic parts, and yet receives wind generated by the fan, thereby to cool the above electronic part, wherein the heat sink includes a fluid unit, and a shutter plate for controlling the quantity of wind flowing in the above heat sink generated by the fan with an action of the fluid unit that is actuated by heat of the electronic part, wherein said fluid unit is a unit obtained by filling up a container with liquid; wherein the container is arranged for the electronic part so that heat of the above electronic part is conducted with a heat conducting action; and wherein a configuration is made so that in a case where a generated heat quantity of the electronic part is large, the fluid inside the container arranged for the above electronic part expands, thereby allowing the shutter plate to operate in an opening direction, and increasing the quantity of wind flowing in the heat sink generated by the fan, and in a case where a generated heat quantity of the electronic part is small, the fluid inside the container arranged for the above electronic part shrinks, thereby allowing the shutter plate to operate in a closing direction, and reducing the quantity of wind flowing in the heat sink generated by the fan. | 09-04-2008 |
| 20080239669 | COMBINED-NATURAL-AND-FORCED-CONVECTION HEAT SINK - A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating. | 10-02-2008 |
| 20080239670 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink, and a fan. The heat sink includes an end plane, and an engaging portion is defined in a middle of the end plane. The fan includes a frame, and an impeller mounted in the frame. The frame includes an end surface. A protrusion extends from a middle of the end surface of the frame for engaging in the engaging portion of the heat sink, such that the fan is fixed to the heat sink. | 10-02-2008 |
| 20080247136 | HEAT DISSIPATION APPARATUS FOR HEAT PRODUCING DEVICE - A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base. | 10-09-2008 |
| 20080259565 | Heat radiator and electronic apparatus - A heat radiator has two or more heat radiation fins arranged at intervals, and conducts heat from the heat radiation fins to air that flows in space of the heat radiation fins. The heat radiation fins have notches formed such that central parts of edges of the heat radiation fins in at least one of the air inflow side and the air outflow side of the heat radiation fins are cut alternately or on a circulating basis in an array direction of the heat radiation fins. | 10-23-2008 |
| 20080266795 | HEAT DISSIPATING DEVICE - A heat dissipation device includes a heat sink and a fan. The heat sink includes two first fins, and a plurality of second fins between the first fins. A locking portion extends outward from each first fin. The locking portions are located higher than the second fins. A sliding guideway is defined in each locking portion. Two flanges extend from two opposite sides of the fan respectively. The flanges are capable of engaging in the guideways of the heat sink to mount the fan to the heat sink. | 10-30-2008 |
| 20080266796 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins. | 10-30-2008 |
| 20080266797 | Surface airflow heatsink device and the heatsink device components - It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu | 10-30-2008 |
| 20080278912 | THERMAL MANAGEMENT SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS IN A SEALED ENCLOSURE - Systems and methods for thermal management for electronic components in a sealed enclosure are provided. In one embodiment, a thermal management system for electronic components in a sealed enclosure comprises: an enclosure for housing electronic components, the enclosure sealed from an external environment; a card cage housed within the enclosure; at least one electronic device card installed in the card cage; and at least one baffle configured to form an airflow channel through at least part of the card cage, wherein the airflow channel directs air warmed by thermal energy from the at least one electronic device card to follow a circular path along an internal surface of the enclosure, wherein the internal surface is configured to conductively remove heat from the air to the environment external to the enclosure. | 11-13-2008 |
| 20080285234 | THERMAL MODULE AND ELECTRONIC APPARATUS USING THE SAME - A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again. | 11-20-2008 |
| 20080291627 | APPARATUS FOR ENCLOSING ELECTRONIC COMPONENTS USED IN TELECOMMUNICATION SYSTEMS - An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing. | 11-27-2008 |
| 20080304235 | ELECTRONIC MODULE CONFIGURED FOR AIR FLOW THERETHROUGH AND SYSTEM INCLUDING SAME - An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The capacitors are positioned within the chassis, and at least one of the capacitors is proximate the first end. The bus bars are positioned within the chassis proximate the second end. The heat sink is positioned between the capacitors and the bus bars. The capacitors, the heat sink and the bus bars are positioned such that when an airflow enters the chassis at the first end, a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars before exiting at the second end. | 12-11-2008 |
| 20080310108 | EXTERNAL HEAT SINK FOR ELECTRONIC DEVICE - An external heat sink device that can be attached to an electronic device during periods of excess heat generation, such as during a gaming session, for example. The external heat sink device can be removed from the electronic device during times of relatively lower heat generation. Other external accessories can be associated with the external heat sink device, such as an external antenna, speakers, game input device, power supply, etc. | 12-18-2008 |
| 20080310109 | Cooling structure for high voltage electrical parts of a hybrid electric vehicle - The present invention provides a cooling structure for high voltage electrical parts of a HEV in which a plurality of high voltage electrical parts are fixedly arranged in parallel on a cross section of a cooling passage in a case where the plurality of the high voltage electrical parts are cooled by air, thereby being able to supply cooling air at the same temperature to all electrical parts. | 12-18-2008 |
| 20080316705 | HEAT DISSIPATION DEVICE HAVING A FAN MOUNTED THEREON - A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink. | 12-25-2008 |
| 20080316706 | Heat dissipation structure for electronic devices - The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency. | 12-25-2008 |
| 20090002946 | Heat-dissipation module of light-emitting device - The present invention relates to a heat-dissipation module of a light-emitting device, which includes a cooling unit, at least a cooling fan and at least a light-emitting device. The light-emitting device is preferably an LED and is directly bonded to the cooling unit through a heat-conductor. The cooling unit and the heat conductor are constituted by a highly heat-conducting metal, e.g. aluminum, copper, gold and silver, or an alloy thereof, so as to absorb the heat of the light-emitting device by a heat-conducting means and achieve an ideal heat-dissipation performance by using the cooling fan to accelerating the air convection around the cooling unit. | 01-01-2009 |
| 20090016021 | Cooling structure for high voltage electrical parts of hybrid electric vehicle - The present invention provides a cooling structure for high voltage electrical parts of an HEV, in which a plurality of high voltage electrical parts including a DC-DC converter, an inverter, and an air conditioner inverter are arranged on a cross section of a cooling air passage in a direction horizontal to the flow of cooling air, a cooling blower for cooling the high voltage electrical parts is mounted on one side of an electrical part package in the opposite direction, and; and a duct is integrally formed on an upper portion of the blower so that the cooling air passing through the electrical part package is discharged therethrough, thereby being able to supply the cooling air at the same temperature to the plurality of high voltage electrical parts and mount the electrical part package in a relatively small space. | 01-15-2009 |
| 20090021913 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat spreader ( | 01-22-2009 |
| 20090027855 | HEAT DISSIPATION DEVICE HAVING FIXING BRACKET - A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure. | 01-29-2009 |
| 20090034193 | HEAT-DISSIPATING MODULE - A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a plurality of fins, a fan and a heat pipe. The fan is adapted for generating an air current. Each fin has an edge facing the fan. The edges are located on a folded surface. The air current first passes through the folded surface and then passes by the fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the fins. | 02-05-2009 |
| 20090040718 | HEAT DISSIPATING ASSEMBLY HAVING A FAN DUCT - A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base ( | 02-12-2009 |
| 20090040719 | GRAPHITE HEAT DISSIPATION APPARATUS AND CLAMPING FRAME FOR CLAMPING GRAPHITE HEAT DISSIPATION FIN MODULE - A graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module are provided. The graphite heat dissipation apparatus includes a graphite heat dissipation fin module and at least one clamping frame. The graphite heat dissipation fin module includes a substrate and a plurality of graphite fins which are positioned at and extend from one surface of the substrate. The clamping frame includes at least one support bracket, at least one retention plates and a frame body. The support brackets are positioned at top surface of a chassis. The frame body upwardly extends from the support brackets, and the retention plates traverse extend across the side surface of the frame body. The retention plates are used to clamp the substrate so that the graphite fins are positioned above the chassis. The graphite heat dissipation fin module is used to draw hear away from the electronic device which can be positioned below the substrate and at the surface of the chassis. | 02-12-2009 |
| 20090040720 | Electronic apparatus and heat radiating unit - A heat radiating unit provided in an electronic apparatus includes: a fan for blowing air; and a heat radiating member in which heat radiation fins for transmitting heat to passing air are arranged and which has an endothermic section that contacts a top surface of a first heat-producing component on a circuit substrate so as to absorb heat from the first heat-producing component. The heat radiating unit further includes a supporting member provided with a heat-radiating-member biasing section that biases the heat radiating member toward the circuit substrate. The supporting member is also provided with an endothermic arm that extends toward and contacts a top surface of a second heat-producing component so as to absorb heat from the second heat-producing component. The top surfaces of the first and second heat-producing components are different in height. | 02-12-2009 |
| 20090040721 | COMPUTER COOLING SYSTEM AND METHOD - A method for providing a computer component includes providing a motherboard apart from a cooling solution such that the end user can select the motherboard and cooling solution separately, based on preferences and needs for each and connect them together after they are selected. To support this method, a motherboard includes: a support board; a chipset mounted on the support board; and a heat sink base mounted over the chipset, the heat sink base including an open, planar upper surface devoid of any cooling system working components pre-installed thereon but including a fastener aperture about the edge of the open, planar upper surface and in addition to any support board mounting connections, the fastener aperture formed to accept releasable connectors for securing the selected cooling working component. | 02-12-2009 |
| 20090046428 | THERMAL MODULE AND FIN ASSEMBLY THEREOF - A thermal module includes a centrifugal fan ( | 02-19-2009 |
| 20090059524 | HEAT DISSIPATION DEVICE - A heat dissipation device ( | 03-05-2009 |
| 20090059525 | HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS - A heat dissipation device mounted on a heat-generating component of a graphics card, includes a base, a fin unit and a fan. The base is kept in intimate contact with the heat-generating component. The fin unit includes a plurality of fins arranged on the base and forming a plurality of air passages between each fin and its neighboring fins. The fan is mounted on the base, close to the fin unit and producing airflow in the air passages. The base comprises a spreader inlayed in the base. The spreader is a flattened heat pipe. A bottom surface of the spreader is in contact with the heat-generating component. The fin unit is thermally attached to a top surface of the spreader. | 03-05-2009 |
| 20090073656 | HEAT SINK, HEAT SINK FAN, AND METHOD FOR MANUFACTURING THE SAME - A heat sink has a structure which enables the heat sink to be carried by a holding device in an automated production line. The heat sink includes a base portion at a center thereof and a finned portion around the base portion. The heat sink is arranged in contact with, or very close to, an object to be cooled, e.g., an MPU, and receives the heat generated in the object. The heat is then dissipated to ambient air from the fins. At an object-side end of the heat sink is provided a convex portion which has an engagement feature to be caught by the holding device while the heat sink is carried. | 03-19-2009 |
| 20090080156 | Cooling Arrangement to Cool Components on Circuit Board - A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement. | 03-26-2009 |
| 20090080157 | METHOD, APPARATUS AND COMPUTER SYSTEM FOR AIR MOVER LID COOLING - Some embodiments of a method, apparatus and computer system are described for cooling a lid with an air mover. A computer system may include a frame and a display with a heat spreader and one or more air movers. In some embodiments, the one or more air movers may include a piezoelectric fan, a synthetic jet, a centrifugal fan, a coaxial fan, an axial fan, or a propeller fan. Moreover, in some embodiments, the air movers may be integrated into or formed as part of the heat spreader's structure. Other embodiments are described. | 03-26-2009 |
| 20090103264 | Heat dissipation device and electronic device with the same - A heat dissipation device includes a fan ( | 04-23-2009 |
| 20090103265 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber. | 04-23-2009 |
| 20090109620 | HEAT-DISSIPATING DEVICE OF PORTABLE ELECTRONIC APPARATUS - A heat-dissipating device of a portable electronic apparatus includes a heat-conducting plate disposed on a heat-generating element. One end of a heat-conducting pipe is disposed on the heat-conducting plate, and the other end of the heat-conducting pipe is disposed on a surface of a power generator to form a high-temperature source. The opposite surface of the power generator is fixedly disposed on a heat-dissipating body to form a low-temperature source. A heat-dissipating fan is provided on one side of the heat-dissipating body. The positive and negative lines of the heat-dissipating fan are electrically connected to the positive and negative lines of the power generator. Via the above arrangement, after the heat-conducting plate conducts the heat source to the heat-conducting pipe to perform a heat exchange, the heat source is then conducted to the other end of the heat-conducting pipe, so that the surface of the power generator contacting the end of the heat-conducting pipe becomes a high-temperature source, while the other surface acts as a low-temperature source. Thus, the heat due to the temperature difference can be converted into electricity correspondingly, thereby providing the necessary power for the operation of the heat-dissipating fan. Therefore, a self-powered heat-dissipating device can be achieved. | 04-30-2009 |
| 20090109621 | HEAT DISSIPATING DEVICE - A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided. | 04-30-2009 |
| 20090122486 | Semiconductor Packages - The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages. | 05-14-2009 |
| 20090129018 | HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD - A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink ( | 05-21-2009 |
| 20090129019 | HEAT DISSIPATION DEVICE WITH FAN HOLDER - A heat dissipation device includes a heat sink attached to an electronic component, a fan and a fan holder mounting the fan onto the heat sink. The heat sink includes a plurality of fins. The fan holder includes a plurality of walls connecting with each other. A pair of tabs is formed on one of the walls for abutting against the fan, and a pair of fasteners is formed on another wall and opposite to the tabs. Each of the fasteners includes a sleeve formed on the another wall, a pressing member movably received in the sleeve, and a crank pivotally engaged with the sleeve. When the crank is positioned in a closed position, the pressing member is pushed out of the sleeve by the crank and abuts against the fan. The fasteners cooperate with the tabs to mount the fan onto the fan holder. | 05-21-2009 |
| 20090129020 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes an heat producing component mounted on a first surface of a circuit board, a second heat producing component mounted on a second surface of the circuit board, a cooling fan overlapping the circuit board, a first heat radiating member located between the cooling fan and an exhaust aperture, a first heat transfer member which extends along the first surface of the circuit board and which transports heat generated by the first heat producing component to the first heat radiating member, a second heat radiating member including a part positioned opposite the second heat producing component with respect to the circuit board, and a second heat transfer member including a part extending along the second surface of the circuit board, the second heat transfer member transporting heat generated by the second heat producing component to the second heat radiating member. | 05-21-2009 |
| 20090135562 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a heat-dissipation portion attached to the base, at least one heat pipe connecting the base and the heat-dissipation portion and a fan directly secured to the heat-dissipation portion. The heat-dissipation portion comprises a square, tubular housing having opposite front and rear end portions opening to surroundings and a plurality of fins extending inclinedly and inwardly from an inner circumferential periphery of the housing. The housing of the heat-dissipation portion is employed as a fan duct to guide an airflow generated by the fan through the fins; the inclined orientation of the fins facilitates the airflow to flow toward the inner circumferential periphery of the housing and lower parts of the fins adjacent the inner circumferential periphery, whereby the airflow can effectively take heat away from the heat-dissipation portion. | 05-28-2009 |
| 20090135563 | HEAT RADIATION STRUCTURE OF ELECTRONIC COMPONENT AND DISPLAY DEVICE - A heat radiation structure of an electronic component of the present invention includes a main board mounted with electronic components, an upper side heat sink disposed opposite to a top face of the main board, a lower side heat sink disposed opposite to a second face of the main board, and a cooling fan connected to the upper side heat sink and the lower side heat sink. | 05-28-2009 |
| 20090141450 | HEAT DISSIPATING STRUCTURE FOR ELECTRONIC COMPONENT AND DISPLAY DEVICE - A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe. | 06-04-2009 |
| 20090147475 | Heat dissipation device having a fan mounted thereon - A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip comprises a V-shaped main body and two locking parts at two opposite ends of the main body. Middles of the main bodies of the two wire clips are securely attached to two lateral sides of the heat sink by two screws. The locking parts of the wire clips are fastened to the frame of the fan, with the main bodies being deformed and pushing the fan toward the heat sink. | 06-11-2009 |
| 20090147476 | CIRCUIT BOARD APPARATUS WITH INDUCED AIR FLOW FOR HEAT DISSIPATION - A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component. | 06-11-2009 |
| 20090147477 | Electronic device - An electronic device includes a housing, a plurality of heat-dissipating fins, and a heat-dissipating fan. The housing defines a receiving space, and an opening communicating the receiving space with the outside environment. The housing includes a power socket disposed in the receiving space. The heat-dissipating fins are disposed in the receiving space. The heat-dissipating fan includes a power plug portion corresponding to the power socket. The heat-dissipating fan is mountable in the receiving space through the opening so as to provide an air current to the heat-dissipating fins. The power plug portion is inserted into the power socket upon insertion of the heat-dissipating fan into the receiving space. The heat-dissipating fan is removable from the housing through the opening for cleaning of the heat-dissipating fan and the heat-dissipating fins. | 06-11-2009 |
| 20090147478 | HEAT SINK FAN - A heat sink fan of the present invention includes a heat sink and a fan. The heat sink includes a base having a center axis and a plurality of fins extending radially outwardly from an outer circumference of the base and disposed in a circumferential direction. The fan includes an impeller portion disposed adjacently to the heat sink in the direction along the center axis, the impeller portion rotating about the center axis, and a frame portion for covering and fixing the impeller portion, part of the frame portion being opposed to the heat sink. The frame portion has at least one protruding portion. The protruding portion enters into a space between the fins which are adjacent to each other. | 06-11-2009 |
| 20090154099 | HEAT DISSIPATING ASSEMBLY HAVING A FAN DUCT - A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver ( | 06-18-2009 |
| 20090154100 | HEAT DISSIPATING ASSEMBLY - A heat dissipating assembly for dissipating heat from a plurality of electronic components, including a heat sink ( | 06-18-2009 |
| 20090161314 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN - A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan. | 06-25-2009 |
| 20090168349 | HEAT SINK ASSEMBLY HAVING SUPPORTING CLIP - A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a supporting clip mounted on the bolt and located at a bottom of the heat sink. The supporting clip comprises a body and a support extending from the body. When the bolt of each fastener extends through the unit and the body of the supporting clip, a distance between the bottom of the unit and the heat-generating electronic component remains unchanged with the help of the support of the supporting clip. | 07-02-2009 |
| 20090168350 | HEAT DISSIPATION DEVICE WITH A FAN HOLDER - A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and a fin assembly thermally connecting with the heat spreader. The fin assembly has a plurality of channels therein. The fan holder includes a top plate mounted on a top of the fin assembly and a pair of vertical baffle walls extending from two opposite ends of the top plate. The baffle walls of the fan holder are located at two lateral ends of the fin assembly and sandwich the fin assembly therebetween. The two fans respectively abut against inlets and outlets of the channels of the fin assembly. An airflow generated by one fan flows through the fin assembly and is sucked by the other fan. | 07-02-2009 |
| 20090168351 | HEAT DISSIPATION MODULE AND FAN THEREOF - The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member. | 07-02-2009 |
| 20090168352 | Heat sink device for a display card - A heat sink device for a display card includes a heat sink, the heat sink having a base and a plurality of heat-dissipating fins on the base, the base having two hooks respectively beside two lateral sides of the groove; a heat-dissipating fan, having a blade wheel and a power wire for the blade wheel, the blade wheel being on the base and the power wire being inside the groove of the base; and a fastener, having two engagement parts respectively corresponding to the hooks, wherein the fastener covers the groove so as to position the power wire by means of engagement of the hooks with the engagement parts. Therefore, the power wire of the heat-dissipating fan can be properly arranged on the heat sink. | 07-02-2009 |
| 20090168353 | Electronic apparatus - An electronic apparatus includes a housing, first and second circuit boards disposed in the housing in such a way that the first and second circuit boards are stacked on each other, and a pump block disposed between the first and second circuit boards, the pump block abutting a first electronic part mounted on the first circuit board and a second electronic part mounted on the second circuit board, the pump block sucking air outside the housing and discharging the air out of the housing. | 07-02-2009 |
| 20090185349 | ELECTRONIC APPARATUS - According to one embodiment, a fan case of a cooling fan includes first and second exhaust openings separately provided in two side surface portions. The first exhaust opening and the second exhaust opening are arranged in a rotational direction of a fan blade in the order named. A first heating element has a heating value greater than that of a second heating element. A first heat radiating member is thermally connected to the first heating element through a first heat transfer member and opposed to the first exhaust opening of the cooling fan. A second heat radiating member is thermally connected to the second heating element through a second heat transfer member and opposed to the second exhaust opening of the fan. | 07-23-2009 |
| 20090195983 | Techniques for Cooling Portable Devices - The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow. | 08-06-2009 |
| 20090219690 | Heat sink capable of external deflection - A heat sink capable of external deflection includes a heat-dissipating member, a cooling fan, and a deflector. The heat-dissipating member includes an entrance side and an exit side. The cooling fan is mounted at the entrance side of the heat-dissipating member. The deflector includes at least one inlet, at least one outlet, and at least one passage in communication with the at least one inlet and outlet. The deflector is mounted to the heat-dissipating member in such a way that each of the at least one inlet is close to the entrance side, each of the at lease one passage extends to an external side of said exit side, and each of the at least one outlet faces a lower side of the heat-dissipating member. Therefore, the heat sink attains relatively larger heat-dissipating range and relatively higher heat-dissipating efficiency on the whole. | 09-03-2009 |
| 20090219691 | Heat sink capable of internal deflection - A heat sink includes a heat-dissipating member and a cooling fan. The heat-dissipating member includes at least two spaced fins. Each of the two fins has a first side, a second side, and a deflection piece mounted to a surface thereof. Each of the deflection pieces is inclined, extending from the first side toward the second side and engaging the adjacent fin. The cooling fan is mounted to the heat-dissipating member and close to the first sides of the fins. Accordingly, the heat sink enlarges the heat-dissipating area and enhances the heat-dissipating efficiency on the whole. | 09-03-2009 |
| 20090231809 | Electronic Apparatus - According to an aspect of the present invention, an electronic apparatus includes: a plurality of heat generating components; a plurality of heat sinks respectively provided for the plurality of heat generating components; | 09-17-2009 |
| 20090237882 | HEAT SINK AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency. | 09-24-2009 |
| 20090244844 | Heat-dissipating module - A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of the two lap joint portions has a fasten hole. Each of the support portions has a support hole. Each of the fixtures corresponds to one of the hollowed portions. The two lap joint portions of each fixture are mounted to a top edge of the fins and close to two sides of the support portion. The fasteners fasten the lap joint portions to the heat sink. In this way, the heat sink and the fixtures are fastened with each other to enhance the structural durability of the heat-dissipating module. In addition, the heat-dissipating module is small-sized, taking less space. | 10-01-2009 |
| 20090244845 | MOTOR CONTROLLER - A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module ( | 10-01-2009 |
| 20090262500 | COOLING DEVICE, HEAT SINK, AND ELECTRONIC APPARATUS - There are provided a cooling device and a heat sink that can effectively radiate heat generated by a heat source while reducing the volume of discharged gas to avoid noise, and an electronic apparatus in which the cooling device and the heat sink are mounted. A heat sink | 10-22-2009 |
| 20090268405 | POWER ELECTRONIC MODULE COOLING SYSTEM AND METHOD - An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is deployed in a cooling channel adjacent to a heatsink in a first cooling zone, such that some portion of the cooling air is forced through the heatsink while the rest of the cooling air bypasses the heatsink to provide additional cooling air to a second cooling zone. Additionally, the air-flow resistance of the air directing structure can be chosen so that the fan operates at its optimal point (maximum power input to the air). | 10-29-2009 |
| 20090268406 | MOTOR CONTROLLER - A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller. | 10-29-2009 |
| 20090279255 | PIEZO FANS FOR COOLING AN ELECTRONIC DEVICE - A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB. | 11-12-2009 |
| 20090279256 | Heat-dissipating structure - A heat-dissipating structure includes a base seat, a plurality of heat-dissipating fins and a heat pipe. The heat-dissipating fins are separated from each other by a predetermined distance, and each heat-dissipating fin has a base portion and at least one bending portion that is bent and extended upwards from one side of the base portion. The length of each bending portion is the same to or larger than the length of the base portion. The heat pipe is connected with the base seat, and at least one side of the heat pipe passing through the base portions of the heat-dissipating fins. Therefore, the present invention can obtain a perfect heat-dissipating coefficient and a better heat-dissipating efficiency by using the bending portion that is bent and extended upwards from one side of the base portion. | 11-12-2009 |
| 20090284920 | COMBINATION HEAT SINK - A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining flange has a bottom neck perpendicularly extending from the respective radiation fin, two pairs of vertically spaced retaining fingers respectively extending from two opposite lateral sides of the bottom neck in a parallel manner relative to the respective radiation fin for securing another radiation fin, a top retaining notch defined between the two pairs of vertically spaced retaining fingers above the bottom neck for accommodating the bottom neck of another radiation fin, and a retaining gap defined between each two vertically spaced retaining fingers for receiving another radiation fin. | 11-19-2009 |
| 20090290308 | Heat sink for chips - A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped therebetween. A base board has a first extension portion and a second extension portion extending from two ends thereof. A second heat dispensing unit is fixed on a top of the base board. A first clamping member is integrally connected to the first extension portion and a second clamping member is removably connected to the second extension portion. The first and second clamping members connect the base board to the first heat dispensing unit. | 11-26-2009 |
| 20090303683 | Heat sink unit , circuit board unit , and electronic device - A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws. | 12-10-2009 |
| 20090310305 | FAN IMPELLER AND HEAT DISSIPATING DEVICE INCORPORATING THE SAME - A heat dissipation device ( | 12-17-2009 |
| 20090310306 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan. | 12-17-2009 |
| 20090316358 | HEAT DISSIPATION DEVICE WITH A FAN HOLDER ATTACHED WITH A POSITION-ADJUSTABLE AIR GUIDING MEMBER - A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink. | 12-24-2009 |
| 20090323284 | HEAT DISSIPATION APPARATUS HAVING A FAN RECEIVED THEREIN - A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base. | 12-31-2009 |
| 20100002389 | FAN FASTENER - An elastic, rod-like fan fastener for securing a heat sink cooling fan to a heat sink is disclosed having a head at one end, a positioning rod comprising an extension rod at the opposite end, a first shank segment axially connected between the head and the extension rod, and a second shank segment axially connected between the first shank segment and the extension rod, a neck axially connected between the head and the first shank segment, a shoulder extending around the periphery between the neck and the first shank segment, and a plurality of barbed portions extending around the periphery of the positioning rod and spaced along the length of the positioning rod. | 01-07-2010 |
| 20100002390 | HEAT SINK ASSEMBLY - A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink. | 01-07-2010 |
| 20100002391 | ELECTRONIC DEVICE WITH HEAT SINK ASSEMBLY - An electronic device includes a first heat source, a second heat source adjacent to the first heat source, a heat sink, and a fan. The heat sink is mounted on the first heat source for transferring heat from the first heat source to the heat sink. The fan has an air inlet and an air outlet. The air outlet faces the second heat source to drive air flowing through the second heat source if the air inlet faces the heat sink. The air outlet faces the heat sink to drive air flowing through the heat sink if the air inlet faces the second heat source. | 01-07-2010 |
| 20100008042 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink and a second heat sink, a bridge sandwiched between the first and second heat sinks, a plurality of fasteners extending onto the first and second heat sinks and the bridge to combine the two heat sinks and the bridge, a clip mounted on the bridge and positioned between the two heat sinks, and a fan located on the first and second heat sinks. Each of the heat sinks includes a base and a plurality of fins extending from the base. A plurality of grooves is defined in the bridge and the base of each of the heat sinks to accommodate the fasteners. | 01-14-2010 |
| 20100027219 | FAN FRAME ASSEMBLY FOR A HEAT SINK - A fan frame assembly for a heat sink includes the fan frame, the fasteners and the heat sink. The fan frame has the plate-shaped holding members extending downward along the circumferential side thereof with a horizontal engaging end part respectively. The engaging end part has a piercing hole for being passed through by the respective fasteners. Due to the fasteners being surrounded with a spring, the spring exerts a pressing force to the fan frame in addition to the holding members locating the heat sink for the fan frame assembly being joined to the heat sink firmly. | 02-04-2010 |
| 20100039772 | Cooling device and electronic device - In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to the first heat-radiating fin is provided on one side of the heat pipe, and a first duct that guides the airflow produced by the first fan unit to the first heat-radiating fin is provided on the other surface of the heat pipe. | 02-18-2010 |
| 20100053895 | FAN AND FAN ASSEMBLY - A fan for easily being attached to a fixing device and includes a fan body and a frame for holding the fan body therein. The frame includes two parallel first sidewalls, and two parallel second sidewalls perpendicular to the first sidewalls. Two pairs of rims symmetrically extend from the first sidewalls and the second sidewalls. Ends of the rims on the first sidewalls toward one same second sidewall each include a latch flange. Ends of the rims on the second sidewalls toward one same first sidewall each includes a latch flange. Each of the latch flanges includes a guiding edge slantingly extending from the corresponding rim, and a latch edge perpendicular to the corresponding rim. Each of the latch flanges includes a guiding edge slantingly extending from the corresponding rim, and a latch edge perpendicular to the corresponding rim. | 03-04-2010 |
| 20100053896 | HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE UTILIZING THE SAME - An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module. | 03-04-2010 |
| 20100053897 | ELECTRONIC EQUIPMENT - Electronic equipment has a first circuit substrate disposed in opposition with the second circuit substrate, a first heat generating component mounted on the first circuit substrate, a first heat receiving portion thermally connected the first heat generating component, a second heat generating component mounted on a surface of the second circuit substrate, a second heat receiving portion thermally connected the second heat generating component, and a holding member having a first and a second elastic holding portion for pressing the first and second heat receiving portion in the direction of the first and second heat generating component and a supporting portion for supporting the first elastic holding portion and the second elastic holding portion and a plurality of fixing portion for fixing the supporting portion between the first circuit substrate and the second circuit substrate. | 03-04-2010 |
| 20100053898 | MOTOR CONTROLLER - There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. | 03-04-2010 |
| 20100061060 | HEAT-DISSIPATING DEVICE - A heat-dissipating device includes a heat sink, a heat-dissipating fan, and a first air guide hood. The heat sink includes a base, and a plurality of interconnected heat-dissipating fins provided on the base. Each adjacent pair of the heat-dissipating fins defines an air channel therebetween. The heat-dissipating fan is disposed at a rear side of the heat sink to provide a heat-dissipating air current to the heat sink such that the air current flows from the rear side of the heat sink through the air channels and out through a front side of the heat sink. The first air guide hood is disposed at one of left and right sides of the heat sink and is located in front of the heat-dissipating fan to guide a portion of the air current provided by the heat-dissipating fan to the outside through one side of the heat sink. | 03-11-2010 |
| 20100073877 | HEAT SINK ASSEMBLY - A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board. | 03-25-2010 |
| 20100073878 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink ( | 03-25-2010 |
| 20100073879 | THERMAL MODULE - A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect. | 03-25-2010 |
| 20100079950 | Radiating Fin and Thermal Module Formed Therefrom - A thermal module includes a base for contacting with a heat-producing element, a radiating fin assembly consisting of a plurality of stacked radiating fins, a heat pipe having an end connected to the base and the other end extended through the radiating fin assembly, and a fan mounted to one side of the radiating fin assembly. Each of the radiating fins includes a flat main body having a first and a second transverse edge, and at least one projected portion provided on at least one of the first and the second transverse edge. Positions on the first and/or the second transverse edge without the projected portion are open portions. The projected portions on two adjacent radiating fins are staggered, so that a plurality of expanded heat dissipating spaces can be formed on the radiating fin assembly to enable smooth flowing of heat-carrying airflows and upgraded heat dissipating efficiency. | 04-01-2010 |
| 20100079951 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a sub-board opposed to a main board, a heat producing component mounted on the sub-board, a heat pipe opposed to the heat producing component, a pressing member including a main part opposed to the heat pipe, and a fixing part extending from the main part, a support member interposed between the main board and the sub-board, and a fixing member which fixes the fixing part of the pressing member to the sub-board, and fixes the sub-board to the support member. | 04-01-2010 |
| 20100085709 | COOLING SYSTEM FOR RACK-MOUNTED ELECTRONICS EQUIPMENT - A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example. | 04-08-2010 |
| 20100085710 | Canister Housing - According to one embodiment, a housing for a pedestal canister includes a first side plate and a fan. The first side plate includes a plurality of fins disposed on an exterior portion of the first side plate. The fan is coupled to the exterior portion of the first side plate. The pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block. | 04-08-2010 |
| 20100085711 | HEAT DISSIPATION MODULE AND FAN THEREOF - A heat dissipation module assembled with a circuit board is disclosed. The heat dissipation module assembled comprises a fan and at least a heat sink. The fan comprises a frame and an impeller. The frame comprises a body and at least an extension, wherein the extension protrudes from at least a side of the body. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element. | 04-08-2010 |
| 20100097762 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink ( | 04-22-2010 |
| 20100097763 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly. | 04-22-2010 |
| 20100097764 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins. | 04-22-2010 |
| 20100103617 | CONTROL DEVICE - It is possible to provide a small-size and light-weight control device having a structure which prevents detaching of a board even when an external shock is applied without using a screwed connection. The control device is formed by a case ( | 04-29-2010 |
| 20100124020 | Radiating fin assembly and thermal module formed therefrom - A radiating fin assembly includes a plurality of alternately stacked first radiating fins and second radiating fins, such that a V-shaped recession is formed between any two adjacent first and second radiating fins. The V-shaped recessions are defined on at least one of two longitudinal sides of the radiating fin assembly and include a plurality of split spaces, first widened spaces, and second widened spaces. The split spaces are formed at a bottom portion of the V-shaped recessions, and the first and the second widened spaces are formed at two opposite ends of the split spaces. The radiating fin assembly can be associated with at least one heat pipe and a base to form a thermal module. With the V-shaped recessions, the radiating fin assembly and the thermal module can have widened airflow inlets, shortened airflow paths, reduced airflow pressure drop and flowing resistance, and accordingly upgraded heat dissipating efficiency. | 05-20-2010 |
| 20100124021 | Heat radiating fin assembly and thermal module formed therefrom - A heat radiating fin assembly is formed from alternately stacked first and second heat radiating fins. The first and the second heat radiating fins each are provided on at least one lateral side with a projected point and a receded point, respectively, to thereby define an airflow guiding section on at least one longitudinal side of the heat radiating fin assembly. The airflow guiding section includes a first and a second airflow inlet, and a middle airflow inlet located between the first and the second airflow inlet. The heat radiating fin assembly can be associated with at least one heat pipe and a base to form a thermal module. The airflow guiding section enables widened airflow inlets, shortened airflow paths, reduced airflow pressure drop and flowing resistance, and upgraded cooling air flowing efficiency, so that the heat radiating fin assembly and the thermal module can provide excellent heat dissipating effect. | 05-20-2010 |
| 20100134978 | Cooling fan housing structrue - A cooling fan housing structure for connecting to a heat sink includes a boosting portion, a top face, and an enclosing portion. The top face is outward extended from an end of the boosting portion, and the enclosing portion is extended from an end of the top face farther away from the boosting portion in a vertical direction opposite to the boosting portion. The top face and the enclosing portion together cover one side of the heat sink. The top face includes at least one projected element, and the heat sink includes at least one heat-absorbing portion and at least one heat-dissipating portion defining at least one heat-dissipating flow passage. By inserting and holding the projected element in the heat-dissipating flow passage, the cooling fan housing structure can be quickly and stably connected to the heat sink at reduced time and labor and manufacturing cost. | 06-03-2010 |
| 20100157531 | Air Cooling for a Phased Array Radar - In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat. | 06-24-2010 |
| 20100157532 | ENERGY STORAGE PACK COOLING SYSTEM AND METHOD - An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure. | 06-24-2010 |
| 20100165573 | HEAT SINK USED IN INTERFACE CARD - A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended. | 07-01-2010 |
| 20100172098 | IMAGE DISPLAY - A flat-type image display, such as, a plasma display, a LCD display, an OLED display, etc., in particular, for improving a cooling efficiency of a display panel, various kinds of substrates and an image display element, within the thin-sized housing thereof, comprises: a display panel; a chassis, which supports the display panel from a rear surface side thereof; a front surface-side cover, which is provided on a front side of the display panel; a rear surface-side cover, which is provided on a rear side of the display panel; an image display element connected with the display panel; a display driver substrate, which is connected with the display panel, and on a surface of which opposite to the chassis are provided circuit parts thereof; a power source substrate, which supplies driving power to the display driver substrate and the image display element, and on a surface of which opposite to the chassis are provided circuit parts thereof; and a first insulator board, which is provided at a position opposite to the display driver substrates and the power source substrate of the chassis. | 07-08-2010 |
| 20100177480 | HEAT EXCHANGER DEVICE AND METHOD FOR HEAT REMOVAL OR TRANSFER - Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air. | 07-15-2010 |
| 20100182750 | INDUSTRIAL VEHICLE WITH ELECTRIC COMPONENT UNIT - An industrial vehicle has a vehicle body and an electric component unit. The electric component unit has a base member fixed to the vehicle body, a fan fixed to the base member for ventilating, at least one electric device fixed to the base member and at least one radiator fixed to the electric device. The base member has an opening provided in the center of the base member and a plurality of ducts. The ducts and the electric device cooperate to form a ventilating passage. The ventilating passage has a plurality of separate passages communicated with the opening and the radiator is disposed in each of the separate passages. | 07-22-2010 |
| 20100188817 | HEAT DISSIPATION DEVICE - A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one. | 07-29-2010 |
| 20100195284 | ELECTRONIC DEVICE AND FREQUENCY CONVERTER OF MOTOR - The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively. Said electronic device may further comprise a separating member for separating a main body of said at least one second heat-generating element from said circuit board, so as to prevent the cooling air guided to said at least one second heat-generating element from flowing to said circuit board; a bracket for separating said at least one first heat-generating element from other elements on said circuit board, so as to thermally insulate between them; and a flow-guiding gate guiding the airflow from said fan, and dispensing more airflow flow through the region on the heat sink corresponding to at least one first heat-generating element. | 08-05-2010 |
| 20100202109 | ELECTRONIC DEVICE AND FREQUENCY CONVERTER OF MOTOR - The present invention provides a frequency converter for driving a motor, comprising: a circuit board, having at least one first heat-generating element mounted thereon; a heat sink, connected to the at least one first heat-generating element; a fan, facing the heat sink; and a bracket, for positioning the at least one heat-generating element relative to the heat sink and the circuit board. The frequency converter further comprises: a separating member for separating the at least one portion of the main body of the at least one second heat-generating element from the circuit board, so as to prevent the cooling air guided to the at least one second heat-generating element from flowing to the circuit board; an airflow guiding member placed between the fan and the heat sink, for guiding the cooling air flowed from the fan to the heat sink and the at least one second heat-generating element respectively; and a flow guiding gate guiding the airflow from the fan to the heat sink, and dispensing more airflow to flow through the region corresponding to the at least one first heat-generating element. | 08-12-2010 |
| 20100232108 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the heat generating element through the opening, a number of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet. The air intake and the air outlet are located outside the housing. | 09-16-2010 |
| 20100232109 | HEAT DISSIPATION DEVICE - A heat dissipation device for cooling an electronic device mounted on a printed circuited board includes a heat sink thermally contacting the electronic device, a fan defining a plurality of through holes in a periphery thereof and a fixing device fixing the fan on a side of the heat sink. A plurality of fasteners are attached on a bottom of the heat sink and fasten the heat sink on the printed circuited board. The fasteners block the through holes in a bottom of the fan. The fixing device includes fixing brackets attached to the heat sink and a plurality of resilient connecting devices. Each resilient connecting device has an end extending through a corresponding through hole in the bottom of the fan and connected to the fan, and another end connected to a bottom of a corresponding fixing bracket. | 09-16-2010 |
| 20100238628 | PORTABLE ELECTRONIC DEVICE INCORPORATING EXTENDABLE THERMAL MODULE - An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis. | 09-23-2010 |
| 20100246126 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink, a fan, and a fixing structure. The fan defines a number of fixing holes. The fixing structure includes a base, two resilient side panels bent from two sides of the base. The base and the side panels bound an accommodating space to accommodate the fan. An airflow opening is defined in the base for allowing air to flow between the heat sink and the fan. First ends of a number of fasteners secure the base of the fixing structure to the heat sink. Second ends of the number of fasteners protrude through the base into the accommodating space, to be accommodated in the corresponding fixing holes of the fan. | 09-30-2010 |
| 20100246127 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit. | 09-30-2010 |
| 20100254086 | Electronic Apparatus - Provided is an electronic apparatus capable of also supplying sufficient air flow to a heat generating device other than the heat sink. An electronic apparatus includes: a cooling unit ( | 10-07-2010 |
| 20100259896 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER THEREON - A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs. | 10-14-2010 |
| 20100302731 | Inverter Cooler - A DC to AC inverter used in a solar cell power system can include an improved structure for cooling itself and increasing power output. | 12-02-2010 |
| 20100302732 | HEAT-DISSIPATING MECHANISM FOR USE WITH MEMORY MODULE - A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device. | 12-02-2010 |
| 20100328887 | Heat Sink for a Circuit Device - Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell. | 12-30-2010 |
| 20110007476 | SYSTEMS AND METHODS FOR PROVIDING HEAT TRANSFER - There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate. | 01-13-2011 |
| 20110032675 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component. | 02-10-2011 |
| 20110043998 | HEAT-DISSIPATING MODULE - A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel. | 02-24-2011 |
| 20110051370 | Electronics Unit with Cooling Fins - The invention concerns a unit with electronic components, which, when in operation, generate heat. The unit comprises a carrier plate, upon the first section of which a first group of electronic components is placed. Upon a second section thereof is installed a plurality of cooling ribs for the removal of heat produced by the electronic components. The cooling ribs are designed to be curved to a predetermined extent along their longitudinal axis and to lie in a plane parallel to the said carrier plate. | 03-03-2011 |
| 20110063800 | HEAT DISSIPATING DEVICE - The present invention relates to a heat dissipating device. More particularly, the present invention relates to a heat dissipating device in which an air flow is directed to a heat dissipating member by flapping a blade for making a driving unit and a device therefor small, improving heat dissipating efficiency and reducing noise therefrom. | 03-17-2011 |
| 20110075364 | ELECTRONIC DEVICE - An electronic device including a case, a fan module and a transparent cover is provided. The fan module including a fan and a fin set is disposed in the case. The fin set is disposed aside the fan, and a space is formed there between. The transparent cover is connected to the case, and is located above the space formed between the fin set and the fan. | 03-31-2011 |
| 20110075365 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet. | 03-31-2011 |
| 20110075366 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board. | 03-31-2011 |
| 20110080709 | Digital Signage Player - A digital signage player is provided. The digital signage player includes a body having a main board and a hard disk, an outer frame in which the body is framed, and a heat dissipation unit disposed in the body. The digital signage player of the present invention can be conveniently fixed to a wall surface nearby the digital signage by fixing a fixing mechanism of the outer frame with screw bolts or rivets to the wall surface. Further, the corrugation shaped heat dissipation fins are also configured to prevent dusts or dirts from entering the body and contaminating the main board. | 04-07-2011 |
| 20110080710 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a cooling unit includes a radiator unit on the circuit board, and a cooling fan connected to the radiator unit and supported outside the circuit board in a floating state, a keyboard on a top wall of the housing, opposed to the circuit board and the cooling fan, a first supporting member disposed between the cooling fan and the keyboard and configured to support the keyboard when a key is depressed, and a second supporting member disposed between the cooling fan and a bottom wall of the housing and configured to support the cooling fan when a key is depressed. At least one of the first and second supporting members is formed of an elastic material. | 04-07-2011 |
| 20110085303 | AIRFLOW GUIDING COVER - An airflow guiding cover includes a first airflow guiding portion, a second airflow guiding portion connected to an end of the first airflow guiding portion, and a third airflow guiding portion connected to an opposite end of the first airflow guiding portion. The first airflow guiding portion is collapsible and extendable along a first direction and flexible along a second direction perpendicular to the first direction, to enable the airflow guiding cover to fit for different system layout. | 04-14-2011 |
| 20110090647 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module. | 04-21-2011 |
| 20110096501 | HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE USING THE SAME - An exemplary heat dissipation device includes a heat sink defining air passages therein, a fan holder fixedly mounted on the heat sink, a fan mounted on the fan holder, and an adjustable wind-guiding module located in and pivoted to the fan holder. The fan is positioned for generating an airflow flowing through the adjustable wind-guiding module generally toward the air passages of the heat sink. The adjustable wind-guiding module is selectably pivotable with respect to the fan holder such that a direction of the airflow generally toward the air passages of the heat sink is changed accordingly. | 04-28-2011 |
| 20110103016 | HEAT DISSIPATION APPARATUS WITH FOOL-PROOF MECHANISM AND ELECTRONIC DEVICE INCORPORATING THE SAME - An electronic device includes a circuit board, an electronic component mounted on the circuit board and a heat dissipation apparatus for dissipation heat generated by the electronic component. The heat dissipation apparatus includes a heat sink, at least one first supporting sleeve and a second supporting sleeve connected to a bottom side of the base of the heat sink, and a positioning sleeve mounted on the circuit board. The heat sink includes a base and a plurality of fins formed on the base. The positioning sleeve and the second supporting sleeve cooperatively form a fool-proof mechanism. The fool-proof mechanism includes a first engaging portion formed on the second supporting sleeve and a second engaging portion formed on the positioning sleeve. The heat sink can be mounted to the circuit board in a right mounting orientation only when the first engaging portion engages in the second portion of the fool-proof mechanism. | 05-05-2011 |
| 20110103017 | HEAT DISSIPATION DEVICE FOR ELECTRONIC DEVICE ASSEMBLY - A heat dissipation device adapted for cooling an electronic device mounted on a printed circuit board comprises a base plate adapted for being thermally attached to the electronic device and a clip attached on a top face of the base plate. The base plate comprises two protruding poles protruding downwardly from a bottom face thereof. The protruding poles are capable of extending through the printed circuit board, thereby establishing a location for the heat dissipation device on the printed circuit board. The clip fastens the heat dissipation device on the printed circuit board after the location for the heat dissipation device on the printed circuit board has been established. | 05-05-2011 |
| 20110110041 | HEAT DISSPATION STRUCTURE OF ELECTRONIC APPARATUS - A heat dissipation structure of an electronic apparatus includes a bendable vapor chamber with a large area. A small section of the vapor chamber is arranged to contact with the heat source of the electronic apparatus and a large remaining section of the vapor chamber contacts with an internal wall of the chassis of the electronic apparatus through appropriate bending. The working fluid in the vapor chamber absorbs the heat generated by the heat source and vaporizes. The heat-carrying vapor spreads within the vapor chamber to condense on a large condensation zone. The released heat is then dissipated to the atmosphere via the large area of the chassis and the heat dissipating fin structure thereon. Therefore, the heat dissipation structure provides efficient passive heat dissipation. | 05-12-2011 |
| 20110122582 | HEAT DISSIPATING DEVICE - The present invention relates to a heat dissipating device. More particularly, the present invention relates to a heat dissipating device in which an air flow is directed to a heat dissipating member by alternating rotation of blades within a preset range of angle for making a driving unit and a device thereof smaller, and improving heat dissipating efficiency. | 05-26-2011 |
| 20110128703 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a board housed in a housing, a plurality of first modules mounted on the board and a second module. The first modules generating heat while in operation are mounted on the board at intervals while projecting from the board, and the first modules are arranged to be adjacent to each other inside the housing. At least one air flow path is formed between an adjacent pair of first modules. The second module is placed adjacent to one end side of the first modules across the air flow path and has a projecting height from the board lower than that of the first modules. A fan is housed in the housing. The fan creates an air flow inside the housing from the first modules towards the second module. | 06-02-2011 |
| 20110128704 | FLOW CONTROL DEVICE AND COOLED ELECTRONIC SYSTEM EMPOLYING THE SAME - A flow control device and a related cooled electronic system are provided. The electronic system comprises a first heat dissipation component and a second heat dissipation component. The flow control device controls an amount of an air flow to the first heat dissipation component and the second heat dissipation component. In one illustrative embodiment, the flow control device comprises: a memory metal component coupled to the first heat dissipation component and the second heat dissipation component and a movable component comprising a first end and a second end. The first end is coupled to a point between two ends of the memory metal component and the second end is movable with respect to the first end. In response to a temperature difference between the first heat dissipation component and the second heat dissipation component, the second end approaches the first heat dissipation component or the second heat dissipation component. | 06-02-2011 |
| 20110149514 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction. | 06-23-2011 |
| 20110149515 | HEAT DISSIPATION DEVICE AND ELECTRONIC SYSTEM INCORPORATING THE SAME - A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided. | 06-23-2011 |
| 20110149516 | ELECTRONIC SYSTEM AND HEAT DISSIPATION DEVICE THEREOF - A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation section. The fastening assembly includes a retention plate and a wire clip. The retention plate includes a retaining portion abutting against the heat pipe, and two fastening portions located at opposite sides of the evaporation section of the heat pipe. The wire clip includes two abutting portions, a resisting portion interconnecting the abutting portions, and two locking arms extending outwardly from two outer ends of the abutting portions, respectively. The retaining portion and the resisting portion abut against the evaporation section of the heat pipe, the abutting portions abut against inner surfaces of the fastening portions, the locking arms are fastened to the circuit board, thereby mounting the retention plate with the heat pipe on the electronic component. | 06-23-2011 |
| 20110157826 | COOLING UNIT AND ELECTRONIC DEVICE - According to one embodiment, a cooling unit includes a heat dissipating mechanism, a fan, and a movable cover. The heat dissipating mechanism is housed in a housing of an electronic device. The fan is housed in the housing, and generates an air flow that collides against the heat dissipating mechanism. The movable cover includes a sheet and a knob. The sheet serves as an openable and closable cover to cover an opening on a chamber formed between the fan and the heat dissipating mechanism from the outside. The knob is located on the sheet and protrudes outward. | 06-30-2011 |
| 20110194253 | SEMICONDUCTOR APPARATUS HAVING SEMICONDUCTOR MODULE COOLED BY HEAT SINKS WHICH HAVE INCREASED STRENGTH TOGETHER WITH INCREASED THERMAL MASS - In a semiconductor apparatus, a semiconductor module containing semiconductor elements is enclosed between a pair of heat sinks which are held attached together by spring clips. Each heat sink has one side thermally coupled to a corresponding main face of the semiconductor module and has an array of primary fins and a pair of secondary fin protruding from the other side, with the secondary fins being located at opposing ends of the array of primary fins, beyond the outermost primary fins. At least part of each secondary fin is made thicker than each primary fin, to provide greater strength and greater thermal mass for each secondary fin than each primary fin. | 08-11-2011 |
| 20110199731 | COOLING STRUCTURE OF ELECTRONIC DEVICE - According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside. | 08-18-2011 |
| 20110222243 | POWER SUPPLY APPARATUS INCLUDING FAN FOR AIR COOLING - A power supply apparatus includes an air path extending longitudinally, a fan that blows air into the air path in a direction intersecting a longitudinal direction of the air path, and a plurality of electronic components arranged in the longitudinal direction. Each of the electronic components is cooled by air passing through the air path. With this configuration, it is possible to efficiently cool the electronic components without compromising the flexibility of arrangement of the various electronic components. Also, a dust removal operation can be readily performed without the possibility of damaging the fan. | 09-15-2011 |
| 20110249401 | ELECTRONIC APPARATUS - According to one embodiment, a television attachment device includes a case, a fan unit, a fin unit and a heat pipe. The fan unit includes a case, a fan main body rotatably provided inside the case, and a motor fixed to the inner surface of a second wall and rotating the fan main body. The fin unit is arranged adjacent to a first side portion of the case. The heat pipe includes a first end portion connected to a circuit component, and a second end portion opposed to the first end portion, close to the second wall and connected to the fin unit. | 10-13-2011 |
| 20110261532 | HEAT DISSIPATION DEVICE WITH SELF-LOCKING BASE - A heat dissipation device for dissipation of heat from an electronic component includes a base for contacting the electronic component, a shroud connected to the base and multiple fins arranged on the bottom section of the shroud. The shroud comprises a bottom section defining an opening therein and a plate within the opening and connected to the bottom section by multiple beams. Multiple fins in the form of a fin assembly are mounted on the bottom section. The base includes a plate and multiple latch hooks extending upwardly from the plate. The latch hooks are extended into the bottom section to lock with the bottom section, thereby securing the base onto the shroud. | 10-27-2011 |
| 20110261533 | COMPACT HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base. | 10-27-2011 |
| 20110267777 | Cooling unit, electronic device, and heat sink - A cooling unit includes: a case having an air inlet that sucks an air, an air outlet that discharges the sucked air, and a side wall that forms a ventilation path leading the air from the air inlet to the air outlet; a fan housed in the case; and a heat sink arranged in the air outlet of the case, having a plurality of heat dissipating fins, and having a dust and dirt discharging port formed at a position corresponding to a flow rate of the air flowing in the case. | 11-03-2011 |
| 20110279977 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing. | 11-17-2011 |
| 20110310559 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A heat conducting adhesive is filled in the through-hole. The heat conducting adhesive is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the heat conducting adhesive to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 12-22-2011 |
| 20110310560 | ELECTRONIC ASSEMBLY AND CASING THEREFOR - A secure control unit is provided with a completely sealed casing ( | 12-22-2011 |
| 20110310561 | TELEVISION, RADIATING MEMBER, AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion. | 12-22-2011 |
| 20120014063 | HEAT SINK COOLING ARRANGEMENT FOR MULTIPLE POWER ELECTRONIC CIRCUITS - The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges. | 01-19-2012 |
| 20120014064 | NON-CIRCULAR RADIAL HEAT SINK - A heat sink includes a blower located in the heat sink and a plurality of fins extending from a periphery of the blower toward a perimeter of the heat sink. The plurality of fins define a plurality of channels each having a channel inlet located at the blower and a channel exit located at the perimeter of the heat sink. The plurality of channels vary in length around the perimeter of the heat sink A velocity of an air flow from the blower at each channel inlet is substantially equal for each channel of the plurality of channels, and a total pressure drop from the channel inlet to the channel exit is substantially equal for each channel of the plurality of channels. | 01-19-2012 |
| 20120014065 | Power Tool Having Circuit Board - A power tool includes a brushless motor, a switching element, a power cable a rectifying device, a heat releasing member. The switching element controls a drive of the brushless motor. The power cable supplies an electric current to the brushless motor from power source. The rectifying device rectifies the electric current from the power cable. The heat releasing member is connected to the switching element and the rectifying device in order to enhance a cooling efficiency for the same. | 01-19-2012 |
| 20120033381 | ELECTRONIC DEVICE COOLING STRUCTURE - A cooling structure ( | 02-09-2012 |
| 20120057300 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a conductive board, a heat sink, and a thermo-electric cooler (TEC). The heat sink is mounted on the conductive board. The heat sink includes a base board defining a groove in a bottom of the base board. The TEC is accommodated in the groove, and a cooling surface of the TEC is coplanar with a bottom surface of the base board. A first part of the conductive board contacts the bottom surface of the base board. A second part of the conductive board contacts the cooling surface of the TEC. | 03-08-2012 |
| 20120057301 | HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCORPORATING SAME - A heat dissipation apparatus for an electronic device includes a centrifugal fan, a fin assembly, a heat pipe and an air guiding plate. The fin assembly is disposed at an air outlet of the centrifugal fan. The heat pipe includes a condensing section thermally connected to the fin assembly and an evaporating section. The air guiding plate extends from the air outlet toward a side of the centrifugal fan, and has a first end adjacent to the air outlet and a second end far from the air outlet. When the heat dissipation apparatus is mounted in a casing, a drawing passage and an exhaust passage are defined at two lateral sides of the air guiding plate. In operation, airflow in the drawing passage is blocked by the air guiding plate to circulate past the second end of the air guiding plate and enter the exhaust passage. | 03-08-2012 |
| 20120063088 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion. | 03-15-2012 |
| 20120063089 | ELECTRONIC DEVICE - An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel. | 03-15-2012 |
| 20120069521 | HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE HAVING THE SAME - A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source. | 03-22-2012 |
| 20120087088 | MICROSCALE HEAT TRANSFER SYSTEMS - This disclosure concerns micro-scale heat transfer systems. Some systems relate to electronics cooling. As one example a microscale heat transfer system can comprise a microchannel heat exchanger defining a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels. The cross-connect channels can be spaced apart along a streamwise flow direction defined by the flow microchannels. Such a configuration of flow microchannels and cross-connect channels can enable the microchannel heat exchanger to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source. Microscale heat transfer systems can also comprise a condenser fluidicly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid. A pump can circulate the working fluid between the microchannel heat exchanger and the condenser. | 04-12-2012 |
| 20120092830 | ELECTRONIC APPARATUS AND COOLING FAN - According to one embodiment, an electronic apparatus is provided with a housing, a circuit board in the housing, fan blades configured to rotate and blow air in a centrifugal direction, and a casing which contains the fan blades. The casing includes an exhaust port and a cut portion which opens in a centrifugal direction different from a direction in which the exhaust port opens, from a perspective of a rotation center of the fan blades, and into which a part of the circuit board is inserted. | 04-19-2012 |
| 20120099278 | ELECTRONIC APPARATUS WITH HEAT DISSIPATION DEVICE - An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink. | 04-26-2012 |
| 20120106082 | ELECTRONIC APPARATUS - An electronic apparatus includes a housing, a fan module, a heat-dissipating module, and a channel. The housing includes a first heat-dissipating vent and a second heat-dissipating vent. The fan module is disposed in the housing and includes a first outlet and a second outlet. The first outlet is substantially aligned with the first heat-dissipating vent and has a first airflow. The second outlet has a second airflow. The heat-dissipating module is disposed in the housing between the first outlet and the first heat-dissipating vent. The channel is located between the second outlet and the second heat-dissipating vent for guiding the second airflow out of the housing from the second heat-dissipating vent. The temperature of the first heat-dissipating vent is higher than that of the second heat-dissipating vent. | 05-03-2012 |
| 20120134114 | Thermal management of environmentally-sealed electronics enclosure - Heat generated by operating electronic components within an environmentally-sealed enclosure is removed, without direct transmission of a viscous medium through the enclosure. An internal heat sink and external heat sink each span a given wall. The internal heat sink section is baffled and channeled with one place for air to enter, and one to exit. A fan forces air over heat sink extremities of the internal heat sink section. A circulating air column entrapped within the enclosure is drawn into the entrance of the internal heat sink, and forced through the entire length of the internal heat sink, providing for a thermal conduit for a heated entrapped air column to transfer its heat into the internal heat sink. The external heat sink is exposed to the ambient environment, with airflow managed over the external heat sink preferably with a structural surround that provides for channeling of airflow. | 05-31-2012 |
| 20120162917 | HEAT DISSIPATION DEVICE UTILIZING FAN DUCT - A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate. | 06-28-2012 |
| 20120182690 | ELECTRONIC DEVICE WITH COOLER - An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard. | 07-19-2012 |
| 20120188716 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan. | 07-26-2012 |
| 20120218710 | System and Methods for Improving Power Handling of an Electronic Device - There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, a third dual IGBT coupled to the heatsink and common to the field exciter and the battery. The electronic device also includes a temperature sensor disposed in the heatsink, a cooling unit comprising a plenum and a variable source of air flow, and a controller. The controller is configured to receive a temperature reading from the temperature sensor and, based on the temperature reading, determine a desired level of cooling for at least one of the dual IGBTs, wherein an air flow rate provided by the cooling unit is determined based on the desired level of cooling. | 08-30-2012 |
| 20120229980 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base for being contacted with a heat-generating element mounted on a circuit board, two frames rotatably mounted to the base, and a thermal module secured to the base. A slot is defined in each frame for allowing a fastener to extend through to engage in the circuit board. | 09-13-2012 |
| 20120229981 | ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE COMPOSITION AND ELECTRONIC DEVICE - An embodiment of the invention provides an electrically insulating and thermally conductive composition including 5-80 parts by weight of a resin, 20-95 parts by weight of an electrically insulating and thermally conductive powder, and 0.0001-2 parts by weight of a graphene. Another embodiment of the invention also provides an electronic device including the electrically insulating and thermally conductive composition. | 09-13-2012 |
| 20120229982 | DISPLAY DEVICE AND ELECTRONIC DEVICE - According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path. | 09-13-2012 |
| 20120229983 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing including an opening area and a closing area, a fan in the housing, a first area between the fan and the opening area, a second area between the fan and the closing area, and a windshield in the second area. | 09-13-2012 |
| 20120262879 | ELECTRONIC APPARATUS - A curved wall | 10-18-2012 |
| 20120262880 | HEAT SINK AND ELECTRONIC APPARATUS INCLUDING HEAT SINK - A heat sink | 10-18-2012 |
| 20120275115 | ELECTRONIC DEVICE - An electronic device including a casing, a heat generating element, a heat dissipating element and a fan is provided. The heat generating element is disposed in the casing. The heat dissipating element is disposed on the heat generating element. The fan is disposed on the heat dissipating element and is capable of rotating forward or reverse. When the electronic device in a first state is changed into a second state, the fan firstly rotates reverse to generate a first airflow for removing the dust in the casing. After the fan rotates reverse over a period of time, the fan stops from rotating reverse and starts to rotate forward to generate a second airflow for dissipating heat from the heat dissipating element. | 11-01-2012 |
| 20120300401 | ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE - An electronic device includes an expansion card, an electronic component attached on the expansion card, and a heat dissipation device attached to the expansion card to cool the component. The heat dissipation device includes a heat sink, a fixing member abuts the heat sink, and a fan fixed to the fixing member. The fixing member includes a frame, and two resilient latching arms extending from two opposite sides of the frame. The latching arms are detachably latched to the expansion card. The fan is fixed to a side of the frame opposite to the arms. | 11-29-2012 |
| 20120307450 | ELECTRONIC DEVICE ENCLOSURE - The electronic device enclosure includes a case and a cooling assembly. The case includes a top plate, a bottom plate, a side plate and a mounting plate. The top plate is opposite to the bottom plate, and the side plate is substantially perpendicularly connected to the top plate and the bottom plate. The cooling assembly includes a cooler and a fan secured to the cooler. The mounting plate is secured to the top plate and the bottom plate, the fan is secured to the mounting plate and located between the mounting plate and the cooler. | 12-06-2012 |
| 20120327601 | WATER-PROOF COVER FOR AN INVERTER UNIT - The front case of the unit case contains a circuit section including a power semiconductor module, and the rear case contains a cooling fin assembly of the semiconductor module and a cooling fan. The cooling air ventilated through the wind channel by the cooling fan is discharged upward from the unit case. The water-proof cover is placed over the top of the unit case. The water-proof cover includes an exhausting structure formed with openings downward at the left and right sides of a front part of the water-proof cover to form an exhausting path; and a ventilation guide formed around an exhausting port inside a rear part of the water-proof cover. The cooling air discharged to the inside space of the water-proof cover by the cooling fan is ventilated through the ventilating path and exhausted outside through the exhausting path. | 12-27-2012 |
| 20130003300 | ELECTRONIC DEVICE WITH CASE FOR ELECTRO MAGNETIC COMPATIBILITY - An electronic device includes a display module, a motherboard, a heat dissipating device, a case, and a cover. The motherboard is secured on the display module. A first heat generating member is secured to the motherboard. The heat dissipating device is secured to the motherboard. The heat dissipating device includes a heat sink and a heat pipe secured to the heat sink. The heat pipe capable of transferring heat generated from the first heat generating member to the heat sink. The case is secured to the display module and covers the motherboard. A fan module is secured to the case above the first heat generating member and capable of directing air out of the case. The cover is secured to the display module and covers the heat dissipating device and the case. The heat sink is located in the case and out of the cover. | 01-03-2013 |
| 20130010427 | ELECTRONIC DEVICE WITH HEAT DISSIPATION UNIT - A heat dissipation unit for radiating heat produced by at least one heat source of an electronic device includes a fan, at least an electrical connector, and a latching member. The fan has at least one power cord. The at least one connector is connected to the at least one power cord and is engageable with a power connector of a power supply unit of the electronic device. The latching member corresponds to the power connector for clasping the electrical connector therein. The electrical connector is clasped in the latching member for being aligned with the power connector of the electronic device. | 01-10-2013 |
| 20130021751 | Electronic Device - A notebook computer | 01-24-2013 |
| 20130027880 | Electronic Device - A notebook computer | 01-31-2013 |
| 20130027881 | Electronic Device - A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component | 01-31-2013 |
| 20130058040 | COMMUNICATION APPARATUS AND AIR-COOLING METHOD FOR THE SAME - A communication apparatus and an air-cooling method for the same utilizes an air-cooling mode that can be easily changed to reduce the cost to increase the number of transceiver units and space for the housing. The communication apparatus includes transceiver units installed in a housing and attachable onto and detachable from the communication apparatus and fan units for forcibly air-cooling heat generated from the transceiver units. The fan units are installed in the housing and are attachable onto and detachable from the communication apparatus. Each transceiver unit includes a transceiver function section; a forced air-cooling radiator fixedly mounted in the transceiver function section for forcibly air-cooling heat generated from the transceiver function section; and a natural air-cooling radiator mounted in the transceiver function section for naturally air-cooling heat generated from the transceiver function section. The natural air-cooling radiator is attachable onto and detachable from the main transceiver section. | 03-07-2013 |
| 20130077243 | CONTROLLER - A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the rear side of which a first connector is provided, is inserted into the corresponding spatial area so as to move over a shelf from an open end [of the unit cover]; and a backboard which is disposed inside the unit cover and on which a second connector is provided in a position where the first package box, inserted in the corresponding spatial area, mates with the first connector, wherein the shelf is provided with a protrusion which rotatably supports the first package box in a fan direction. | 03-28-2013 |
| 20130083483 | HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE USING SAME - A heat dissipation device is for dissipating heat generated from an electronic device, and includes a fan duct and a heat sink. The fan duct includes a top plate having a receiving hole penetrating therethrough. The heat sink is configured to dissipate heat from a heat-generating electronic component of the electronic device, and includes a base configured to be mounted on the heat-generating electronic component and a number of heat dissipating sheets positioned on the base. The heat dissipating sheets are long enough to extend towards the fan duct and into the receiving hole when the heat dissipation device is installed in the electronic device. | 04-04-2013 |
| 20130135823 | SEMICONDUCTOR PACKAGES USABLE WITH A MOBILE DEVICE - A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow. | 05-30-2013 |
| 20130141869 | HEAT DISSIPATING MODULE - A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet. | 06-06-2013 |
| 20130155617 | HEAT DISSIPATION DEVICE FOR MEMORY CARD - A heat dissipation device for a memory card includes a memory slot mounted on a circuit board, a frame, and two fans. The memory slot includes a main body and two fixing portions pivotably mounted to opposite ends of the main body. The frame includes a connection bar abutted against a side surface of the main body, and two plates perpendicularly extending from opposite ends of the connection bar and positioned at opposite ends of the main body. Two hooks protrude from the connection bar respectively adjacent to the two plates to abut against opposite side surfaces of the main body. The fans are respectively fixed to the plates. | 06-20-2013 |
| 20130170140 | System for Cooling an Electronic Display - A system for cooling an electronic display where an isolating structure may be used to allow ambient air to cool power modules. The isolating structure substantially prohibits contaminants which may be present within the ambient air from contacting sensitive electrical components on the power modules or otherwise. A gasket may be used to seal the interface between the power modules and the isolating structure. Heat sinks may be placed in thermal communication with the power supplies and fans may draw air through a narrow channel in which the heat sinks are located. In some embodiments the narrow channel may have the opposing surface of the channel defined by the rear portion of an LED assembly. Exemplary embodiments may use the ambient air to cool both the power modules and a closed loop of isolated gas within the electronic display. | 07-04-2013 |
| 20130223007 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing including an opening area and a closing area, a fan in the housing, a first area between the fan and the opening area, a second area between the fan and the closing area, and a windshield in the second area. | 08-29-2013 |
| 20130235525 | TELEVISION, RADIATING MEMBER, AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion. | 09-12-2013 |
| 20130250517 | HEAT DISSIPATING MODULE HAVING ENHANCED HEAT DISSIPATING EFFICIENCY - A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component. | 09-26-2013 |
| 20130250518 | HEAT DISSIPATION MODULE ADAPTED TO AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH - A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface. | 09-26-2013 |
| 20130286588 | ELECTRONIC DEVICE - An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group. | 10-31-2013 |
| 20130286589 | ELECTRONIC DEVICE WITH HEAT SINK STRUCTURE - An electronic device includes a housing and a chip. The housing includes a main body and a supporting portion. The main body has an inner surface and an outer surface, and an opening disposed on the outer surface. The supporting portion is disposed on the inner surface, and has a heat dissipating chamber that communicates with the opening. The chip is disposed on the supporting portion, and the heat generated by the chip is transmitted via the housing. | 10-31-2013 |
| 20130286590 | COOLING UNIT, ELECTRONIC APPARATUS, AND GUIDE MEMBER - Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink. | 10-31-2013 |
| 20130301219 | RACK MOUNTED ELECTRONICS HAVING CONNECTORS WITH HEAT COOLING FINGERS - A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards. | 11-14-2013 |
| 20130329364 | NETWORK COMMUNICATION DEVICE - A simple configuration for cooling comprises a front-back air supply and exhaust system. A first circuit board is located in front of a relay circuit board. A cooling unit and a second circuit board are placed behind the relay circuit board in a chassis. A first air passage allows intake air through an intake hole in a front side of the first circuit board unit to pass through the first circuit board and then through an opening in the relay circuit board to the cooling unit. A second air passage allows intake air through an intake hole in a front face of the chassis to pass through a lateral side of the first circuit board and then through a vent hole in a partition provided at the lateral side of the first circuit board. The second circuit board is placed in the second air passage. | 12-12-2013 |
| 20140036445 | HEAT SINK AND ELECTRONIC APPARATUS PROVIDED WITH HEAT SINK - A heat sink for cooling a heat generating member, provided with a first cooling part which cools the peripheral edge part of the heat generating member and a second cooling part which cools the center part of the neat generating member, the first cooling part is equipped with a first base member having first fins on the top surface thereof and a recess at the bottom surface thereof, the second cooling part is equipped with a second base member which can be accommodated in the recess, a slide member which is provided on the top surface of the second base member and which is inserted in a through hole which is provided in the recess, second fins which are provided on the free end of the slide member, and a cooling water passage which is provided inside of the second base member and which is supplied with cooling water. | 02-06-2014 |
| 20140036446 | ARRANGEMENT FOR COOLING ELECTRONIC COMPONENTS AND/OR ASSEMBLIES - Components and/or assemblies are applied on a substrate. The substrate has a populating side and a heat sink side, to which a heat sink is fitted. The populating side is provided with a cover, which together with a heat sink on the heat sink side of the substrate forms a type of housing for the populated substrate. Between substrate and heat sink, a guide channel for a cooling medium (e.g. air, etc.) is provided and the substrate has an opening. A fan is fitted above the opening in such a way that a cooling flow of the cooling medium generated by the fan is conducted through the guide channel on the heat sink side of the substrate and over the populating side of the substrate and thus over the mounted components and/or assemblies. The heated cooling medium is then conducted away with the aid of the cover. | 02-06-2014 |
| 20140063739 | HEAT-DISSIPATING SYSTEM FOR HIGH-POWER CABINET AND STATIC VAR COMPENSATION SYSTEM - A heat-dissipating system for high-power cabinet is provided, which comprises: a cabinet; at least one main air duct, which is formed in the cabinet with a first opening and a second opening, and a first heat-generating assembly, a second heat-generating assembly and at least one first fan, which are mounted in the at least one main air duct, wherein the first fan is mounted between the first heat-generating assembly and the second heat-generating assembly; and the outlet of the first fan faces the first heat-generating assembly, airflow enters the main air duct from the first opening of the main air duct, flows through the second heat-generating assembly, an inlet of the first fan, an outlet of the first fan, and the first heat-generating assembly in sequence, and finally is discharged out of the cabinet from the second opening of the main air duct cabinet. | 03-06-2014 |
| 20140071622 | RADIATOR, ELECTRONIC APPARATUS AND COOLING APPARATUS - A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube. | 03-13-2014 |
| 20140092557 | ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE - An electronic device includes a bottom enclosure and a heat dissipating module. The heat dissipating module includes an installation box, a fan received in the installation box, and a plurality of fins secured to the installation box and closed to the fan. The installation box defines a cutout located between the fan and the plurality of fins. Airflow generated by the fan is guided along a first direction by the plurality of fins to dissipate heat generated by a heat generating component, and along a second direction through the cutout to dissipate heat generated by the bottom enclosure; the second direction is substantially perpendicular to the first direction. The heat dissipating module dissipates heat for the heat generating component and the bottom enclosure simultaneously. | 04-03-2014 |
| 20140111941 | ELECTRONIC DEVICE WITH COOLING MODULE - An electronic device includes a chassis and a cooling module. A plurality of air inlets and a plurality of air outlets are defined in a same side plate of the chassis. A partition separates the air inlets from the air outlets. Air flows into the chassis through the plurality of air inlets and flows out of the plurality of air outlets under the action of the cooling module, and then the electronic device is cooled. | 04-24-2014 |
| 20140111942 | THERMAL PLATE WITH OPTIONAL COOLING LOOP IN ELECTRONIC DISPLAY - Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well. | 04-24-2014 |
| 20140126148 | FLAT PANEL ELECTRONIC DEVICE, AUXILIARY HEAT-DISSIPATING MEANS THEREOF AND ASSEMBLY OF BOTH - An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base. | 05-08-2014 |
| 20140146474 | ENCLOSURE FOR ELECTRONIC COMPONENTS WITH ENHANCED COOLING - An enclosure is provided and includes a frame defining an interior and a pathway, the frame being configured to prevent external air infiltration to the interior, a divider disposed to divide the interior into first and second chambers that are each fluidly communicative with the pathway and a blower including a cold-plate configured to cool first electronic components disposed on the cold plate, second electronic components disposed in the second chamber and third electronic components disposed in the first chamber by cycling air through the first chamber, the second chamber and the airflow pathway. | 05-29-2014 |
| 20140168895 | ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE - An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. | 06-19-2014 |
| 20140168896 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat diffusing member. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. The heat diffusing member is attached to an inner surface of the wall and extends from the first region to the second region. | 06-19-2014 |
| 20140211420 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes a main body, a motherboard, at least one connector, and at least one external graphics card module. The motherboard is disposed within the main body and equipped without a built-in graphics chip. The connector is disposed on the motherboard. The main body has at least one slot, and the slot is disposed at a position corresponding to the position of the connector. The external graphics card module includes a circuit board, and a graphic processing unit and a first connecting interface are electrically disposed on the circuit board. The external graphics card module is removable and selectively inserts into the slot, and the external graphics card module electrically connects to the motherboard via the first connecting interface. | 07-31-2014 |
| 20140218864 | ELECTRONIC DEVICE WITH COOLING ASSEMBLY - An electronic device includes a bottom plate and a cooling assembly. The cooling assembly includes an installation box, a fan received in the installation box, and a fin module secured to the installation box and closed to the fan. The fin module defines a cutout adjacent to the fan module and extends towards the bottom plate. An airflow directed by the fan is guided along a first direction by the fin module to dissipate heat generated from a heat generating component that is thermally connected to the fin module, and along a second direction through the cutout to dissipate heat generated from the bottom plate. The cooling assembly dissipates heat for the heat generating component and the bottom plate simultaneously. | 08-07-2014 |
| 20140254097 | Electronic Apparatus, Such as a Modem or the Like, Comprising a Plurality of Air-Cooled Processors - An electronic appliance of modem or analogous type has a fan and an internal casing channeling the air stream generated by the fan, and a plurality of processors fitted with radiators that are mounted in the appliance. The radiators are situated in register with different portions (PS, PI) of the cross-section of the channeled air stream so that the different radiators are cooled by different portions (PS, PI) of the air stream. The appliance applies to the field of home electronics. | 09-11-2014 |
| 20140293541 | HEAT PIPE HEAT SINK FOR HIGH POWER DENSITY - A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged substantially vertical and thermally coupled to the cold plate, a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes. | 10-02-2014 |
| 20140301040 | VIDEO SURVEILLANCE MODULE WITH HEAT-DISSIPATING FUNCTION - A video surveillance module with a heat-dissipating function includes a thermal conductive casing, a transparent cover, a video capturing device, a motherboard device, and a first fan. The transparent cover is connected to the thermal conductive casing. The video capturing device is disposed in the transparent cover. The motherboard device is disposed in the thermal conductive casing and electrically connected to the video capturing device. The first fan is disposed on the motherboard device and opposite to the thermal conductive casing for generating a first airflow. The first fan guides the first airflow toward the thermal conductive casing. | 10-09-2014 |
| 20140301041 | FORCED AIR COOLING-TYPE POWER CONVERSION DEVICE - Power conversion sub-blocks are combined to be configured as a power conversion block. The power conversion sub-blocks include power conversion modules including cooler base sections on which semiconductor elements are mounted and cooler fin sections provided on the rear surface side of semiconductor element mounting surfaces in the cooler base sections and cooler attachment members to which cooler fin sections are attached back to back, the cooler attachment members being configured to be capable of separating an opened section where the cooler fin sections are present and external air circulates and a closed section where the semiconductor elements are present and circulating cooling air to the cooler fin sections. | 10-09-2014 |
| 20140313668 | PROTECTIVE DEVICE - An exemplary protective device is for protecting an electronic component mounted on a printed circuit board. The protective device includes a protective board covering the electronic component, and a hard carbon film coated on an outer periphery of the protective board. The protective board is made of anti-EMI materials. | 10-23-2014 |
| 20140321055 | DIGITAL SIGNAGE - There is disclosed a digital signage including a display panel, a housing having the display panel arranged in one surface, the housing comprising a closed inner space, a cooling unit provided in a predetermined portion of the housing, the cooling unit comprising a hole configured to suck and exhaust external air, a heat pipe comprising one end positioned in the inner space of the housing to be coupled to a back surface of the display and the other end positioned in the cooling unit, with a liquid flowing therein to move heat, and a driving circuit board coupled to a back surface of the heat pipe to control driving of the display panel, such that the digital signage having a slim design can exhaust the heat generated from a display panel and a driving circuit board effectively. | 10-30-2014 |
| 20140321056 | ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS - An electronic substrate | 10-30-2014 |
| 20150009627 | FIGURE EIGHT CLOSED LOOP COOLING SYSTEM FOR ELECTRONIC DISPLAY - The exemplary embodiments herein provide a figure eight closed loop of circulating gas pathways wrapping around an electronic display. One or more open loop ambient air pathways may pass through the figure eight but do not allow the circulating gas and the ambient air to mix. In some embodiments, the open loop ambient air pathway travels along a rear surface of the electronic display. In some embodiments, the circulating gas pathways contain a front channel placed in front of the electronic display, a rear channel placed behind the electronic display, and a center channel placed between the front and rear channels. Pass-through apertures may be placed within the path of the circulating gas and/or the ambient air to allow the paths of the two gaseous matters to cross without allowing them to mix with one another. | 01-08-2015 |
| 20150016061 | CENTRIFUGAL FAN MODULE AND ELECTRONIC DEVICE USING THE CENTRIFUGAL FAN MODULE - A centrifugal fan module comprising a fan housing and an impeller is provided. The fan housing includes an air inlet and a sidewall. The sidewall is pivotally disposed in the fan housing to rotate in the rotational direction relative to the fan housing. A tongue portion is formed between the sidewall and the impeller, a pressurized region is formed from the tongue portion along the rotational direction to the air outlet, the pressurized region includes a strong airflow region and the dust-discharging hole is in the strong airflow region. | 01-15-2015 |
| 20150049436 | Heat dissipation device for electronic ballast - An electronic ballast is provided with an elongated housing; a heat sink module disposed in the housing and including a channel extending from one end to an other end; a plurality of power semiconductor modules disposed on both sides of the heat sink module respectively; an inlet assembly disposed at one end of the heat sink module proximate to a first panel at one end of the housing; an outlet assembly disposed at the other end of the heat sink module proximate to a second panel at an other end of the housing; and a fan disposed between the other end of the heat sink module and the second panel. Only a small portion of heat is dissipated by surface areas of the housing. Thus, the housing can be made compact to save space. | 02-19-2015 |
| 20150055297 | ACTIVE COOLING OF INSPECTION OR TESTING DEVICES - Modules, systems, and methods are provided for cooling components of an inspection or testing apparatus, such as a borescope. In some exemplary embodiments, the modules include two heat sinks, with the top-most heat sink having a fan assembly approximately centrally disposed therein. The fan assembly can be operated to draw air into the top-most heat sink, and then exhaust airflow out of the top-most heat sink such that the exhaust air passes across at least a portion of the second heat sink to help cool both the first and second heat sinks, and components of the apparatus associated therewith, using the same fan assembly. As a result, the components of the apparatus can be cooled more easily, and the performance and efficiency of these components is improved, all while reducing the overall size and weight of the inspection apparatus. | 02-26-2015 |
| 20150062818 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first housing and a second housing. The first housing includes a first wall, a second wall opposite to the first wall, and a third wall between the first wall and the second wall. The third wall faces the second housing when the second housing is raised from the first housing. The third wall includes an outmost portion of the third wall in a direction from a fan toward the third wall, a first area obliquely extending between the outmost portion and the first wall and including a first opening, and the second area obliquely extending between the outmost portion and the second wall and including a second opening. | 03-05-2015 |
| 20150296658 | POWER TRANSMISSION APPARATUS - Disclosed is a power transmission apparatus that is cooled by airflow sent from a fan and includes fins provided on side surfaces of a casing. The fins include upstream fins close to the fan and downstream fins distant from the fan. An interval between the upstream fins is smaller than an interval between the downstream fins. | 10-15-2015 |
| 20150305137 | ELECTRONIC DEVICE WITH COMBINATION HEAT SINK/BLOWER OR FAN ASSEMBLY HAVING AIR DUCT - An electronic device includes a circuit board having heat generating components thereon. A heat sink with air current generating electric device assembly lies over the circuit board, through which heat from the circuit board and the components thereon is dispersed. The assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. An air current generating electric device is disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. An air duct extends from the exhaust opening of the air current generating electric device to exhaust apertures on at least one side wall of the electronic device. | 10-22-2015 |
| 20150305205 | Kinetic-Heat-Sink-Cooled Server - A rack server has a base supporting a plurality of circuit elements, and a kinetic heat sink in direct contact with at least one first circuit element. The direct contact is configured to produce a heat-conduction relationship between the at least one first circuit element and the kinetic heat sink. The kinetic heat sink has a radial side spanning 360 degrees. The rack server also has a member for radially directing air from the kinetic heat sink. The member has an exhaust port spanning no more than about 180 degrees of the radial side, and the kinetic heat sink is configured to exhaust air from no more than about 180 degrees of the radial side. The exhaust port faces at least one second circuit element and is configured to direct air toward the at least one second circuit element. | 10-22-2015 |
| 20150351215 | TRANSVERSELY ACTUATED PIEZOELECTRIC BELLOWS HEATSINK - A transversely actuated piezoelectric bellows heatsink (TAPBH) has a linkage that includes multiple rigid sections coupled by flexible joints. A first fixed support is affixed to a first end of the linkage, and a piezoelectric element is mechanically coupled to a second end of the linkage. A diaphragm is mechanically affixed to a first side of the linkage, and an air enclosure, having an open area, is affixed to the diaphragm. A second fixed support is mechanically affixed to a second side of the linkage. Cyclic power from the power supply causes the piezoelectric element to expand and contract to force the linkage to expand and contract in an analogous manner, thus causing the diaphragm to move in an amplified motion to cause air to enter and be expelled from the air enclosure via air valves. | 12-03-2015 |
| 20150382504 | Radio Remote Unit and Communications Device - A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability. | 12-31-2015 |
| 20160037677 | POWER CONVERSION APPARATUS - An inverter includes: a housing base which includes a front area and a rear area opposite to the front area; a main body which is arranged in the front area of the housing base and houses a plurality of electronic components forming a power conversion circuit; a first duct which is arranged in the rear area of the housing base and includes a first end connected to an intake port of cooling air; a first heat sink which is arranged in the rear area of the housing base and includes a first fin and a first heat sink base extending perpendicular to an extension direction of the first duct; and a reactor which is arranged in the heat sink base in the rear area of the housing base, and generates heat at the time of energization. | 02-04-2016 |
| 20160066469 | COOLING ARRANGEMENT FOR A CIRCUIT PACK - A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device. | 03-03-2016 |
| 20160120069 | DRIVE UNIT - A drive unit for driving a motor has a component assembly including a main circuit board having a component side and a solder side, one or more main circuit conductors formed in at least one layer of the main circuit board, a power component module including one or more power components, the power component module having electrical connection terminals for connecting the power component(s) to the one or more main circuit conductors of the main circuit board and a cooling plate coupled to the power component(s) in a manner enabling transfer of heat from the power component(s) to the cooling plate. The power component module is mounted to the component side of the main circuit board. The component assembly further includes a heat sink mounted on the cooling plate and a fan mounted on the heat sink. | 04-28-2016 |
| 20160133372 | AN ELECTRONICS SYSTEM AND METHOD OF FORMING SAME - Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion. | 05-12-2016 |
| 20160135283 | COOLING DEVICE FOR A PRINTED CIRCUIT BOARD - The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink ( | 05-12-2016 |
| 20180027672 | CONTROL UNIT AND DISPLAY DEVICE COMPRISING THE SAME | 01-25-2018 |
| 20220141994 | HEAT DISSIPATION DEVICE WITH MULTIPLE HEAT DISSIPATION ZONES - A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them. | 05-05-2022 |
