Entries |
Document | Title | Date |
20080204996 | Air Guiding Plate - In one embodiment, an air guiding plate is attached to an enclosure with a plurality of vents defined therein. The air guiding plate includes a plurality of guiding holes defined therein. Each of the guiding holes is surrounded by a plurality of walls and includes an inlet with a large size, and an outlet with a small size. The outlets are in alignment with the vents of the enclosure. A size in cross section of each of the walls gradually decreases along a direction from the inlet to the outlet. | 08-28-2008 |
20080225479 | METHOD AND APPARATUS FOR PROVIDING THERMAL MANAGEMENT IN AN ELECTRONIC DEVICE - An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system. | 09-18-2008 |
20080278910 | Electronic component unit and electronic apparatus - Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost. | 11-13-2008 |
20080285232 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-20-2008 |
20090002942 | Holding Device for Encased High-Protective Capacitors - A holding device for encased capacitors used for electric drive engineering. The inventive holding device comprises integrateable and separable lower and top holding parts. Axially protruded retaining clamps are arranged on the top holding part around each encased capacitor. The lower holding part comprises an opening for the respective capacitor and each opening is surrounded with a sealing lip. The retaining clamps are pressed against the capacitors by the internal surface of the lower holding part. Sections protruded from the respective openings of the lower holding part are embodied in the form of the capacitor sections freely extending directly to a cold air flow of a device. The sealing lip is sealingly placed on the external wall of each encased capacitor in such a way that the penetration of solid or liquid materials inside the lower holding part is prohibited, thereby preventing a high IP protection degree. | 01-01-2009 |
20090002943 | COOLING DEVICE FOR AN ELECTRONIC EQUIPMENT CABINET - An example embodiment includes three fans (F | 01-01-2009 |
20090021909 | METHOD AND SYSTEM FOR COOLING AT LEAST ON ELECTRONIC DEVICE - A method of cooling at least one electronic device is described, wherein a movable pumping element ( | 01-22-2009 |
20090040716 | FLUID-TO-FLUID SPOT-TO-SPREADER HEAT MANAGEMENT DEVICES AND SYSTEMS AND METHODS OF MANAGING HEAT - Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like. | 02-12-2009 |
20090046423 | Internal access mechanism for a server rack - The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer. | 02-19-2009 |
20090086428 | DOCKING STATION WITH HYBRID AIR AND LIQUID COOLING OF AN ELECTRONICS RACK - A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein. The enclosure is separate and freestanding from the electronics rack and surrounds the electronics rack, and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly, disposed within the air return pathway for cooling circulating air passing through the closed loop airflow path, and at least one modular cooling unit, disposed within the enclosure for providing system coolant to the air-to-liquid heat exchange assembly and to at least one electronics subsystem of the electronics rack. | 04-02-2009 |
20090091887 | Cooling system for embedded television - A cooling system for an embedded television is a structure disposed with a dissipating space for receiving a television; first and second air paths are circulated by air with the dissipating space; the first air path is used for guiding cold air to enter an inside of the dissipating space, the second air path is used for expelling hot air out of the inside of the dissipating space, and a general indoor air condition/exhaust system is utilized to cool the embedded television to allow the effective cooling to be proceeded on the embedded television so as to elongate the use of the television. | 04-09-2009 |
20090109618 | Ventilation Member and Ventilation Structure - A ventilation member ( | 04-30-2009 |
20090129016 | AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER - An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism. | 05-21-2009 |
20090141447 | Power Supply Unit - A cooling device includes a cooling fan placed in a power storage device, an exhaust port placed in a battery, and a cooling wind flow path for allowing cooling wind taken in from the cooling fan to flow therethrough. In the power storage device and the battery, communication between a gap inside a casing a gap inside a casing can be established via an opening. The cooling wind supplied from the wind blowing fan (F | 06-04-2009 |
20090147472 | Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System - A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME electronics module and the modified chassis, requiring no modifications to the VME electronics module. For enhanced performance, additional features may include having any individual or combination of fin orientation on the convection bridge, interstitial material such as grease or indium foil can be inserted between the convection bridge and the VME electronics module, and compatible air-moving appliances such as a fan as part of the modified VME chassis. | 06-11-2009 |
20090154096 | APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough. | 06-18-2009 |
20090175002 | DISPLAY APPARATUS - A display apparatus includes a casing, a display module, a cooling device, and a dust-proof device. The casing has first and second openings. The display module disposed in the casing has a display area exposed by the first opening and a non-display area corresponding to the second opening. The cooling device disposed at the non-display area in the casing has an air inlet corresponding to the second opening. The dust-proof device includes a body disposed at the non-display area in the casing, a cover disposed at the body, and a dust-proof element disposed therebetween. The body has first holes corresponding to the air inlet. The second opening exposes second holes of the cover. Each second hole overlaps at least one of the first holes. An airflow produced by the cooling device flows through the second opening, the second holes, the dust-proof element, the first holes, and the air inlet. | 07-09-2009 |
20090190308 | METHOD AND APPARAUS FOR INVERTED VORTEX GENERATOR FOR ENHANCED COOLING - Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described. | 07-30-2009 |
20090201640 | NOISE-REDUCING ATTACHMENT APPARATUS FOR HEAT EXCHANGER DOOR OF AN ELECTRONICS RACK OF A DATA CENTER - A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door. | 08-13-2009 |
20090201641 | Airflow conducting structure - The present invention provides an airflow conducting structure for an electronic device having a base and a control box. The control box is inserted in and mounted on the base, and a first connection section is disposed in a grooved top of the base. The control box has a box body, a heat generating source disposed in the box body, and a second connection section disposed on the bottom of the box body for being connected to the first connection section. The airflow conducting structure includes airflow inlets and airflow outlets that are respectively disposed on the base and the control box, so as to form a chimney-like airway. Therefore, a better heat dissipating efficiency is achieved without increasing the volume of the electronic device. | 08-13-2009 |
20090213543 | MODULAR ELECTRONIC DEVICE OPERATING IN DIFFICULT ENVIRONMENTS - The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components. | 08-27-2009 |
20090316357 | METHOD OF ARRANGING COMPONENTS OF CIRCUIT BOARD FOR OPTIMAL HEAT DISSIPATION AND CIRCUIT APPARATUS HAVING COMPONENTS ARRANGED BY PERFORMING THE METHOD - A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit. | 12-24-2009 |
20090323282 | AIR INLET DIFFUSER - An air inlet diffuser | 12-31-2009 |
20100002381 | HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME - A heat dissipation device used for dissipating heat generated by an electronic device comprises a base defining two cutouts recessed from two opposite sides thereof, two fasteners mounted in through holes of the base via the two cutouts and two elastic members coiled around the two fasteners. Each of the two fasteners comprises a shaft, a head and a threaded pole located at two ends of the shaft, a latching portion interconnecting the shaft and the threaded pole and a mounting portion which is formed on the shaft and located a distance above the latching portion. The mounting portion extends through the cutout and makes the elastic member be sandwiched elastically between the head and a top face of the base. The latching portion abuts against a bottom face of the base, thereby the two fasteners being mounted on the base. | 01-07-2010 |
20100039771 | METHOD FOR COOLING A STATIC ELECTRONIC POWER CONVERTER DEVICE AND CORRESPONDING DEVICE - The present invention relates to a method of cooling a static electronic power converter device ( | 02-18-2010 |
20100097758 | FLEXIBLE AIRFLOW BAFFLE FOR AN ELECTRONIC SYSTEM - A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors. | 04-22-2010 |
20100097759 | BLAST VENTING FOR ELECTRICAL DEVICE - An electrical component may include a vent located in a mounting portion of a case to vent a blast from within the case. A chassis may have a mounting site for an electrical component, wherein the mounting site includes a passage to receive a blast from the electrical component. A system may include a chassis having a mounting site to engage a mounting portion of a case for an electrical component, wherein the mounting portion of the case includes a vent, and the chassis forms at least a portion of a blast chamber to receive a blast from the vent. | 04-22-2010 |
20100118489 | Tray-type structure device - A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate. | 05-13-2010 |
20100118490 | AIRFLOW CONTROL SYSTEM - A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment. | 05-13-2010 |
20100124016 | ELECTRONIC DEVICE - An electronic device including a base and a pluggable unit is provided. The base includes a first heat sink having a first heat-transfer contacting surface. The pluggable unit includes a second heat sink and a heat source. The second heat sink has a second heat-transfer contacting surface. When the pluggable unit is plugged in the base, the first heat-transfer contacting surface gets in contact with the second heat-transfer contacting surface. | 05-20-2010 |
20100128434 | INTEGRATED ELECTRONIC ASSEMBLY FOR CONSERVING SPACE IN A CIRCUIT - An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated. | 05-27-2010 |
20100134975 | ELECTRIC CONNECTION BOX - In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case. | 06-03-2010 |
20100157530 | ELECTRONIC DEVICE WITH HEAT DISSIPATION MECHANISM - An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature. | 06-24-2010 |
20100172093 | ELECTRONIC EQUIPMENT ENCLOSURE WITH SIDE-TO-SIDE AIRFLOW CONTROL SYSTEM - An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment. | 07-08-2010 |
20100177479 | FLAT-PANEL DISPLAY APPARATUS - A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board. | 07-15-2010 |
20100265658 | ELECTRONIC EQUIPMENT - An electronic equipment includes: air sending unit configured to send, at a front of an inside of a casing, air in a direction from a front surface of the casing to a back surface to cool a heat generating element; air flow control unit that is disposed in the inside of the casing and behind the air sending unit and is for controlling, by a shape, an air flow generated by air blow of the air sending unit; and expanding unit that is disposed in the inside of the casing and behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are the electronic circuits as cooling targets of the air blow of the air sending unit, and is for expanding a function of the electronic circuit of the main board, wherein the expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the casing, and the air flow control unit has an opening part for allowing the air flow to pass through and a blocking part to block the air flow, and supplies most of the air flow into the inside of the casing of the expanding unit by the opening part and the blocking part. | 10-21-2010 |
20100290186 | Open Frame Electronic Chassis For Enclosed Modules - An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis. | 11-18-2010 |
20100302730 | USE OF VORTEX GENERATORS TO IMPROVE EFFICACY OF HEAT SINKS USED TO COOL ELECTRICAL AND ELECTRO-OPTICAL COMPONENTS - Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components. | 12-02-2010 |
20100309630 | INTEGRATED HEAT EXCHANGER - In one aspect, a cooling device comprising a heat exchanger body comprising a cooling channel for a coolant, a mounting surface to which the electronic component is mountable and an outer heat exchange surface is provided. The cooling device comprises a feeding line connection for feeding the coolant and a draining line connection for draining the coolant. The cooling channel is interconnected to the feeding line connection and the draining line connection. The cooling channel is fanned within the heat exchanger body in such a way that the coolant in the cooling channel is in thermal contact with the mounting surface and the outer heat exchange surface for providing a heat exchange. | 12-09-2010 |
20110032673 | Display Apparatus - A display apparatus has a display unit, a housing which accommodates the display unit, a transparent component arranged at a front side of the display unit, and a cover component which generates an air flow between the transparent component and the display unit, the cover component is removable to the housing. | 02-10-2011 |
20110080708 | DISPLAY APPARATUS HAVING A COOLING DEVICE - A display apparatus having a front substrate that is a display panel, a rear substrate disposed at a predetermined distance apart from the front substrate and facing the front substrate, the rear substrate comprising a back light unit, and a cooling device to remove heat generated by the rear substrate. The cooling device includes an actuator disposed between the front substrate and the rear substrate, the actuator to generate an ion wind using a voltage, a transparent electrode installed to face the actuator and which is grounded, a plurality of supports to support ends of the actuator, and a high-voltage power source to apply a voltage to the actuator. | 04-07-2011 |
20110085300 | COMMUNICATIONS CABINET WITH PROJECTILE RESISTANT VENTS - A communications cabinet includes a housing defining a location for mounting communications equipment, the housing having a wall formed of a first material with a first penetration resistance, a vent opening in the wall, and a door. At least one plate of material having a second penetration resistance greater than or about equal to the first penetration resistance is mounted between the vent opening and the location for mounting the communications equipment, and the plate is positioned to stop projectiles larger than a given size from traveling in a straight line from the at least one vent opening to the location for mounting communication equipment while leaving an airflow path from the vent opening to the location for mounting the communications equipment that passes around at least one edge of the plate of material through a gap between the at least one plate and the wall. | 04-14-2011 |
20110211311 | ELECTRONIC APPARATUS FOR VEHICLE - An electronic apparatus for a vehicle, includes an electronic device, a waterproof housing that receives the electronic device, and a filter. The housing has a ventilation hole that penetrates through a housing wall of the housing. The filter is attached to a filter attachment portion of the housing wall to cover the ventilation hole. A wall surface of the ventilation hole includes a slope surface section that has an increasing cross-sectional area, which progressively increases from an inner end to an outer end of the slope surface section toward an outer surface of the housing wall in a penetrating direction of the ventilation hole. Furthermore, a distance between the filter attachment portion and the outer surface is larger than that between the inner end of the slope surface section and the outer surface in the penetrating direction. | 09-01-2011 |
20110267776 | CONDUCTION-COOLED APPARATUS AND METHODS OF FORMING SAID APPARATUS - A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an outer body. The inner body comprises a thermally conductive material. The outer body comprises a structural material. Card slots of the circuit card enclosure are defined between opposed card channels of the first and second conduction rails. Each card slot is constructed and arranged to register an inserted circuit card with at least one of the connectors, the card channels including a thermally conductive region constructed and arranged to thermally interface with a thermal frame of an inserted circuit card, the thermally conductive region of the card channels being thermally coupled to the inner body of the conduction rail. | 11-03-2011 |
20110292603 | AIRFLOW CONTROL APPARATUS - An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space. | 12-01-2011 |
20120044643 | HEAT MANAGEMENT AND REDUCTION OF HIGH TEMPERATURES EXPOSURE TO COMPONENTS INSIDE ENERGY METER - Electronic components of an energy meter are mounted in an encapsulated compartment within a sealed outer enclosure of the meter. The encapsulated compartment is advantageously positioned to form air channels between the encapsulated compartment and the sealed outer enclosure to deliver thermal air circulation there-between to promote sufficient heat transfer through an outer skin of the sealed outer enclosure for maintaining acceptable thermal conditions for the encapsulated electronic components. | 02-23-2012 |
20120057299 | ELECTRONIC APPARATUS - An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame. | 03-08-2012 |
20120113590 | ELECTRONIC SYSTEM WITH EHD AIR MOVER VENTILATION PATH ISOLATED FROM INTERNAL AIR PLENUM - An electronic system including an enclosure and an internal air plenum within the enclosure. At least one component of the electronic system within the enclosure evolves heat and has a surface exposed to the internal air plenum. The enclosure has inlet and outlet ventilation boundaries together with an EHD air mover disposed therein to motivate airflow along a flow path between the inlet and outlet ventilation boundaries, wherein the flow path is substantially excluded from the internal air plenum by a barrier. | 05-10-2012 |
20120155025 | SYSTEMS AND METHODS TO THERMALLY MANAGE ELECTRONIC DEVICES - A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature. | 06-21-2012 |
20120155026 | APPARATUS FOR EXTERNALLY CHANGING THE DIRECTION OF AIR FLOWING THROUGH ELECTRONIC EQUIPMENT - A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit. | 06-21-2012 |
20120275113 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure, and an airflow guiding duct. The enclosure includes a bottom panel. The airflow guiding duct is pivotably mounted to the enclosure. The airflow guiding duct includes a positioning portion. The bottom panel defines a sliding slot. A positioning opening is defined in the bottom panel communicating with the sliding slot. The positioning portion is used for being driven to slide along the sliding slot to move into the positioning opening when the airflow guiding duct is rotated. | 11-01-2012 |
20130027878 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 01-31-2013 |
20130070416 | Thermal Management System - A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the front of the electronic equipment enclosure and hot air in the back of the electronic enclosure, as needed, for example, depending on the configuration of the thermal management system and/or the electronic equipment enclosure. The intake duct includes a front cover, which acts as an additional blanking panel, when installed, changing the airflow pattern of the electronic equipment enclosure, for example, from side-to-side to front-to back. | 03-21-2013 |
20130077240 | ELECTRONIC DEVICE WITH EXPANSION CARDS - An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot. | 03-28-2013 |
20130077241 | FLOW DIVERSION APPARATUSES AND METHODS - Flow diversion apparatuses and methods are provided. A flow diversion apparatus can include a vent configured to permit the flow of a fluid therethrough. The apparatus can also include an electronic device capable of a range of motion across at least a portion of the vent disposed proximate at least a portion of the vent. The apparatus can include a shutter disposed proximate at least a portion of the vent opposite the electronic device. The shutter can be capable of a range of motion across at least a portion of the vent in conjunction with the electronic device. The shutter can prevent at least a portion of the fluid flowing through the vent from impinging on the electronic device. | 03-28-2013 |
20130088834 | Barrier Device - This disclosure relates to an apparatus and method | 04-11-2013 |
20130107453 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE | 05-02-2013 |
20130107454 | COMPACT NETWORK SERVER OR APPLIANCE | 05-02-2013 |
20130107455 | THERMOSIPHON COOLER ARRANGEMENT IN MODULES WITH ELECTRIC AND/OR ELECTRONIC COMPONENTS | 05-02-2013 |
20130141868 | THERMALLY CONTROLLED ASSEMBLY - A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB. | 06-06-2013 |
20130194748 | Monitoring Device for a Sliding Closure, a Casting Tube Changer or the Like on a Metallurgical Vessel - The invention relates to a monitoring device for sliding closures, casting tube changers or the like on a foundry ladle or a similar metallurgical vessel, wherein the device has an electronics system ( | 08-01-2013 |
20130250516 | AIR COOLED MOTOR CONTROLLERS - An air cooled motor controller includes a substrate and at least one inductor assembly arranged on the substrate. The at least one inductor assembly includes a outer cylindrical housing, a wound inductor core arranged within the outer cylindrical housing, and a inner cylindrical housing arranged within the wound inductor core, wherein the inner cylindrical housing defines an inner cylindrical cavity configured to transmit air, and wherein the outer cylindrical housing and the inner cylindrical housing define at least one cylindrical gap in fluid communication with the inner cylindrical cavity and configured to transmit air. The motor controller also includes at least one air source in fluid communication with the at least one cylindrical gap. | 09-26-2013 |
20130258589 | HEAT-DISSIPATING MODULE - A heat-dissipating module is disposed within an electronic device. The heat-dissipating module includes at least one vibration element, a bracket, and a driving unit. The vibration element includes a working part and a free end. The bracket is connected with the working part of the at least one vibration element. The driving unit is connected with the bracket. When the driving unit drives the bracket to vibrate at a vibration frequency, the vibration element is moved with the bracket, and a resonant vibration causes the free end of the vibration element to generate a displacement, so that an airflow is generated at the free end of the vibration element to cool the electronic device. | 10-03-2013 |
20130265717 | Ultrafine particle removal system in printer exhaust - A printing device having ultrafine particle (UFP) emissions is disclosed which includes an UFP particle removal assembly comprising a fluid conduit having a printing device emission input and output and an other fluid input and output wherein an emission portion of the conduit is affected by the other fluid portion and communication of the other fluid through the removal assembly effects a condensation/coalescence of the UFP emissions between the emission input and output for a reduction in UFP content of printing device emissions at the printing device emission output. | 10-10-2013 |
20130271915 | HEAT DISSIPATION OF POWER ELECTRONICS OF A COOLING UNIT - A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the transport unit with air of the cooling unit to cool one or more generating devices; and a heat pipe for heat dissipation of the power electronics. At a first portion of the heat pipe, at least some of a working agent is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent is in the gas phase. In the first portion of the heat pipe, heat from the power electronics is absorbed by evaporating the working agent in the liquid phase. In the second portion of the heat pipe, heat is released to the cooling agent by condensing the working agent in the gas phase. | 10-17-2013 |
20130294028 | Ventilation-cooled avionics module - An avionics module including an electronic circuit board, a case in which the circuit board is positioned and including at least one inlet orifice and at least one outlet orifice for cooling air, a first corridor for the circulation of the cooling air formed between a first face of the circuit board and a first facing wall of the case, and a second corridor for the circulation of the cooling air formed between a second face of the circuit board and a second facing wall of the case. The module includes at least one baffle for controlling the distribution of the cooling air between the first and second corridors. Preferably, the baffle is fixed to the electronic circuit board. | 11-07-2013 |
20130329363 | Apparatus and Method for Assembling Large Electronic Displays - Provided herein is an electronic display assembly for use with a housing as well as a method for assembling an electronic display assembly within a housing. The assembly preferably contains an electronic display module having an electronic display secured within a mounting frame having a top and bottom surface. Top brackets and bottom brackets may be secured to the mounting frame and then secured to the interior of the housing. A front glass assembly can also be secured to the brackets. In some embodiments the housing may contain interior hangers which correspond to hangers that are fastened to the mounting frame of the electronic display module. | 12-12-2013 |
20130335919 | ELECTRONIC APPARATUS FOR VEHICLE - An electronic apparatus for a vehicle, includes an electronic device, a waterproof housing that receives the electronic device, and a filter. The housing has a ventilation hole that penetrates through a housing wall of the housing. The filter is attached to a filter attachment portion of the housing wall to cover the ventilation hole. A wall surface of the ventilation hole includes a slope surface section that has an increasing cross-sectional area, which progressively increases from an inner end to an outer end of the slope surface section toward an outer surface of the housing wall in a penetrating direction of the ventilation hole. Furthermore, a distance between the filter attachment portion and the outer surface is larger than that between the inner end of the slope surface section and the outer surface in the penetrating direction. | 12-19-2013 |
20140002990 | THERMAL MANAGEMENT IN OPTICAL AND ELECTRONIC DEVICES | 01-02-2014 |
20140002991 | THERMAL MANAGEMENT IN OPTICAL AND ELECTRONIC DEVICES | 01-02-2014 |
20140049915 | ELECTRONIC DEVICE - An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air. | 02-20-2014 |
20140118935 | ELECTRONIC DEVICE WITH AIR GUIDING PLATES - An electronic device includes a main body, two air guiding plates, and a cover. The main body includes a bottom plate and two side plates extending up from opposite sides of the bottom plate. A number of mounting tabs extend from an inner side of each side plate, arranged in a row. A circuit board is supported on the bottom plate, and includes a number of electronic components located between the two rows of mounting tabs. A cutout is defined in a top of each mounting tab. A number of hooking slots are defined in a bottom of each air guiding plate. Top walls of the hooking slots of each air guiding plate are respectively supported by bottom walls of the cutouts of the corresponding row of mounting tabs. The cover is covered on a top of the main body and abuts tops of the air guiding plates. | 05-01-2014 |
20140118936 | ELECTRONIC MODULE, GUIDE RAIL OF SUCH A MODULE AND CIRCUIT BOARD INTENDED TO BE SLOTTED INTO SUCH A MODULE - An electronics module comprising a box including at least one pair of slideways to define a housing for receiving an electronics card, the slideways being fastened to two opposite faces of the box that are provided with ventilation means arranged to establish a flow of a total stream of air between the two faces. According to the invention, the electronics module includes at least one screen arranged in the housing between one of the slideways and the associated electronics card in order to define a passage for an individual stream of air in the housing. | 05-01-2014 |
20140133096 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 05-15-2014 |
20140146470 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for effective dissipation of heat comprises an air flow module and a heat sink. The air flow module comprises a casing, a piston module slidably mounted in the casing, an airflow outlet module attached to a first side of the casing, and an electromagnet module attached to a second side of the casing that is opposite to the first side. The airflow outlet module comprises a plurality of airflow outlet grooves. The piston module comprises a magnet. The heat sink is aligned with the plurality of airflow outlet grooves. The electromagnet module is capable of moving the magnet and the piston module back and forth in the casing. The air flow module is capable of blowing air to the heat sink via the plurality of airflow outlet grooves. | 05-29-2014 |
20140153190 | ELECTRONIC DEVICE - An electronic apparatus includes: a case; a support device arranged at the case; a rotating plate articulated to the support device; a driving device; and a heat generating device. The driving device is configured to drive the rotating plate to rotate with respect to the support device; the rotating plate rotates with respect to the support device to generate airflow, the airflow is in a direction parallel to a rotation plane of the rotating plate and away from the support device; and the heat generating device is arranged at a region that the airflow flows through and heat of the heat generating is dissipated by the airflow. | 06-05-2014 |
20140268566 | DIGITAL SUBSCRIBER LINE ACCESS MULTIPLEXER ENCLOSURES HAVING ONBOARD POWER - A system includes a digital subscriber line access multiplexer (DSLAM) enclosure having a power area for housing power components and a component area for housing components configured to receive power from the power components. The system further includes at least one DSLAM positioned in the component area of the DSLAM enclosure and an AC power supply for providing AC power to the at least one DSLAM. The AC power supply is positioned in the power area of the DSLAM enclosure. | 09-18-2014 |
20140268567 | ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a casing, an air duct mounted in the casing, and a latching member. The air duct includes a receiving bracket formed on the air duct for receiving an uninterruptible power supply module. The latching member is covered on the receiving bracket to position the uninterruptible power supply module. A first side of the latching member is rotatably connected to the receiving bracket, and a second side of the latching member is detachably latched to the receiving bracket. | 09-18-2014 |
20140369001 | HIGH-DENSITY RACK UNIT SYSTEMS AND METHODS - High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements. | 12-18-2014 |
20140376185 | COOLING DEVICE - A cooling device according to an exemplary embodiment of the present invention includes: a chamber including at least one flexible surface; a piezoelectric element formed in the at least one flexible surface and generating a volume change in the chamber by bending the at least one flexible surface in a first direction or a second direction to generates a first directional air flow or a second directional air flow; an opening formed in the chamber and becoming a channel of the first direction air flow or the second directional air flow; and at least one connection unit connected to the outer side of the chamber and the outer side of a heat source that is provided at a distance from the chamber and connecting the chamber and the heat source. | 12-25-2014 |
20150062813 | COOLING DEVICE - A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body. | 03-05-2015 |
20150062814 | IMAGE FORMING APPARATUS - An image forming apparatus includes a main body, an upper-portion device, a substrate, an electronic wire, and a duct. The main body has an upper surface and an insertion hole formed in the upper surface. The upper-portion device is disposed above the main body. The substrate is disposed inside the main body. The electronic wire is inserted into the insertion hole to connect the substrate and the upper-portion device. The duct has an interior space extending from the insertion hole and guides the electronic wire from a rear side of the main body and the upper-portion device into insertion hole. | 03-05-2015 |
20150077934 | SYSTEMS AND METHODS FOR DISSIPATING HEAT IN AN ENCLOSURE - An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array. | 03-19-2015 |
20150092348 | SPACE-SAVING THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICES - A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board. | 04-02-2015 |
20150109732 | DEVICE AND ARRANGEMENT FOR GENERATING A FLOW OF AIR - A device for generating a flow of air, particularly for cooling electronic components, with an annular piezo element and an emitter element, wherein the annular piezo element can be vibrated radially by applying an alternating voltage, the emitter element is coupled radially to the annular piezo element, and wherein the radial vibration of the annular piezo element is configured so as to set the emitter element into axial vibration to generate the air flow which thereby permits a device of small dimensions for generating the an air flow to be created that is simultaneously characterized by low energy consumption and a long service life. | 04-23-2015 |
20150124404 | SYSTEM AND APPARATUS FOR NETWORK DEVICE HEAT MANAGEMENT - Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted on the printed circuit board, the connector cage being within a certain distance from the at least one slot in the PCB. | 05-07-2015 |
20150318230 | FLEXURAL PLATE WAVE DEVICE FOR CHIP COOLING - Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die. | 11-05-2015 |
20160007507 | Power Conversion Device - A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers | 01-07-2016 |
20160135305 | DISPLAY DEVICE - A display device comprises: a display panel; a rear surface panel coupled to the display panel by means of a first adhesive tape partially coated onto a rear surface of the display panel; a rigid bar which is arranged between the display panel and the rear surface panel and coupled to the rear surface of the display panel by means of a second adhesive tape, such that it is possible to provide a display device having sufficient rigidity while minimizing increase in thickness and reducing the weight of a structure for supporting the rear surface of the display panel by simultaneously using the rear surface panel and the rigid bar on the rear surface. | 05-12-2016 |
20160183405 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE | 06-23-2016 |
20170238440 | HIGH DENSITY TELECOMMUNICATIONS SYSTEM WITH CABLE MANAGEMENT AND HEAT DISSIPATION FEATURES | 08-17-2017 |
20170238445 | INVERTER AND METHOD FOR COOLING AN INVERTER | 08-17-2017 |