| Entries |
| Document | Title | Date |
|---|
| 20080316676 | Ceramic Capacitor and Method for Manufacturing Same - Material powder having a tetragonal perovskite crystal structure essentially containing BaTiO | 12-25-2008 |
| 20090040688 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced. | 02-12-2009 |
| 20090141425 | SCREEN-PRINTABLE ENCAPSULANTS BASED ON SOLUBLE POLYBENZOXAZOLES - This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed. | 06-04-2009 |
| 20090174985 | Ceramic capacitor assembly - A ceramic capacitor assembly has a ceramic capacitor and a cushion. The ceramic capacitor has a body, two terminals formed respectively on the body and two legs connecting to and protruding respectively from the terminals. The cushion is a resilient material and has an upper surface corresponding to and mounted adjacent to the ceramic capacitor, a lower surface, an outer edge and two fastening detents. The detents correspond to the legs and are provided for legs to fasten to the cushion. The ceramic capacitor and the cushion are easily assembled and reduce cost and complexity of manufacture. | 07-09-2009 |
| 20100020469 | Capacitor, Capacitor Device, Electronic Component, Filter Device, Communication Apparatus, and Method of Manufacturing Capacitor Device - The present invention relates to a small, low-height capacitor device in which deterioration of characteristics such as leakage current is reduced. The capacitor device includes a supporting substrate | 01-28-2010 |
| 20100027191 | Ceramics Based on Lanthanum-Doped Barium Titanate, Method of Preparation and Uses - The present invention relates to a method of preparing ceramics based on lanthanum-doped barium titanate, which comprises the following steps: (a) flash sintering of lanthanum-doped barium titanate powders; and (b) heat treatment of the material thus obtained, in an air atmosphere or in an oxidising atmosphere. The invention also relates to ceramics based on lanthanum-doped barium titanate, possessing a very high real part of the relative dielectric permittivity, and to their use for obtaining capacitors of high capacitance and high capacitance per unit volume for high-voltage withstand capability. | 02-04-2010 |
| 20100073846 | BULK CAPACITOR AND METHOD - A bulk capacitor includes a first electrode formed of a metal foil and a semi-conductive porous ceramic body formed on the metal foil. A dielectric layer is formed on the porous ceramic body for example by oxidation. A conductive medium is deposited on the porous ceramic body filling the pores of the porous ceramic body and forming a second electrode. The capacitor can then be encapsulated with various layers and can include conventional electrical terminations. A method of manufacturing a bulk capacitor includes forming a conductive porous ceramic body on a first electrode formed of a metal foil, oxidizing to form a dielectric layer and filling the porous body with a conductive medium to form a second electrode. A thin semi-conductive ceramic layer can also be disposed between the metal foil and the porous ceramic body. | 03-25-2010 |
| 20100103587 | SEMICONDUCTOR CERAMIC POWDER, SEMICONDUCTOR CERAMIC, AND MONOLITHIC SEMICONDUCTOR CERAMIC CAPACITOR | 04-29-2010 |
| 20100177461 | WELL DEFINED STRUCTURES FOR CAPACITOR APPLICATIONS - A capacitor is disclosed having a plurality of drawn fibers. Each of the drawn fibers has an electrically conductive fiber core and an electrically insulating cladding. The drawn fibers are arranged in a matrix bundle pattern of a first and second set of fiber cores with each fiber core of the first set being disposed adjacent to and aligned with at least one fiber core of the second set to create a capacitance between the first and second set of fiber cores. A first electrode contacts the first set of fiber cores and a second electrode contacts the second set of fiber cores so that an electric capacitance is established between the first and second sets of fiber cores and between the first and second electrodes. | 07-15-2010 |
| 20100195262 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology. | 08-05-2010 |
| 20100195263 | CAPACITORS USING CARBON-BASED EXTENSIONS - Devices for storing energy at a high density are described. The devices include carbon-containing extensions which increase the surface area between a dielectric material and one or both of the electrodes. The dielectric material may have a high dielectric constant (high permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density. | 08-05-2010 |
| 20100271754 | ELECTRONIC COMPONENT - An electronic component includes a substantially rectangular parallelepiped electronic component body and first to fourth external electrodes. The first to fourth external electrodes are arranged such that a shaped defined by joining the centers of portions of the first to fourth external electrodes on a first main surface with a substantially straight line is substantially square. The first main surface is provided with a substantially linear orientation identifying mark disposed thereon. The orientation identifying mark passes through an intersection of two diagonals of the substantially square shape and extends along the longitudinal direction or the width direction. | 10-28-2010 |
| 20100302706 | METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS - The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250° C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450° C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750° C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired. | 12-02-2010 |
| 20110051314 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode | 03-03-2011 |
| 20110085279 | SELF HEALING HIGH ENERGY GLASS CAPACITORS - A self healing high energy glass capacitor is provided. The capacitor can have a glass layer with a top surface and a bottom surface. A top sacrificial layer can extend across the top surface and a bottom sacrificial layer can extend across the bottom surface. In addition, a top electrode can extend across the top sacrificial layer and a bottom electrode can extend across the bottom sacrificial layer. In some instances the glass capacitor has an energy breakdown of at least 6 joules per cubic centimeter. | 04-14-2011 |
| 20110110017 | HEXAGONAL TYPE BARIUM TITANATE POWDER, PRODUCING METHOD THEREOF, DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT - Dielectric ceramic composition includes a hexagonal type barium titanate as a main component shown by a generic formula of (Ba | 05-12-2011 |
| 20110141657 | CONDUCTIVE PASTE COMPOUND FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - Provided are a conductive paste for an external electrode, a multilayer ceramic capacitor including the same, and a manufacturing method thereof. The conductive paste compound for an external electrode includes a first powder and a second powder. The first powder includes copper and has a mean grain size of 3 μm or less, and the second powder has a lower diffusion speed and a higher melting point than the copper and has a mean grain size of 180 nm or less. | 06-16-2011 |
| 20110164346 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT - A dielectric ceramic composition comprises a main component composed of at least one selected from BaTiO | 07-07-2011 |
| 20110228443 | DIELECTRIC CERAMIC COMPOSITION AND TEMPERATURE COMPENSATION LAMINATED CAPACITOR - A dielectric ceramic composition enabling one to obtain a laminated capacitor which hardly causes degradation of insulation resistance with time under high-humidity even in using a base metal such as Ni as an internal electrode, contains as a main constituent, a constituent represented by (Ca | 09-22-2011 |
| 20110235234 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface. | 09-29-2011 |
| 20110242728 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd | 10-06-2011 |
| 20110310528 | Capacitor with Three-Dimensional High Surface Area Electrode and Methods of Manufacture - A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors. | 12-22-2011 |
| 20110317328 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An array-type ceramic electronic component C | 12-29-2011 |
| 20120019981 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first reinforcement layer. The first reinforcement layer is arranged in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer face a first portion of a first external electrode and a first portion of a second external electrode in the thickness direction. The first reinforcement layer is not exposed at a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface of the ceramic electronic component in which the first portion of the first or second external electrode is provided, a portion that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer. | 01-26-2012 |
| 20120019982 | ELECTRONIC COMPONENT - An electronic component includes a ceramic body including first to fourth side surfaces, a first external electrode provided on one side surface of the ceramic body, a second external electrode, and a plurality of reinforcing electrodes. Each of the first and second external electrodes includes a thick-film electrode layer including sintered metal, a plated layer arranged so as to cover the thick-film electrode layer, an external electrode main body portion covering the side surface of the ceramic body, and turnback portions extending to the top surface and the bottom surface of the ceramic body. An end portion of at least one reinforcing electrode of the plurality of reinforcing electrodes is exposed on the top surface or the bottom surface of the ceramic body on the center portion of the ceramic body in relation to the thick-film electrode layer in the turnback portion. | 01-26-2012 |
| 20120069489 | ELECTRONIC COMPONENT - In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin. | 03-22-2012 |
| 20120176725 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME - A ceramic electronic component includes a ceramic sintered body and an electrode provided on a surface of the ceramic sintered body. The electrode contains Ag. The ceramic sintered body contain glass material made of borosilicate glass. The glass material has closed pores and open pores therein. The closed pores and the open pores have diameters decreasing as being located away from the surface of the ceramic sintered body. This ceramic electronic component can prevent delamination of the electrode from the ceramic sintered body during a process of firing a green sheet. | 07-12-2012 |
| 20120262839 | GLASS FILM FOR CAPACITOR - A glass film for a capacitor has a thickness of 50 μm or less and an average surface roughness Ra of 50 Å or less. The glass film for a capacitor also has a dielectric constant at a frequency of 1 MHz of 5 or more and a dielectric dissipation factor at a frequency of 1 MHz of 0.05 or less. | 10-18-2012 |
| 20120300363 | BULK CAPACITOR AND METHOD - A bulk capacitor includes a first electrode formed of a metal foil and a semi-conductive porous ceramic body formed on the metal foil. A dielectric layer is formed on the porous ceramic body for example by oxidation. A conductive medium is deposited on the porous ceramic body filling the pores of the porous ceramic body and forming a second electrode. The capacitor can then be encapsulated with various layers and can include conventional electrical terminations. A method of manufacturing a bulk capacitor includes forming a conductive porous ceramic body on a first electrode formed of a metal foil, oxidizing to form a dielectric layer and filling the porous body with a conductive medium to form a second electrode. A thin semi-conductive ceramic layer can also be disposed between the metal foil and the porous ceramic body. | 11-29-2012 |
| 20120314339 | COMPOSITE ASSEMBLY FOR AN ELECTRICAL CONNECTOR AND METHOD OF MANUFACTURING THE COMPOSITE ASSEMBLY - A method of manufacturing a composite assembly includes providing a fluid bath and adding a ceramic material to the fluid bath. The ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating. The method further includes immersing at least part of a conductive substrate in the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate, whereby the ceramic material is electrodeposited onto the conductive substrate as at least a portion of a dielectric layer. | 12-13-2012 |
| 20120327553 | HIGH CAPACITANCE SINGLE LAYER CAPACITOR - A high capacitance single layer ceramic capacitor structure having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and bottom surfaces and a metallization pad electrically isolated from the metallization side and bottom surfaces positioned on a top surface of the ceramic body. | 12-27-2012 |
| 20120327554 | HIGH CAPACITANCE SINGLE LAYER CAPACITOR - A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces. | 12-27-2012 |
| 20120327555 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths. | 12-27-2012 |
| 20130010400 | SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO TEMPERATURE SENSITIVE AND ATMOSPHERIC SENSITIVE MATERIALS - An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic. | 01-10-2013 |
| 20130038983 | CONDUCTIVE PASTE FOR INTERNAL ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There is provided a conductive paste for an internal electrode of a multilayer ceramic electronic component and a multilayer ceramic electronic component using the same. One or more nitride powders containing a nitride selected from the group consisting of silicon nitride, boron nitride, aluminum nitride, a vanadium nitride are added to the conductive paste for an internal electrode to increase a shrinkage initiation temperature of the internal electrodes. Accordingly, the reliability of the multilayer ceramic electronic component can be improved by using the conductive paste for an internal electrode. | 02-14-2013 |
| 20130094122 | Low Inductance Capacitor Module and Power System with Low Inductance Capacitor Module - According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module. | 04-18-2013 |
| 20130094123 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 04-18-2013 |
| 20130107420 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
| 20130107421 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
| 20130148263 | POLYVINYL ACETAL RESIN, SLURRY COMPOSITION PREPARED THEREFROM, CERAMIC GREEN SHEET, AND MULTILAYER CERAMIC CAPACITOR - According to the present invention, provided is a polyvinyl acetal resin capable of obtaining a ceramic green sheet that has sufficient mechanical strength, in which the dimensional change in the storage of ceramic green sheet is small, and the delamination hardly occurs in the delipidation. | 06-13-2013 |
| 20130242462 | CERAMIC CAPACITOR - When a voltage two times a rated voltage is applied between a first external electrode and a second external electrode of a ceramic capacitor, the electric field intensity generated at portion connected between a first internal electrode and an end of a portion of a second external electrode at a side of a first side surface by a shortest distance F | 09-19-2013 |
| 20140029160 | CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND COLLECTIVE COMPONENT - A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region. | 01-30-2014 |
| 20140036410 | DIELECTRIC THIN FILM, DIELECTRIC THIN FILM ELEMENT AND THIN FILM CAPACITOR - A thin film capacitor includes a substrate and a dielectric thin film element formed on the substrate. The substrate can include an Si plate, an SiO | 02-06-2014 |
| 20140049874 | METAL POWDER, ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME - There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle. | 02-20-2014 |
| 20160027579 | THIN FILM CAPACITOR - A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers. | 01-28-2016 |
| 20160055972 | COMBINATION CAPACITOR AND STRIP MATERIAL ARRANGEMENT - A combination capacitor and strip material arrangement includes a capacitor element, a strip material, and two connecting wires each including an angled rear mounting part fastened to the strip material, a front contact part providing two contact surfaces connected in series at a predetermined angle and attached to one of positive and negative electrodes of the capacitor element and a middle conducting part having angled portion connected to the angled rear mounting part and an inwardly and transversely extended extension portion connected to the front contact part. Thus, the capacitor element is firmly held down by the contact surfaces of the front contact parts of the two connecting wires for packaging, preventing the capacitor element from deviation, displacement or falling, and thus the capacitor yield can be greatly increased. | 02-25-2016 |
