| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361308100 | Lead attached to edge of capacitor | 6 |
| 20100123995 | CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME - In a ceramic capacitor, first and second electrode terminals each include a bonded-to-substrate portion, a first bonded-to-electrode portion bonded to a first edge of one of first and second external electrodes, a second bonded-to-electrode portion bonded to a second edge of the one of first and second external electrodes and disposed at a distance from the first bonded-to-electrode portion in the first directions, and a connecting portion connecting the first and second bonded-to-electrode portions and the bonded-to-substrate portion. W | 05-20-2010 |
| 20120236463 | ELECTRONIC COMPONENT - An electronic component includes an electronic component body. The electronic component body includes a base member including two opposed end surfaces, and two outer electrodes respectively disposed on at least the two opposed end surfaces of the base member. Two connection portions of two metal terminals are respectively connected to the two outer electrodes. A relationship of 6.4≦h/t is satisfied where h is a length of each of two leg portions of the two metal terminals and t is a thickness of each of the two leg portions of the two metal terminals. | 09-20-2012 |
| 20140049873 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film. | 02-20-2014 |
| 20140063687 | ELECTRONIC COMPONENT WITH TERMINAL STRIPS - An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner. | 03-06-2014 |
| 20140063688 | CAPACITOR MODULE - A capacitor module includes a first film capacitor, a second film capacitor, and a bus bar. The first film capacitor has electrodes at both ends thereof. The second film capacitor has electrodes at both ends thereof A lateral face of the second film capacitor is provided adjacent to a lateral face of the first film capacitor. The bus bar electrically connects the first film capacitor and the second film capacitor to an external device. The bus bar is connected to the electrodes on one end side of the first film capacitor and the second film capacitor. The bus bar is extended to the other end side through a gap between the first film capacitor and the second film capacitor. | 03-06-2014 |
| 361308300 | Wire | 1 |
| 20090059470 | CAPACITOR UNIT, AND ITS MANUFACTURING METHOD - According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate. | 03-05-2009 |
