| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 361302000 | Feed through | 41 |
| 20080239618 | MANUFACTURE OF 3 DIMENSIONAL MIM CAPACITORS IN THE LAST METAL LEVEL OF AN INTEGRATED CIRCUIT - A method is for fabricating an integrated circuit formed from a substrate and including several metallic interconnection levels in which, in a same plane parallel to the main plane of the substrate, is a plurality of thick horizontal metallic interconnection lines, as well as one or several MIM capacitors fitted with metallic electrodes that are orthogonal to the main plane of the substrate. | 10-02-2008 |
| 20080247116 | INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC CIRCUIT PACKAGE - An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate. | 10-09-2008 |
| 20080247117 | FILTERING ASSEMBLY AND A FEEDTHROUGH ASSEMBLY - Filtering assembly for a feedthrough, for implantable medical devices, having operating conductive pin(s) and a ground conductive pin. The filtering assembly has:
| 10-09-2008 |
| 20080273287 | FILTERING CAPACITOR FEEDTHROUGH ASSEMBLY - A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture. An electrically conductive split ring sleeve is disposed within the aperture and between the terminal pin and the capacitor. The split ring sleeve includes a first end, a second end, a sleeve length therebetween. A longitudinal slit through the sleeve extends from the first end to the second end. The electrically conductive split ring sleeve mechanically securing and electrically coupling the terminal pin to the capacitor. | 11-06-2008 |
| 20080310076 | CONTROLLED ESR DECOUPLING CAPACITOR - Disclosed are apparatus and methodology for providing controlled equivalent series resistance (ESR) decoupling capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Controlled equivalent series resistance (ESR) is provided by providing extended length tab connections to active electrode layers within the device. | 12-18-2008 |
| 20090015982 | FEEDTHROUGH MULTILAYER CAPACITOR - A first signal internal electrode is connected to a first signal terminal electrode and a signal connection conductor. A second signal internal electrode is connected to a second signal terminal electrode and the signal connection conductor. A first ground internal electrode is connected to a first ground terminal electrode and a ground connection conductor. A second ground internal electrode is connected to a second ground terminal electrode and the ground connection conductor. The first signal internal electrode and the first ground internal electrode have their respective regions opposed to each other. The second signal internal electrode and the second ground internal electrode have their respective regions opposed to each other. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other. | 01-15-2009 |
| 20090034153 | FEEDTHROUGH MULTILAYER CAPACITOR - A first signal internal electrode is connected to a first signal terminal electrode and a second signal internal electrode is connected to a second signal terminal electrode. A first ground internal electrode is connected to a first ground terminal electrode and a second ground internal electrode is connected to a second ground terminal electrode. The first signal internal electrode and the first ground internal electrode have their respective opposed regions. The second signal internal electrode and the second ground internal electrode have their respective opposed regions. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other. The first signal internal electrode and the second signal internal electrode are connected through a signal throughhole conductor. The first ground internal electrode and the second ground internal electrode are connected through a ground throughhole conductor. | 02-05-2009 |
| 20090059468 | FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE MEDICAL DEVICES AND METHODS OF MANUFACTURE - A feedthrough assembly for an implantable medical device includes an insulator element hermitically sealed to a ferrule and a feedthrough member, and a capacitive element spaced apart from the insulator element within the ferrule and coupled to the feedthrough member by a conductive material; the conductive material extends in an area between the capacitive element and the feedthrough member. The assembly further includes a heat and pressure deformed thermoplastic adhesive member that extends around the feedthrough member within the ferrule, is located between the capacitive element and the insulator element, and is sealed to an external surface of the capacitive element in order to isolate the conductive material. | 03-05-2009 |
| 20090080140 | FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE - A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form. | 03-26-2009 |
| 20090103233 | Metal capacitor and manufacturing method thereof - A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The metal capacitor includes a metal member comprising a through-hole forming portion where a plurality of through-holes is formed, an electrode withdrawing portion formed on the through-hole forming portion, and a sealing portion; a metal oxide layer being formed on the metal member; a main electrode layer being formed on the metal oxide layer that is formed on the through-hole forming portion of the metal member, to fill the plurality of through-holes; an insulating layer being formed on the main electrode layer and the metal member to externally expose the electrode withdrawing portion of the metal member. | 04-23-2009 |
| 20090128986 | HYBRID DISCOIDAL/TUBULAR CAPACITOR - A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor. | 05-21-2009 |
| 20090141421 | FEEDTHROUGH CAPACITOR MOUNTED STRUCTURE - A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction. The pair of first terminal electrodes are connected to the respective first land electrodes corresponding to the pair of adjacent first via holes. The second terminal electrode is connected to the second land electrode. | 06-04-2009 |
| 20100033893 | PRINTED WIRING BOARD FEED-THROUGH CAPACITOR - A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes. | 02-11-2010 |
| 20100128411 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT BUILT-IN SUBSTRATE - An electronic component includes an electronic component main body including opposed first and second main surfaces, opposed first and second side surfaces, and opposed first and second end surfaces and also includes first and second external terminal electrodes disposed on the first main surface. The first and second external terminal electrodes are spaced apart by a gap region. When a dimension in a longitudinal direction being a direction linking the first and second end surfaces of the electronic component main body is L, a dimension in a width direction being a direction linking the first and second side surfaces is W, and a dimension of the gap region along the longitudinal direction is g, W| 05-27-2010 | |
| 20100134951 | ELECTROMAGNETIC INTERFERENCE FILTER AND METHOD FOR ATTACHING A LEAD AND/OR A FERRULE TO CAPACITOR ELECTRODES - A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface. | 06-03-2010 |
| 20100177458 | CAPACITOR FOR FILTERED FEEDTHROUGH WITH CONDUCTIVE PAD - A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. An conductive pad of conductive material is applied to the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material. | 07-15-2010 |
| 20100202096 | FILTERED FEEDTHROUGH ASSEMBLY AND ASSOCIATED METHOD - A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor. | 08-12-2010 |
| 20100284124 | CAPACITOR ASSEMBLY AND ASSOCIATED METHOD - A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member. | 11-11-2010 |
| 20100302702 | Feedthrough Capacitor Assemblies - A feedthrough capacitor assembly for attachment to a mount having an opening is disclosed. The assembly includes a feedthrough terminal adapted for insertion through said opening for coupling a signal from a first side of the mount to a second side of the mount. The assembly includes a first conductive region extending about and electrically coupled to the feedthrough terminal and a second conductive region extending about the first conductive region. A plurality of capacitors are electrically coupled between the first conductive region and the second conductive region. The plurality of capacitors are arranged about the feedthrough terminal with each capacitor having about the same capacitance as each of the other capacitors. | 12-02-2010 |
| 20110032658 | CAPACITOR ASSEMBLY AND ASSOCIATED METHOD - A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the outer diameter of the capacitor proximate an unfiltered terminal pin, such that high voltage arcing between the unfiltered terminal pin and capacitor is inhibited. | 02-10-2011 |
| 20110102967 | IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS - A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer. | 05-05-2011 |
| 20110170230 | Filtering Capacitor Feedthrough Assembly - A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture. An electrically conductive split ring sleeve is disposed within the aperture and between the terminal pin and the capacitor. The split ring sleeve includes a first end, a second end, a sleeve length therebetween. A longitudinal slit through the sleeve extends from the first end to the second end. The electrically conductive split ring sleeve mechanically securing and electrically coupling the terminal pin to the capacitor. | 07-14-2011 |
| 20110286145 | ARRANGEMENT HAVING A DIELECTRIC BETWEEN AT LEAST TWO CONDUCTING SURFACES AND FEED-THROUGH FOR HIGH VOLTAGES - An assembly has at least two conducting surfaces and a dielectric therebetween formed of a plastic nonwoven fabric that is impregnated with cast resin. A corresponding feed-through for high voltages has a central conductor, around which conducting intermediate layers concentrically spaced from each other are arranged as conducting surfaces. A plastic nonwoven fabric impregnated with cast resin is located between the conducting intermediate layers as a dielectric. | 11-24-2011 |
| 20120039016 | MULTILAYER FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE OF MULTILAYER FEEDTHROUGH CAPACITOR - A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface. | 02-16-2012 |
| 20120120546 | FEED-THROUGH CAPACITOR AND FEED-THROUGH CAPACITOR MOUNTING STRUCTURE - In a feed-through capacitor, a conduction unit having a plurality of conduction inner electrodes can fully secure a tolerable level of DC. A capacitor unit is formed on the mount surface side in a capacitor body, so that high-frequency noise components can be removed by the capacitor unit before reaching the conduction unit. The distance between the grounding inner electrode located closest to the conduction unit and the conduction inner electrode in the conduction unit is greater than that between the signal inner electrode and grounding inner electrode in the capacitor unit. This enhances the impedance between the capacitor unit and the conduction unit, so as to inhibit the high-frequency noise components from flowing into the conduction unit. | 05-17-2012 |
| 20120127627 | MODULAR EMI FILTERED TERMINAL ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE - A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup. | 05-24-2012 |
| 20120250218 | FEEDTHROUGH MULTILAYER CAPACITOR - A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes. | 10-04-2012 |
| 20120293910 | FEEDTHROUGH CAPACITOR - A feedthrough capacitor includes an inner electrode that extends coaxially within a grounded outer electrode. A non-conductive, epoxy-based potting material insulates and adhesively joins opposing roughened portions of the inner and outer electrodes. A capacitor assembly extends between the inner and outer electrode and serves to bypass relatively high frequency signals carried by the inner electrode to the grounded outer electrode. The capacitor assembly includes a plurality of monolithic multilayer ceramic capacitors, each capacitor having first and second terminals that are respectively surface mounted onto inner and outer concentric conductive rings. A plurality of deflectable tines project radially inward from the inner ring and resiliently circumferentially contact the exterior of the inner electrode. Similarly, a plurality of deflectable tines project radially outward from the outer ring and resiliently circumferentially contact the interior of the outer electrode. | 11-22-2012 |
| 20120300362 | Tantalum Wire Used for Anode Lead of Tantalum Capacitor and Manufacturing Method Thereof - The present invention relates to a tantalum wire for anode lead of tantalum capacitors, characterized in that the cross section of the tantalum wire is approximate rectangular or regular rectangular. The present invention also relates to a process for manufacturing the tantalum wire, comprising the steps of: providing feedstock tantalum wire; subjecting the feedstock tantalum wire to heat treatment; subjecting the heat treated tantalum wire to surface pretreatment to form an oxide membrane on the surface-pretreated tantalum wire; rolling the surface-pretreated tantalum wire by lubricating with lubricant oil to make the cross section of the rolled tantalum wire being approximate rectangular or regular rectangular; subjecting the tantalum wire to final annealing. | 11-29-2012 |
| 20120307416 | CAPACITOR INCLUDING REGISTRATION FEATURE FOR ALIGNING AN INSULATOR LAYER - In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor. | 12-06-2012 |
| 20130058003 | FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY - A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule. | 03-07-2013 |
| 20130058004 | FEEDTHROUGH ASSEMBLY INCLUDING UNDERFILL ACCESS CHANNEL AND ELECTRICALLY INSULATING MATERIAL - A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and an electrically insulating material disposed between an externally-facing filter array side and an internally-facing feedthrough side. In some examples, the feedthrough includes at least one feedthrough conductive pathway extending between an internally-facing feedthrough side and an externally-facing feedthrough side. In some examples, the capacitive filter array includes at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side. In some examples, at least one of the ferrule, the feedthrough, or the capacitive filter array defines an underfill access channel through which the electrically insulating material is introduced. | 03-07-2013 |
| 20130070387 | DUAL STAGE EMI FILTER AND OFFSET HIGHLY EFFICIENT MULTI-POLAR ACTIVE CAPACITOR ELECTRODES FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE - A multipolar feedthrough filter capacitor assembly for an active implantable medical device includes a feedthrough filter capacitor including a first active electrode plate, a second active electrode plate and a plurality of ground electrode plates. The plates are in spaced parallel relation disposed within a monolithic dielectric substrate where the first and second active electrode plates are disposed between the plurality of ground electrode plates. A first conductive terminal pin is disposed through the feedthrough filter capacitor electrically coupled to the first active electrode plate and in non-conductive relation to both the second active electrode plate and ground electrode plate. A second conductive terminal pin may be disposed through the feedthrough filter capacitor electrically coupled to the second active electrode plate and in non-conductive relation to both the first active electrode plate and ground electrode plate. | 03-21-2013 |
| 20130176658 | FEEDTHROUGH ASSEMBLY INCLUDING ELECTRICAL GROUND THROUGH FEEDTHROUGH SUBSTRATE - A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule. | 07-11-2013 |
| 20130215553 | FILTERED FEEDTHROUGH ASSEMBLY AND ASSOCIATED METHOD - A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor. | 08-22-2013 |
| 20130286536 | IMPLANTABLE MEDICAL DEVICE WITH FEEDTHROUGH, FEEDTHROUGH AND METHOD - Feedthrough and method for making a feedthrough. The feedthrough has a ferrule forming a ferrule lumen, an electrically conductive pin extending longitudinally through at least a portion of the ferrule lumen, a filter capacitor surrounding the electrically conductive pin within the ferrule lumen, the filter capacitor having a bonding surface, and a ceramic seal positioned within the ferrule lumen directly abutting the filter capacitor sealing a space between the electrically conductive pin and the ferrule. The ceramic seal adheres to and creates an adhesive bond with the bonding surface of the capacitor and substantially inhibits fluid flow through the ferrule lumen. | 10-31-2013 |
| 20130286537 | EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW - An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive. | 10-31-2013 |
| 20140036409 | EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device - A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire. | 02-06-2014 |
| 20140111904 | CAPACITOR INCLUDING REGISTRATION FEATURE FOR ALIGNING AN INSULATOR LAYER - In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor. | 04-24-2014 |
| 20140168850 | RF FILTER FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD - An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies. | 06-19-2014 |
| 20160008595 | EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE | 01-14-2016 |
