| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 338307000 | Resistance element and/or terminals printed or marked on base | 16 |
| 20080258862 | RESISTOR LAYOUT STRUCTURE AND MANUFACTURING METHOD THEREOF - A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor. | 10-23-2008 |
| 20080272879 | Chip resistor and manufacturing method therefor - A chip resistor includes a resistive element ( | 11-06-2008 |
| 20090015369 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A resistor R | 01-15-2009 |
| 20090040009 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element disposed between the terminals. The resistor element includes at least two resistive portions (hereinafter referred to as a first resistive portion and a second resistive portion) that are continuously disposed. The first resistive portion includes a plurality of first dots overlapping one another. The second resistive portion includes a plurality of second dots having a different electric resistance from that of the first dots overlapping one another. | 02-12-2009 |
| 20090231085 | RESISTOR AND DESIGN STRUCTURE HAVING RESISTOR MATERIAL LENGTH WITH SUB-LITHOGRAPHIC WIDTH - A resistor and design structure including at least one resistor material length in a dielectric, each of the least one resistor material length having a sub-lithographic width are disclosed. | 09-17-2009 |
| 20090237200 | Chip resistor and its manufacturing process - A chip resistor ( | 09-24-2009 |
| 20090256670 | THIN FILM RESISTOR STRUCTURE AND FABRICATION METHOD THEREOF - A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed. | 10-15-2009 |
| 20100245030 | Processes for Producing Thin-Film Sensors, Thin-Film Sensors and Thin-Film Sensor Modules - It is an object to provide processes for the production of thin-film sensors whereby crystals are strongly oriented without cost-adding steps such as heating and variations in electrical properties are small among the obtainable products. A process of producing a thin-film sensor is a process of producing a thin-film sensor that include an insulating substrate and an electrical resistor which is made of a metal and is provided on the insulating substrate, the process including a step of forming the electrical resistor by sputtering the metal while applying a negative direct-current voltage to the insulating substrate. | 09-30-2010 |
| 20100308955 | Ultra-Stable Refractory High-Power Thin Film Resistors for Space Applications - A method of fabricating a thin film resistor including providing a substrate, using a low-temperature pulsed-laser deposition process to deposit a titanium carbide (TiC) layer on the substrate, removing portions of the TiC layer with an etching process to leave a TiC pattern on the substrate, and depositing conductive material on opposite ends of the TiC pattern to provide a thin film resistor. | 12-09-2010 |
| 20110279221 | RESISTOR AND METHOD OF FORMING A RESISTOR - A resistor and a method of forming a resistor are disclosed. The method of forming a resistor in accordance with an embodiment of the present invention can include: providing an electric conductor having a resistance area in which a plurality of through-holes are formed; measuring a resistance value of the resistance area; and compensating the resistance value of the resistance area by selectively removing a portion connecting the plurality of through-holes. Since it is possible to compensate the resistance value precisely by simply removing a portion connecting through-holes, the resistance value can be readily compensated. Moreover, since most of the through-holes needed for the adjustment of the resistance value can be formed by a common process, the production cost for forming a precise resistor can be saved. | 11-17-2011 |
| 20120223804 | METAL AND SEMIMETAL SENSORS NEAR THE METAL INSULATOR TRANSITION REGIME - This invention generally relates to sensors made of granular thin films in the discontinuous phase. More particularly, the invention relates to microbolometers and displacement sensors fabricated from thin films that are close to the metal insulator transition (MIT) or metal semiconductor transition (MST) regime. Sensors of various designs have been fabricated according to the invention and may be used for deflection measurements, nano-indentation, visco-elastic measurements, topographical scanning, explosive detection, low abundance biomolecular detection, electromagnetic radiation detection and other similar detection and measurement systems. | 09-06-2012 |
| 20120223805 | IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS - An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film. | 09-06-2012 |
| 20130321121 | CHIP RESISTOR AND METHOD OF PRODUCING SAME - An object of the disclosure is to provide a chip resistor without causing the disconnection in atmosphere of sulfidizing gas and without precipitating silver sulfide on its surface. | 12-05-2013 |
| 20140247108 | CHIP RESISTOR, MOUNTING STRUCTURE FOR CHIP RESISTOR, AND MANUFACTURING METHOD FOR CHIP RESISTOR | 09-04-2014 |
| 20160172083 | RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME | 06-16-2016 |
| 20160172084 | RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME | 06-16-2016 |
