| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 338308000 |
Resistance element coated on base
| 52 |
| 338307000 |
Resistance element and/or terminals printed or marked on base
| 16 |
| 338314000 |
Resistance element and base formed in layers
| 15 |
| 338311000 |
Resistance element mounted in a groove in base | 3 |
| 20080278279 | Semiconductor structure with high breakdown voltage and resistance and method for manufacturing the same - A semiconductor structure with high breakdown voltage and high resistance and method for manufacturing the same. The semiconductor structure at least comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate; two first wells having the first conductive type and formed within the deep well; a second well having the first conductive type and formed between two first wells within the deep well, and a implant dosage of the second well lighter than a implant dosage of the first well; and two first doping regions having the first conductive type and respectively formed within the first wells. | 11-13-2008 |
| 20090231087 | RESISTOR AND DESIGN STRUCTURE HAVING SUBSTANTIALLY PARALLEL RESISTOR MATERIAL LENGTHS - A resistor and design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped. | 09-17-2009 |
| 20140055228 | CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes. | 02-27-2014 |
| Entries |
| Document | Title | Date |
|---|
| 20090322467 | RESISTOR, PARTICULARLY SMD RESISTOR, AND ASSOCIATED PRODUCTION METHOD - The invention relates to a resistor ( | 12-31-2009 |
| 20110018677 | CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction. | 01-27-2011 |
| 20110241820 | MEANDER RESISTOR - The present invention relates in general to the field of integrated circuits, and more specifically to a meander resistor. Basically, a meander resistor can be considered as a bar resistor with the exception of the corner squares (right-angle bends). The Electrostatic Discharge (ESD) sensitivities of on-chip resistors can be a problem for both electronic manufactures and electronic component users. As others components, passive devices are known to be susceptible to ESD events. The context of this invention is to improve the reliability of the resistors during an ESD event. An ESD stress means that high current and high voltage levels are applied to the device. The device has to be able to dissipate this energy without failure. | 10-06-2011 |
| 20110285498 | SURFACE-MOUNTED RESISTOR AND SUBSTRATE FOR MOUNTING THE SAME THEREON - A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element faulted on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion. | 11-24-2011 |
| 20130187749 | CHIP RESISTOR AND MANUFACTURING METHOD THEREOF - A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching. | 07-25-2013 |
| 20140184381 | SINGLE PHOTOMASK HIGH PRECISION THIN FILM RESISTOR - An integrated circuit contains a thin film resistor in which a body of the thin film resistor is disposed over a lower dielectric layer in a system of interconnects in the integrated circuit. Heads of the thin film resistor are disposed over electrodes which are interconnect elements in the lower dielectric layer, which provide electrical connections to a bottom surface of the thin film resistor. Top surfaces of the electrodes are substantially coplanar with a top surface of the lower dielectric layer. A top surface of the thin film resistor is free of electrical connections. An upper dielectric layer is disposed over the thin film resistor. | 07-03-2014 |
| 20140240083 | CHIP RESISTOR AND METHOD FOR MAKING THE SAME - A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate. | 08-28-2014 |
| 20140292474 | CHIP RESISTOR - Disclosed herein is a chip resistor in which a plurality of resistor bodies are configured in a single chip in a limited space in an electronic product. The chip resistor includes: a substrate; electrodes formed on each side surface of the substrate; and resistor bodies connected to the electrodes and formed on upper and lower surfaces of the substrate, such that a production cost thereof may be significantly reduced. | 10-02-2014 |
