| Entries |
| Document | Title | Date |
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| 20080224800 | Dielectric Filter, Chip Device and Method of Manufacturing the Chip Device - A chip device having a ground electrode and a plurality of top-surface electrodes on a plate-like dielectric substrate. Two of the top-surface electrodes are connected to the ground electrode via respective short-circuit side-surface electrodes to form quarter wavelength resonant lines. A third top-surface electrode is provided between the two top-surface electrodes and both ends thereof are opened to form a half wavelength resonant line. The two top-surface electrodes each have a parallel portion arranged near and in parallel to the third top-surface electrode and a flexion that curves from the parallel portion, extends toward the remaining of the two top-surface electrodes, and is jump-coupled to the remaining of the two top-surface electrodes. The short-circuit side-surface electrodes are jump-coupled to each other, like the flexions. | 09-18-2008 |
| 20080238577 | REFLECTION-TYPE BANDPASS FILTER - A reflection-type bandpass filter for ultra-wideband wireless data communication is provided. The filter comprises two conductors extending in a first direction on the surface of a dielectric substrate at a first distance from each other, the surface of the dielectric substrate between the conductors defining a non-conducting portion, wherein the width of the two conductors or the first distance, or both, varies in a length direction of the two conductors. Furthermore, a reflection-type bandpass filter comprising a dielectric substrate; a first conductor provided on the surface of the dielectric substrate; and a side conductor provided next to the first conductor at a first distance from the first conductor, with a non-conducting portion intervening a portion between the first and side conductors, wherein the first conductor width or the distance between the first and side conductors, or both, varies along the length direction of the first conductor, is provided. | 10-02-2008 |
| 20080238578 | COPLANAR WAVEGUIDE RESONATOR AND COPLANAR WAVEGUIDE FILTER USING THE SAME - A coplanar waveguide resonator ( | 10-02-2008 |
| 20080252400 | FILTER AND RADIO COMMUNICATION DEVICE USING THE SAME - A filter includes a resonant unit which has a plurality of resonators respectively formed of each microstrip line and connected in cascade with one another, and a coupling unit which has at least one inter-resonator coupling of the resonant unit in an area within a range of ±45° (⅛-wavelength) in an electrical length from a voltage maximum point at a intermediate of the microstrip line. | 10-16-2008 |
| 20080266028 | Enhanced Substrate Using Metamaterials - In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate ( | 10-30-2008 |
| 20080284545 | FIXED IMPEDANCE LOW PASS METAL POWDER FILTER WITH A PLANAR BURIED STRIPLINE GEOMETRY - A fixed impedance low pass metal powder filter having a planar buried stripline geometry comprises first and second parallel ground planes spaced from one another and a central stripline spaced equal distance from the first and second parallel ground planes and parallel thereto. The space between the first and second ground planes is filled with a dielectric containing metal powder. The densities of the metal powder within the dielectric are highest near the central stripline and become less near the first and second ground planes. The dielectric is a laminated structure that comprises layers of epoxy impregnated fiberglass, layers having different densities of metal powder. | 11-20-2008 |
| 20080309435 | NOISE FILTER - A noise filter connected to an LC oscillator is provided. The noise filter comprises a transmission line, a DC bias circuit, and a capacitor. The transmission line is connected to the LC oscillator. The DC bias circuit is connected to the transmission line and provides a bias current. The capacitor has one end connected between the transmission line and the DC bias circuit and the other end AC grounded and provides a path to AC ground to the transmission line. A length of the transmission line is odd times that of a quarter-wavelength of a secondary harmonic wave of the LC oscillator. | 12-18-2008 |
| 20090002101 | HIGH-PASS FILTER - A high frequency filter for filtering a frequency component from a high frequency signal includes a capacitor and a branch line. The capacitor may be disposed in series to a transmission line. The transmission line transmits the high frequency signal. The capacitor performs as capacitive component to the high frequency signal. The branch line may intersect the transmission line. The branch line may include, but is not limited to, a capacitive portion and an inductive portion. The capacitive portion performs as capacitive component to the high frequency signal. The inductive portion performs as inductive component to the high frequency signal. | 01-01-2009 |
| 20090002102 | ELECTRICAL FILTERS WITH IMPROVED INTERMODULATION DISTORTION - A method of constructing a band-stop filter comprises designing a band-stop filter including a signal transmission path, resonant elements disposed along the signal transmission path, and non-resonant elements coupling the resonant elements together to form a stopband having transmission zeroes corresponding to respective frequencies of the resonant elements. The method further comprises changing the order in which the resonant elements are disposed along the signal transmission path to create different filter solutions, computing a performance parameter for each filter solution, comparing the performance parameters to each other, selecting one of the filter solutions based on this comparison, and constructing the band-stop filter using the selected filter solution. Another RF band-stop filter comprises resonant elements coupled together to form a stopband, wherein at least two of the resonant elements have third order IMD components different from each other, such that the IMD components are asymmetrical about the stopband. | 01-01-2009 |
| 20090027141 | FILTER CIRCUIT, FILTER CIRCUIT DEVICE, MULTILAYERED CIRCUIT BOARD, AND CIRCUIT MODULE EACH INCLUDING THE FILTER CIRCUIT - A filter circuit comprises a first impedance element disposed in an input side, a second impedance element disposed in an output side, having an input end connected to an output end of the first impedance element, and made of the same component as that of the first impedance element, a distributed constant resonance circuit having one end connected to a junction between the output end of the first impedance element and the input end of the second impedance element, and a third impedance element having one end connected to the input end of the first impedance element and the other end connected to the output end of the second impedance element. The first and second impedance elements and the distributed constant resonance circuit are each constituted by a transmission line having a predetermined distributed constant, and the third impedance element is constituted by a capacitor having a predetermined concentrated constant. | 01-29-2009 |
| 20090045890 | FILTERING CIRCUIT AND STRUCTURE THEREOF - A filtering circuit and a structure thereof are provided. The filtering circuit includes an input terminal, an output terminal, a resonant circuit, a first coupling portion, and a second coupling portion. The resonant circuit is coupled between the input terminal and the output terminal and includes M resonators which are arranged in sequence. A signal received by the input terminal can be transmitted to the output terminal by the resonant circuit through inter-coupling between adjacent resonators. The first coupling portion and the second coupling portion are respectively coupled to non-adjacent resonators. A part of the signal received by the input terminal is transmitted to the second coupling portion via the first coupling portion through cross-couple. Thereby, sideband interference can be further suppressed. | 02-19-2009 |
| 20090072928 | REFLECTION-TYPE BANDPASS FILTER - This invention provides a reflection-type bandpass filter for ultra-wideband wireless data communication, in which are provided, on the surface of a dielectric substrate, a center conductor and side conductors, provided on both sides of the center conductor, securing a prescribed distance between conductors with non-conducting portions intervening therebetween. The center conductor width or the distances between conductors, or both, are distributed non-uniformly in a length direction of the center conductor. | 03-19-2009 |
| 20090085693 | Filter - A filter being small and having a narrowband filter characteristic is achieved using interdigital-coupled resonators. A first resonator and a second resonator are configured using interdigital-coupled quarter-wavelength resonators respectively. In addition, the first resonator and the second resonator are disposed so as to extend along directions intersecting with each other at a predetermined angle θ. Thus, coupling between the resonators is reduced compared with, for example, a case that the first resonator and the second resonator are, as a whole, disposed in parallel to each other. The angle θ, with which the first resonator and the second resonator are disposed respectively, is adjusted, thereby coupling between the resonators may be made into a desired state. Thus, a desired narrowband filter characteristic is obtained. | 04-02-2009 |
| 20090121811 | MULTILAYERED COPLANAR WAVEGUIDE FILTER UNIT AND METHOD OF MANUFACTURING THE SAME - A multilayered coplanar waveguide (CPW) filter unit and a method of manufacturing the same are provided. A plate having a capacitance element is formed on or below a CPW layer including a signal line for transmitting a signal and a ground plane. As the filter unit has a multilayered structure, characteristic impedance may be reduced without increasing the width of the signal line. Where an inductor line is inserted between the signal line and the plate, a clear frequency response curve may be obtained without performing an additional process or increasing the area of the filter unit. | 05-14-2009 |
| 20090146762 | RESONATOR AND FILTER - According to an aspect of the present invention, there is provided a resonator including: a transmission line including a conductor line with a bent portion, wherein the conductor line has a plurality of slits formed therein, the slits being formed in an extending direction of the conductor line to pass through the bent portion, and wherein the slits are formed to have intervals that become narrower from an outer-side toward an inner-side of the bent portion. | 06-11-2009 |
| 20090146763 | High Q Surface Mount Technology Cavity Filter - A cavity filter device includes a micro-strip structure comprising a low dielectric organic material forming a printed wiring board. The printed wiring board may be soldered, welded, or adhered to the base of one or more cavity filters. The cavity filter may include a coupling pin such as a RF pin positioned at the base of the filter. The micro-strip structure may be configured to carry a RF signal from the input, across the micro-strip structure to the RF pin positioned at the base of the filter. | 06-11-2009 |
| 20090160582 | BAND-PASS FILTER, HIGH-FREQUENCY COMPONENT, AND COMMUNICATION APPARATUS - A band-pass filter according to the present invention includes two or more resonant lines arranged side by side in a direction orthogonal to a laminating direction in a laminate substrate formed by laminating plural dielectric layers. Each of the resonant lines has a first coil pattern portion formed in the dielectric layers and a second coil pattern portion formed in the dielectric layers different from the dielectric layers in which the first coil pattern portion is formed. The first and second coil pattern portions are connected in series and formed in a spiral shape. At least one of the first and second coil pattern portions is formed as parallel lines in the plural dielectric layers. According to such a configuration, a band-pass filter that is reduced in size and reduced in loss is provided. | 06-25-2009 |
| 20090167463 | Dielectric Filter - A dielectric filter having inner-conductor holes penetrating through a dielectric block from a first surface to a second surface thereof. An outer conductor and input/output electrodes are formed on an outer surface of the dielectric block. A side of each of the input/output electrodes facing the first surface is substantially in parallel to the first surface, and an intersection of a side facing the second surface and a side facing a sixth surface is tapered. With such a configuration, an attenuation characteristic at an attenuation band is improved by making the attenuation characteristic less likely to receive an influence of a TE mode. | 07-02-2009 |
| 20090174504 | ULTRA WIDEBAND FILTER - An ultra wideband (UWB) filter ( | 07-09-2009 |
| 20090174505 | ELECTRICAL CONNECTOR WITH FREQUENCY-TUNED GROUNDPLANE - An electrical connector with a frequency-tuned groundplane is disclosed. The connector includes a signal medium to communicate an electrical signal and a frequency-tuned groundplane medium to communicate a reference voltage (i.e., ground). The groundplane medium differentially supplies the reference voltage to the groundplane second end, responsive to the frequency of the electrical signal. In one aspect, the first groundplane layer conductive trace includes a transmission line pattern, and the second groundplane layer conductive trace is connected to the first groundplane layer conductive trace through a plurality of conductive vias. For example, the first groundplane layer may include a plurality of conductive patches, some of which have a via connection to the second groundplane layer conductive trace. | 07-09-2009 |
| 20090184782 | Electromagnetic bandgap structure and printed circuit board - Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other. | 07-23-2009 |
| 20090189716 | FILTER DEVICE WITH FINITE TRANSMISSION ZEROS - A filter device with transmission zeros is provided according to the present invention, which has an odd mode resonant frequency and an even mode resonant frequency. The filter device includes: a substrate, a metallic rectangular ring, a signal couple-in/couple-out module, and a metallic ground plane, wherein the surface of said metallic ground plane is parallel to the plane enclosed by said metallic rectangular ring, and said metallic rectangular ring applied to the filter device of the present invention has a perimeter shorter than or equal to the wavelength corresponding to the mean of said odd mode resonant frequency and said even mode resonant frequency, thereby allowing said filter device of the present invention, in a situation of specific bandpass frequency, to reduce its perimeter to about half of the perimeter of conventional annular rectangular dual mode filters. In addition, the locations of the transmission zeros can be changed by adjusting the length/width ratio of said metallic rectangular ring, and the frequency response of the filter signal can also be reduced by disposing a ground capacitor module. Accordingly, the area of the dual mode filter can be greatly reduced. Furthermore, the frequency response of the filter signal can be increased by disposing a ground inductor module, accordingly, decreasing the size of dual mode filter and providing a means of easy fabrication thereof. | 07-30-2009 |
| 20090206956 | SUBSTRATE, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS - A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line. | 08-20-2009 |
| 20090212886 | DUAL-BAND BANDPASS RESONATOR AND DUAL-BAND BANDPASS FILTER - A dual-band bandpass filter according to the present invention includes a plurality of dual-band bandpass resonators. The dual-band bandpass resonator includes a central conductor having a central axis aligned with an input/output direction, a pair of grounding conductors, a central conductor short-circuit part and a pair of stub conductors that are formed on a surface of a dielectric substrate. The pair of grounding conductors are disposed on the opposite sides of the central conductor with a space interposed therebetween. The central conductor short-circuit part short-circuits the pair of grounding conductors, and one end of the central conductor is connected to the central conductor short-circuit part. The pair of stub conductors are disposed in the spaces on the opposite sides of the central conductor symmetrically with respect to the central axis of the central conductor, extend at least partially parallel with the central conductor and are connected to the central conductor short-circuit part at one ends thereof. | 08-27-2009 |
| 20090219115 | Resonant Element and Method for Manufacturing the Same - A plurality of flat-plate filter elements are placed on a pallet having a plurality of holding holes. Each of the filter elements includes a rear-principal-surface electrode pattern having a ground electrode provided on a rear principal surface and a front-principal-surface electrode pattern having a principal-surface electrode provided on a front principal surface. One of a first side surface and a second side surface of each of the filter elements is placed on a printing surface of the pallet. A first side-surface electrode pattern of a point-symmetric form in the side surfaces is formed on the side surfaces placed on the printing surface of the pallet. Then, the filter elements are vertically inverted, and a second side-surface electrode pattern having the same form as the first side-surface electrode pattern is formed on the side surfaces facing each other. | 09-03-2009 |
| 20090231063 | LOW-PASS FILTER - A low-pass filter ( | 09-17-2009 |
| 20090237182 | Compact single-to-balanced bandpass filter - A compact single-to-balanced bandpass filter is proposed in this invention. Firstly, a pre-design circuit is presented, which is composed of an inductive coupled-line (ICL) bandpass filter and an out-of-phase capacitive coupled-line (CCL) bandpass filter. A novel compact circuit with three coupled lines configuration, derived from the pre-design circuit, is then proposed for miniaturizing the single-to-balanced bandpass filter. In order to verify the feasibility of the proposed structure, a 2.4 GHz multilayer ceramic chip type single-to-balanced bandpass filter with size of 2.0 mm×1.2 mm×0.7 mm is developed. The filter is designed by using circuit simulation as well as full-wave electromagnetic (EM) simulation softwares, and fabricated by the use of low-temperature co-fire ceramic (LTCC) technology. The measured results agree quite well with the simulated. According to the measurement results, the maximum insertion loss is 1.65 dB, the maximum in-band phase imbalance is within 3 degrees, and the maximum in-band magnitude imbalance is less than 0.32 dB. | 09-24-2009 |
| 20090237183 | LOW-PASS FILTER - A low-pass filter includes an input portion inputting an electromagnetic signal, an output portion outputting the electromagnetic signal, a high impedance transmission portion electrically connecting the input portion and the output portion to transmit the electromagnetic signal therebetween, and a pair of low impedance transmission members arranged on opposite sides of the high impedance transmission portion. Each of the low impedance transmission members electrically connects the input portion, the output portion, and the high impedance transmission portion, and includes a first low impedance transmission portion and a second low impedance transmission portion. A width of the first low impedance transmission portion is different from that of the second low impedance transmission portion. | 09-24-2009 |
| 20090243759 | LOW-PASS FILTER - A low-pass filter ( | 10-01-2009 |
| 20090243760 | Second-Order Band-Pass Filter and Wireless Apparatus Using the Same - A second-order band-pass filter for generating at least two transmission zeros includes a first signal terminal, a second signal terminal, a first transmission line resonator, a second transmission line resonator and an impedance inverter. The first transmission line resonator and the second transmission line resonator are symmetric to each other and coupled to the first signal terminal and the second signal terminal, which are formed by bending two quarter-wavelength open stubs and have an open circuit gap between the two terminals. The impedance inverter includes an inductor, a first micro strip line and a second micro strip line. The first micro strip line and the second micro strip line are symmetric to each other, and are coupled to the first signal terminal and the second signal terminal and coupled to a ground through the inductor, respectively. | 10-01-2009 |
| 20090256653 | DUAL-BAND COUPLING DEVICE - A coupling device is provided. The coupling device has a substrate, a ground element, a first feed conductor and a second feed conductor. The substrate has a first surface and a second surface. The ground element is disposed on the second surface, wherein the ground element has a first annular groove, a second annular groove and a feed slot, the second annular groove surrounds the first annular groove, the feed slot is connected to the first annular groove and the second annular groove. The first feed conductor is disposed on the first surface corresponding to the first annular groove and the second annular groove, wherein the first feed conductor couples the ground element to feed an electric current. The second feed conductor is disposed on the first surface corresponding to the feed slot, wherein the second feed conductor couples the feed slot to feed a magnetic current. | 10-15-2009 |
| 20090267708 | Dielectric Filter - A dielectric filter having a dielectric block disposed on a mount board. The dielectric block includes inner conductor holes having open ends on the front surface of the dielectric block. Input/output electrodes are disposed on the undersurface of the dielectric block. Each of the input/output electrodes extends from the boundary between a side surface and the undersurface of the dielectric block to the boundary between the front surface and the undersurface of the dielectric block. An outer conductor includes undersurface electrode corner portions and an undersurface electrode main portion. Each of the undersurface electrode corner portions is disposed at a corner formed by the front surface and one of the side surfaces of the dielectric block. | 10-29-2009 |
| 20090273417 | Microstripline Filter - A microstripline filter capable of strengthening capacitive coupling between resonators and suppressing fineness of electrodes is provided. The microstripline filter includes principal-surface lines, a ground electrode, and input/output electrodes. A first principal-surface line is capacitively coupled to a second principal-surface line. The second principal-surface line is inductively coupled to a third principal-surface line. The third principal-surface line is capacitively coupled to a fourth principal-surface line. The first through fourth principal-surface lines include open-end-side electrodes, short-circuit-end-side electrodes, and end-opened electrodes. A first pair of the end-opened electrodes are adjacent to each other, whereas a first pair of the short-circuit-end-side electrodes are separate from each other. A second pair of end-opened electrodes are adjacent to each other, whereas a second pair of short-circuit-end-side electrodes are separate from each other. | 11-05-2009 |
| 20090278630 | Substrate With HF-Compatible Line - A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased. | 11-12-2009 |
| 20090302975 | MICROSTRIPLINE FILTER AND METHOD FOR MANUFACTURING THE SAME - A microstripline filter in which characteristics of a plurality of resonators which are connected to one another in a manner of inductive coupling are precisely set. The microstripline filter includes a ground electrode, main-surface lines, common electrodes, short-circuit electrodes, and input/output electrodes. The ground electrode is arranged on a lower surface of a dielectric substrate having a rectangular plate shape. The plurality of main-surface lines are arranged on an upper surface of the dielectric substrate and form respective resonators. The common electrodes connect some of the main-surface lines to one another in conduction states. The plurality of short-circuit electrodes connect a group of the main-surface lines which are brought to conduction states by the common electrodes to the ground electrode through an identical side surface of the dielectric substrate. The input-and-output electrodes are connected to corresponding ones of the resonators including the main-surface lines. | 12-10-2009 |
| 20090315647 | DUAL MODE FILTER INCLUDING RING-SHADED TRANSMISSION LINE - At a first coupling point on a ring resonator having a ring-shaped transmission line, an input feeder is electromagnetically coupled with the ring resonator. An output feeder is electromagnetically coupled with the ring resonator at a second coupling point on the ring resonator. A dual mode generating line is disposed in an inner area of the ring resonator. One end of the dual mode generating line is electromagnetically coupled with the ring resonator at a third coupling point on the ring resonator, and the other end is electromagnetically coupled with the ring resonator at a fourth coupling point on the ring resonator distant from the third coupling point by half of a transmission line length of the ring resonator. | 12-24-2009 |
| 20090322450 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers. | 12-31-2009 |
| 20100007445 | TRANSMISSION LINE RESONATOR, HIGH-FREQUENCY FILTER USING THE SAME, HIGH-FREQUENCY MODULE, AND RADIO DEVICE - A transmission line type resonator having a low-loss characteristic. In order to realize the low-loss characteristic, the transmission line type resonator in the present invention includes a laminate body formed of a plurality of dielectric sheets, a transmission line of complex right hand left hand system disposed between the plurality of dielectric sheets, and an external connection terminal disposed at the end face of the transmission line type resonator and connected with the transmission line of complex right hand left hand system. | 01-14-2010 |
| 20100013577 | BANDPASS FILTER, WIRELESS COMMUNICATION MODULE AND WIRELESS COMMUNICATION DEVICE - A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter can receive a pair of signals, namely a balanced signal, and output a pair of signals. The bandpass filter comprises a plurality of ½ wavelength resonance electrodes, a plurality of ¼ wavelength resonance electrodes and a plurality of coupling electrodes. A transmission characteristic of the bandpass filter having flat and low loss over the entire region of the broad pass band can be achieved. | 01-21-2010 |
| 20100033269 | Integrated Circuit and Method for Manufacturing an Integrated Circuit - One or more embodiments of the invention relate to an integrated circuit including a first power supply domain and at least a second power supply domain. Furthermore, the integrated circuit includes a radio frequency element connected between the first power supply domain and the second power supply domain. | 02-11-2010 |
| 20100033270 | BANDPASS FILTER, WIRELESS COMMUNICATION MODULE AND WIRELESS COMMUNICATION DEVICE - A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter can receive a pair of signals, namely a differential signal, and output a single signal, namely an unbalanced signal. A transmission characteristic of the bandpass filter having an attenuation pole near both sides of the passband can be achieved. | 02-11-2010 |
| 20100033271 | BANDPASS FILTER, WIRELESS COMMUNICATION MODULE AND WIRELESS COMMUNICATION DEVICE - A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter comprises a laminate of a plurality of dielectric layers, a first ground electrode connected to a ground potential, a plurality of resonant electrodes in a first inter-layer and a plurality of coupling electrodes in a second inter-layer. A transmission characteristic of the bandpass filter having flat and low loss over the entire region of the broad pass band can be achieved. | 02-11-2010 |
| 20100039190 | SLOT-LINE TYPE MICROWAVE DEVICE WITH A PHOTONIC BAND GAP STRUCTURE - The present invention relates to a microwave device of the slot-line type with a photonic band gap structure, comprising at least:
| 02-18-2010 |
| 20100052820 | COMMON MODE FILTERING METHOD AND DEVICE - Provided are common mode filtering method and device for use with a defected ground structure, the device including a substrate, coupled microstrip lines formed on the substrate and a ground plane formed underneath the substrate, the common mode filtering method being characterized by forming at least a defected ground structure on the ground plane and making dual mode signals pass through the coupled microstrip lines, thereby using the defected ground structure to suppress dual model noises within a specific frequency band and prevent signal distortion. | 03-04-2010 |
| 20100052821 | COMPACT FILTERING STRUCTURE - An electromagnetic band gap (EGB) structure includes a substrate made of an isolating material. A plurality of identical planar transmission line segments are formed one under another in conductor layers embedded in the substrate. Vertical transitions connect one by one the plurality of planar transmission line segments. Adjacent ones of the vertical transitions are equally spaced on a predetermined distance in a direction parallel to the transmission line segments, thereby the vertical transitions serve as periodical inclusions forming the EBG structure. | 03-04-2010 |
| 20100073107 | MICRO-MINIATURE MONOLITHIC ELECTROMAGNETIC RESONATORS - A filter comprises a substrate, and one or more resonator structures formed on a planar side of the substrate. Each of the one or more resonator structures has a resonant frequency and comprises a folded transmission line that is patterned to form a plurality of adjacent line segments and a plurality of gaps disposed between the adjacent line segments. The ratio of a sum of an average width of the adjacent lines and an average width of the gaps to a thickness of the substrate is equal to or less than 0.50. The filter further comprises an input terminal coupled to one end of the one or more resonator structures, and an output terminal connected to another end of the one or more resonator structures. | 03-25-2010 |
| 20100073108 | LAMINATED BANDPASS FILTER, HIGH-FREQUENCY COMPONENT AND COMMUNICATIONS APPARATUS COMPRISING THEM - A three-stage-resonator, laminated bandpass filter comprising electromagnetically coupled first to third resonator electrodes, adjacent first and second resonator electrodes and a third resonator electrode being different in a grounding direction, and a coupling-capacitor electrode extending over resonator electrodes. | 03-25-2010 |
| 20100079221 | RESONATOR AND FILTER - The present invention provides a resonator and a filter that reduce the resonator radiation loss so as to achieve a high Q value that is inherent to a low-loss material while maintaining high power handling capability. In this manner, both high power handling capability and a high Q value can be achieved at the same time. The resonator is a microstripline structure and includes a line structure formed with resonance lines in which current standing waves are generated in a resonant state in a line, and currents in each two adjacent lines flow in the opposite directions from each other, and a connection line that connects the resonance lines at the portions having in-phase voltages among the nodes of the current standing waves of the resonance lines in the resonant state. The filter includes resonators of the same type as the above resonator. | 04-01-2010 |
| 20100090782 | STRIP LINE FILTER - A strip line filter includes a dielectric substrate having a ground electrode, input/output electrodes, upper-surface lines, and side-surface lines. Certain side-surface lines are connected to the ground electrode at first terminal portions thereof which are positioned near the a bottom surface of the dielectric substrate, and are connected to certain upper-surface lines among the upper-surface lines at second terminal portions thereof which are positioned near a top surface. The second terminal portions of the side-surface lines are deviated from the first terminal portions of the side-surface lines in a direction parallel to the top and bottom surfaces of the dielectric substrate. | 04-15-2010 |
| 20100090783 | STRIP LINE FILTER - A strip line filter includes a substantially rectangular plate-like shaped dielectric substrate. A ground electrode is arranged on a bottom surface of the substrate. A first resonant line and a second resonant line face the ground electrode through the substrate. Input/output electrodes are connected to the corresponding resonant lines. The first resonant line includes a first top-surface line, a connection line, and a second top-surface line. The first top-surface line is arranged on the top surface of the substrate and extends so as to pass a portion adjacent to a portion, on the left side, of a third top-surface line. The connection line and the second top-surface line are branched from the first top-surface line and pass a portion adjacent to a portion, on the right side, of the third top-surface line. | 04-15-2010 |
| 20100109811 | BAND-PASS FILTER - A band-pass filter includes an input portion inputting an electromagnetic signal, an output portion outputting the electromagnetic signal, a plurality of transmission portions electrically connecting the input portion and the output portion to transmit the electromagnetic signal therebetween, and a pair of coupling members each adjusting the frequency of the band-pass filter. Each of the coupling members includes a first coupling portion electrically connecting two of the transmission portions and a second coupling portion electrically connecting the first coupling portion. The first coupling portion includes a pair of parallel coupling microstrip lines of the same size. The second coupling portion includes a pair of transmission lines of different sizes. | 05-06-2010 |
| 20100109812 | LOW-PASS FILTER - A low-pass filter includes a first curved microstrip, a second curved microstrip, a first flat microstrip, a second flat microstrip, and a third flat microstrip. The first curved microstrip is in an n-shape and defines a first receiving space therein. The second curved microstrip is in an n-shape and defines a second receiving space therein. The first flat microstrip is received in the first receiving space and connected to a topside of the n shape of the first curved microstrip. The second flat microstrip is received in the first receiving space along with the first flat microstrip and connected to one end of the first curved microstrip. The third flat microstrip is received in the second receiving space and connected to one end of the second curved microstrip. | 05-06-2010 |
| 20100109813 | FILTER STRUCTURE - In a filter structure for suppressing a spurious signal, a conductor layer in a printed circuit board includes a pattern with interconnected pattern elements ( | 05-06-2010 |
| 20100117764 | Assisted selective growth of highly dense and vertically aligned carbon nanotubes - The selective growth of vertically aligned, highly dense carbon nanotube (CNT) arrays using a thermal catalytic chemical vapor deposition (CCVD) method via selection of the supporting layer where the thin catalyst layer is deposited on. A thin iron (Fe) catalyst deposited on a supporting layer of tantalum (Ta) yielded CCVD growth of the vertical dense CNT arrays. Cross-sectional transmission electron microscopy revealed a Vollmer-Weber mode of Fe island growth on Ta, with a small contact angle of the islands controlled by the relative surface energies of the supporting layer, the catalyst and their interface. The as-formed Fe island morphology promoted surface diffusion of carbon atoms seeding the growth of the CNTs from the catalyst surface. | 05-13-2010 |
| 20100117765 | DIFFERENTIAL FILTERING DEVICE WITH COPLANAR COUPLED RESONATORS AND FILTERING ANTENNA FURNISHED WITH SUCH A DEVICE - This differential filtering device ( | 05-13-2010 |
| 20100117766 | CAPACITIVELY LOADED SPURLINE FILTER - In an exemplary embodiment, a spurline filter comprises a capacitive element connected to a spur and either a through-line of the spurline filter or ground. In another embodiment, multiple capacitive elements are connected to the spur. In an exemplary embodiment, the capacitively loaded spurline filter provides a band rejection frequency response similar to the band rejection frequency response of a similar spurline filter that does not comprise at least one capacitive element but the capacitively loaded spurline filter has half the layout area or less. In an exemplary embodiment, the spurline filter comprises capacitive elements, where the capacitive elements are configured to reduce the resonant frequency of the filter. | 05-13-2010 |
| 20100117767 | Three Dimensional Integrated Passive Device And Method Of Fabrication - An integrated passive device ( | 05-13-2010 |
| 20100156567 | Hairpin Microstrip Bandpass Filter - A microstrip filter having a plurality of hairpin microstrip resonators each having two substantially rectangular legs connected at one end and generally configured in a “U” shape. The microstrip filter may comprise a first of the plural resonators operatively connected to a first feed point, a second of the plural resonators operatively connected to a second feed point, and a third of the plural resonators operatively connected between the first and second resonators where an end portion of one of the legs of one of the resonators is tapered so that a thickness of the one leg is greater at one end of the one leg than at another end of the one leg. | 06-24-2010 |
| 20100164651 | BANDPASS FILTER WITH DUAL BAND RESPONSE - There is provided an improved bandpass filter having multiple passbands, and in one embodiment, two independent passbands are provided by a single filter. Embodiments of the present invention support communication architectures with several frequency bands without requiring one signal path per band, thus realizing improvements in size, cost, and weight. One aspect of the invention utilizes strongly overcoupled resonators to achieve multiple passband response, and in various embodiments, single-ended or differential mode inputs and outputs are accommodated. | 07-01-2010 |
| 20100164652 | FILTER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS - A filter includes a substrate; a signal line formed on the substrate and including an input terminal and an output terminal at either end of the signal line; and a first pair of resonant lines connected between the signal line and a ground portion, wherein the first pair of resonant lines are connected to the signal line at the same point. | 07-01-2010 |
| 20100182103 | INTERCONNECTION APPARATUS AND METHOD FOR LOW CROSS-TALK CHIP MOUNTING FOR AUTOMOTIVE RADARS - An apparatus for reducing crosstalk including a substrate having a bottom surface and a top surface defining a horizontal plane, a ground plane coupled to the bottom surface of the substrate, first and second microstrip lines formed on the top surface of the substrate, the first and second microstrip lines formed on the top surface of the substrate and spaced apart from one another, and a first plurality of vias traveling through the substrate from the top surface of the substrate to the ground plane and positioned between the first and second microstrip lines for reducing crosstalk between the first and second microstrip lines. | 07-22-2010 |
| 20100182104 | STRIPLINE FILTER - A stripline filter includes a ground electrode, input and output electrodes, top-surface resonant lines, side-surface resonant lines, side-surface line portions, connection electrode portions, and top-surface line portions. The ground electrode is provided on the bottom side of a dielectric substrate. The input and output electrodes are provided on the bottom surface of the substrate so as to be separate from the ground electrode. The top-surface resonant lines are provided on the top surface of the substrate. The side-surface line portions, the connection electrode portions, and the top-surface line portions connect two of the top-surface resonant lines to the input and output electrodes. The line width of the two top-surface resonant lines is smaller than the line width of the remainder of the top-surface resonant lines. | 07-22-2010 |
| 20100201459 | TRANSMISSION NOISE SUPPRESSING STRUCTURE AND WIRING CIRCUIT BOARD - The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other. | 08-12-2010 |
| 20100201460 | RESONATOR AND FILTER USING THE SAME - The resonator includes first high-impedance wiring plate-like, arranged parallel to top-surface ground electrode; second high-impedance wiring plate-like, arranged so as to face first high-impedance wiring; first columnar conductor electrically connecting first high-impedance wiring to second high-impedance wiring; first low-impedance wiring arranged between first high-impedance wiring and second high-impedance wiring; second columnar conductor electrically connecting first high-impedance wiring to first low-impedance wiring; second low-impedance wiring arranged between first low-impedance wiring and second high-impedance wiring; and third columnar conductor electrically connecting second high-impedance wiring to second low-impedance wiring, to reduce the area size the resonator. | 08-12-2010 |
| 20100207710 | Electrical Circuit Arrangement with Concentrated Elements in Multi-Layer Substrates - An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement. | 08-19-2010 |
| 20100214039 | FILTER - A filter for filtering noise generated by a differential signal having a specific wavelength transmitted by a first transmission line and a second transmission line is disclosed. The filter includes a multi-layer substrate, a first microstrip line and a second microstrip line. The first and the second transmission lines and the first and the second microstrip lines are disposed at the multi-layer substrate. In addition, one end of the first microstrip line and one end of the second microstrip line are electrically connected to the first and the second transmission lines, respectively, by passing through the vias, and the other end is in a floating state. The impedances of the first and the second microstrip lines match the impedances of the first and the second transmission lines, respectively. Thus, the first and the second microstrip lines may filter the noise generated by the differential signal having the specific wavelength. | 08-26-2010 |
| 20100219915 | Bandpass Filter, and Wireless Communication Module and Wireless Communication Apparatus Which Employ the Bandpass Filter - An ultra-wideband bandpass filter having two adequately-wide pass bands, and a wireless communication module and a wireless communication apparatus which employ the bandpass filter are provided. In a bandpass filter, first resonant electrodes are arranged on a first interlayer of a multilayer body in an interdigital form; a plurality of second resonant electrodes are arranged on a second interlayer in an interdigital form; and an input coupling electrode and an output coupling electrode are arranged on a third interlayer located between the first interlayer and the second interlayer. The input coupling electrode faces an input-stage first resonant electrode and an input-stage second resonant electrode in an interdigital form. The output-coupling electrode faces an output-stage first resonant electrode and an output-stage second resonant electrode in an interdigital form. | 09-02-2010 |
| 20100225422 | METHOD AND SYSTEM FOR A CONFIGURABLE FINITE IMPULSE RESPONSE FILTER USING A TRANSMISSION LINE AS A DELAY LINE - Methods and systems for a configurable finite impulse response (FIR) filter using a transmission line as a delay line are disclosed and may include selectively coupling one or more taps of a multi-tap transmission line to configure delays for one or more finite impulse response (FIR) filters to enable transmission and/or reception of signals. The delays may be configured based on a location of the one or more selectively coupled taps on the multi-tap transmission line. The FIR filters, which may include one or more stages, may be impedance matched to the selectively coupled taps. The multi-tap transmission line may be integrated on the chip, or a package to which the chip is coupled. The multi-tap transmission line may include a microstrip structure or a coplanar waveguide structure, and may include ferromagnetic material. The distortion of signals in the chip may be compensated utilizing the FIR filters. | 09-09-2010 |
| 20100244990 | STRIPLINE FILTER - A stripline filter with wide-band filter characteristics having an attenuation pole on a high frequency side of frequency characteristics. The stripline filter includes at least three resonant lines, and two of the resonant lines include parallel line parts and bent parts. The third resonant line has a U shape in which both ends thereof are open and interdigitally coupled to the two resonant lines located on both sides thereof. The parallel line parts extend from base ends connected to a ground electrode via side surface lines that are parallel to respective line parts of the third resonant line. The bent parts extend so as to be bent from ends of the parallel line parts, and face each other at an interval. | 09-30-2010 |
| 20100265011 | CIRCUIT STRUCTURE AND DESIGN STRUCTURE FOR AN OPTIONALLY SWITCHABLE ON-CHIP SLOW WAVE TRANSMISSION LINE BAND-STOP FILTER AND A METHOD OF MANUFACTURE - The present invention generally relates to a circuit structure, design structure and method of manufacturing a circuit, and more specifically to a circuit structure and design structure for an on-chip slow wave transmission line band-stop filter and a method of manufacture. A structure includes an on-chip transmission line stub comprising a conditionally floating structure structured to provide increased capacitance to the on-chip transmission line stub when the conditionally floating structure is connected to ground. | 10-21-2010 |
| 20100265012 | Stripline Filter and Manufacturing Method Thereof - The element size of a stripline filter that achieves a high efficiency percentage with optional stable filter characteristics, is reduced. A stripline filter includes substantially L-shaped top surface resonant lines. The top surface resonant lines include connection electrode parts, first line parts, and second line parts. The connection electrode parts are formed so as to have a width greater than line widths of side surface resonant lines. Each line part faces an edge of a corner portion of a central top surface resonant line at an interval. An edge of each first line part on an edge side of a dielectric substrate, other than a connection portion with the connection electrode part, faces an edge of the dielectric substrate at an interval. | 10-21-2010 |
| 20100265013 | Miniaturized Band-Pass Filter - Provided is a band-pass filter using a λ/4 transmission line. According to an embodiment of the present invention, a band-pass filter using a support layer formed of a semiconductor wafer, a circuit unit constructed on the support layer or between multilayered insulating layers formed on the support layer, and a λ/4 transmission line formed on the circuit unit includes: at least one miniaturized λ/4 transmission line with capacitors connected in parallel to an input/output connection portion of a coupled line with ends shorted in the diagonal direction; and a ground plane surrounding the band-pass filter. | 10-21-2010 |
| 20100271154 | COMMUNICATION MODULE - A communication module includes a filter element, a package substrate on which the filter element is mounted, and a module substrate on which the package substrate is mounted. Each of the package substrate and the module substrate is formed of a laminate of a plurality of metal layers and a plurality of insulation layers. An outermost insulation layer forming a mounting surface of the package substrate that is a surface on which the filter element is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the package substrate. An outer insulation layer forming a mounting surface of the module substrate that is a surface on which the package substrate is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the module substrate. | 10-28-2010 |
| 20100277259 | SERIAL L-C RESONATOR WITH THREE-DIMENSIONAL STRUCTURE AND ULTRA-WIDE BANDPASS FILTER USING THE SAME - In an ultra-wideband (UWB) band-pass filter, an equivalent circuit of a band-pass filter for direct frequency conversion is configured to have a series LC resonator and a parallel LC resonator, the parallel LC resonator is implemented as a short stub and an open stub, and the series LC resonator is implemented by modeling an inductor and a capacitor as a distributed constant circuit. The series LC resonator is implemented to have a 3D structure for effective designing of the band-pass filter by a new method of implementing a series resonator circuit. In the UWB band-pass filter, a low-pass filter for improving band-stop characteristics is additionally connected. | 11-04-2010 |
| 20100283557 | MULTILAYER BANDPASS FILTER - A multilayer bandpass filter that is capable of preventing variations in filter characteristics caused by variations in electrode formation, etc., is easily reduced in size, and performs predetermined impedance conversion between an input and an output, includes a first common electrode and a second common electrode disposed on a dielectric layer, and capacitor electrodes are disposed on a dielectric layer. An input/output terminal lead-out electrode is disposed on a dielectric layer, input/output terminal lead-out electrodes are disposed on a dielectric layer, and line electrodes are disposed on a dielectric layer. Via electrodes are formed to establish conduction in the layering direction between individual electrode patterns disposed on the plural dielectric layers. Three LC parallel resonators are constructed with such an arrangement, and respective line lengths of the line electrodes are gradually changed in order to convert the impedance between the input and the output. | 11-11-2010 |
| 20100295633 | ELECTROMAGNETIC BANDGAP PATTERN STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND SECURITY PRODUCT USING THE SAME - Disclosed herein is an electromagnetic bandgap (EBG) pattern structure, including: a nonconductive substrate; and a pattern assembly formed on the substrate and including regularly arranged closed-loop patterns and open-loop patterns both of which are made of a conductive material. The EBG pattern structure is advantageous in that it can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and in that it can be variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern. | 11-25-2010 |
| 20100301970 | SELF-MATCHING BAND-PASS FILTER AND RELATED FREQUENCY DOWN CONVERTER - A band-pass filter includes an input port, an output port, and a plurality of resonators. The input port is utilized for receiving a radio frequency signal. The output port is utilized for outputting a filtered signal. The plurality of resonators are placed between the input port and the output port, and are utilized for band-pass filtering the radio frequency signal for generating the filtered signal, wherein the plurality of resonators comprise at least two different trace widths for matching the output impedance of the band-pass filter with the input impedance of a rear-stage circuit coupled to the output port. | 12-02-2010 |
| 20100321134 | FLIPPED MICRO-STRIP FILTER - A filter device for a printed circuit board, wherein the filter device comprises a selected pattern of conductive material arranged to be electromagnetically coupled to an electrically conductive plane comprised in the printed circuit board. The invention is characterized in that the filter device is a separate unit from the printed circuit board and is connectable to the printed circuit board via first connectors positioned on the filter device and second connectors correspondingly positioned onto the printed circuit board. | 12-23-2010 |
| 20110006861 | Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Signal Processing Components for RF/Wireless Multi-Band Applications - The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufactured using one or more LCP layers having integrated passive components formed thereon to provide the density and performance necessary for multi-band wireless devices. In the designs involving multiple LCP layers, the LCP layers are separated by prepeg layers. In accordance with an aspect of the present invention, coplanar waveguide, hybrid stripline/coplanar waveguide and/or microstrip topologies are utilized to form the integrated passive components, and the devices can be mass produced on large area panels at least 18 inches by 12 inches with line widths smaller than 10 um. | 01-13-2011 |
| 20110025434 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor. | 02-03-2011 |
| 20110032055 | PRINTED CIRCUIT BOARD AND SIGNAL TRANSMISSION APPARATUS THEREOF - A signal transmission apparatus used in a printed circuit board (PCB). The apparatus includes a differential pair composed of two transmission lines arranged side by side in the PCB. The differential pair includes a filter section arranged therein to filter noise of transmission signals of the differential pair. The filter includes a number of section pairs connected in series. Each section pair includes two sections arranged in the two transmission lines symmetrically. Every two adjacent sections are different in line width. A distance between the two transmission lines, and the line width of each of the sections are predetermined according to desired frequency bandwidth, and desired frequency response of the differential pair. | 02-10-2011 |
| 20110037540 | LAMINATED FILTER - A laminated filter includes a first insulation layer including first and second coil patterns and a first capacitor pattern and a second insulation layer including third and fourth coil patterns and second and third capacitor patterns. The first and second coil patterns are located near one longer side of the first insulation layer and connected to the third and fourth coil patterns through penetration electrodes in the first insulation layer. The third and fourth coil patterns extend to ends of the second insulation layer through extension patterns and are connected to external electrodes to define input and output inductors. The first capacitor pattern is located near the other longer side of the first insulation layer and connected to an external ground electrode through an extension pattern. The first capacitor pattern faces the second and third capacitor patterns with the first insulation layer interposed therebetween to define input and output capacitors. | 02-17-2011 |
| 20110074527 | LAYERED BANDPASS FILTER - A bandpass filter includes three resonators of which adjacent two are electromagnetically coupled to each other, and two coupling paths connected in parallel for forming capacitive coupling between non-adjacent two of the resonators. Each of the two coupling paths includes at least one capacitor and an inductor connected in series. The two coupling paths function to form an attenuation pole at a frequency lower than the passband frequencies in the pass attenuation characteristics of the bandpass filter. | 03-31-2011 |
| 20110080235 | BANDPASS FILTER AND RADIO COMMUNICATION MODULE AND RADIO COMMUNICATION DEVICE USING THE SAME - Provided are a bandpass filter and a radio communication module and a radio communication device using the same. The bandpass filter includes: a first and a second grounding electrode arranged on the upper and the lower surface of a layered body; first resonance electrodes and second resonance electrodes arranged to orthogonally intersect the first resonance electrodes; a first input coupling electrode opposing to the first resonance electrode of the input stage and a second input coupling electrode connected thereto and opposing to the second resonance electrode of the input stage; a first output coupling electrode opposing to the first resonance electrode of the output stage and a second output coupling electrode connected thereto and opposing to the second resonance electrode of the output stage. | 04-07-2011 |
| 20110102111 | BAND-PASS FILTER CIRCUIT WITH TRANSMISSION LINES - A band-pass filter circuit with transmission lines includes an input end and an output end connected by a transmission line circuit. The input end is configured for inputting signals into the band-pass filter circuit. The output end is configured for outputting the filtered signals to other devices. The transmission line circuit includes a microstrip transmission line and a number of shorted transmission lines parallel to each other. An end of each shorted transmission line is connected to the microstrip transmission line, and the other end of each shorted transmission line is grounded. Both the microstrip transmission line and the shorted transmission lines are quarter wavelength lossless transmission lines and the phase difference in signal transmission is π/2. | 05-05-2011 |
| 20110128096 | SYSTEM AND METHOD FOR MODIFYING HAIRPIN FILTER, AND HAIRPIN FILTER - A system for modifying a hairpin filter is provided which includes a structure transformer to divide a hairpin filter into a plurality of filters and to arrange the plurality of filters in a bilaterally symmetrical pattern, and a coupling generator to generate a plurality of coupling lines, each of the plurality of coupling lines being between each of the filters. | 06-02-2011 |
| 20110133860 | BANDPASS FILTER, HIGH-FREQUENCY DEVICE AND COMMUNICATIONS APPARATUS - A bandpass filter comprising two or more resonators arranged between two input/output terminals in a laminate substrate comprising pluralities of dielectric layers; each resonator being constituted by a resonance line and a resonance capacitance connected to one end of the resonance line; capacitance electrodes forming said resonance capacitances and said resonance lines being arranged on different dielectric layers, via a planar ground electrode covering the entire structural portion of the bandpass filter when viewed in a lamination direction; and in each of the resonators connected to said two input/output terminals, the junctions of said input/output terminals to said paths between said resonance lines and said resonance capacitances being closer to said resonance capacitances than said resonance lines in a lamination direction. | 06-09-2011 |
| 20110193657 | Resonance Filter Having Low Loss - The invention relates to a resonance filter ( | 08-11-2011 |
| 20110215885 | Broadband Coupling Filter - A broadband coupling filter for generating a notch filtering effect is disclosed. In the broadband coupling filter, a substrate includes a first layer, a second layer and a third layer. A first signal terminal, a second signal terminal, and a block transmission line are formed in the first layer, wherein the first signal terminal is used for receiving a signal, and the second signal terminal is used for outputting a filtering result of the signal. A grounding plate is formed in the second layer, having a hole. A third signal terminal, a forth signal terminal and a second block transmission line are formed in the third layer. A connection unit is further formed in the third layer, for connecting the third signal terminal and the forth signal terminal. | 09-08-2011 |
| 20110248798 | PROJECTED ARTIFICIAL MAGNETIC MIRROR - A projected artificial magnetic mirror (PAMM) includes conductive coils, a metal backing, and a dielectric material. The conductive coils are arranged in an array on a first layer of a substrate and the metal backing is on a second layer of the substrate. The dielectric material is between the first and second layers of the substrate. The conductive coils are electrically coupled to the metal backing to form an inductive-capacitive network that, for a third layer of the substrate and within a given frequency band, substantially reduces surface waves along the third layer. | 10-13-2011 |
| 20110248799 | MILLIMETRE WAVE BANDPASS FILTER ON CMOS - Q of resonant elements formed over lossy substrates such as in a CMOS process is improved by forming the ground plane of the resonant element immediately over a high impedance layer to reduce cross coupling and eddy currents. A new type of meandering hairpin resonator configuration is also introduced providing, for example, for 4th order cross coupled filters of high selectivity and compact layout. | 10-13-2011 |
| 20110248800 | FILTER BASED ON A COMBINED VIA STRUCTURE - A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via. | 10-13-2011 |
| 20110267156 | Stripline Filter - A stripline filter that suppresses a fundamental wave frequency without increasing the size of a board and in which a harmonic frequency is easily set to a desired frequency. The stripline filter includes a glass layer having a relative dielectric constant lower than that of a dielectric board. A first top surface line is provided on a top surface of the dielectric board and has a resonant open end. A second top surface line and a side surface electrode are provided on the glass layer so as to extend from positions connected to the first top surface line. | 11-03-2011 |
| 20110273245 | PRINTED CIRCUIT BOARD AND COMMON MODE FILTER THEREOF - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollowing patterns on the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines on the ground layer. Each of the two filter portions includes a number of long narrow parallel strips connected in a snake like pattern. Hollowed areas of the two filter portions are bridged through a void. | 11-10-2011 |
| 20110279198 | Compact-area capacitive plates for use with spiral inductors having more than one turn - A method and an apparatus are described for constructing a compact inductive-capacitive circuit, using a spiral inductor of more than one turn, plus a capacitive plate. This method includes duplicating the layout of the spiral, and then offsetting the duplicate so that the trace pattern of the spiral overlaps its duplicate at an insulating distance away, with the duplicate as an underlying capacitive plate. The plate's trace pattern includes at least one gap, plus an extension of its trace to span the region under the terminals of the spiral inductor. For the case where the spiral inductor has more than one turn—plus an underpass—the capacitive plate may also have more than one turn and may also have an underpass. The resulting pair of underpasses may be either overlapping or nonoverlapping. If overlapping, the full circuit requires at least four metal layers, and at least three if the underpasses are nonoverlapping. | 11-17-2011 |
| 20110279199 | Hairpin Microstrip Bandpass Filter - A microstrip filter having a plurality of hairpin microstrip resonators each having two substantially rectangular legs connected at one end and generally configured in a “U” shape. The microstrip filter may comprise a first of the plural resonators operatively connected to a first feed point, a second of the plural resonators operatively connected to a second feed point, and a third of the plural resonators operatively connected between the first and second resonators where an end portion of one of the legs of one of the resonators is tapered so that a thickness of the one leg is greater at one end of the one leg than at another end of the one leg. | 11-17-2011 |
| 20110309898 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void. | 12-22-2011 |
| 20110316651 | BAND STOP FILTER OF COMPOSITE RIGHT/LEFT HANDED STRUCTURE AND THE MANUFACTURING METHOD THEREOF - Provided are a band stop filter of a CRLH structure and a manufacturing method thereof. A band stop filter of a CRLH structure according to an exemplary embodiment of the present invention includes a microstrip transmission line formed on a substrate; a right handed material (RHM) region including a first stub and a first capacitor connected to the microstrip transmission line in parallel and stopping a signal of a first frequency band passing through the microstrip transmission line; and a left handed material (LHM) region further provided between the first stub and the first capacitor to block a signal of a second frequency band passing through the microstrip transmission line. | 12-29-2011 |
| 20110316652 | MULTIBAND RESONATOR AND MULTIBAND-PASS FILTER - An multiband resonator of the present invention includes a dielectric substrate including three or more dielectric layers, a ground conductor, a main-line conductor, a sub-line conductor, a sub open stub, a main open stub, a short-circuit conductor, a main through conductor, and a sub through conductor. The short-circuit conductor electrically connects one end of the main-line conductor to one end of the sub-line conductor and to the ground conductor. The main through conductor electrically connects the other end of the main-line conductor to one end of the main open stub that is aligned with that other end of the main-line conductor. The sub through conductor electrically connects the other end of the sub-line conductor to one end of the sub open stub that is aligned with that other end of the sub-line conductor. | 12-29-2011 |
| 20120025932 | Integrated Lossy Low-Pass Filter - An apparatus for filtering a signal is disclosed. The apparatus includes a conductive line affixed to a surface of a substrate. For a signal received at an end of the conductive line, the apparatus is configured to filter at least a portion of the frequency components of the signal. First and second resistive films are adjacent to a respective side of the conductive line along a first side of each of the first and second resistive films, respectively. The first and second resistive films have a first resistivity. Third and fourth resistive films adjacent to a respective one of the first and second resistive films along a second side of each of the first and second resistive films. Each second side of the first and second resistive films extends beyond the third and fourth resistive films. The third and fourth resistive films have a second resistivity. | 02-02-2012 |
| 20120032760 | COMPACT PLANAR RESONATORS WITH Z-AXIS FOLDING - A planar filter includes a first ground plate that is formed from a material that is a good conductor of electricity and a first substrate that is formed from a dielectric material disposed adjacent to the first ground plate. The planar filter also includes a second ground plate that is formed from a material that is a good conductor of electricity and a second substrate that is formed from a dielectric material disposed adjacent to the second ground plate. A resonator is formed from a material that is a good conductor of electricity and including a first portion that is disposed adjacent to the first substrate, a second portion that extends from the first portion, and a third portion that extends from the second portion and is disposed adjacent to the second substrate, wherein the first and third portions of the resonator extend in different planes. | 02-09-2012 |
| 20120038436 | REDUCING COUPLING COEFFICIENT VARIATION USING INTENDED WIDTH MISMATCH - A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace with a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The first trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. Further, the coupler includes a second trace, which includes a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The second trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. | 02-16-2012 |
| 20120062342 | MULTI BAND-PASS FILTER - A multi band-pass filter includes a first resonator and a second resonator. The first resonator has a first frequency pass band and a second frequency pass band. Moreover, the second resonator is electromagnetically coupled to another end of the first resonator. The second resonator has a third frequency pass band and a fourth frequency pass band, wherein the third frequency pass band overlaps (or is congruous with) the first frequency pass band and the fourth frequency pass band overlaps the second frequency pass band. | 03-15-2012 |
| 20120062343 | SIGNAL TRANSMISSION DEVICE, FILTER, AND INTER-SUBSTRATE COMMUNICATION DEVICE - A signal transmission device includes: a first substrate and a second substrate disposed to oppose each other in a first direction; a first resonator including a plurality of first quarter wavelength resonators provided in a first region of the first substrate, and interdigitally coupled to one another in the first direction, and a single or the plurality of second quarter wavelength resonators provided in a region of the second substrate corresponding to the first region and interdigitally coupled to one another in the first direction; and a second resonator electromagnetically coupled to the first resonator, and performing a signal transmission between the second resonator and the first resonator. The first and the second quarter wavelength resonators located at positions nearest to one another in the first resonator, respectively have open ends which are disposed to oppose one another, and respectively have short-circuit ends which are disposed to oppose one another. | 03-15-2012 |
| 20120062344 | Stripline Filter - A stripline filter having a substrate, a grounding electrode, principal-surface lines, side-surface lines, and common electrodes, and is mounted on a set substrate by soldering. The side-surface lines are disposed on a side surface of the substrate, and are wetted by solder during soldering. Each of the common electrodes is connected to a corresponding one of the principal-surface lines. The common electrodes are also connected to the grounding electrode via the side-surface lines. | 03-15-2012 |
| 20120075038 | WIRING SUBSTRATE, FILTER DEVICE AND PORTABLE EQUIPMENT - In a wiring substrate, a wiring layer includes a pair of differential transmission lines. A conductive layer is provided on one side of the wiring layer. The conductive layer is grounded. An insulating layer is provided between the wiring layer and the conductive layer. The conductive layer includes a region, formed by an electrically continuous conductor, within a filter region. At least part of the conductor is turned around in the region. Seen from a stacking direction, the pair of differential transmission lines intersects with at least two strip portions disposed counter to each other because of the turning-around of the electrically continuous conductor. | 03-29-2012 |
| 20120092090 | COUPLING STRUCTURE FOR MULTI-LAYERED CHIP FILTER, AND MULTI-LAYERED CHIP FILTER WITH THE STRUCTURE - Disclosed herein are a coupling structure for a multi-layered chip filter capable of overcoming a limitation of an existing coupling by improving a coupling structure and a multi-layered chip filter with the structure. | 04-19-2012 |
| 20120098626 | DISTRIBUTED CONSTANT CIRCUIT - A distributed constant circuit includes a plurality of insulator layers including a first insulator layer that contains a first transmission line formed into a rectangular ring of less than one turn, a second insulator layer that contains a second transmission line which is electrically connected to the first transmission line through an inter-layer connection conductor, and which is formed into a rectangular ring of less than one turn, and a third insulator layer containing a ground electrode. In the distributed constant circuit, a rectangular spiral circuit pattern including the first transmission line and the second transmission line is formed by laminating the plurality of insulator layers. The second transmission line includes a side which is located in parallel with at least one side of the first transmission line, the sides parallel with each other are arranged so as not to overlap in the lamination direction of the plurality of the insulator layers, and at least one corner of at least one of the first transmission line and the second transmission line is formed so that the inner circumference and the outer circumference of the corner are concentric circular arcs. | 04-26-2012 |
| 20120098627 | COMMON MODE FILTER - To pass an ultrahigh speed differential signal and sufficiently attenuate a common mode signal on an ultrahigh speed differential transmission line. A pair of conductor lines | 04-26-2012 |
| 20120119852 | MULTILAYER BAND-PASS FILTER - In a multilayer band-pass filter, each of first-stage to third-stage LC parallel resonators includes capacitor electrodes, via electrodes, and a line electrode. Jump-coupling capacitor electrodes face the capacitor electrodes of the first-stage and third-stage LC parallel resonators. The direction in which the inductor electrode extends from the capacitor electrodes of each of the first-stage and third-stage LC parallel resonators is opposite to the direction in which the inductor electrode extends from the capacitor electrodes of the second-stage LC parallel resonator. | 05-17-2012 |
| 20120119853 | RESONANT ELEMENTS DESIGNED VERTICALLY IN A MULTILAYER BOARD AND FILTERS BASED ON THESE ELEMENTS - A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric. | 05-17-2012 |
| 20120139666 | WIDEBAND HIGH FREQUENCY BANDPASS FILTER - A wideband high frequency bandpass filter uses a metamaterial transmission line composed of an open-circuit resonator and a short-circuit resonator to realize a bandpass filter at the band of 60 GHz. The bandpass filter has an ultra-wide passband resulting from the coupling of the two resonators in the resonant modes thereof. The ultra wide passband formed by resonance coupling includes a left-handed passband and a right-handed passband. The two passbands jointly provides a passband ranging from 57.4 GHz to 63.6 GHz and having a bandwidth of 6.2 GHz. The stopbands of the bandpass filter are respectively extended downward from 57.4 GHz to the DC current and extended upward from 63.6 GHz to 109.4 GHz. The bandpass filter of the present invention can be applied to wireless transmission at the band of 60 GHz. | 06-07-2012 |
| 20120169436 | MICROWAVE FILTER - A microwave filter is provided that includes a transmission line having a signal input port and a signal output port, a stub connected to the transmission line between the input port and the output port, and a spurline embedded in the stub. The microwave filter is configured to substantially attenuate a frequency while substantially passing at least one predetermined odd harmonic of the frequency. | 07-05-2012 |
| 20120169437 | COMPACT BANDPASS FILTER WITH NO THIRD ORDER RESPONSE - A bandpass filter passes a range of frequencies with low loss while suppressing frequencies above and below the passed range of frequencies. One or more spurlines is included into the existing structure of the bandpass filter so that a selected odd multiple of the passed frequency range is suppressed. | 07-05-2012 |
| 20120182093 | MICROWAVE FILTER - A filter unit and a corresponding printed circuit board. The filter unit and the printed circuit board have been equipped with modified end portions being matched such that a number of filter units can be used on the printed circuit board without changing the printed circuit board. | 07-19-2012 |
| 20120194299 | LOW PASS FILTER - A low pass filter includes a signal transmission line, a first open stub, a second open stub, a first coupling line, and a second coupling line. The signal transmission line is connected between a first port and a second port, and operable to transmit RF signals from the first port to the second port. The signal transmission line defines a first side and a second side opposite to the first side. The first open stub and the second stub are disposed on the first side and perpendicularly connected to the signal transmission line. The second open stub and the first open stub co-define a T-shaped gap. The first coupling line is parallel to the signal transmission line and disposed in the T-shaped gap. The second coupling line is parallel to the signal transmission line and disposed on the second side of the signal transmission line. | 08-02-2012 |
| 20120206218 | PRINTED CIRCUIT BOARD - Provided is a printed circuit board configured to remove undesired signals generated in a transmission line, the signals having frequencies that are integral multiples of a basic frequency. Two 1/4 wavelength lines | 08-16-2012 |
| 20120235772 | TRIPLE-MODE MICROSTRIP FILTER - Microstrip filters and methods of operation are described. In one aspect, a filter includes a substrate having a substantially planar surface and a microstrip patch located on the surface of the substrate. The microstrip patch includes multiple symmetric slots in the microstrip patch, a first feed line extending from the microstrip patch, and a second feed line extending from the microstrip patch. The first and second feed lines are asymmetric. | 09-20-2012 |
| 20120280769 | SPIN WAVE DEVICE - A spin wave device according to an embodiment includes: an input interconnect transmitting an input impulse signal; a multilayer film including a foundation layer; a first magnetic layer formed on the multilayer film and generating spin waves when receiving the input impulse signal, the spin waves propagating through the first magnetic layer; a plurality of input electrodes arranged in a straight line on the first magnetic layer, being connected to the input interconnect, and transmitting the input impulse signal to the first magnetic layer; and a plurality of sensing electrodes sensing the spin waves, being arranged on the first magnetic layer, and being located at different distances from one another from the straight line having the input electrodes arranged therein, and the following equation is satisfied: d=Vg×t | 11-08-2012 |
| 20120306597 | RESONANT VIA STRUCTURES IN MULTILAYER SUBSTRATES AND FILTERS BASED ON THESE VIA STRUCTURES - A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers. | 12-06-2012 |
| 20120313733 | PLANAR FILTER ASSEMBLY - Various exemplary embodiments relate to a support assembly for a planar filter. The assembly includes a u-shaped housing with angled surfaces at the inner corners of the u-shape, a first dielectric plate having a first angled surface in contact with one of the angled surfaces of the housing, a second dielectric plate having a second angled surface in contact with the other angled surface of the housing, at least one compressible ring, and a cover. The planar filter is supported between the first dielectric plate and the second dielectric plate. The cover compresses the compressible ring to apply downward force on the first and second dielectric plates. The downward force is translated to an inward force by the angled surfaces of the housing. The angled surfaces of the housing apply an inward force on the first dielectric plate and the second dielectric plate. | 12-13-2012 |
| 20120319803 | SWITCHABLE BAND-PASS FILTER - The invention relates to a switchable band-pass filter. In particular, the invention relates to a narrowband switchable band-pass filter over a broad frequency band with two filter elements (including microstripline technology, suitable for use as a cosite filter with a compact structure, which is particularly suitable for efficient mass production and robust in operation. The two filter elements in this context are coupled to one another, on the one hand via a switchable coupling device and, on the other hand, via a direct electromagnetic interaction. | 12-20-2012 |
| 20130002373 | HIGH REJECTION BAND-STOP FILTER AND DIPLEXER USING SUCH FILTERS - The present invention relates to a high rejection stop band filter and a diplexer using such filters. | 01-03-2013 |
| 20130057362 | MULTILAYER CIRCUIT BOARD STRUCTURE AND CIRCUITRY THEREOF - An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure. | 03-07-2013 |
| 20130088309 | RING RESONATOR AND FILTER HAVING THE SAME - Disclosed are a resonator configured by a microstrip line and a filter. A ring resonator in accordance with an embodiment of the present invention includes a ring resonant unit configured by a microstrip line; and a via connecting the resonant unit with a ground surface. In accordance with the embodiment of the present invention, the ring resonator configured by a microstrip line including a via and a filter, thereby providing a smaller and cheaper resonator and filter. | 04-11-2013 |
| 20130099878 | STRUCTURES FOR REGISTRATION ERROR COMPENSATION - Metallization layer structures for reduced changes in radio frequency characteristics due to registration error and associated methods are provided herein. An example resonator includes a first conductive layer defining an error limiting feature and a second conductive layer. The resonator further includes at least one communication feature configured to electrically couple the first conductive layer and the second conductive layer at a communication position. The error limiting feature is configured to reduce changes in radio frequency characteristics of the resonator due to registration error. Methods of manufacturing resonators are also provided herein. | 04-25-2013 |
| 20130135061 | MICROWAVE CIRCUIT IN STRIP LINE TECHNOLOGY - A microwave circuit ( | 05-30-2013 |
| 20130147580 | ELECTROMAGNETIC RESONANCE COUPLER - An electromagnetic resonance coupler includes a transmission resonator provided on the transmission substrate and having a shape obtained by opening a loop shape including an inwardly recessed portion in part to make a transmission resonator slit, transmission wiring connected to the transmission resonator, a reception substrate, a reception resonator provided on the reception substrate and having the same size and shape as the transmission resonator, and reception wiring connected to the reception resonator. The transmission and reception resonators are symmetric with respect to a point and face each other so that their contours match. In the transmission resonator, at least part of wiring constituting the recessed portion is close to wiring other than the at least part of wiring at a distance less than or equal to four times the wiring width of the transmission resonator. | 06-13-2013 |
| 20130154771 | BAND PASS FILTER - A band pass filter is provided. The band pass filter includes a first resonator which includes a first pattern and first microstrip line; a second resonator which includes a second pattern and second microstrip line; a third pattern vertically arranged between the first pattern and second pattern; and a ground pattern connected with the third pattern, embodying a band pass filter using a resonator having a length of 1/16 wavelength or less, instead of a resonator having a length of ¼ wavelength. | 06-20-2013 |
| 20130214880 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including a plurality of insulator layers laminated on each other in a lamination direction. A first strip line resonator is provided within a first region in the laminated body. A second strip line resonator is provided within a second region in the laminated body. A third strip line resonator is provided within the first region in the laminated body, and in a planar view in a lamination direction, the third strip line resonator and the first strip line resonator sandwich therebetween the second strip line resonator. A coupling conductor capacitively couples the first strip line resonator and the third strip line resonator. | 08-22-2013 |
| 20130249652 | GIGAHERTZ COMMON-MODE FILTER FOR MULTI-LAYER PLANAR STRUCTURE - An apparatus includes a filter that includes a multi-layer planar structure having a first layer and a second layer. The first layer includes an electronic band-gap structure that is configured to suppress a first frequency component of signals passing through the filter. The second layer includes a quarter-wavelength stub that is configured to suppress a second frequency component of the signals passing through the filter. | 09-26-2013 |
| 20130328645 | Plating Stub Resonance Shift with Filter Stub Design Methodology - A technique is provided to increase signal bandwidth of data processing signals by providing a plating stub as a filter using multiple line segments of different widths to filter the reflected high frequency components bouncing from the stub end toward the signal path. This stub-filter shifts the resonance point to a much higher frequency, placing that point of resonance beyond the bandwidth of interest without sacrificing a low frequency loss. Accordingly, there is provided an apparatus comprising a stub filter of a substrate, comprising a multi-segmented stub comprising a plurality of stub portions, where one of the stub portions has a different impedance than another of the stub portions. | 12-12-2013 |
| 20130342287 | HIGH FREQUENCY BAND PASS FILTER WITH COUPLED SURFACE MOUNT TRANSITION - A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements. | 12-26-2013 |
| 20140015625 | DUAL MODE FILTER - A dual mode filter ( | 01-16-2014 |
| 20140022032 | MICROWAVE RESONATOR WITH IMPEDANCE JUMP, NOTABLY FOR BAND-STOP OR BAND-PASS MICROWAVE FILTERS - A microwave resonator with impedance jump, comprises at least one line of high characteristic impedance of a determined length and one line of low characteristic impedance, at least the line of high characteristic impedance comprising a first line cut, a first link wire of a first determined impedance ensuring an electrical link for the passage of the signal from one side to the other of the first line cut. A method for producing a microwave resonator comprising an adjustment step is also provided. | 01-23-2014 |
| 20140035703 | Multiple-Mode Filter for Radio Frequency Integrated Circuits - A fully integrated silicon-based bandpass filter which lends itself to applications in the gigahertz region is disclosed. The bandpass filter is fabricated on an integrated circuit and operates as a microwave/millimeter-wave filtering circuit. In accordance with one aspect, the bandpass filter includes a first set and a second set of filter coupled elements, a three-port “T” transmission line junction and a perturbing element. The three-port “T” transmission line junction has a first port coupled to a first end of a first one of the first set of filter coupled elements and a second port coupled to a first end of a first one of the second set of filter coupled elements. The perturbing element is coupled to a third port of the three-port “T” transmission line junction. A second one of the first set of filter coupled elements includes an input transmission line and has a first end thereof coupled to an input port and an opposite end thereof having an open end. A second one of the second set of filter coupled elements includes an output transmission line and has a first end thereof coupled to an output port and an opposite end thereof having an open end. | 02-06-2014 |
| 20140077899 | BAND-PASS FILTER - A band-pass filter including a double-sided circuit board, an input terminal, an output terminal and a plurality of resonance units are provided. The double-sided circuit board includes a first conductor layer and a second conductor layer. The first conductor layer includes a grounded metal layer. The grounded metal layer includes one or more vias to connect to a grounded layer of the second conductor layer. The input terminal is disposed in the first conductor layer to receive a signal. The output terminal is disposed in the first conductor layer to output the filtered signal. The resonance units are disposed in the first and second conductor layers respectively, wherein the number of the resonance units is N, and N is a positive integer greater than or equal to 3. | 03-20-2014 |
| 20140159834 | ADJUSTABLE RADIOFREQUENCY FILTER IN PLANAR TECHNOLOGY AND METHOD OF ADJUSTING THE FILTER - An adjustable radiofrequency filter in planar technology comprises at least one dielectric substrate and n resonators R | 06-12-2014 |
| 20140159835 | DUAL-BAND MICROSTRIP-TO-SLOTLINE TRANSITION CIRCUIT - This invention relates to a microstrip to slotline transition circuit operating on two frequency bands, in which a first filtering circuit is connected between a first portion of microstrip line and a first input/output port, said first circuit and the portion of microstrip line being adapted to accept the frequencies from a first frequency band and reject the frequencies of a second frequency band, a second filtering circuit is connected between a second portion of microstrip line and a second input/output port, said second circuit and the portion of microstrip line being adapted to accept the frequencies from the second frequency band and reject the frequencies from the first frequency band, and the slotline is sized to provide an impedance that is substantially equal to the impedance of an open circuit at the coupling zone between the microstrip line and the slotline. | 06-12-2014 |
| 20140167885 | BAND-PASS FILTER WITH A LOOP CONFIGURATION - A band-pass filter with a loop configuration is implemented on a circuit board in the form of a microstrip line for signals in the gigahertz range. The band-pass filter includes a dielectric substrate and a conductive layer disposed over the dielectric substrate, wherein the conductive layer comprises a loop portion; a first signal terminal extending from a first side of the loop portion; a second signal terminal extending from a second side of the loop portion; a first branch extending from a third side of the loop portion; and a second branch extending from a fourth side of the loop portion. | 06-19-2014 |
| 20140167886 | Plating Stub Resonance Shift with Filter Stub Design Methodology - A technique is provided to increase signal bandwidth of data processing signals by providing a plating stub as a filter using multiple line segments of different widths to filter the reflected high frequency components bouncing from the stub end toward the signal path. This stub-filter shifts the resonance point to a much higher frequency, placing that point of resonance beyond the bandwidth of interest without sacrificing a low frequency loss. Accordingly, there is provided an apparatus comprising a stub filter of a substrate, comprising a multi-segmented stub comprising a plurality of stub portions, where one of the stub portions has a different impedance than another of the stub portions. | 06-19-2014 |
| 20140176262 | PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern. | 06-26-2014 |
| 20140191827 | WIDEBAND HIGH FREQUENCY BANDPASS FILTER - A wideband high frequency bandpass filter is disclosed, which includes an open-circuit resonator structure and a short-circuit resonator structure. The open-circuit resonator has a signal transmission strip line and a T-shaped strip line. Both ends of the signal transmission strip line are bent toward to opposite ends of the T-shaped strip line respectively, so as to form gaps in the open-circuit resonator. The open-circuit resonator structure and the short-circuit resonator structure are coupled under the resonant mode, thereby achieving a bandpass filtering at 60 GHz. | 07-10-2014 |
| 20140203894 | NOTCH FILTER STRUCTURE WITH OPEN STUBS IN SEMICONDUCTOR SUBSTRATE AND DESIGN STRUCTURE - On-chip millimeter wave (mmW) notch filters with via stubs, methods of manufacture and design structures are disclosed. The notch filter includes a signal line comprising a metal trace line connected to a metal via stub partially extending into a semiconductor substrate. The notch filter further includes a defected ground plane connected to at least one or more additional metal via stubs partially extending into the semiconductor substrate. | 07-24-2014 |
| 20140210572 | MULTI-LAYER DIGITAL ELLIPTIC FILTER AND METHOD - The present invention relates generally to digital elliptic filters, and more particularly, but not exclusively to multi-layer digital elliptic filters and methods for their fabrication. | 07-31-2014 |
| 20140218135 | COMPACT MICROWAVE DISTRIBUTED-ELEMENT DUAL-MODE BANDPASS FILTER - A compact microwave distributed-element dual-mode bandpass filter is provided, comprising a dual-mode resonator and a signal input port and a signal output port coupled electrically to the dual-mode resonator respectively; wherein, the dual-mode resonator comprises a main stripline with a center-loaded short-circuited stub, the main stripline is reasonably folded in both vertical and horizontal directions and is reasonably folded into a first layer, a second layer, a third layer and a fourth layer; a symmetrical plane is provided between the second layer and the third layer, while the first layer and the fourth layer are symmetrical to each other relative to the symmetrical plane, the second layer and the third layer are symmetrical to each other relative to the symmetrical plane as well; the center-loaded short-circuited stub is located on the symmetrical plane, and the symmetrical plane can be treated as a virtual ground at odd-mode resonant frequency. | 08-07-2014 |
| 20140285288 | FILTER - Embodiments of the present invention disclose a filter, including: a conductive box body, and an insulating substrate, a first conductor, and a second conductor that are arranged inside the conductive box body. The insulating substrate includes a first surface and a second surface. The first conductor is arranged on the first surface of the insulating substrate. A position on the second surface corresponding to the first conductor contacts with the conductive box body. The second conductor is arranged on the first surface or the second surface of the insulating substrate. The second conductor and the conductive box body form a coaxial resonant cavity together. Further, an end of the second conductor is coupled with the first conductor, and the other end of the second conductor is coupled with the conductive box body. The filter has advantages of a microstrip filter of simple manufacturing process and small volume. | 09-25-2014 |
| 20140306782 | RESONANCE DEVICE - A resonance device is disclosed. The resonance device in accordance with an embodiment of the present invention includes: a case including a first ground surface and a second ground surface which face each other; a stacked part formed inside the case by stacking a first conductive layer and a second conductive layer, wherein the first conductive layer is grounded to the first ground surface and the second conductive layer is separated from the first conductive layer without being grounded to the first ground surface; and a transmission layer connecting the second conductive layer to the second ground surface. | 10-16-2014 |
| 20140327500 | FILTER AND RESONATOR - A filter according to embodiments includes n resonators, an input line, and an output line. Each of the resonators includes a first comb-like structure, a second comb-like structure, and a connection line that connect the first and the second comb-like structure. The first and second comb-like structures have a plurality of first lines and a second line that is connected to one end of the first lines. The first lines of the first and the second comb-like structures are arranged parallel to each other. The connection line has bending portions. Further, a second comb-like structure of a k-th resonator and a first comb-like structure of a (k+1)-th resonator are arranged so as to have an interlaced arrangement, and a second comb-like structure of the (k+1)-th resonator and a first comb-like structure of a (k+2)-th resonator are arranged so as to have an interlaced arrangement. | 11-06-2014 |
| 20140340175 | SIGNAL TRANSMISSION DEVICE, FILTER, AND INTER-SUBSTRATE COMMUNICATION DEVICE - A signal transmission device includes substrates and resonance sections resonating at the predetermined resonance frequency. At least one of the substrates is formed with two or more resonators in the second direction, and the remaining one or two or more of the substrates are each formed with one or more resonators in the second direction, and at least one of the resonance sections is configured by a plurality of resonators opposing one another in the first direction between the substrates, the opposing resonators form a coupled resonator resonating as a whole at the predetermined resonance frequency through electromagnetic coupling in a hybrid resonance mode, and in a state that the substrates are separated away from one another to fail to establish electromagnetic coupling thereamong, the resonators forming the coupled resonator resonate at any other resonance frequency different from the predetermined resonance frequency on the substrate basis. | 11-20-2014 |
| 20150022284 | MICROSTRIP LINE FILTER - A microstrip line filter comprising a coupling mechanism arranged to couple a first resonator and a second resonator, wherein the coupling mechanism includes a shared metallic coupling member arranged to have a predetermined dimension associated with an operation characteristics of the first and second resonators. | 01-22-2015 |
| 20150022285 | BANDPASS FILTER - A bandpass filter includes a first uniform impedance resonator comprising a first microstrip line and a second microstrip line, a second uniform impedance resonator which is axisymmetric to the first uniform impedance resonators, a first asymmetric stepped-impedance resonator comprising a third microstrip line and a fourth microstrip line, a second asymmetric stepped-impedance resonator which is axisymmetric to the first asymmetric stepped-impedance resonator, a third asymmetric stepped-impedance resonator consisting of a fifth microstrip line and a sixth microstrip line, a fourth asymmetric stepped-impedance resonator which is axisymmetric to the third asymmetric stepped-impedance resonator, a input consisting of a seventh microstrip line and connecting with the first microstrip line, and a output which is axisymmetric to the input and connects with the second uniform impedance resonator. | 01-22-2015 |
| 20150022286 | HIGH-FREQUENCY SIGNAL LINE - A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer. | 01-22-2015 |
| 20150035624 | HIGH FREQUENCY FILTER - In a high frequency filter, a multilayer structure includes a plurality of insulator layers, a first transmission line transmits an input signal, and a second transmission line is electromagnetic coupled with the first transmission line on the same insulator layer and transmits an output signal. A conductor layer defines capacitors with the first transmission line and the second transmission line with the insulator layer in between. A dielectric constant of the insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of an insulator layer other than the insulator layer. | 02-05-2015 |
| 20150042419 | MULTI-BAND PASS FILTER - An multi-band pass filter is disclosed. The multi-band pass filter in accordance with an embodiment of the present invention includes: a housing comprised with an input terminal and an output terminal separated from each other; a high pass filter installed in one inside of the housing and electrically connected to the input terminal and configured to form a plurality of resonator patterns with the circuit patterns on the printed circuit board; and a dual band reject filter series-connected with the high pass filter and provided between the high pass filter and the output terminal by forming a plurality of cavities inside the housing and furnishing each of the cavities with a resonator. | 02-12-2015 |
| 20150077197 | HYBRID RESONATORS IN MULTILAYER SUBSTRATES AND FILTERS BASED ON THESE RESONATORS - A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias. | 03-19-2015 |
| 20150091670 | STRUCTURES FOR REGISTRATION ERROR COMPENSATION - Metallization layer structures for reduced changes in radio frequency characteristics due to registration error and associated methods are provided herein. An example resonator includes a first conductive layer defining an error limiting feature and a second conductive layer. The resonator further includes at least one communication feature configured to electrically couple the first conductive layer and the second conductive layer at a communication position. The error limiting feature is configured to reduce changes in radio frequency characteristics of the resonator due to registration error. Methods of manufacturing resonators are also provided herein. | 04-02-2015 |
| 20150116059 | COMPACT MICROSTRIP BANDPASS FILTER WITH MULTIPATH SOURCE-LOAD COUPLING - A method and device for a compact microstrip bandpass filter that includes an input terminal, an output terminal, a plurality of quarter-wavelength resonators, a resonant disk, a plurality of layers, and a microstrip line which connects the resonant disk to a joint point of the quarter-wavelength resonators. A method of forming two signal paths in a compact microstrip bandpass filter includes forming a first signal path between an input terminal and an output terminal of the filter with a plurality of quarter-wavelength resonators with a resonant disk and a microstrip line which connects the resonant disk to a joint point of the quarter-wavelength resonators. The method includes forming a second signal path of the quarter-wavelength resonators, the filter includes a plurality of layers. | 04-30-2015 |
| 20150303546 | DIELECTRIC STRAP WAVEGUIDES, ANTENNAS, AND MICROWAVE DEVICES - A new class of antennas and microwave components are introduced. In this approach a high-permittivity dielectric film is applied (i.e. printed) on a dielectric substrate, which may be grounded. By changing the shape of the high-permittivity film, different microwave devices (e.g. waveguides, filters, couplers, and antennas) are produced. By changing the size and permittivity of the high-permittivity film and dielectric substrate, these elements are designed at different frequencies for different applications. Highly-efficient microwave devices can result due to the absence of surface currents. | 10-22-2015 |
| 20160006095 | MICROWAVE-FREQUENCY FILTERING STRUCTURES - A microwave-frequency filtering structure includes two dielectric layers separated by a conducting layer that is etched in the pattern of a filter, the upper and lower exterior faces of the stack being covered over the larger part of their surface by a conducting plane constituting ground planes of the structure, which are interlinked by a metallization of the periphery of the structure; two identical devices, an input and an output transition device, each allowing the passage from a microstrip mode to a stripline mode and vice versa, configured so that the geometry of the transition device is optimized to minimize the standing wave ratios at the ports of the filter, and to minimize the excitation and the coupling of the TE10 mode, two conducting pillars perpendicular to the plane of the structure and situated close to its principal axis, without being coupled with the filter, and linking the upper and lower ground planes. | 01-07-2016 |
| 20160006097 | FILTER DEVICE - Disclosed herein is a filter device for suppressing ground bounce and electromagnetic interference. The filter device comprises a dielectric substrate, a signal transmission layer, a signal via, a plurality of ground vias, and first, second, and third metal layers. The signal transmission layer is located on the dielectric substrate, the vias and the first and second metal layers in the dielectric substrate, and the third metal layer underneath it. The first metal layer has a filter portion and a resonance portion. The ground vias connect the second and third metal layers and are disposed perpendicularly to them. The signal via, disposed in a via space defined by the ground vias, connects the first metal layer and the signal transmission layer. As a result, the resonance portion is able to reduce noise of a certain frequency band, the ground vias abate ground bounce, and electromagnetic interference is minimized. | 01-07-2016 |
| 20160013533 | MICROSTRIP LINE FILTER | 01-14-2016 |
| 20160056520 | Microwave Filter - A microwave filter includes a strip transmission line and a filtering assembly connected to the strip transmission line. The transmission line has an input terminal and an output terminal. The filtering assembly includes a strip first primary branch connected directly to a first connection point of the transmission line. The first primary branch includes a first body portion and a first bent portion at a first end of the first body portion, where the first bent portion is connected directly to the first connection point, and the first body portion is substantially parallel to a body portion of the transmission line. With the microwave filter incorporated in an electric motor, the impedance curve of the transmission line can be matched with a high-frequency EMI curve, and therefore the filtering effect is enhanced, EMI is suppressed and the EMC level improved. | 02-25-2016 |
| 20160104927 | ELECTRONIC CIRCUIT - An electronic circuit includes at least two first conductors having line shapes which are arranged on a first plane of a substrate, a second conductor arranged on a second plane of the substrate, and a third conductor having a line shape, with at least part thereof being arranged on a third plane between the first plane and the second plane of the substrate. The open end of the third conductor is included in part of the third conductor which is arranged on the third plane, and the part is arranged to at least partly overlap one of at least the two first conductors and not to overlap the other first conductor when viewed from a direction perpendicular to the substrate. | 04-14-2016 |
| 20160149285 | THIN, FLEXIBLE TRANSMISSION LINE FOR BAND-PASS SIGNALS - A signal transmission line includes a signal conductor and an array of resonators. The resonators can include split resonators. The array of resonators can partially overlap with the signal conductor of the signal transmission line. In some embodiments, the portion of the signal conductor overlapping with the split ring resonators is wider than the portion of the signal conductor outside the overlapping area. The signal transmission line can be tuned for a range of frequencies. For example, the signal transmission line can be tuned to have an absolute value of a s-parameter less than or equal to 1 dB for a range of frequencies. The signal transmission line can be less than or equal to 200 microns in thickness and may also be flexible. | 05-26-2016 |
| 20160172734 | DIFFERENTIAL INTERCONNECT TOPOLOGY IN A SUBSTRATE WITH STAGGERED VIAS | 06-16-2016 |
| 20160181678 | BAND-REJECTION FILTER | 06-23-2016 |
| 20160254796 | FILTER | 09-01-2016 |
| 20170237136 | FOUR-MODE DEFECTED GROUND STRUCTURE FILTER | 08-17-2017 |
