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Having mechanical switching means

Subclass of:

333 - Wave transmission lines and networks

333001000 - PLURAL CHANNEL SYSTEMS

333100000 - Having branched circuits

333101000 - Including switching means

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
333105000 Having mechanical switching means 22
20090153265METHOD AND SYSTEM FOR CONTROLLING MEMS SWITCHES IN AN INTEGRATED CIRCUIT PACKAGE - Methods and systems for controlling MEMS switches in an integrated circuit package are disclosed and may include controlling one or more arrays of MEMS switches utilizing a control chip. The arrays of MEMS switches and one or more circuit components may be integrated in and/or on a multi-layer package. The control chip may be bonded to the multi-layer package. The circuit components may be coupled to the arrays of MEMS switches via electrical traces embedded in and/or deposited on the multi-layer package. The control chip may be flip-chip bonded to the multi-layer package. The MEMS switches may be actuated electrostatically or magnetically. The circuit components may include integrated circuits, inductors, capacitors, surface mount devices, and/or transformers.06-18-2009
20090289736MAGNETIC SWITCHES FOR SPINWAVE TRANSMISSION - Spinwave transmission systems that include switching devices to direct the transmission of the spinwaves used for data transfer and processing. In one particular embodiment, a system for spinwave transmission has a first magnetic stripe configured for transmission of a spinwave and a second magnetic stripe for transmission of the spinwave, with a gap therebetween. The system includes a coupler that has a first orientation and a second orientation, where in the first orientation, no magnetic connection is made between the magnetic stripes, and in the second orientation, a connection is made between the magnetic stripes. The connection allows transmission of the spinwave from the first magnetic stripe to the second magnetic stripe. The first and second orientation may be the physical position of the coupler, moved by thermal, piezoelectric, or electrostatic forces, or, the first and second orientation may be a magnetic state of the coupler.11-26-2009
20090315637METHOD AND SYSTEM FOR COMMUNICATING VIA FLIP-CHIP DIE AND PACKAGE WAVEGUIDES - Methods and systems for communicating via flip-chip die and package waveguides are disclosed and may include communicating one or more signals between sections of an integrated circuit via one or more waveguides integrated in a multi-layer package. The integrated circuit may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuit or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.12-24-2009
20110133851ELECTROSTATIC SWITCH FOR HIGH FREQUENCY AND METHOD FOR MANUFACTURING THE SAME - An electrostatic switch for high frequency and a method for manufacturing the same are disclosed. The electrostatic switch for high frequency in accordance with an embodiment includes: a first substrate module including a first substrate, an electrode part and a pair of CoPlanar Waveguides (CPWs), the electrode part being installed on the first substrate, the pair of CPWs being formed on either side of the electrode part and guiding an RF signal to travel; and a second substrate module being joined to the first substrate module, the second substrate module including a membrane and a bias line, the membrane being installed on a second substrate and bent by bias voltage supplied to the electrode part and being coupled to the pair of CPWs across an upper area of the electrode part in order to be short-circuited to the electrode part, the bias line being connected to the electrode part.06-09-2011
20110193652Feeding Device for Smart Antenna - A feeding device for a smart antenna includes a signal reception terminal, a first antenna feeding terminal, a second antenna feeding terminal, a power divider, and a switching circuit. The signal reception terminal is utilized for receiving a transmitting signal. The first antenna feeding terminal and the second antenna feeding terminal are utilized for outputting feeding signals to the two antennas, respectively. The power divider, having a first input port, a second input port, a first output port, and a second output port, is utilized for distributing energy received by the first input port or the second input port equally to the first output port and the second output port, and making signals of the first output port and the second output port having 90 degree phase difference. The switching circuit performs switching operations to control electrical connections of the power divider according to a control signal.08-11-2011
20110279192APPARATUS AND METHOD FOR DETECTING RADIO FREQUENCY POWER - Apparatus and methods are disclosed related to radio frequency (RF) power detection. One such apparatus includes a directional coupler, an RF switch, and an RF power detector. The RF switch can selectively change coupling between the directional coupler and the RF power detector. This can enable accurate power detection based on a ratio of power levels, without factory calibration or laser trimming.11-17-2011
20120112852METHOD AND APPARATUS FOR TUNING ANTENNAS IN A COMMUNICATION DEVICE - A system that incorporates teachings of the present disclosure may include, for example, a process for obtaining a first operational metric for a transmitter of a communication device, determining a range of impedances based on the first operational metric where the range of impedances is associated with an acceptable level of performance for the communication device, obtaining a second operational metric for the transmitter, determining a target impedance within the range of impedances based on the second operational metric, and tuning a first impedance matching network based on the target impedance, where the first impedance matching network is coupled with a first antenna of the communication device, and where the tuning is based on adjusting a first variable component of the first impedance matching network. Additional embodiments are disclosed.05-10-2012
20120249261SYSTEMS AND METHODS FOR ENHANCING RELIABILITY OF MEMS DEVICES - A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.10-04-2012
20130154762MEMS Switches in an Integrated Circuit Package - Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.06-20-2013
20140009244RF MEMS CROSSPOINT SWITCH AND CROSSPOINT SWITCH MATRIX COMPRISING RF MEMS CROSSPOINT SWITCHES - The RF MEMS crosspoint switch comprising a first transmission line and a second transmission line that crosses the first transmission line; the first transmission line comprises two spaced-apart transmission line portions, and a switch element that permanently electrically connects the said two spaced-apart transmission line portions; the second transmission line crosses the first transmission line between the two spaced-apart transmission line portions; the RF MEMS crosspoint switch further comprises actuation means for actuating the switch element at least between a first position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and the first and second transmission lines are electrically disconnected, and a second position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and is also electrically connecting the two transmission lines together.01-09-2014
20140184352ELECTROSTATIC MICRO RELAY AND MANUFACTURING METHOD FOR THE SAME - An electrostatic micro relay has a substrate, a signal line arranged on the substrate and having an input point configured to receive a signal and a plurality of signal channels configured to distribute the signal, the plurality of signal channels being each formed with a fixed contact, a plurality of movable contacts, each provided with respect to each of the fixed contacts and arranged so as to be opposed to a corresponding fixed contact across a space, a plurality of movable electrodes, each connected to each of the plurality of movable contacts and configured to make the connected movable contact brought into contact with and separated from the corresponding fixed contact, a cap, formed with a space configured to house the plurality of movable electrodes, and bonded with the substrate, and a signal input portion.07-03-2014
20140253260HIGH-FREQUENCY SWITCH - A high-frequency switch configured to transmit differential signals including first and second signals, has first and second switches each comprising an input terminal configured to receive a signal and two output terminals configured to output the signal, and a substrate comprising a first surface mounted with the first and second switches. The input terminal is arranged between the two output terminals. The first and second switches are arranged on the substrate along a direction intersecting with a direction in which the input terminal and the two output terminals are placed side by side. One terminal of the first switch and one terminal of the second switch are placed side by side along the direction in which the first and second switches are arranged.09-11-2014
20140368292MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE AND DESIGN STRUCTURES - Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and usage, and design structures are disclosed herein. The method includes applying a first voltage polarity to an actuator of a Micro-Electro-Mechanical System (MEMS) structure to place the MEMS structure in a predetermined state for a first operating condition. The method further includes applying a second voltage polarity which is opposite from the first voltage polarity to the actuator of the MEMS structure during a subsequent operating condition.12-18-2014
20150097635PIEZOELECTRIC MULTIPLEXER - A piezoelectric multiplexer includes an actuator and multiple piezo-morph beams. The actuator includes an actuator conducting head and an actuator stem, and each piezo-morph beam includes a conducting beam contact head and a beam stem manufactured out of piezo-morph material. A control voltage is selectively applied to electrical contacts coupled to the beam stems to create a piezoelectric effect that bends the selected piezo-morph beam and creates an electrical connection between its contact head and the conducting head of the actuator. A control circuit with a controller signals which piezo-morph beam to connect to the actuator. This multi-piezo-morph-beam piezoelectric multiplexer can be affixed to the electrical terminals of different electrical components (e.g., a transistor) to create an electrical cell that can be manufactured on a semiconductor chip or in a microelectromechanical system (MEMS) device.04-09-2015
333106000 Using rotary switching means 2
20090315638MILLIMETER WAVE LOW-LOSS HIGH-ISOLATION SWITCH - A switch for selectively providing an input signal to an output terminal. The switch includes a first waveguide terminal, a second waveguide terminal, a reduced-width waveguide connecting the first waveguide terminal to the second waveguide terminal, and at least one switching element spanning the reduced-width waveguide between the first and second waveguide terminals. The reduced-width waveguide is configured to pass a signal from the first waveguide terminal to the second waveguide terminal when the at least one switching element is in a first state and block a signal when the at least one switching element is in a second state. In some embodiments, the switch also includes at least one additional waveguide terminal and the reduced-width waveguide also connects the first waveguide terminal to the at least one additional waveguide terminal.12-24-2009
20140184353Waveguide T-Switch - An arrangement is disclosed for providing the functionality of a four port, four channel rotary switch. The arrangement includes a first four port rotary microwave switch, the first switch including a first rotor and a first set of four waveguide ports, and a second four port rotary microwave switch, communicatively coupled to the first switch, the second switch including a second rotor and a second set of four waveguide ports. Each of the first switch and the second switch has at most three channels.07-03-2014
333108000 For waveguide 6
20090315639DPDT RF Switch and TMA Using the Same - Disclosed is a DPDT RF switch. The DPDT RF switch includes: first to fourth transmission lines for forming first to fourth ports, respectively; and first to fourth slot line pattern sections. The first slot line pattern section includes: a first slot line; and a first switching device for blocking signal transfer by short-circuiting a gap of a slot line. The third slot line pattern section includes: a third slot line; and a third switching device for blocking signal transfer by short-circuiting a gap of a slot line. The second slot line pattern section includes: a first loop-shaped slot line; a second slot line; and a second switching device for blocking signal transfer by short-circuiting a gap of a slot line. The fourth slot line pattern section includes: a second loop-shaped slot line; a fourth slot line; and a fourth switching device for blocking signal transfer by short-circuiting a gap of a slot line.12-24-2009
20120280762HIGH ISOLATION WAVEGUIDE SWITCH - Embodiments of the invention are directed to a high isolation waveguide switch that can either be manually or mechanically operated. Operation proceeds by loosening a fastener, which draws a rotor portion of the switch away from a stator portion; rotating the rotor by 90 degrees; and tightening the fastener, pushing the rotor into contact with the stator and completing connections to the waveguide ports. Gaskets may provide EMI shielding and ensure port-to-port isolation.11-08-2012
20130321096Compact Multiport Waveguide Switches - A waveguide switch based on alternating short and open loads in a waveguide path. In one embodiment, the switch being made up of four waveguides connected by sections of ridge waveguides where simple short-circuit loads can be activated to control the signal paths. The switch being adapted for the C-, R- and T-type switches. Another embodiment of the same device being adapted for SPT type switched.12-05-2013
20140266498TRANSFER DEVICE FOR MICROWAVE SIGNALS - A transfer device for microwave signals is presented. The transfer device comprises a housing defining a cavity therein, input ports and output ports defined on walls of the housing and a translatably displaceable waveguide structure positioned within the cavity and including at least two selectable functional segments. In use the translatably displaceable waveguide structure is displaced within the cavity to apply a selected function, such as a switching function and/or a combining function, to microwave signals propagating between the input ports and the output ports. Optionally, the transfer device may include multiple stacked translatably displaceable waveguide structures which can be independently displaced within the housing to apply a desired function to the microwave signals propagating between the input ports and the output ports. A method of using such transfer device is also presented.09-18-2014
20160164161MULTICHANNEL RELAY ASSEMBLY WITH IN LINE MEMS SWITCHES - An ohmic RF MEMS relay includes a substrate with a capacitive coupling, C06-09-2016
20160172731WAVEGUIDE SWITCH06-16-2016
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