| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324697000 | For interface | 6 |
| 20100148807 | ORIENTATION DETECTION CIRCUIT AND ELECTRONIC DEVICE USING THE SAME - An orientation detection circuit is provided. The circuit includes a processor, a first resistor, a second resistor, a third resistor, and a vibration switch. The processor comprises a first input pin and a second input pin. The second resistor has a resistance value greater than that of the first resistor. The third resistor has a resistance value greater than that of the second resistor. The switch comprises a first terminal connected to a power source and a second terminal connected to the second input pin and connected to ground via the third resistor. The switch includes a third terminal connected to the first terminal via the second resistor, and a fourth terminal connected to the first input pin and connected to ground via the first resistor. The switch also includes a fifth terminal connected to the fourth terminal, and a conductive ball for contacting two or three of the terminals. | 06-17-2010 |
| 20120217983 | HEAT SPREADER FLATNESS DETECTION - A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack. | 08-30-2012 |
| 20130321008 | HEAT SPREADER FLATNESS DETECTION - A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against a chip stack. One or more nodes within a sensor are electrically connected. The electrical resistance values of the connection may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be correlated to heat spreader flatness for determining whether the heat spreader is flat against the chip stack when the heat spreader is installed upon the chip stack. | 12-05-2013 |
| 20140111227 | Housing Cladding Module with Collision Identification for Medical Devices - A housing cladding module for a medical device is provided for collision identification. The module includes resistor elements, which are arranged in and/or on the surface and which are designed such that the resistor elements change their electrical resistance on expansion. The resistor elements are arranged in such a way that the resistor elements are expanded in the event of a collision with an object. The collision is identified easily, and the effective collision force may be ascertained. | 04-24-2014 |
| 20150344060 | SYSTEMS AND METHODS FOR PRINTING SENSOR CIRCUITS ON A SENSOR MAT FOR A STEERING WHEEL - Systems and methods of printing sensor loops on a sensor mat for use in a steering wheel are disclosed herein. For example, the sensor mat may include a base substrate, one or more printed sensing loops, and an insulating material. The printed sensing loops are made with conductive ink that is disposed upon the base substrate or the insulating layer from a print head and adheres thereto. These sensor mats are versatile with respect to the type of base substrate and insulating materials that may be used, the shape of the sensing loops, and the area each loop may occupy. Shielding loop(s) may also be printed adjacent the sensing loop(s). This configuration allows shielding for the sensing loops as part of the sensing mat, which may reduce the thickness of the steering wheel rim and manufacturing and installation times. | 12-03-2015 |
| 20160018348 | SENSING STRUCTURE - Disclosed is a sensing structure including a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit. | 01-21-2016 |
