| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 324760000 | With temperature control | 53 |
| 20080211526 | Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober - By wafer holder including a chuck top for mounting a wafer and a supporter supporting the chuck top and having flatness of at most 0.1 mm, a heater unit for a wafer prober and the wafer prober using the wafer holder, a wafer holder and a wafer prober apparatus hardly deformable even under high load and capable of effectively preventing contact failure, and capable of preventing temperature increase in a driving system when a semiconductor wafer having semiconductor chips with minute circuitry that requires high accuracy is heated can be provided. In the wafer holder of the present invention, the flatness of the supporter is preferably at most 0.05 mm, and more preferably at most 0.01 mm. | 09-04-2008 |
| 20080211527 | Heat-resistant lens kit - A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole. | 09-04-2008 |
| 20080231303 | SEMICONDUCTOR DEVICE FOR ELECTRICAL CONTACTING SEMICONDUCTOR DEVICES - A semiconductor device with a number of contact pads for the electrical contacting of the semiconductor device is disclosed. A padding layer, which is manufactured of a hard material, is provided at least partially below an upper layer of the contact pads. | 09-25-2008 |
| 20080231304 | Apparatus and method for controlling temperature in a chuck system - An apparatus and method of controlling the temperature of a thermal chuck system are disclosed. The system includes a temperature controller which controls a temperature transition in a thermal chuck. The temperature controller comprises inputs that receive air and fluid from an air source and water source, respectively, and an output for alternately transferring the air and fluid in proportions to the thermal chuck. A time proportional controller generates the proportions by computing a proportion band in each of a plurality of control regions. The proportion bands are used by the temperature controller to manage the flow of air and fluid to the chuck such that a minimum undershoot of the temperature transition is realized. | 09-25-2008 |
| 20080238465 | BURN-IN SYSTEM WITH HEATING BLOCKS ACCOMODATED IN COOLING BLOCKS - A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces. | 10-02-2008 |
| 20080238466 | TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS - An apparatus is provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption. | 10-02-2008 |
| 20080246499 | SYSTEM AND METHOD FOR THE ELECTRICAL CONTACTING OF SEMICONDUCTOR DEVICES - A device and a method for the electrical contacting of semiconductor devices. One embodiment provides for testing semiconductor devices by using a contacting device for the electrical contacting of a number of semiconductor devices to be tested and for the electrical connection with a test system. The contacting device includes a fluid container for accommodating a fluid adapted to be tempered. | 10-09-2008 |
| 20080252324 | Active thermal control unit for maintaining the set point temperature of a DUT - A thermal control unit (TCU) for maintaining the set point temperature of an IC device under test (DUT) has a thermoelectric module (a Peltier device), a fluid circulation block, a lower pedestal assembly containing a thermal sensor, and an upper cover housing arranged in a stacked relationship along the z-axis of the TCU. A z-axis compliant force is supplied from the TCU's cover housing by means of a spring-loaded pusher mechanism that supplies a compliant spring force to the stacked arrangement of the fluid block, peltier device, and pedestal assembly. The z-axis compliant force provided by the spring-loaded pusher mechanism produces efficient thermal contact between the peltier device and the stacked components of the TCU containing the peltier device and allows the peltier device to expand and contract within the TCU to extend the life of the peltier device. An alternative quick disconnect feature allows the electrical leads of the thermal sensor in the pedestal assembly to automatically make electrical connection with associated wiring in the cover housing when the cover housing is secured to the pedestal assembly. | 10-16-2008 |
| 20080272795 | Prober Apparatus and Operating Method Therefor - An operating method for a prober apparatus is disclosed which includes controlling the temperature of at least one part of the prober apparatus. Another operating method for a prober apparatus includes production and transfer of thermal energy between means for the exchange of heat and at least one component of the prober apparatus, wherein the production, the transfer or the production and the transfer of thermal energy is controlled. A prober apparatus includes at least one heat exchange element disposed in a spatial relation to at least one probe tool support so as to have an impact on the temperature thereof. | 11-06-2008 |
| 20080309361 | Method of Monitoring Burn-In Apparatus - A method of monitoring a burn-in apparatus, which brings a heater and a temperature sensor into contact with various devices under test during a burn-in test and controls power consumption of the heater to adjust levels of temperature of the devices under test, wherein the temperature sensor detects temperature of a temperature control block in which the heater and the temperature sensor are arranged and with which a cooling liquid is in contact while the devices under test are not in contact with the heater and the temperature sensor, and the temperature sensor is diagnosed to be normal or not based on a result of detection. | 12-18-2008 |
| 20090002010 | Active thermal control using a burn-in socket heating element - In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed. | 01-01-2009 |
| 20090002011 | INSPECTING METHOD AND STORAGE MEDIUM FOR STORING PROGRAM OF THE METHOD - An inspecting method includes registering a pre-obtained relationship between contact time of the probes with the target object having the predetermined temperature and tip positions of the probes which vary in accordance with the contact time. The method further includes inspecting the chips by estimating the tip positions of the probes based on the relationship and the contact time of the probes with the chips upon the inspection and then correcting the tip positions of the probes from previous tip positions based on the estimated values until the probes are stable without being extended or contracted during the inspection. | 01-01-2009 |
| 20090009203 | INSPECTION APPARATUS AND METHOD - There are provided an inspection apparatus and method that can locally perform sample temperature regulation, so that the sample drift can be suppressed. There are included a sample stage | 01-08-2009 |
| 20090009204 | Test socket - A test socket in accordance with one aspect of the present invention includes a socket body, a thermoelectric element and a heat transfer member. The socket body receives an object. The thermoelectric element is arranged in the socket body to emit heat and absorb heat in accordance with current directions. The heat transfer member is arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element. Thus, the object may be directly provided with a desired test temperature using the thermoelectric element so that the desired test temperature may be set rapidly and accurately. Further, the heat transfer member interposed between the object and the thermoelectric element may quickly dissipate the heat in the object. | 01-08-2009 |
| 20090015282 | ELECTRONICS TESTER WITH A SIGNAL DISTRIBUTION BOARD AND A WAFER CHUCK HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION - The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit. | 01-15-2009 |
| 20090015283 | INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING MECHANISM - A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card. | 01-15-2009 |
| 20090027073 | DEVICE MOUNTED APPARATUS, TEST HEAD, AND ELECTRONIC DEVICE TEST SYSTEM - A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first cover covering only the measurement device among the plurality of devices, and a second cover covering only the power device among the plurality of devices. The first cover and the second cover are electrically insulated from each other. | 01-29-2009 |
| 20090051381 | Electronic Device Testing Apparatus and Temperature Control Method in an Electronic Device Testing Apparatus - An electronic device testing apparatus | 02-26-2009 |
| 20090058446 | INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus for inspecting electric characteristics of a plurality of devices formed on a target object includes a vertical drive mechanism for lifting and lowering a movable mounting table and a control unit for controlling the vertical drive mechanism. The vertical drive mechanism includes an elevation shaft connected to the mounting table and a servo motor for driving the elevation shaft to lift and lower the mounting table. Further, the control unit has a servo driver which includes a position control part for controlling a position of the servo motor, a torque control part for controlling a torque of the servo motor as a probe card is expanded or contracted by a change in temperature and a switching part for switching the position control part and the torque control part. | 03-05-2009 |
| 20090079453 | AUTOMATED TEST EQUIPMENT WITH DIB MOUNTED THREE DIMENSIONAL TESTER ELECTRONICS BRICKS - Automated test equipment is provided which includes a test head having a tester electronics bricks mounted to a device interface board. In some embodiments, support circuitry is positioned adjacent the tester electronics bricks opposite the DIB. The support circuitry may include power circuitry and/or data bus circuitry, which may be coupled to separate sides, or the same side of the tester electronics brick. A heat transfer apparatus located between the DIB and the support circuitry may be provided for cooling the tester electronics bricks. A tester electronics brick may include multi-chip modules arranged so that the edges generally define interface sides of the tester electronics brick. These sides may include a DIB interface side mounted to the DIB, a data bus interface side, a power interface side, and a heat transfer interface side. Contacts may be located at the edges of the MCMs. | 03-26-2009 |
| 20090079454 | METHOD OF TESTING USING A TEMPORARY CHIP ATTACH CARRIER - A method of testing integrated circuit chips. The method includes: attaching integrated circuit chips to an interposer of a temporary carrier, the carrier comprising: a substrate, a first interconnects on a bottom surface and a second array of interconnects on a top surface of the substrate, corresponding first and second interconnects electrically connected by wires in the substrate; the interposer, first pads on a top surface and a second pads on a bottom surface of the interposer, corresponding first and second pads electrically connected by wires in the interposer, and the second pads in physical and electrical contact with corresponding second interconnects; and the interposer including an interposer substrate comprising a same material as a substrate of the integrated circuit chip; connecting interconnects of the first array of interconnects to a tester; and testing the one or more integrated circuit chips. | 03-26-2009 |
| 20090096475 | TEST DEVICE - A test device includes a movable mounting table having a temperature controlling mechanism therein; a probe card provided with a plurality of probes positioned above the mounting table; and a first temperature control unit for controlling the temperature controlling mechanism so that a target object on the mounting table can be heated to a predetermined temperature to test electrical characteristics of the target object. The mounting table is provided with a heater facing a plurality of probes protruding from the mounting table in the high-temperature test on the target object. | 04-16-2009 |
| 20090102499 | METHOD AND APPARATUS FOR WAFER LEVEL BURN-IN - A temperature regulation plate | 04-23-2009 |
| 20090115441 | PROBE CARD AND TEMPERATURE STABILIZER FOR TESTING SEMICONDUCTOR DEVICES - One aspect of the invention provides an apparatus that includes a probe card [ | 05-07-2009 |
| 20090146676 | Measuring module for rapid measurement of electrical, electronic and mechanical components at cryogenic temperatures and measuring device having such a module - Measuring module for the measurement of an object ( | 06-11-2009 |
| 20090153171 | Apparatus for testing objects under controlled conditions - An apparatus for testing objects includes a test board having electrical connection areas to connect to the objects, a chamber fixture located on the test board to form test chambers that are configured to individually receive the objects, a thermoelectric element provided to each test chamber to adjust the temperature of the object, and a temperature controller for individually controlling operations of the thermoelectric elements. | 06-18-2009 |
| 20090160472 | WAFER-LEVEL BURN-IN METHOD AND WAFER-LEVEL BURN-IN APPARATUS - Temperature control in wafer-level burn-in is performed such that a set temperature used for the temperature control is corrected using a correction value calculated from the generated heat density of a wafer ( | 06-25-2009 |
| 20090195264 | High temperature test system - A high temperature test system is adapted for testing a device under test (DUT) under a high temperature environment. The high temperature test system includes a preheating unit, a first moving unit, a testing unit, and a second moving unit. The preheating unit is adapted for preheating the DUT. The first moving unit is adapted for removing the preheated DUT from the preheating unit. The testing unit is adapted for placement of the DUT removed by the first moving unit, for testing the DUT, and for providing the high temperature environment to the DUT during testing. The second moving unit is adapted for removing the DUT that has passed testing from the testing unit. | 08-06-2009 |
| 20090230985 | BURN-IN SYSTEM WITH MEASUREMENT BLOCK ACCOMODATED IN COOLING BLOCK - A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces. | 09-17-2009 |
| 20090237102 | HEATING APPARATUS FOR SEMICONDUCTOR DEVICES - A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven. | 09-24-2009 |
| 20090261852 | Ducted Test Socket - A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a carrier and a base with opposing, mated cavities and holes. These cavities and holes channel airflow around the entire DUT body and out outlet ports. | 10-22-2009 |
| 20090267631 | Large Component Thermal Head Adapter - A thermal head adapter for testing a device under test is provided that can accommodate a large device and will improve the airflow through the thermal head to the device under test and out into the shroud. The thermal head adapter comprises a first section with a first perimeter and a second section with a second perimeter. The shroud is sealed onto an upper surface of first section, and the base of the second section attaches to a printed board. The perimeter of the first section is greater than the perimeter of the second section. The upper surface of the first section may comprise ridges that effectively form a moat-like structure to capture fallen condensation from the shroud walls. A drain may take the liquid within the boundary of the ridges to a desired location outside of the thermal head adapter. | 10-29-2009 |
| 20090315581 | CHUCK FOR SUPPORTING AND RETAINING A TEST SUBSTRATE AND A CALIBRATION SUBSTRATE - A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate. | 12-24-2009 |
| 20100007364 | Hot Testing of Semiconductor Devices - A testing apparatus for testing of integrated circuit devices at elevated temperatures comprises hot belt | 01-14-2010 |
| 20100013509 | PROBER AND SEMICONDUCTOR WAFER TESTING METHOD USING THE SAME - A prober for a semiconductor wafer test includes a stage, a probe card, and an adjuster The stage has a first region and a second region other than the first region The first region is covered by a wafer on which a plurality of electrode pads is provided. The probe card includes a plurality of probe pins to be in contact with the plurality of electrode pads. The adjuster is included in the stage and adjusts a temperature of the wafer and the second region. | 01-21-2010 |
| 20100052720 | APPARATUS FOR TESTING SEMICONDUCTOR DEVICES - A probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen. | 03-04-2010 |
| 20100066398 | TEMPERATURE CONTROL DEVICE AND TEMPERATURE CONTROL METHOD - Pressing an electronic device ( | 03-18-2010 |
| 20100066399 | MINIATURE FLUID-COOLED HEAT SINK WITH INTEGRAL HEATER - A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink comprising a first heat transfer portion in a first plane and a second heat transfer portion in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits, thus resulting in a three-dimensional cross-flow within the heat sink structure. | 03-18-2010 |
| 20100085071 | THERMOELECTRIC DEVICE AND METHOD - A system, device and method for electrically addressing an element include providing a thermoelectric layer in proximity with an area to be addressed and positioning a probe in proximity of the thermoelectric layer. Electrical activity is induced in the thermoelectric layer by applying heat from the probe. A response is caused in the area to be addressed. | 04-08-2010 |
| 20100109696 | ELECTRONICS TESTER WITH A SIGNAL DISTRIBUTION BOARD AND A WAFER CHUCK HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION - The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit. | 05-06-2010 |
| 20100134129 | MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE - A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface. | 06-03-2010 |
| 20100134130 | INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING MECHANISM - A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card. | 06-03-2010 |
| 20100156449 | PROBE CARD - An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element. | 06-24-2010 |
| 20100164525 | TEST SOCKET, TEST APPARATUS WITH TEST SOCKET - A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket. | 07-01-2010 |
| 20100201389 | INTEGRATED UNIT FOR ELECTRICAL/RELIABILITY TESTING WITH IMPROVED THERMAL CONTROL - In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket. | 08-12-2010 |
| 20100201390 | PROBE CARD, METHOD FOR MANUFACTURING PROBE CARD, AND PROBER APPARATUS - Embodiments of the present invention provide a probe card in which the positional shift of the tip of a probe can be compensated for in response to a change in the temperature, and a wafer test in a wide range of temperatures can be performed. More specifically, the probe card includes a substrate, a probe composed of a first metallic material having a first thermal expansion coefficient, a base of the probe being joined to the substrate, a tip of the probe coming into contact with a connection terminal of an electronic device, and a thermal compensation member composed of a second metallic material having a second thermal expansion coefficient that is higher than the first thermal expansion coefficient, a base of the thermal compensation member being fixed to the substrate, a tip of the thermal compensation member coming into contact with the probe at an intermediate portion between the base of the probe and the tip of the probe. | 08-12-2010 |
| 20100201391 | APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICES - A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost. | 08-12-2010 |
| 20100207653 | Apparatus for testing semiconductor device - An apparatus for testing an electrical property of a semiconductor device includes a substrate support unit, a tester head above the substrate support unit, the tester head including a base, a probe card connected to the base of the tester head, and a temperature control unit within the base of the tester head, the temperature control unit being configured to control temperature of the probe card by heat transfer with the probe card. | 08-19-2010 |
| 20100231250 | Pin Electronics Liquid Cooled Multi-module for High Performance, Low Cost Automated Test Equipment - In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module. | 09-16-2010 |
| 20100253379 | Method and Apparatus for Probing a Wafer - A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the wafer, but no less than the larger of the area of an optical collection area and an electrical probe assembly. The equal and opposing forces cause the wafer to conform to the shape of the contact element. Measurements, including electrical testing, optical probing and wafer characterization are performed on the wafer. | 10-07-2010 |
| 20100264949 | FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY - A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are removed. The flexure band can hold one or more temperature control devices against a peripheral edge of a stiffening frame in a probe card assembly, or the flexure band can itself be a temperature control device. The band can be made of a metal that can be selected to impart one or more of the following properties: low thermal conductivity, high specific heat, generates little to no appreciable contamination, and/or usable over a wide range of temperatures. A material can be added to the band as a full or partial coating that enhances or adds one or more of the above-mentioned possible properties of the metal band. | 10-21-2010 |
| 20100289514 | INSPECTION APPARATUS - An inspection apparatus is provided to perform an accurate temperature control, cut a noise wave, overcome contact failure, and improve inspection accuracy. The inspection apparatus includes a probe device having a contact for contacting with an electrode of an inspected object and having a built-in heater for correcting dislocation of the contact to the electrode caused by temperature difference between the probe device and the inspected object; a tester for testing probe device and supplying electric power to the heater; an electric power supply system, provided on the tester, for supplying electric power to the heater; and a temperature control unit for controlling electric power to the heater of the probe device through the electric power supply system, wherein the electric power supply system includes at least one open/close switch for switching on and off power supply to the heater. A connector including a male connector and a female connector provided on the other end are provided. A continuity-checking device checks to be able to supply electric power to the heater from the electric power supply system. | 11-18-2010 |
| 20100289515 | PROBE FOR A SOCKET, SOCKET FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC DEVICE - A socket for electrically connecting conductive patterns of a circuit board and electrodes of an integrated circuit, the socket includes a main body, a plurality of hollow probes that connect conductive patterns of the circuit board and electrodes of the integrated circuit, the plurality of hollow probes provided to the main body, and an outlet that discharges a refrigerating medium passing through each of the hollow probes, the outlet provided on a side of the main body. | 11-18-2010 |
