| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 257476000 |
In integrated structure
| 51 |
| 257483000 |
With means to prevent edge breakdown
| 32 |
| 257472000 |
To compound semiconductor
| 25 |
| 257475000 |
With doping profile to adjust barrier height
| 25 |
| 257485000 |
Specified materials
| 17 |
| 257474000 |
As active junction in bipolar transistor (e.g., Schottky collector) | 5 |
| 20090166795 | SCHOTTKY DIODE OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method includes forming a first conductive type buried layer on a semiconductor substrate, forming a second conductive type epi-layer on the semiconductor substrate using an epitaxial growth method such that the epi-layer surrounds the buried layer, forming a first conductive type plug from the surface of the semiconductor substrate to the buried layer, forming a first conductive type well, which is horizontally spaced from the first conductive type plug, from the surface of the semiconductor substrate to the buried layer, and forming a plurality of metal contacts as an anode and cathode of the schottky diode, respectively, by making electrical connection to the well and plug. | 07-02-2009 |
| 20100230774 | Diode Having High Breakdown Voltage and Low on-Resistance - A Schottky or PN diode is formed where a first cathode portion is an N epitaxial layer that is relatively lightly doped. An N+ buried layer is formed beneath the cathode for conducting the cathode current to a cathode contact. A more highly doped N-well is formed, as a second cathode portion, in the epitaxial layer so that the complete cathode comprises the N-well surrounded by the more lightly doped first cathode portion. An anode covers the upper areas of the first and second cathode portions so both portions conduct current when the diode is forward biased. When the diode is reverse biased, the depletion region in the central N-well will be relatively shallow but substantially planar so will have a relatively high breakdown voltage. The weak link for breakdown voltage will be the curved edge of the deeper depletion region in the lightly doped first cathode portion under the outer edges of the anode. Therefore, the N-well lowers the on-resistance without lowering the breakdown voltage. | 09-16-2010 |
| 20110248375 | Bipolar Transistor with an N-Type Base and Method of Production - A base contact connection, an emitter structure and a collector structure are arranged on an n-layer, which can be provided for additional npn transistors. The collector structure is arranged laterally to the emitter structure and at least one of the emitter and collector comprises a Schottky contact on a surface area of the n-layer. | 10-13-2011 |
| 20120068297 | HIGH VOLTAGE DEVICE HAVING SCHOTTKY DIODE - A high voltage device having a Schottky diode integrated with a MOS transistor includes a semiconductor substrate a Schottky diode formed on the semiconductor substrate, at least a first doped region having a first conductive type formed in the semiconductor substrate and under the Schottky diode, and a control gate covering a portion of the Schottky diode and the first doped region positioned on the semiconductor substrate. | 03-22-2012 |
| 20150091125 | SEMICONDUCTOR ARRAY HAVING TEMPERATURE-COMPENSATED BREAKDOWN VOLTAGE - A semiconductor array is described whose breakdown voltage has only a very low temperature coefficient or none at all and therefore there is little or no temperature-dependent voltage rise. The voltage limitation is achieved by a punch-through effect. | 04-02-2015 |
| 257481000 |
Avalanche diode (e.g., so-called "Zener" diode having breakdown voltage greater than 6 volts) | 3 |
| 20100237456 | SEMICONDUCTOR DEVICE AND METHOD FOR ITS MANUFACTURE - A semiconductor system having a trench MOS barrier Schottky diode, having an integrated substrate PN diode as a clamping element (TMBS-ub-PN), suitable in particular as a Zener diode having a breakdown voltage of approximately 20V for use in a vehicle generator system, the TMBS-sub-PN being made up of a combination of Schottky diode, MOS structure, and substrate PN diode, and the breakdown voltage of substrate PN diode BV_pn being lower than the breakdown voltage of Schottky diode BV_schottky and the breakdown voltage of MOS structure BV_mos. | 09-23-2010 |
| 20130207222 | SUPER-JUNCTION SCHOTTKY OXIDE PIN DIODE HAVING THIN P-TYPE LAYERS UNDER THE SCHOTTKY CONTACT - A semiconductor chip, which includes an n-type substrate, over which an n-type epitaxial layer having trenches introduced into the epitaxial layer and filled with p-type semiconductor is situated, the trenches each having a heavily doped p-type region on their upper side, the n | 08-15-2013 |
| 20150364613 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device and a method for forming the same. The device has a substrate including one and another surfaces. A first semiconductor region of a first conductivity type is formed in the substrate. A second conductivity type, second semiconductor region is provided in a first surface layer, that includes the one surface, of the substrate. A first electrode is in contact with the second semiconductor region to form a junction therebetween. A first conductivity type, third semiconductor region is provided in a second surface layer, that includes the another surface, of the substrate. The third semiconductor region has a higher impurity concentration than the first semiconductor region. A fourth semiconductor region of the second conductivity type is provided in the first semiconductor region at a location deeper than the third semiconductor region from the another surface. A second electrode is in contact with the third semiconductor region. | 12-17-2015 |
| 257480000 |
In voltage variable capacitance diode | 1 |
| 20100059850 | VARACTOR DIODE WITH DOPED VOLTAGE BLOCKING LAYER - A varactor diode includes a contact layer having a first conductivity type, a voltage blocking layer having the first conductivity and a first net doping concentration on the contact layer, a blocking junction on the voltage blocking layer, and a plurality of discrete doped regions in the voltage blocking layer and spaced apart from the carrier injection junction. The plurality of discrete doped regions have the first conductivity type and a second net doping concentration that is higher than the first net doping concentration, and the plurality of discrete doped regions are configured to modulate the capacitance of the varactor diode as a depletion region of the varactor diode expands in response to a reverse bias voltage applied to the blocking junction. Related methods of forming a varactor diode are also disclosed. | 03-11-2010 |
| Entries |
| Document | Title | Date |
|---|
| 20080211052 | FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME - A method for fabricating a field effect transistor includes: forming an insulating film provided on a semiconductor layer, the insulating film having an opening via which a surface of the semiconductor layer is exposed and including silicon oxide; forming a Schottky electrode on the insulating film and in the opening, the Schottky electrode having an overhang portion and having a first contact layer that is provided in a region contacting the insulating film and contains oxygen, and a second contact layer that is provided on the first contact layer and contains a smaller content of oxygen than that of the first contact layer; and removing the insulating film by a solution including hydrofluoric acid. | 09-04-2008 |
| 20090050999 | Apparatus for storing electrical energy - An apparatus to store electrical energy is provided. The apparatus includes a first magnetic section, a second magnetic section, and a semiconductor section configured between the first magnetic section and the second magnetic section, wherein the junction between the semiconductor section and the first and second magnetic section forms a diode barrier preventing current flow to store electrical energy. | 02-26-2009 |
| 20090102007 | Lateral Power Diode with Self-Biasing Electrode - A semiconductor diode includes a drift region of a first conductivity type and an anode region of a second conductivity type in the drift region such that the anode region and the drift region form a pn junction therebetween. A first highly doped silicon region of the first conductivity type extends in the drift region, and is laterally spaced from the anode region such that upon biasing the semiconductor power diode in a conducting state, a current flows laterally between the anode region and the first highly doped silicon region through the drift region. A plurality of trenches extends into the drift region perpendicular to the current flow. Each trench includes a dielectric layer lining at least a portion of the trench sidewalls and also includes at least one conductive. | 04-23-2009 |
| 20090160008 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device that includes an n-type semiconductor substrate and an upper electrode formed on an upper face of the semiconductor substrate and a method of manufacturing the semiconductor device are provided. A p-type semiconductor region is repeatedly formed in the semiconductor substrate in at least one direction parallel to the substrate plane so as to be exposed on an upper face of the semiconductor substrate. The upper electrode includes a metal electrode portion; and a semiconductor electrode portion made of a semiconductor material whose band gap is narrower than that of the semiconductor substrate. The semiconductor electrode portion is provided on each p-type semiconductor region exposed on the upper face of the semiconductor substrate. The metal electrode portion is in Schottky contact with an n-type semiconductor region exposed on the upper face of the semiconductor substrate, and is in ohmic contact with the semiconductor electrode portion. | 06-25-2009 |
| 20090243026 | Schottky Barrier Diode and Method for Using the Same - An intermediate metal film is formed between a Schottky electrode and a pad electrode. A Schottky barrier height between the intermediate metal film and a silicon carbide epitaxial film is equivalent to or higher than a Schottky barrier height between the Schottky electrode and the silicon carbide epitaxial film. By this configuration, an excess current and a leak current through a pin-hole can be suppressed even in the case in which a Schottky barrier height between the pad electrode and the silicon carbide epitaxial film is less than the Schottky barrier height between the Schottky electrode and the silicon carbide epitaxial film. | 10-01-2009 |
| 20090309181 | TRENCH SCHOTTKY WITH MULTIPLE EPI STRUCTURE - A trench Schottky barrier rectifier includes an cathode electrode at a face of a semiconductor substrate and an multiple epitaxial structure in drift region which in combination provide high blocking voltage capability with low reverse-biased leakage current and low forward voltage. The multiple structure of the drift region contains a concentration of first conductivity dopants therein which comprises two or three different uniform value from a Schottky rectifying junction formed between the anode electrode and the drift region. The thickness of the insulating region (e.g., SiO2) in the MOS-filled trenches is greater than 1000 Å to simultaneously inhibit field crowing and increase the breakdown voltage of the device. The multiple epi structure is preferably formed by epitaxial growth from the cathode region and doped in-situ. | 12-17-2009 |
| 20100155876 | Junction barrier Schottky (JBS) with floating islands - A Schottky diode includes a Schottky barrier and a plurality of dopant regions disposed near the Schottky barrier as floating islands to function as PN junctions for preventing a leakage current generated from a reverse voltage. At least a trench opened in a semiconductor substrate with a Schottky barrier material disposed therein constitutes the Schottky barrier. The Schottky barrier material may also be disposed on sidewalls of the trench for constituting the Schottky barrier. The trench may be filled with the Schottky barrier material composed of Ti/TiN or a tungsten metal disposed therein for constituting the Schottky barrier. The trench is opened in a N-type semiconductor substrate and the dopant regions includes P-doped regions disposed under the trench constitute the floating islands. The P-doped floating islands may be formed as vertical arrays under the bottom of the trench. | 06-24-2010 |
| 20100200945 | Schottky diode and method of fabricating the same - A schottky diode may include a schottky junction including a well formed in a semiconductor substrate and a first electrode contacting the first well. The well may have a first conductivity type. A first ohmic junction may include a first junction region formed in the well and a second electrode contacting the first junction region. The first junction region may have a higher concentration of the first conductivity type than the well. A first device isolation region may be formed in the semiconductor substrate separating the schottky junction and the first ohmic junction. A well guard having a second conductivity type opposite to the first conductivity type may be formed in the well. At least a portion of the well guard may be formed under a portion of the schottky junction. | 08-12-2010 |
| 20100224952 | SCHOTTKY BARRIER DIODE AND METHOD OF PRODUCING THE SAME - A Schottky barrier diode includes an epitaxial growth layer disposed on a substrate and having a mesa portion, and a Schottky electrode disposed on the mesa portion, wherein a distance between an edge of the Schottky electrode and a top surface edge of the mesa portion is 2 μm or less. Since the distance x is 2 μm or less, a leakage current is significantly decreased, a breakdown voltage is improved, and a Schottky barrier diode having excellent reverse breakdown voltage characteristics is provide. | 09-09-2010 |
| 20100258897 | Trench junction barrier controlled Schottky - A method for manufacturing a Schottky diode comprising steps of 1) providing a region with a dopant of a second conductivity type opposite to a first conductivity type to form a top doped region in a semiconductor substrate of said first conductivity type; 2) providing a trench through the top doped region to a predetermined depth and providing a dopant of the second conductivity type to form a bottom dopant region of the second conductivity type; and 3) lining a Schottky barrier metal layer on a sidewall of the trench at least extending from a bottom of the top doped region to a top of the bottom doped region. | 10-14-2010 |
| 20100327394 | EM RECTIFYING ANTENNA SUITABLE FOR USE IN CONJUCTION WITH A NATURAL BREAKDOWN DEVICE - A rectenna capable of power conversion from electromagnetic (EM) waves of high frequencies is provided. In one embodiment, a rectenna element generates currents from two sources—based upon the power of the incident EM wave and from an n-type semiconductor, or another electron source attached to a maximum voltage point of an antenna element. The combined current from both sources increases the power output of the antenna, thereby increasing the detection sensitivity of the antenna of a low power signal. Full wave rectification is achieved using a novel diode connected to a gap in the antenna element of an rectenna element. The diode is conductive at a zero bias voltage, and rectifies the antenna signal generated by the desired EM wave received by antenna. Further, the diode may provide a fixed output voltage regardless of the input signal level. The rectenna element of the present invention may be used as a building block to create large rectenna arrays. | 12-30-2010 |
| 20110037139 | SCHOTTKY BARRIER DIODE (SBD) AND ITS OFF-SHOOT MERGED PN/SCHOTTKY DIODE OR JUNCTION BARRIER SCHOTTKY (JBS) DIODE - A merged PN/Schottky diode is provided having a substrate of a first conductivity type and a grid of doped wells of the second conductivity type embedded in the substrate. A Schottky barrier metal layer makes a Schottky barrier contact with the surface of the substrate above the grid. Selected embedded wells in the grid may make electrical contact to the Schottky bather metal layer, while most embedded wells do not. The diode forward voltage drop is reduced for the same diode area with reverse blocking benefits similar to a conventional JBS structure. | 02-17-2011 |
| 20110095391 | SCHOTTKY DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A Schottky diode device is provided, including a p-type semiconductor structure. An n drift region is disposed over the p-type semiconductor structure, wherein the n drift region comprises first and second n-type doping regions having different n-type doping concentrations, and the second n-type doping region is formed with a dopant concentration greater than that in the first n-type doping region. A plurality of isolation structures is disposed in the second n-type doping region of the n drift region, defining an anode region and a cathode region. A third n-type doping region is disposed in the second n-type doping region exposed by the cathode region. An anode electrode is disposed over the first n-type doping region in the anode region. A cathode electrode is disposed over the third n-type doping region in the cathode region. | 04-28-2011 |
| 20110101485 | Detector for Plastic Optical Fiber Networks - An apparatus comprises a substrate having a type of conductivity, an intrinsic region above the substrate, and a metal layer on a portion of the surface of the intrinsic region. The intrinsic region has a surface. The metal layer may have a thickness that is configured to allow a plurality of photons to pass through the metal layer into the intrinsic region and form a rectifying contact with the intrinsic region. | 05-05-2011 |
| 20110233711 | METHOD FOR LOCAL CONTACTING AND LOCAL DOPING OF A SEMICONDUCTOR LAYER - A method for local contacting and local doping of a semiconductor layer including the following process steps: A) Generation of a layer structure on the semiconductor layer through i) application of at least one intermediate layer on one side of the semiconductor layer, and ii) application of at least one metal layer onto the intermediate layer last applied in step i), wherein the metal layer at least partly covers the last applied intermediate layer, B) Local heating of the layer structure in such a manner that in a local region a short-time melt-mixture of at least partial regions of at least the layers: metal layer, intermediate layer and semiconductor layer, forms. After solidification of the melt-mixture, a contacting is created between metal layer and semiconductor layer. It is essential that in step A) i) at least one intermediate layer designed as dopant layer is applied, which contains a dopant wherein the dopant has a greater solubility in the semiconductor layer than the metal of the metal layer. | 09-29-2011 |
| 20110233712 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - According to a method for fabricating a semiconductor device, a first semiconductor layer made of a first nitride semiconductor is formed over a substrate. Thereafter, a mask film covering part of the upper surface of the first semiconductor layer is selectively formed on the first semiconductor layer. A multilayer film, in which second and third nitride semiconductors having different band gaps are stacked, is selectively formed on the first semiconductor layer with the mask film used as a formation mask. On the multilayer film, an ohmic electrode is formed. | 09-29-2011 |
| 20120018836 | SCHOTTKY BARRIER DIODE - A Schottky barrier diode includes a semiconductor layer having a plurality of trenches formed by digging in from a top surface and having mesa portions formed between adjacent trenches, and a Schottky metal formed to contact the top surface of the semiconductor layer including inner surfaces of the trenches. | 01-26-2012 |
| 20120098082 | SCHOTTKY RECTIFIER - A semiconductor rectifier includes a semiconductor substrate having a first type of conductivity. A first layer, which is formed on the substrate, has the first type of conductivity and is more lightly doped than the substrate. A second layer having a second type of conductivity is formed on the substrate and a metal layer is disposed over the second layer. The second layer is lightly doped so that a Schottky contact is formed between the metal layer and the second layer. A first electrode is formed over the metal layer and a second electrode is formed on a backside of the substrate. | 04-26-2012 |
| 20120133016 | LATERAL POWER DIODE WITH SELF-BIASING ELECTRODE - A schottky diode includes a drift region of a first conductivity type and a lightly doped silicon region of the first conductivity type in the drift region. A conductor layer is over and in contact with the lightly doped silicon region to form a schottky contact with the lightly doped silicon region. A highly doped silicon region of the first conductivity type is in the drift region and is laterally spaced from the lightly doped silicon region such that upon biasing the schottky diode in a conducting state, a current flows laterally between the lightly doped silicon region and the highly doped silicon region through the drift region. A plurality of trenches extend into the drift region perpendicular to the current flow. Each trench has a dielectric layer lining at least a portion of the trench sidewalls and at least one conductive electrode. | 05-31-2012 |
| 20120139079 | DIODE - A diode has a semiconductor layer and cathode and anode electrodes on a surface of the semiconductor layer. The semiconductor layer has cathode and anode regions respectively contacting the cathode and anode electrodes. The anode region has a first diffusion region having high surface concentration, a second diffusion region having intermediate surface concentration, and a third diffusion region having low surface concentration. The first diffusion region is covered with the second and third diffusion regions. The second diffusion region has a first side surface facing the cathode region, a second side surface opposite to the cathode region, and a bottom surface extending between the first and second side surfaces. The third diffusion region covers at least one of the first corner part connecting the first side surface with the bottom surface and the second corner part connecting the second side surface with the bottom surface. | 06-07-2012 |
| 20120168893 | Mesa edge shielding trench Schottky rectifier and method of manufacture thereof - A mesa edge shielding trench Schottky rectifier includes a semiconductor substrate; an epitaxial layer grown on the first surface of the semiconductor substrate; a plurality of trenches spaced from each other and extended into the epitaxial layer, wherein an epitaxial region between two adjacent trenches forms the silicon mesa; a polysilicon region, having a T-shape, is separated from an inner wall of each of the trenches and a top surface of the epitaxial layer by an oxide layer, wherein a width of the top surface of the polysilicon region is bigger than an open size of each of the trenches; an anode electrode, deposited on an entire structure, forming an ohmic contact on the top surface of the polysilicon region and a Schottky contact on an exposed surface of the epitaxial layer; and a cathode electrode, deposited on the second surface of the semiconductor substrate, forming an ohmic contact thereon. | 07-05-2012 |
| 20120181652 | SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING SAME - A semiconductor system having a trench MOS barrier Schottky diode is described, including an n-type epitaxial layer, in which at least two etched trenches are located in a two-dimensional manner of presentation on an n | 07-19-2012 |
| 20120199936 | SCHOTTKY DIODE SWITCH AND MEMORY UNITS CONTAINING THE SAME - A switching element that includes a first semiconductor layer, the first semiconductor layer having a first portion and a second portion; a second semiconductor layer, the second semiconductor layer having a first portion and a second portion; an insulating layer disposed between the first semiconductor layer and the second semiconductor layer; a first metal contact in contact with the first portion of the first semiconductor layer forming a first junction and in contact with the first portion of the second semiconductor layer forming a second junction; a second metal contact in contact with the second portion of the first semiconductor layer forming a third junction and in contact with the second portion of the second semiconductor layer forming a fourth junction, wherein the first junction and the fourth junction are Schottky contacts, and the second junction and the third junction are ohmic contacts. | 08-09-2012 |
| 20120199937 | INTEGRATED CIRCUIT - An integrated circuit including a Schottky diode, and a method of making the same. The diode includes an active region bordered by an isolation region in a semiconductor substrate of the integrated circuits, a first electrode having a metal contact provided on a surface of the active region, and a second electrode having a silicide contact also provided on the surface of the active region. | 08-09-2012 |
| 20120205770 | SCHOTTKY DIODE WITH HIGH ANTISTATIC CAPABILITY - A Schottky diode with high antistatic capability has an N− type doped drift layer formed on an N+ type doped layer. The N− type doped drift layer has a surface formed with a protection ring. Inside the protection ring is a P-type doped area. The N− type doped drift layer surface is further formed with an oxide layer and a metal layer. The contact region between the metal layer and the N− type doped drift layer and the P-type doped area forms a Schottky contact. The P-type doped area has a low-concentration lower layer and a high-concentration upper layer, so that the surface ion concentration is high in the P-type doped area. The Schottky diode thus has such advantages of lowered forward voltage drop and high antistatic capability. | 08-16-2012 |
| 20120205771 | SCHOTTKY DIODE WITH LOW FORWARD VOLTAGE DROP - A Schottky diode with a low forward voltage drop has an N− type doped drift layer formed on an N+ type doped layer. The N− type doped drift layer has a first surface with a protection ring inside which is a P-type doped area. The N− type doped drift layer surface is further formed with an oxide layer and a metal layer. The contact region between the metal layer and the N− type doped drift layer and the P-type doped area forms a Schottky barrier. The height of the Schottky barrier is lower than the surface of the N− type doped drift layer, thereby reducing the thickness of the N− type doped drift layer under the Schottky barrier. This configuration reduces the forward voltage drop of the Schottky barrier. | 08-16-2012 |
| 20120205772 | TRENCH SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF - A trench Schottky diode and a manufacturing method thereof are provided. A plurality of trenches are formed in Asemiconductor substrate. A plurality of doped regions are formed in the semiconductor substrate and under some of the trenches. A gate oxide layer is formed on a surface of the semiconductor substrate and the surfaces of the trenches. A polysilicon structure is formed on the gate oxide layer. Then, the polysilicon structure is etched, so that the gate oxide layer within the trenches is covered by the polysilicon structure. Then, a mask layer is formed to cover the polysilicon structure within a part of the trenches and a part of the gate oxide layer, and the semiconductor substrate uncovered by the mask layer is exposed. Afterwards, a metal sputtering layer is formed to cover a part of the surface of the semiconductor substrate. | 08-16-2012 |
| 20120241896 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type, a plurality of second semiconductor regions of a second conductivity type, a third semiconductor region of the second conductivity type and a first electrode. The second regions are provided separately on a first major surface side of the first layer. The third region is provided on the first major surface side of the first layer so as to surround the second regions. The first electrode is provided on the first layer and the second regions. The first layer has a first portion and a second portion. The second portion has a lower resistivity than the first portion. The second portion is provided between the second regions and between the first portion and the first major surface and is provided outside the third region and between the first portion and the first major surface. | 09-27-2012 |
| 20120256288 | Schottky Diode and Method for Making It - A Schottky diode and a method for making one. The method includes the following steps: providing a semiconductor base body, preferably in the form of a wafer, having a high dopant concentration and having a first main surface, which forms the first electrical contact surface of the Schottky diode; epitaxially depositing a semiconductor layer having the same conductivity and a lower dopant concentration on that surface of the semiconductor base body which lies opposite the first main surface; arranging a first metal layer on the semiconductor layer with the formation of a Schottky contact between the first metal layer and the semiconductor layer; connecting a planar contact body to the first metal layer by means of a connecting means; forming at least one individual Schottky diode; and arranging a passivation layer in the edge region of the at least one Schottky diode. | 10-11-2012 |
| 20120267748 | SEMICONDUCTOR DEVICE INCLUDING SCHOTTKY BARRIER JUNCTION AND PN JUNCTION - A semiconductor device includes a first conductivity-type semiconductor stack including the recesses which extend from a first principal surface toward a second principal surface and have bottoms not reaching the second principal surface, the second conductivity-type anode regions which are embedded at a distance from one another in the first principal surface, each of which has a part of an outer edge region exposed to a side surface of the corresponding recess, an anode electrode which is provided on the first principal surface of the semiconductor stack to form a Schottky barrier junction with the semiconductor stack in a region where the plurality of anode regions are not formed and form ohmic junctions with the anode regions; and a cathode electrode provided on the second principal surface of the semiconductor stack. | 10-25-2012 |
| 20120273916 | Superjunction Structures for Power Devices and Methods of Manufacture - A power device includes a semiconductor region which in turn includes a plurality of alternately arranged pillars of first and second conductivity type. Each of the plurality of pillars of second conductivity type further includes a plurality of implant regions of the second conductivity type arranged on top of one another along the depth of pillars of second conductivity type, and a trench portion filled with semiconductor material of the second conductivity type directly above the plurality of implant regions of second conductivity type. | 11-01-2012 |
| 20120292732 | SEMICONDUCTOR DIODE AND METHOD OF MANUFACTURE | 11-22-2012 |
| 20120306043 | JUNCTION BARRIER SCHOTTKY (JBS) WITH FLOATING ISLANDS - A Schottky diode includes a Schottky barrier and a plurality of dopant regions disposed near the Schottky barrier as floating islands to function as PN junctions for preventing a leakage current generated from a reverse voltage. At least a trench opened in a semiconductor substrate with a Schottky barrier material disposed therein constitutes the Schottky barrier. The Schottky barrier material may also be disposed on sidewalls of the trench for constituting the Schottky barrier. The trench may be filled with the Schottky barrier material composed of Ti/TiN or a tungsten metal disposed therein for constituting the Schottky barrier. The trench is opened in a N-type semiconductor substrate and the dopant regions includes P-doped regions disposed under the trench constitute the floating islands. The P-doped floating islands may be formed as vertical arrays under the bottom of the trench. | 12-06-2012 |
| 20120313212 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor region of a first conductivity type and formed of a material having a band gap wider than that of silicon; a first layer selectively disposed on a surface of and forming a first junction with the first semiconductor region; a second layer selectively disposed on the first semiconductor region and forming a second junction with the first semiconductor region; a first diode formed by a region including the first junction; a second diode formed by a region including the second junction; and a fourth semiconductor region of a second conductivity type and disposed in the first semiconductor region, between and contacting the first and second junctions. A recess and elevated portion are disposed on the first semiconductor region. The first and the second junctions are formed at different depths. The second diode has a lower built-in potential than the first diode. | 12-13-2012 |
| 20130161779 | SUPER TRENCH SCHOTTKY BARRIER SCHOTTKY DIODE - A Schottky diode includes an n | 06-27-2013 |
| 20130181319 | Trench Schottky Barrier Diode and Manufacturing Method Thereof - The present invention discloses a trench Schottky barrier diode (SBD) and a manufacturing method thereof. The trench SBD includes: an epitaxial layer, formed on a substrate; multiple mesas, defined by multiple trenches; a field plate, formed on the epitaxial layer and filled in the multiple trenches, wherein a Schottky contact is formed between the field plate and top surfaces of the mesas; a termination region, formed outside the multiple mesas and electrically connected to the field plate; a field isolation layer, formed on the upper surface and located outside the termination region; and at least one mitigation electrode, formed below the upper surface outside the termination region, and is electrically connected to the field plate through the field isolation layer, wherein the mitigation electrode and the termination region are separated by part of a dielectric layer and part of the epitaxial layer. | 07-18-2013 |
| 20130270668 | TRENCHED SEMICONDUCTOR STRUCTURE - A trenched semiconductor structure comprises a semiconductor substrate, an epitaxial layer, an ion implantation layer, a termination region dielectric layer, an active region dielectric layer, and a first polysilicon layer. The epitaxial layer doped with impurities of a first conductive type is formed on the semiconductor substrate. A plurality of active region trenches and a termination region trench are formed in the epitaxial layer. The ion implantation layer is formed in the active region trenches by doping impurities of a second conductive type. The termination region dielectric layer covers the termination region trench. The active region dielectric layer covers the ion implantation region. The first polysilicon layer covers the active region dielectric layer and fills the active region trenches. The depth of the termination region trench is greater than that of the active region trenches and close to that of the depletion region under reverse breakdown. | 10-17-2013 |
| 20130292790 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a semiconductor layer and a Schottky electrode, a Schottky junction being formed between the semiconductor layer and the Schottky electrode. The Schottky electrode includes a metal part containing a metal, a Schottky junction being formed between the semiconductor layer and the metal part; and a nitride part around the metal part, the nitride part containing a nitride of the metal, and a Schottky junction being formed between the semiconductor layer and the nitride part. | 11-07-2013 |
| 20130313676 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A method of manufacturing a semiconductor device is disclosed. The method includes forming a first trench and a second trench in an n-type substrate surface, the first trenches being spaced apart from each other, the second trench surrounding the first trenches, the second trench being wider than the first trench. The method also includes forming a gate oxide film on the inner surfaces of the first and second trenches, and depositing an electrically conductive material to the thickness a half or more as large as the first trench width. The method further includes removing the electrically conductive material using the gate oxide film as a stopper layer, forming an insulator film thicker than the gate oxide film, and polishing the insulator film by CMP for exposing the n-type substrate and the electrically conductive material in the first trench. | 11-28-2013 |
| 20130320482 | High-Voltage Monolithic Schottky Device Structure - A semiconductor device includes a pillar formed on a substrate of the same conductivity type. The pillar has a vertical thickness that extends from a top surface down to the substrate. The pillar extends in first and second lateral directions in a loop shape. First and second dielectric regions are disposed on opposite lateral sides of the pillar, respectively. First and second conductive field plates are respectively disposed in the first and second dielectric regions. A metal layer is disposed on the top surface of the pillar, the metal layer forming a Schottky diode with respect to the pillar. When the substrate is raised to a high-voltage potential with respect to both the metal layer and the first and second field plates, the first and second field plates functioning capacitively to deplete the pillar of charge, thereby supporting the high-voltage potential along the vertical thickness of the pillar. | 12-05-2013 |
| 20130334647 | SEMICONDUCTOR DEVICE - A semiconductor device has a gate electrode including a leg part and a canopy part. A barrier layer is formed on a bottom face of the leg part of the gate electrode. In addition, on the lower surface of the barrier layer, a Schottky metal layer with an electrode width wider than the electrode width of the barrier layer is formed to have a Schottky junction with a semiconductor layer. | 12-19-2013 |
| 20140001593 | Semiconductor Arrangement Having a Schottky Diode | 01-02-2014 |
| 20140027877 | SEMICONDUCTOR STRUCTURE FOR ANTENNA SWITCHING CIRCUIT AND MANUFACTURING METHOD THEREOF - A manufacturing method for antenna switching circuit includes the following steps of: providing a GaAs wafer, which includes a capping layer; disposing an isolation layer to the GaAs wafer for forming a device area; and disposing a gate metal on the capping layer within the device area, wherein an interface between the gate metal and the capping layer forms a Schottky contact, and the Schottky contact is parallel connected with an impedance. The present invention also discloses a semiconductor structure for antenna switching circuit. | 01-30-2014 |
| 20140048901 | RECTIFIER OF ALTERNATING-CURRENT GENERATOR FOR VEHICLE - In a rectifier device ( | 02-20-2014 |
| 20140117487 | SCHOTTKY BARRIER DIODE - A Schottky barrier diode includes a semiconductor layer having a plurality of trenches formed by digging in from a top surface and having mesa portions formed between adjacent trenches, and a Schottky metal formed to contact the top surface of the semiconductor layer including inner surfaces of the trenches. | 05-01-2014 |
| 20140151841 | SEMICONDUCTOR DEVICES HAVING A POSITIVE-BEVEL TERMINATION OR A NEGATIVE-BEVEL TERMINATION AND THEIR MANUFACTURE - Disclosed herein are techniques of manufacturing semiconductor devices having a positive-bevel termination and/or a negative-bevel termination. In a particular example, techniques are disclosed for manufacture of a chip-size SiC device having an orthogonal positive-bevel termination used for the reverse blocking junction. The edge termination may be formed, for example, by cutting across a SiC wafer with a V-shaped dicing tool or blade. The cut may be performed by any suitable dicing tool. The cut may be across a p-n junction for forming positive-bevel termination. Subsequently, a surface of the termination may be etched for removing damage caused by the cutting process. | 06-05-2014 |
| 20140167201 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first-conductivity-type semiconductor substrate, a first first-conductivity-type semiconductor layer, a second first-conductivity-type semiconductor layer, a second-conductivity-type bottom layer, a | 06-19-2014 |
| 20140203393 | SEMICONDUCTOR DEVICE - A semiconductor device having high breakdown voltage and high reliability without forming an embedded injection layer with high position accuracy. The semiconductor device includes a base as an active area of a second conductivity type formed on a surface layer of a semiconductor layer of a first conductivity type to constitute a semiconductor element; guard rings as a plurality of first impurity regions of the second conductivity type formed on the surface layer of the semiconductor layer spaced apart from each other to respectively surround the base in plan view; and an embedded injection layer as a second impurity region of the second conductivity type embedded in the surface layer of the semiconductor layer to connect at least two bottom portions of the plurality of guard rings. | 07-24-2014 |
| 20140264713 | GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF - Embodiments of a gate contact for a semiconductor device and methods of fabrication thereof are disclosed. In one embodiment, a semiconductor device includes a semiconductor structure and a dielectric layer on a surface of the semiconductor structure, where the dielectric layer has an opening that exposes an area of the semiconductor structure. A gate contact for the semiconductor device is formed on the exposed area of the semiconductor structure through the opening in the dielectric layer. The gate contact includes a proximal end on a portion of the exposed area of the semiconductor structure, a distal end opposite the proximal end, and sidewalls that each extend between the proximal end and the distal end of the gate contact. For each sidewall of the gate contact, an air region separates the sidewall and the distal end of the gate contact from the dielectric layer. | 09-18-2014 |
| 20140327103 | Semiconductor Device with an Electrode Buried in a Cavity - A semiconductor device with a buried electrode is manufactured by forming a cavity within a semiconductor substrate, forming an active device region in an epitaxial layer disposed on the semiconductor substrate and forming the buried electrode below the active device region in the cavity. The buried electrode is formed from an electrically conductive material different than the material of the semiconductor substrate. | 11-06-2014 |
| 20140361398 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device includes: a first conductive type semiconductor device; a first conductive type drift region formed by epitaxial growth on the semiconductor substrate; a plurality of first conductive type vertical implantation regions formed by multistage ion implantation in the drift region, the vertical implantation regions having a prescribed vertical implantation width and a prescribed drift region width; an anode electrode disposed on the front surface of the drift region opposite to the semiconductor substrate, the anode electrode being in Schottky contact with the drift region and in ohmic contact with the first conductive type vertical implantation regions; and a cathode electrode disposed on the rear surface of the semiconductor substrate opposite to the drift region, the cathode electrode being in ohmic contact with the semiconductor substrate. | 12-11-2014 |
| 20150035111 | SEMICONDUCTOR DEVICE - A semiconductor device includes first and second electrodes. First semiconductor regions of a first conductivity type are positioned between the first electrode and the second electrode and contact the first electrode. These semiconductor regions are arranged along a first direction. A second semiconductor region of the first conductivity type also contacts the first electrode and is disposed around the plurality of first semiconductor regions. The second semiconductor region has a dopant concentration that is higher than the first semiconductor regions. A semiconductor layer of a second conductivity type has portions that are between the first semiconductor regions and the second semiconductor region. These portions are in Schottky contact with the first electrode. | 02-05-2015 |
| 20150054115 | TRENCH SCHOTTKY RECTIFIER DEVICE AND METHOD FOR MANUFACTURING THE SAME - A trench Schottky rectifier device includes a substrate having a first conductivity type, a plurality of trenches formed in the substrate, and an insulating layer formed on sidewalls of the trenches. The trenches are filled with conductive structure. There is an electrode overlying the conductive structure and the substrate, and thus a Schottky contact forms between the electrode and the substrate. A plurality of embedded doped regions having a second conductivity type are formed in the substrate and located under the trenches. Each doped region and the substrate form a PN junction to pinch off current flowing toward the Schottky contact so as to suppress current leakage. | 02-26-2015 |
| 20150123235 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a substrate, a counter-doping region, and a Schottky barrier diode (SBD) in which a breakdown voltage is improved by using counter doping, and a manufacturing method thereof. A breakdown voltage may be improved by lowering a concentration of impurity on the region and enhancing the characteristics of the semiconductor device including the SBD. | 05-07-2015 |
| 20150372153 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first electrode, a second electrode, a first semiconductor region that is formed between the first electrode and the second electrode and is in contact with the first electrode, a second semiconductor region that is formed between the first semiconductor region and the second electrode, a contact region that is formed between the second semiconductor region and the second electrode and is in contact with the second semiconductor region and the second electrode, a plurality of third semiconductor regions that are formed between the second electrode and the first semiconductor region and are in contact with the second electrode, and a wiring that is in contact with the second electrode, a portion of the wiring bonded to the second electrode being positioned above the third semiconductor region and not positioned above the contact region. | 12-24-2015 |
| 20150380570 | JUNCTION BARRIER SCHOTTKY DIODE AND METHOD FOR MANUFACTURING THE SAME - A junction barrier Schottky diode is formed by shifting second semiconductor regions of a second conductivity type in a staggered shape in a first semiconductor region of a first conductivity type so that pn junction regions are formed at predetermined distances between the second semiconductor regions and the first semiconductor region. A third semiconductor region of the first conductivity type is formed between the second semiconductor regions in order to form a Schottky junction region. An electrode is formed on the second and third semiconductor regions. The second semiconductor regions arranged at equal distances in an X direction are formed in a plurality of columns in a Y direction. An amount of shift between adjacent columns in the X direction is set such that a Y-direct ion distance between the second semiconductor regions in the different columns is larger than an X-direction distance between the second semiconductor regions in each column. | 12-31-2015 |
| 20160043237 | Semiconductor Device with Different Contact Regions - A semiconductor device includes at least one first contact region of a vertical device between a semiconductor substrate and an electrically conductive structure arranged adjacent to the semiconductor substrate, and at least one second contact region of the vertical device between the semiconductor substrate of the semiconductor device and the electrically conductive structure. The at least one first contact region is arranged adjacent to the at least one second contact region. The electrically conductive structure includes a first electrically conductive material in contact with the semiconductor substrate in an area of the at least one first contact region and a second electrically conductive material in contact with the semiconductor substrate in an area of the at least one second contact region, so that a first contact characteristic within the at least one first contact region differs from a second contact characteristic within the at least one second contact region. | 02-11-2016 |
