| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 228164000 | Prior to bonding | 78 |
| 20080237308 | FORGE WELDING METHOD - A method of joining tubulars includes the step of joining the tubulars by forge welding. The tubular ends that are to be welded together may be shaped into a sloping configuration, such that when the tubular ends are heated during the forge welding process the heated tubular ends deform as a result of thermal expansion into a substantially longitudinally oriented cylindrical shape. | 10-02-2008 |
| 20080296351 | DIFFUSION BONDED FLUID FLOW APPARATUS USEFUL IN SEMICONDUCTOR MANUFACTURING - The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling. | 12-04-2008 |
| 20090236406 | Method of electrically connecting a microelectronic component - A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other portions of the posts. The method can include reflowing the solder provided on the posts so that the solder coats the posts. The providing step may be performed so that, prior to the reflowing step, the solder covers only the tips of the posts. The providing step can include depositing portions of the solder on a surface of a metallic sheet and etching the sheet from the surface. The plurality of posts may comprise elongated posts. | 09-24-2009 |
| 20100001044 | Full penetration weld joint - A weld joint adapted to facilitate butt-welding attachment of a first structure to a second structure. The weld joint includes a first J groove disposed across a first side of the weld joint and a second J groove disposed across a second side of the weld joint opposing the first side. A land-projection segment extends away from an intersection of chamfered groove faces across the first structure. The first J groove and the second J groove cooperatively define a substantially K-shaped joint profile. | 01-07-2010 |
| 20100006625 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME - Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture. | 01-14-2010 |
| 20100044416 | METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP - An electronic component manufacturing method including: a step of mounting a bump formation material on a first wiring substrate | 02-25-2010 |
| 20100059573 | PROCESS OF FILLING OPENINGS IN A COMPONENT - A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy. | 03-11-2010 |
| 20100224672 | BRAZE JOINING OF WORKPIECES - A braze joint is made between two workpieces by first forming a thermal shrink fit region between the two workpieces adjacent to, or around, a braze or filler region in which a filler metal is located adjacent to, or within. The filler metal is suitably heated so that it flows in the braze or filler region to form the braze joint of the two workpieces. Cutouts may be formed in the thermal shrink fit region adjacent to the braze or filler region to extend the braze joint region or provide paths for gas byproducts in the brazing process. | 09-09-2010 |
| 20100237136 | GOLF CLUB HOZEL BRAZING - A method of applying brazing to the task of attaching a golf club head to a hozel is presented. Brazing is preferable over gluing because of its improves strength characteristics, and preferable to welding because their is no risk of deforming the head or hozel because of high welding temperatures, and there is no welding bead to grind down. | 09-23-2010 |
| 20110114706 | MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE - A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure | 05-19-2011 |
| 20110139856 | BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME - A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability. | 06-16-2011 |
| 20110192885 | WIREBONDING PROCESS - Consistent with an example embodiment, a wirebonding process comprises forming a bond pad with a roughened upper surface, lowering a copper wirebond ball onto the roughened bond bad, and applying a force to the wirebond ball against the roughened surface, A heat treatment is applied to form the bond between the wirebond ball and the roughened surface, wherein the bond is formed without use of ultrasonic energy. | 08-11-2011 |
| 20110253767 | Manufacturing method for electronic devices - A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting at least one of the first metallic bond part and the second metallic bond part. | 10-20-2011 |
| 20110303736 | BATTERY TAB JOINT BY REACTION METALLURGY - Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond. | 12-15-2011 |
| 20120181325 | Process and Device for Connecting Oxide-Dispersed Precious Metal Sheet Using Hammer Welding - The present invention relates to a process and a device for joining precious metal sheets ( | 07-19-2012 |
| 20160059437 | ARTICLE AND PROCESS FOR PRODUCING AN ARTICLE - An article and a process of producing an article are provided. The article includes a base material, a cooling feature arrangement positioned on the base material, the cooling feature arrangement including an additive-structured material, and a cover material. The cooling feature arrangement is between the base material and the cover material. The process of producing the article includes manufacturing a cooling feature arrangement by an additive manufacturing technique, and then positioning the cooling feature arrangement between a base material and a cover material. | 03-03-2016 |
| 228165000 | Forming channel, groove, or aperture for reception of filler material | 16 |
| 20080230587 | METHOD FOR MANUFACTURING ELECTRIC CONNECTIONS IN WAFER - A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum environment and is heated to soften the solder paste. Subsequently, the vacuum is suddenly broken to have the pressure upon the upper surface of the wafer greater than that in the openings thereby pressing the molten solder paste into the openings. | 09-25-2008 |
| 20090179066 | Container and Exposure Apparatus Having the Same - A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at least one of the lid and the container body, providing the material in the inside space, welding the lid and the container body to each other, and exhausting the organic compound vaporized by welding heat to the outside space through the groove and the communication member. | 07-16-2009 |
| 20100170937 | System and Method of Joining Metallic Parts Using Cold Spray Technique - Systems and methods are disclosed for joining two or more parts together via cold spraying. In one embodiment, a first part and second part may be aligned together to create a joint. The parts are joined by cold spraying a material on the first metal part and the second metal part to create a bond at the joint. A system is disclosed that includes a controller configured to control a cold spray gun to create a bond between a first metal part and second metal part | 07-08-2010 |
| 20110000954 | METHOD FOR PRODUCING A SECURING OBJECT, PARTICULARLY IN THE FORM OF A HEAT-RESISTANT ADHESIVE CLOSURE - Method for producing a securing object, particularly in the form of a heat-resistant adhesive closure, comprising: —designing and providing metal securing elements ( | 01-06-2011 |
| 20110155792 | Method and apparatus for scoring or skiving a solder dam - The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces. | 06-30-2011 |
| 20110297734 | METHOD OF MANUFACTURING AN ARTICLE BY DIFFUSION BONDING AND SUPERPLASTIC FORMING - In a method of manufacturing an article ( | 12-08-2011 |
| 20120223126 | METHOD FOR MANUFACTURING A ROTOR - A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last. | 09-06-2012 |
| 20130146645 | FUNCTIONAL COMPOSITE MATERIAL WHEREIN PIEZOELECTRIC FIBER HAVING METAL CORE IS EMBEDDED - [Object] The object is to provide a functional composite material which is adaptable to environmental changes. | 06-13-2013 |
| 20130168438 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES - Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface. | 07-04-2013 |
| 20130221075 | Method of Reducing Solder Wicking on a Substrate - This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component. | 08-29-2013 |
| 20130277416 | REMOTE MELT JOINING METHODS AND REMOTE MELT JOINING SYSTEMS - Remote melt joining methods include melting a filler material to produce a molten filler material, wherein melting the filler material occurs at a remote distance away from a target site of a substrate material such that melting the filler material maintains the target site of the substrate material below its solidus temperature, and, delivering the molten filler material to the target site of the substrate material in a continuous stream. | 10-24-2013 |
| 20130313307 | METHOD FOR MANUFACTURING A HOT GAS PATH COMPONENT - A method for manufacturing a cooling passage in a component of a machine is described. The method may include: forming a channel in a surface of the component, the channel having a predetermined configuration; forming a cover wire, the cover wire having a predetermined configuration based on the predetermined configuration of the channel; nesting the cover wire in the channel; and welding the nested cover wire to the component such that the channel is enclosed. | 11-28-2013 |
| 20150041523 | METHOD AND APPARATUS FOR ALIGNING A LASER TO A WAVEGUIDE - An apparatus includes a slider structure having a waveguide and a cavity configured to align a laser to the waveguide. The cavity includes a plurality of solder bumps on a bottom of the cavity configured to electrically and thermally couple the laser to the slider. At least one mechanical stopper is disposed in the cavity to facilitate vertical alignment between an output of the laser and an input of the waveguide. At least one solder bump is disposed on the mechanical stopper to facilitate lateral alignment between the output of the laser and the input of the waveguide in response to a reflow of the solder bumps. | 02-12-2015 |
| 20150090773 | BRAZING METHOD - A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate. | 04-02-2015 |
| 20150352650 | BRAZING METHOD - A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate. | 12-10-2015 |
| 20150352651 | BRAZING METHOD - A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate. | 12-10-2015 |
| 228170000 | By cutting | 16 |
| 20090283573 | ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL - An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer. | 11-19-2009 |
| 20100006626 | Method for Making a Hollow Core Floor and Deck Element - A composite structural support which may be utilized as a beam or assembled with similar supports to form a building floor or a bridge deck utilizes an open core element, made preferably of suitably treated fluted paper, upper and lower thin steel skins, and a layer of concrete poured over the top skin. Modules comprising the hollow core element and the upper and lower steel skins are fabricated to lengths required for building floor and bridge spans and, when joined by welding the upper and lower skins of adjacent elements along their full lengths, provide a floor or deck structure of a large span. The open core paper elements may be alternately fabricated from single face corrugated webs or open face double wall webs that are slit to form narrow equal width strips stacked and glued face-to-face. | 01-14-2010 |
| 20100288823 | Application of Solder to Holes, Coating Processes and Small Solder Rods - A small solder rod with a stop-off at the end in order to prevent the solder from dripping from an opening is provided. A process for applying solder to a hole in a substrate, wherein the solder is used in the form of a wire or a small rod is also provided. | 11-18-2010 |
| 20110006106 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE - A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut. | 01-13-2011 |
| 20110036901 | DEVICE AND METHOD FOR THE CONNECTING OF STRIPS - The invention relates to a device ( | 02-17-2011 |
| 20120018495 | Mobile Manufacturing Platform - A mobile manufacturing platform is provided. The mobile manufacturing platform has a base, a cutting platform, and a welding platform. Additionally the mobile manufacturing platform has a rail system capable of moving the stock material in X, Y, Z coordinates around the platform. Stock material can be manufactured into a final desired piece at a building site by being cut on the cutting platform and then welded on the welding platform. A finishing station for painting and other finishing may also be added. The mobile manufacturing platform can be moved from building site to building site or wherever on-site manufacturing is preferred. | 01-26-2012 |
| 20120217286 | METHOD FOR MOUNTING A THREE-AXIS MEMS DEVICE WITH PRECISE ORIENTATION - This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically. | 08-30-2012 |
| 20130001277 | method for brazing a surface of a metallic substrate - A method for brazing a surface of a metallic substrate having a generally passive metal oxide layer includes activating the surface of the metallic substrate by machining the metallic substrate with a hard metal tool, grit blasting powdered particles of an activating material on the surface, and wetting the grit blasted surface of the metallic substrate with a filler material at a brazing temperature, wherein the activating material is reactive with the metal oxide layer at the brazing temperature. | 01-03-2013 |
| 20130126589 | METHOD OF TRANSFERRING A LIGHT EMITTING DIODE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
| 20130126590 | WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD - A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board. | 05-23-2013 |
| 20130313308 | DEVICE FOR TRANSVERSE SEAM WELDING - A device and a method for the positionally accurate arrangement of two material ends located opposite each other. The device includes two carriers with always one fixing device for each material end, wherein at least one of the two carriers is slidably guided relative to the second of the carriers, and at least the first carrier has a first adjusting member and a second adjusting member connected to the first adjusting member, wherein the adjusting members form a drive by means of which the first carrier is slidable against the second carrier. | 11-28-2013 |
| 20140353362 | Laser Ablation Process for Manufacturing Submounts for Laser Diode and Laser Diode Units - A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation. | 12-04-2014 |
| 228171000 | Producing opposed complementary matching bonding surface | 3 |
| 20090200360 | METHOD OF WELDING A COMPONENT TO A SHAPE MEMORY ALLOY WORKPIECE WITH PROVISION OF AN EXTRA CUT FOR COMPENSATING THE VARIATIONS OF DIMENSION OF WORKPIECE AND COMPONENT - A method of cutting, polishing and then welding together two metallic components ( | 08-13-2009 |
| 20100243715 | WELDING RAILWAY LINES - This invention relates to a thermite welding process for joining sections of a railway line in situ, the process including the preliminary step of mounting a suitable welding mould about the aligned sections of railway line to be welded together and sealing the mould to prevent run out; mounting a vibration means on the railway line at a suitable distance from the mould and operating it at a suitable frequency; heating the sections of railway line to a desired temperature; igniting an ignitor means and allowing it to drop into the mould to react with molten steel in the mould and fill a weld area about and between the sections of railway line in the mould; and when solidified, to vibrate the railway line for a further period of time until stress relieving of the cast weld area has occurred. | 09-30-2010 |
| 20140151440 | METHOD FOR MAKING T-BRANCH JOINTS FOR PIPES - The invention relates to a method for making T-branch joints for pipes. The method comprises making a hole ( | 06-05-2014 |
| 228172000 | Abrading | 1 |
| 20150352557 | Method For Manufacturing Large Mill Cylinders - A plurality of cylinder sections are welded together to form a milling cylinder, wherein, prior to welding, individual cylinder sections are machined in the region of their end edges to be welded, using at least one machining tool. Furthermore, the cylinder section to be machined is provided with inwardly oriented bracing means, wherein a temporary axle is fitted on the bracing means such that the temporary axle is oriented in the mid-axis of the cylinder section, and wherein the at least one machining tool is fastened to the temporary axle by means of a holder and the machining tool is rotated relative to the cylinder section about or with the temporary axle during the machining of the end edges. | 12-10-2015 |
| 228173100 | By deforming | 27 |
| 20090078745 | Method for forming interconnects - A method for forming interconnects between a component and a substrate. The method comprises determining at least one location of differential flexing between a component and a substrate during drop impact; and forming a plurality of solder joints on at least one of the component and the substrate. A first number of the plurality of solder joints has a reduced amount of solder and a second number of the plurality of solder joints has normal solder content. The method also comprises conducting solder reflow of the plurality of solder joints to form interconnects between the component and the substrate. Those interconnects formed by the first number of solder joints have a reduced amount of solder forming an included angle with at least one of the component and the substrate. The included angle is large compared to an included angle between each of: the component and the substrate, and the second number of solder joints of normal solder content. | 03-26-2009 |
| 20100133323 | METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRCUIT BOARD - A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure. The method involves electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective wire bond, each of the wire bonds extending in an arc from the contact pad to the conductor and, pushing on each of the wire bonds individually to collapse the arc and plastically deform the wire bond such that the plastic deformation maintains the wire bond in a flatter profile shape. The support structure has a chip mounting area for supporting the die. The die has a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors. | 06-03-2010 |
| 20110017808 | METHOD FOR THE LOW-TEMPERATURE PRESSURE SINTERING - A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following steps: pressing the electronic unit using a mold enveloping matrix while sparing a connecting surface of the substrate for a heat sink connection, providing a heat sink plate, applying a sintering connecting layer onto the spared region of the connecting surface and/or onto to the region of the heat sink plate provided for contacting, and bonding of the heat sink plate to the substrate of the electronic unit in the region of the connecting surface using silver low-temperature pressure sintering technology. | 01-27-2011 |
| 20110266333 | FUSION WELDING METHOD FOR CONNECTING THIN-WALLED CASINGS - The method for connecting thin-walled casings by fusion welding comprises the following: preparation of the end faces to be connected of the casings, abutting arrangement on centring devices and common melting of the end faces to be connected while an arrangement gap sufficient for carrying out the welding is temporarily maintained between the surfaces lying against one another of the end faces. On each of the casings to be connected, deforming of the micro-projections on the surface to be welded of the end faces is carried out by plastic deformation along with upsetting of the material. On the end face, the metal to be deformed is moved to the side of the inner surface of the casing and an inner, annular bead strip is formed thereupon. The casings to be connected are arranged in a device that carries out centring with respect to the outer diameter. Then, initially at the circumference in the plane of the connection, spot welding thereof is carried out. Subsequently, main welding is carried out right through, thereby forming a fusion zone of a width between 4 d and 6 d, where d is the thickness of the wall of the casing to be welded in mm, and the heat removal in the parts to be welded begins at a distance that does not exceed 8 d from the centre line of the connection. | 11-03-2011 |
| 20120074208 | PRINTED BOARD AND BUS BAR ASSEMBLY - A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor. | 03-29-2012 |
| 20120255991 | Corrugated Solder Pre-form and Method of Use - A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side. | 10-11-2012 |
| 20140034713 | FIN STOCK MATERIAL - A fin stock material from an 3xxx-series aluminium alloy and including at least 0.5% to 2.0% Mn, and furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to 0.5%, Se 0.03% to 0.5%, Y 0.03% to 0.05%, Th 0.03% to 0.05%, and the sum of these elements being 0.5% or less, with the remainder including aluminium and tolerable impurities. Also provided is a method for manufacturing a heat exchanger assembly incorporating such a fin stock material. | 02-06-2014 |
| 20140299654 | SETUP FOR ASSEMBLING A PANEL BY BRAZING - A setup for assembling, by brazing, a composite panel including at least two parts separated by a filler material and joined together by brazing. The setup includes a furnace to achieve a brazing temperature for brazing the panel, and an assembly device which has a form having a shape similar to the final shape of the panel to be brazed. In particular, the assembly device further includes a pressing device to apply mechanical pressure to at least part of the surface of the panel in a direction allowing the panel to be permanently deformed into a shape which matches that of the form. The pressing device is moved under the action of a spring, and the forces applied by the spring being determined so that, at the brazing temperature, the spring applies the force necessary for deforming the panel against the form. | 10-09-2014 |
| 20150014397 | METHOD FOR BONDING A TANTALUM STRUCTURE TO A COBALT-ALLOY SUBSTRATE - Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer. | 01-15-2015 |
| 228173200 | Pressing first work part against second work part | 3 |
| 20090314824 | METAL SURFACE TREATMENT METHOD - A metal surface treatment method includes: a shot-peening step of shot-peening a dissimilar metal particle ( | 12-24-2009 |
| 20110297735 | METHOD AND APPARATUS FOR STENT MANUFACTURING ASSEMBLY - A stent manufacturing assembly for assisting in the manufacturing of a medical stent and a process for manufacturing a medical stent are disclosed. A patterned sheet of metal can be wrapped around the manufacturing assembly's outer surface. The assembly includes a mandrel and a sleeve. The mandrel includes a rigid and substantially cylindrical external surface, and the sleeve surrounds the mandrel and has a variable inner diameter. The sleeve adheres to the inner surface of the stent formed around the sleeve to allow the sleeve to remain in place. After the mandrel is slidably removed from the sleeve, the sleeve radially collapses and contracts, thereby causing minimal shear stress on the stent's inner surface and preventing or minimizing friction and pressure between the mandrel and the stent. | 12-08-2011 |
| 20140346215 | METAL CONNECTION METHOD - Disclose is a metal connection method comprising the steps of: holding a connection part of a first metal member and a connection part of a second metal member facing each other; deforming the connection parts by applying pressure to the connection parts with the connection parts butted each other to thereby remove oxide films of the connection parts; and connecting to each other the connection part of the first metal member and the connection part of the second metal member from which the oxide films were removed by means of diffusion connection. As a result, cost is easily reduced and quality can be stably ensured. | 11-27-2014 |
| 228173400 | Tube or frame member | 2 |
| 20140042210 | ROUNDING SYSTEM AND METHOD USED IN THE MANUFACTURE OF CONICAL OR CYLINDRICAL STRUCTURES - A can rounding system and method that uses arms that are able to maintain cans in a concentric arrangement during the welding process. The arms enable the can rounding system to maintain the concentric positions in order to achieve improved circular dimensions and increase the overall efficiency in the construction of cylindrical and conical structures, such as wind towers. | 02-13-2014 |
| 20150076215 | METHOD OF MANUFACTURING CURVILINEAL CLOSED STRUCTURE PARTS WITHOUT FLANGE AND APPARATUS FOR THE SAME - A method and apparatus manufactures a closed structure part without flange having a curvature and welded edges along a longitudinal direction of the part and further having a varying cross-sectional shape, from two metal plates. Each of two metal plates provided with a curvature along the longitudinal direction of the plate and provided with both ends in a width direction of the plate, are press-formed such that a folding line is formed at positions corresponding to a non-welded bent edge in a cross section of the part, and stacked on each other vertically such that their bulging sides face outward. Their left ends and right ends in the width direction are mutually welded along the longitudinal direction to form welded edges. | 03-19-2015 |
| 228173500 | Rod, bar, or wirelike object | 4 |
| 20090072008 | SECONDARY BATTERY PROTECTING MODULE AND LEAD MOUNTING METHOD - In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering. | 03-19-2009 |
| 20090173770 | Lead-free solder alloy and electoronic component using this lead-free solder alloy - Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. | 07-09-2009 |
| 20090250506 | Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards - A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface. | 10-08-2009 |
| 20120018496 | Method and Apparatus for Forming a Wave Form Used to Make Wound Stents - A method for forming a wave form for a stent includes clamping a formable material to a first die including a forming portion; drawing the formable material with the first die in a first direction; clamping the formable material to a second die at a location spaced from the first die, the second die including a forming surface; moving a forming member in between the first die and the second die in a second direction substantially perpendicular to the first direction and into contact with the formable material; and deforming the formable material by moving the forming member in the second direction while moving the first die towards the second die and/or moving the second die towards the first die. | 01-26-2012 |
| 228173600 | Sheet material | 9 |
| 20080230588 | HEMMING WORKING METHOD AND PANEL ASSEMBLY MANUFACTURING METHOD - A hemming working is performed by a positioning step of positioning a first panel formed with a projected portion for welding on a second panel formed with a flange portion; a first bending step of bending the flange portion; and a second bending step of pressing the flange portion on an outer side of the projected portion. | 09-25-2008 |
| 20100187291 | METHOD AND APPARATUS FOR THE TEMPERATURE-CONTROLLED SHAPING OF HOT-ROLLED STEEL MATERIALS - The invention relates to a method for shaping sheet steel. In said method, a blank is produced from the sheet steel, the blank is inserted into a shaping tool, and the shaped workpiece is produced from the blank in a one-stage process by means of the shaping tool. Before being shaped, the blank is heated to such a degree that the steel does not undergo any phase transition and the blank is shaped in the ferritic, pearlitic, or bainitic range without exceeding the eutectoid temperature or the recrystallization temperature. The invention also relates to an apparatus for carrying out said method. | 07-29-2010 |
| 20110192886 | DRUM FOR WASHER AND DRYER - Drum for a washer and a dryer including a cylindrical metal body part, reduced parts at opposite end parts of the body part, each having a diameter smaller than a diameter of the body part, and bent parts each having a folded edge of the reduced part, thereby providing a drum that can prevent occurrence of vibration and noise. | 08-11-2011 |
| 20120018497 | METHOD FOR MANUFACTURING CLAD MATERIAL AND EQUIPMENT FOR MANUFACTURING THE SAME - A method for manufacturing a clad material composed of a core material and one or more skin materials which are superposed on either one or both faces of the core material, includes a clad material preparation process where an ingot for core material is manufactured by dissolving and casting a metal, and an ingot for skin material is manufactured by dissolving and casting a different metal for skin material, without hot rolling. The ingot for skin material is superposed as a skin material at a predetermined position of either one or both faces of the ingot for core material and the superposed material is hot-rolled to manufacture a clad material. | 01-26-2012 |
| 20120160901 | METHOD FOR PRODUCING STEEL PIPE PLATED WITH METAL BY THERMAL SPRAYING - To provide a process for producing a thermal sprayed, metal plated steel tube having a metal layer substantially uniform and favorable over the whole surface in a highly productive manner. | 06-28-2012 |
| 20140191018 | WELDED HOT-ROLLED HIGH-STRENGTH STEEL STRUCTURAL MEMBERS AND METHODS - Hot-rolled high-strength steel elongated structural members and method of making same are disclosed by hot-rolling high-strength steel having a specific chemical composition to provide structural units. The units are then welded together to provide structural members of desired geometrical configuration including a thin web with opposed thicker flanges extending therefrom to increase the load bearing capacity of the members. | 07-10-2014 |
| 20150136841 | METHOD FOR MANUFACTURING A METAL PART - A manufacturing method for a metal part uses a tooling assembly. The tooling assembly includes a counter-form and a deformable core which includes inner and outer skins, a honeycomb structure positioned between the inner and outer skins, and a brazing material interposed between the honeycomb structure and the inner and outer skins. In particular, the core is closed by a lid equipped with ducts through which a gas is introduced. The manufacturing method includes the following steps: positioning the tooling assembly in a vacuum furnace; introducing a pressurized gas directly inside an inner skin of the core of the tooling assembly; purging the pressurized gas from an inner portion of the inner skin of the tooling assembly; and dismounting the tooling assembly so as to extract a metal part manufactured. | 05-21-2015 |
| 20150314395 | METHOD FOR PRODUCING AN ENDLESS BELT - The invention relates to a method of producing an endless belt ( | 11-05-2015 |
| 228173700 | Continuously feeding sheet material | 1 |
| 20150343514 | DRAW FORMING METHOD - A draw bead is formed in a plate-shaped material in which a drawn portion is formed, outside the drawn portion, the draw bead being used to adjust an inflow of the plate-shaped material into a drawing die. The drawn portion is drawn in the plate-shaped material by using the draw bead as formed. The draw bead is crushed and flattened after the drawn portion is drawn. | 12-03-2015 |
| 228174000 | Forming channel, groove, or aperture | 3 |
| 20090184155 | PCB Mounting Method - Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB. | 07-23-2009 |
| 20160121771 | METHOD OF REINFORCING A SEATBACK FRAME OF A SEAT ASSEMBLY - A method of reinforcing a seatback frame of a seat assembly in which the seatback frame includes a pair of first frame members. The method includes the steps of providing a reinforcement member having an insertion end and an arm at an opposite end of the reinforcement member. The arm extends generally normal to the remainder of the reinforcement member to define a generally L-shape. An aperture is formed in one of the pair of first frame members. The insertion end of the reinforcement member is inserted into the aperture. The attachment end is aligned with the other of the pair of first frame members. The reinforcement member is welded to the seatback frame to reinforce the seatback frame. | 05-05-2016 |
| 20170232538 | Attaching Electronic Components to Interactive Textiles | 08-17-2017 |
