With shaping

Subclass of:

Class / Patent application number	Description	Number of patent applications / Date published
228164000	Prior to bonding	78
228155000	Subsequent to bonding	48
228265000	With concurrent bonding	6
228144000	And edge joining of one piece blank or strip	6
228153000	Lap joining of parts of nonplanar surfaces	1
20120273556	TOWER PRODUCTION METHOD - A tower production method, comprising a first production stage including the steps of unrolling and bringing into a planar state a sheet metal wound around a coil; bending the planar sheet metal at the lateral direction at varying bending radii; and winding the bent sheet metal into a conical coil, as well as a final production stage yielding the tower and including the steps of feeding the sheet metal unwound from the conical coil to at least one winding machine, and bending and winding the bent sheet metal in the winding machine around a central bending axis parallel to one surface thereof so that a defined initial winding radius and the angle between a longer edge thereof and the axis are kept constant and the longer edge of the sheet metal is joined over itself.	11-01-2012

Document	Title	Date
Entries
20130334291	METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME - Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.	12-19-2013

Patent applications in all subclasses With shaping