| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 219121830 | With monitoring | 27 |
| 20080210674 | OPTICAL SENSOR FOR QUALITY MONITORING OF A WELDING PROCESS - Disclosed is the design and working principle of a welding monitoring system that can monitor the spectra of zinc and iron in the plasma generated during a welding process involving zinc-coated steel. The monitoring system is capable of monitoring multiple parameters, including spectral line intensity, electron temperature, and ratio of zinc and iron composition in the plasma. The results can then be used individually or in combination to predict resulting weld quality and generate appropriate feedback control signals. | 09-04-2008 |
| 20080223839 | Laser Machining Apparatus - A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey. | 09-18-2008 |
| 20080283510 | Monitoring Method and Device by Shadowscopy - A monitoring device by laser shadowscopy, which comprises a light emitter ( | 11-20-2008 |
| 20090032512 | Method for Measuring Phase Boundaries of a Material During Machining With a Machining Beam Using Additional Illumination Radiation and an Automated Image Processing Algorithm, and Associated Device - The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece ( | 02-05-2009 |
| 20090050612 | Arrangement and method for the on-line monitoring of the quality of a laser process exerted on a workpiece - The invention relates to an arrangement ( | 02-26-2009 |
| 20090084767 | SYSTEM AND METHOD FOR CONTROLLING LASER SHOCK PEENING - A laser shock peening system including a workpiece is provided. The laser shock peening system includes a workholding fixture configured to hold the workpiece. The laser shock peening system also includes a laser source configured to emit multiple laser beam pulses on the workpiece. The laser shock peening system further includes an absorptive layer disposed on the workpiece, the absorptive layer configured to absorb the laser beam pulses from the laser source into the workpiece. The laser shock peening system also includes a transparent constraining layer disposed between the laser source and the absorptive layer. The transparent constraining layer is also configured to provide a pressure medium configured to direct multiple reflected laser generated shock waves from the workpiece back into the workpiece. The laser shock peening system also includes a transducer disposed on the workholding fixture and configured to detect multiple acoustic signals emitted from the workpiece. | 04-02-2009 |
| 20100044359 | HEIGHT POSITION DETECTING APPARATUS AND HEIGHT POSITION DETECTING METHOD - A laser beam having an annular spot shape with which a workpiece is irradiated is reflected on an upper surface and a lower surface of the workpiece. The reflected light having the annular spot shape which is reflected on the lower surface of the workpiece is intercepted by a pinhole mask, whereas the reflected light having the annular spot shape which is reflected on the upper surface of the workpiece is permitted to pass through the pinhole mask, and the intensity of light received is detected based on the latter reflected light. Therefore, the height position of the upper surface of a workpiece can be detected even where the workpiece is transmissive to visible rays. In this case, with regard to the reflected light having the annular spot shape which is reflected on the upper surface of the workpiece, the intensity of the light after diffusion by a laser beam diffusing unit is detected by a photodetector having a detecting surface with a predetermined area. This makes it possible to assuredly and accurately detect the upper surface height position of the workpiece, even in the presence of scattering of the annular spot shape. | 02-25-2010 |
| 20100133247 | MONITORING OF A WELDING PROCESS - A method of monitoring a welding process, comprising detecting a selected portion of a light spectrum of plasma plume of a fusion welding process with a photo detector, processing the detected portion of the spectrum, comparing the detected portion of the spectrum with an expected spectra to determine whether a weld is acceptable, providing a signal to a welder control, and adjusting the weld process based on the signal. | 06-03-2010 |
| 20100163540 | Method for Laser Machining Transparent Materials - A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 μm is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval predetermined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval. | 07-01-2010 |
| 20110139760 | FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS CONTROLS AND FEEDBACK - A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities. | 06-16-2011 |
| 20110220626 | Laser Processing Machine - A laser processing machine for processing workpieces includes a beam guide containing a gas atmosphere, and also includes an apparatus for investigating the gas atmosphere in the beam guide for impurities. The investigation apparatus makes use of the photoacoustic effect. The measuring apparatus has a measuring chamber and at least one measuring head, where the beam guide acts as the measuring chamber. As a measuring chamber, the beam guide contains the gas atmosphere that is to be investigated and also a modulated laser beam modulated. The measuring head(s) are integrated into the beam guide and are used to detect the photoacoustic effect in the measuring chamber. | 09-15-2011 |
| 20120061360 | Method Of And System For Setting Laser Processing Conditions, Laser Processing System, Computer Program For Setting Laser Processing Conditions, Computer Readable Medium and Recording Device On Which Laser Processing Conditions Are Recorded - A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone. | 03-15-2012 |
| 20120103955 | Laser Optical System, Repair Apparatus And Method Using The Same - According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module. | 05-03-2012 |
| 20130001208 | METHOD AND DEVICE FOR DETECTING AND ADJUSTING THE FOCUS OF A LASER BEAM WHEN LASER MACHINING WORKPIECES - The invention relates to a method for detecting and adjusting the focus (F) of a laser beam when laser machining workpieces, having the following steps: a.) guiding and focusing a laser beam of a machining laser ( | 01-03-2013 |
| 20130119029 | DEVICE AND METHOD FOR MATERIAL PROCESSING BY MEANS OF LASER RADIATION - A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≦10 μm from each other. | 05-16-2013 |
| 20130126492 | LASER PROCESSING SYSTEM HAVING AUXILIARY CONTROLLER - A laser processing system includes: a numerical control device ( | 05-23-2013 |
| 20130140289 | APPARATUS, SYSTEM AND METHOD FOR DETERMINING COMPLIANT USE OF AN INTRAORAL APPLIANCE - A compliance monitoring system ( | 06-06-2013 |
| 20130213945 | Methods and Apparatus for the Preparation of Microscopy Samples by Using Pulsed Light - Methods and apparatus are disclosed for the preparation of microscopic samples using light pulses. Material volumes greater than 100 μm | 08-22-2013 |
| 20140183175 | Optical Element of a Laser Material-Processing Machine - An optical element for installation in a laser processing machine has a surface that is optically unused and/or not subject to a laser beam during operation of the laser processing machine when the optical element is installed in the laser processing machine, and a transponder disposed in a region on or near the surface and containing readable information relating to the optical element. | 07-03-2014 |
| 20140312019 | Laser system processing unit connection - A laser system includes one or more lasers and one or more laser processing units each connected to a respective one of the one or more lasers by a laser light cable and a data line associated uniquely with the laser light cable. Each laser processing unit includes a safety device for monitoring the laser processing unit and an interface for the data line. The laser system also includes a central safety control operably associated with the one or more laser processing units and configured to monitor the safety devices of multiple laser processing units of the laser system. The interface of each of the one or more laser processing units is connected to the central safety control and via the data line to the respective one of the one or more lasers. | 10-23-2014 |
| 20140326705 | WELDING POSITION DETECTING APPARATUS AND WELDING POSITION DETECTING METHOD FOR LASER BEAM WELDING - A welding position detecting apparatus for laser beam welding includes: an imaging device that captures, at a predetermined time interval, images of an irradiated portion of a welding material irradiated with a welding laser beam, and a surrounding area thereof, of a welding material; an image processing device that identifies a position of the irradiated portion irradiated with the welding laser beam by performing image processing calculating, from two or more images acquired by the imaging device, a direction and an amount of parallel movement of points in the images; and a display device that displays the position of the irradiated portion irradiated with the welding laser beam, the position being identified by the image processing device. | 11-06-2014 |
| 20140339209 | Method and System for Monitoring Output of High Power Fiber Laser System - The disclosure is a method and system for monitoring the condition of an optical protective component in a laser system associated with a data processor. In one embodiment, the method begins with directing light from the process head of a laser through the optical protective component onto a workpiece. A return light via the workpiece causes light signals coupled through the protective component and into to a fiber which extends proximate the protective component and thereafter flexibly to a sensor. The sensed signals allow monitoring the condition of the protective component during use. The method and system is operative for use with optical protective elements downstream of the process head. | 11-20-2014 |
| 20150314394 | LASER PROCESSING SYSTEM HAVING FUNCTION OF PREPARING TO RESTART PROCESSING - A laser processing system including a laser processing unit, a controller controlling the processing unit according to a laser processing program, and a restart preparation apparatus performing a preparation process of the controller to resume the program execution after being suspended. The restart preparation apparatus includes an operating state judging section judging whether an operating state of the processing unit when suspending the program execution is in course of laser processing, and a restart condition specifying section specifying a restart condition of the processing unit when resuming the program execution, from among predetermined conditions, based on a judgment result. The operating state judging section judges that the operating state is in course of laser processing, if a predetermined operation command for processing the workpiece is output from the controller, or predetermined external information for processing the workpiece is input to the controller, at the instant of suspending the program execution. | 11-05-2015 |
| 20160052086 | SMART ADDITIVE MANUFACTURING SYSTEM (SAMS) - An additive manufacturing process is monitored, in situ, using optical emission spectroscopy to analyze the composition, phase transformation or manufacturing defects. The system or method may include an analysis of contours of the plasma line intensity, or pre-processing of the plasma spectral line including signal-to-noise ratio analysis, baseline removal, line identification, line de-convolution and fitting. Improvements may additionally involve consideration of plasma parameters such as plasma spectral line intensity, line ratio, plasma temperature and electron density using high-resolution optical emission spectroscopy in both visible and ultraviolet regions. Parameters of the plasma may be determined using an intensity ratio of the ions or atoms emission lines, a FWHM of the line profile for electron density estimation, or a Boltzmann plot for plasma temperature estimation. One or more techniques may be used to monitor when there is a lack of deposition. | 02-25-2016 |
| 20160067832 | WELDING PORTION INSPECTION DEVICE AND INSPECTION METHOD THEREFORE, WITH EXTRACTING PORTION FOR EXTRACTING EVAPORATION LUMINESCENCE AND THERMAL RADIATION - A welding portion inspection method includes: irradiating welding laser beam along welding trajectories set in works plural times or irradiating inspection laser beam along scanning trajectories set in a molten pool of the works which is melted by the welding laser beam plural times; receiving return light including reflected light from the molten pool of the work, evaporation luminescence generated due to evaporating of the work and thermal radiation light radiated from the molten pool of the work; extracting short wavelength component containing evaporation luminescence and long wavelength component containing thermal radiation light from the return light and inspecting the welding condition of the welding portion of the work based on a ratio between an intensity of the short wavelength component and an intensity of the long wavelength component. | 03-10-2016 |
| 20160074961 | Laser Machining Nozzle for a Laser Machining Device, and Laser Machining Device - Described is a laser machining nozzle for a laser machining device having a detection device for detecting radiation from a process zone defined by the laser machining nozzle. The surface of the laser machining nozzle has at least one contrast section which has a scattering and/or absorbing effect at least for radiation at an observation wavelength. Also described are a laser machining device and a method for implementing a laser machining nozzle in a laser machining device. | 03-17-2016 |
| 20160144452 | SYSTEM AND METHOD FOR DETECTING A DEFECT IN A WORKPIECE UNDERGOING MATERIAL PROCESSING BY AN ENERGY POINT SOURCE - A method for detecting a subsurface defect in a workpiece undergoing processing includes directing focused heat energy from an energy point source on to the workpiece to generate a melt pool and cause a solid portion of the workpiece to emit incandescent radiation. The incandescent radiation emitted by the solid portion of the workpiece is captured and a signal based upon the color or intensity of the captured incandescent radiation is output. A processor receives the output signal and analyzes it for any variance. If any variance is detected, the region associated with the variance is determined. In this fashion, gradients in the color or intensity distribution reveal subsurface defects. | 05-26-2016 |
