| Entries |
| Document | Title | Date |
|---|
| 20080210667 | RAPID THERMAL PROCESS METHOD AND RAPID THERMAL PROCESS DEVICE - A rapid thermal process method contains providing a substrate, performing a pre-heating process to at least a first portion of the substrate by means of a first laser beam, and performing a rapid heating process to the pre-heated first portion of the substrate by means of a second laser beam. | 09-04-2008 |
| 20080290074 | Laser Machining Nozzle Identification - A system for identifying a laser machining nozzle on insertion of the laser machining nozzle into a laser machining head is provided. On its region insertable into the laser machining head, the laser machining nozzle has a shaping. Means for detecting or sensing the shaping are provided in the receiving region of the laser machining head provided for the laser machining nozzle. | 11-27-2008 |
| 20090026178 | Apparatus for annealing, method for annealing, and method for manufacturing a semi conductor device - An apparatus for annealing a substrate includes a substrate stage having a substrate mounting portion configured to mount the substrate; a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality areas defined laterally in the substrate through a bottom surface of the substrate; and a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate. | 01-29-2009 |
| 20090039058 | Equipment and method for fusing together laminar bands - Equipment ( | 02-12-2009 |
| 20090272722 | Method and device for cleaning the circumferential outer surface of welded metal pipes - A method of cleaning the circumferential outer surface of a welded metal pipe focuses a laser beam above the level of the surface and melts, evaporates and/or sublimates extraneous materials and flaws present on the surface of the pipe. | 11-05-2009 |
| 20090294412 | LASER TYPE SOLDERING APPARATUS - A laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, a portion of a plurality of optical lenses is a corn lens, wherein an incident surface or a emitting surface of the corn lens is a conical surface, and a central portion of the corn lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the corn lens, and the corn lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object. | 12-03-2009 |
| 20090314749 | Slit width adjusting device and microscope laser processing apparatus - Disclosed is a slit width adjusting device comprising: a pair of slit members parallel to each other, which is moved to approach each other or to be separated from each other to adjust a slit width; a driving section to move the pair of slit members; an absolute position original point detection section to detect an arbitrary absolute position of the slit members as an original point; and an adjustment section to adjust the slit width, wherein the adjustment section comprises: a storage unit to store a slit width table in which a displacement amount of the slit width from the original point, and a drive instruction value corresponding to the displacement amount, are corresponding to each other; and a drive control unit to extract the drive instruction value corresponding to a specified slit width, to drive the driving section according to the extracted drive instruction value. | 12-24-2009 |
| 20100140229 | PROCESSING APPARATUS - An processing apparatus comprises a laser oscillator, an overall control device which controls an operation of the laser oscillator, and a plurality of processing units. The processing unit comprises a holding part which movably holds a processed object, an optical system which guides the laser beam, oscillated from the laser oscillator, toward the processed object, a shutter which selectively prevents the laser beam from reaching the processed object, and an individual control device which controls an operation of the holding part, and transmits a laser request signal to the overall control device. When at least one of the plurality of individual control devices transmits the request signal, the overall control device controls the shutter of the processing unit, which has transmitted the laser request signal, to enable the laser beam to reach the processed object, and drives the laser oscillator to allow the laser oscillator to oscillate the laser beam. | 06-10-2010 |
| 20100163533 | INCREASING HEAD TRANSDUCTION VIA SURFACE PLASMON RESONANCE BY MODULATING RESONANT CONTINUOUS-WAVE IRRADIATION - The present invention relates to methods and apparatus for increasing the conversion efficiency of irradiation incident on metal particles to an ambient environment. More specifically the invention relates to methods and apparatus for increasing the heat conversion efficiency from irradiation incident on metal particles to an ambient environment through modulating radiation incident upon the metal particles. | 07-01-2010 |
| 20100193479 | LASER PROCESSING APPARATUS, PROCESS CONTROL APPARATUS, AND PROCESSING APPARATUS - A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit. | 08-05-2010 |
| 20100206854 | LASER SOLDERING APPARATUS - By irradiating laser light | 08-19-2010 |
| 20100270273 | LASER BEAM PROCESSING MACHINE - A laser beam processing machine that includes a laser beam irradiation unit for directing a laser beam to a workpiece held by a chuck table; a water-containing cover including an annular lateral wall surrounding the workpiece held by the chuck table, a top wall formed of a transparent member and closing an upper surface of the annular lateral wall, a water-supply hole and a water-discharge hole; a water-containing cover positioning unit for selectively positioning the water-containing cover at a waiting position remote from the chuck table and at an operating position where the water-containing cover surrounds the workpiece held by the chuck table; and a water supply unit connected to the water-supply hole. | 10-28-2010 |
| 20110210099 | METHOD AND ARRANGEMENT FOR FIRM BONDING OF MATERIALS - A method and an arrangement for a firm bonding of a first material with a second material by means of soldering through focused laser radiation impacting on the first material, with the output controlled in dependence on the temperature measured in the area of the impacting focused laser radiation. To assure that surface properties will not lead to a noticeable distortion of the material temperature to be measured so that a reproducible, high quality soldering will be possible, it is provided for the temperature to be measured in an area of the first material that is adjacent to that in which the focused laser radiation impacts on the first material, with the area in which the temperature is measured and the area of impact of the laser radiation lying within the area of the soldering spot. | 09-01-2011 |
| 20110220621 | Determining Powder Feed Nozzle Misalignment - This invention relates to a method for determining misalignment of a powder feed nozzle and a laser beam. The method includes forming a test structure on a workpiece in at least two different directions by deposition laser welding with powder at substantially constant deposition parameters without relative rotation between a powder feed nozzle and a laser beam, measuring heights and/or wall thicknesses of the test structure along the test structure, and determining a direction and/or an amount of misalignment of the powder feed nozzle relative to the laser beam based on the measured heights and/or wall thicknesses. | 09-15-2011 |
| 20110233175 | PICK-AND-PLACE MACHINE - A pick-and-place machine, comprising: a pick station; a place station; a pick/place head for transporting a die from the pick station along a transport path to the place station; wherein the machine further comprises a die-face processing means, comprising an inspection unit and/or a cleaning unit, operable to process a face of the die on the transport path. | 09-29-2011 |
| 20110259856 | APPARATUSES FOR FABRICATING PATTERNS USING LASER DIODE - An apparatus for fabricating patterns using a laser diode is presented. The apparatus includes at least one laser diode, at least one lens and a mask having at least one pin hole, wherein light emitted from the laser diode is emitted through the lens and the pin hole to be focused on a first material layer. | 10-27-2011 |
| 20110266261 | LASER MACHINING DEVICE - A laser machining device which can suppress the aberration of a laser beam converged into an object to be machined is provided. The laser machining device ( | 11-03-2011 |
| 20110272385 | LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - An object of the present invention is to provide a method and a device for constantly setting the energy distribution of a laser beam on an irradiating face, and uniformly irradiating the laser beam to the entire irradiating face. Further, another object of the present invention is to provide a manufacturing method of a semiconductor device including this laser irradiating method in a process. Therefore, the present invention is characterized in that the shapes of plural laser beams on the irradiating face are formed by an optical system in an elliptical shape or a rectangular shape, and the plural laser beams are irradiated while the irradiating face is moved in a first direction, and the plural laser beams are irradiated while the irradiating fate is moved in a second direction and is moved in a direction reverse to the first direction. The plural laser beams may be irradiated while the irradiating face is moved in the first direction, and the plural laser beams may be irradiated while the irradiating face is moved in the direction reverse to the first direction, and the irradiating face may be also moved in the second direction. | 11-10-2011 |
| 20120080410 | LASER MARKING MACHINE - A laser marking machine includes a support portion, a laser marking device fixed on the support portion, a control chip and a fixing mechanism fixed on the support portion. The fixing mechanism includes a support board configured for supporting a workpiece, and four positioning blocks moved, and four motors being able to control the four positioning blocks to slide in the support board. The fixing mechanism further includes at least two position detectors. The two position detectors are able to position detector a distance data of the workpiece deviating from a center of the support board along X and Y axes, and transmit the distance data to the control chip. The control chip analyzes the distance data to control the four motors to respectively drive the four positioning blocks to slide in the support board until the workpiece is centered on the support board. | 04-05-2012 |
| 20120080411 | LASER ILLUMINATION SYSTEM WITH REDUCED SPECKLE - A despeckling device and method in which an optical path difference staircase element is disposed between a fly's eye lens array and the image plane in a position near the focus position of the fly's eye lens array, and a laser generating unit generates and transmits pulsed laser beams to the optical path difference staircase element, wherein the pulsed laser beams are driven at a very short pulsed rate. | 04-05-2012 |
| 20120125897 | STRESS TREATMENT DEVICE, OPERATING SYSTEM, AND METHOD OF MAKING TURBINE - A stress treatment device has an operating unit including a head unit performing peening by irradiating an inside of a hole formed in a structure with laser to form a compressive stress region in the hole; a laser unit having an optical fiber guiding the laser to the head unit; a jetting unit jetting liquid into the hole; and a support part supporting the optical fiber in a manner of allowing the jetted liquid to flow through and being fixed in the head unit. | 05-24-2012 |
| 20120175352 | NOZZLE WELDING METHOD, NOZZLE PORTION REPAIR METHOD, AND NOZZLE WELDED STRUCTURE - To provide a nozzle welding method which can be performed automatically and efficiently, and which can also be performed under the condition of a high-exposure amount. The nozzle welding method includes: a built-up groove forming process of forming a built-up groove portion by digging an inner surface of a vessel into a substantially cylindrical shape in a range including at least a J-groove; a build-up welding process of forming a built-up weld portion in the built-up groove portion by build-up welding in such a manner that a plug is configured by a plug main body portion having an inner end surface forming an extending portion of the outer surface of the built-up groove portion, and is also configured by a projecting portion projected from the inner end surface and having an axis center substantially coincident with the axis center of the build-up groove portion, and the plug is inserted into a nozzle hole so as to make the inner end surface substantially coincident with the outer surface of the built-up groove portion; a vessel side weld groove portion forming process of forming the J-groove in the build-up weld portion; and a nozzle attaching process of completing the J-groove portion by inserting the nozzle and welding the J-groove portion. | 07-12-2012 |
| 20120228274 | LASER PROCESSING MACHINES AND METHODS OF PROCESSING WORKPIECES - A laser processing machine for processing workpieces, in particular metal sheets, includes a workpiece support and a beam receiver for the laser beam used as a processing tool. The distance between a workpiece lying on the workpiece support and the beam receiver is variable, owing to the fact that the workpiece support and the beam receiver are positionable relative to one another along the beam axis of the laser beam by means of an adjusting drive of an adjusting device with a positioning movement of a variably definable magnitude. A method for processing workpieces, in particular metal sheets, is also provided. | 09-13-2012 |
| 20120234800 | ANNEALING APPARATUS USING TWO WAVELENGTHS OF CONTINUOUS WAVE LASER RADIATION - A thermal processing apparatus and method in which a first laser source, for example, a CO | 09-20-2012 |
| 20120234801 | ANNEALING APPARATUS USING TWO WAVELENGTHS OF CONTINUOUS WAVE LASER RADIATION - A thermal processing apparatus and method in which a first laser source, for example, a CO | 09-20-2012 |
| 20120241419 | APPARATUS FOR PROCESSING CONTINUOUS LENGTHS OF FLEXIBLE FOIL - An apparatus and method are described that use a cylindrical drum type vacuum drum and allows accurately registered, high resolution laser patterning of thin films on discrete lengths or flexible substrate material that are unwound from an unwind reel and after processing are rewound onto a rewind reel. Length compensator units are provided either side of the drum to accommodate variations in the length of the substrate due to differential rotation of the drum and the unwind and rewind reels. | 09-27-2012 |
| 20120255935 | LASER PROCESSING METHOD - There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line. | 10-11-2012 |
| 20120255936 | LASER SYSTEM FOR THE MARKING OF METALLIC AND NON-METALLIC MATERIALS - A laser system for the marking of metallic and non-metallic materials comprising a laser oscillator ( | 10-11-2012 |
| 20120267343 | TEMPERATURE CONTROLLER FOR GAS LASER - A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion and each second temperature-controlled portion in parallel. | 10-25-2012 |
| 20120292295 | LASER ADDITIVE - The present invention relates to a laser additive in the form of particles comprising a white core and a shell which comprises elemental carbon, to a process for the preparation thereof, and to the use of a laser additive of this type in organic polymers, in particular in plastics, coatings, automobile paints, powder coatings, printing inks, paper coatings and papermaking stocks for the production of durable pale laser markings, preferably on a dark background | 11-22-2012 |
| 20120312790 | PULSE CIRCULATOR - A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has a pulsed energy source that directs pulsed energy toward a substrate. A homogenizer increases the spatial uniformity of the pulsed energy. A pulse shaping system shapes the temporal profile of the pulsed energy. A pulse circulator may be selected using a bypass system. The pulse circulator allows a pulse of energy to circulate around a path of reflectors, and a partial reflector allows a portion of the pulse to exit the pulse circulator with each cycle. The pulse circulator may have delaying elements and amplifying elements to tailor the pulses exiting from the circulator. | 12-13-2012 |
| 20120312791 | HIGH THROUGHPUT SOLAR CELL ABLATION SYSTEM - A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source. | 12-13-2012 |
| 20130008878 | THERMAL FLUX ANNEALING INFLUENCE OF BURIED SPECIES - A method including introducing a species into a substrate including semiconductor material; and translating linearly focused electromagnetic radiation across a surface of the substrate, the electromagnetic radiation being sufficient to thermally influence the species. An apparatus including an electromagnetic radiation source; a stage having dimensions suitable for accommodating a semiconductor substrate within a chamber; an optical element disposed between the electromagnetic radiation source and the stage to focus radiation from the electromagnetic radiation source into a line having a length determined by the diameter of a substrate to be placed on the stage; and a controller coupled to the electromagnetic radiation source including machine readable program instructions that allow the controller to control the depth into which a substrate is exposed to the radiation. | 01-10-2013 |
| 20130020289 | METHOD AND SYSTEM TO START AND STOP A HOT WIRE SYSTEM - A method and system to start and/or stop a hot wire process. A hot wire system includes a filler wire feeder that includes a contact tube for holding a filler wire, a wire feed mechanism, a power supply for applying a heating current to the wire; and a controller coupled to the feed mechanism and the power supply. The controller is configured for regulating the heating current to the wire and locating the wire with respect to the workpiece for forming a molten puddle with an arc to initiate a hot wire process. The controller may also be configured to regulate the feed of the wire to the molten puddle and one of regulate and/or pulse the current to the wire so as to retract the wire out of the molten puddle in a stable manner when stopping the hot wire process. | 01-24-2013 |
| 20130020290 | Supply Line Routing Device - A supply line routing device is described, for routing supply lines between connection points on components which are movable relative to each other, and having a sheathing with a changeable course. The supply line routing device comprises at least one guide channel for a supply line in the interior of the sheathing; and a plurality of retaining elements disposed in succession in the longitudinal direction of the sheathing on the outside thereof, which are configured to fasten at least one additional supply line to the outside of the sheathing. | 01-24-2013 |
| 20130032580 | OPTICAL PATH STRUCTURE OF LASER PROCESSING MACHINE - An optical path structure of a laser processing machine that irradiates a laser beam from a processing head to a workpiece to perform laser processing, includes: a casing that has an opening, a light leading unit that includes a bend block including a bend mirror which deflects a laser beam traveling within the casing toward a side of the opening and an optical path tube which protrudes from the bend block toward the side of the opening for leading the laser beam to the processing head, a sealing member that is arranged at an edge part of the opening, a moving member that is abutting against the sealing member, that slides with respect to the sealing member, and that is fixed to the light leading unit, and a drive unit that integrally moves the moving member and the light leading unit in a longitudinal direction of the moving member. | 02-07-2013 |
| 20130032581 | LASER SOURCE AND LASER BEAM MACHINE - The present application discloses a laser source for emitting laser light onto a work-piece. The laser source includes a generator configured to generate the laser light, and an adjuster configured to adjust an output of the laser light. The adjuster situated between the generator and the work-piece reduces output density of the laser light on the work-piece. | 02-07-2013 |
| 20130062320 | APPARATUS AND METHODS TO MANUFACTURE HIGH DENSITY MAGNETIC MEDIA - A substrate having a pattern of magnetic properties may be formed by forming a magnetically inactive layer on the substrate, forming a magnetic precursor on the magnetically inactive layer, and forming magnetically active domains separated by magnetically inactive domains in the magnetic precursor by applying thermal energy to the magnetic precursor. The thermal energy may be applied using a laser, which may be pulsed. Forming the magnetically active domains may include crystallizing portions of the magnetic precursor. | 03-14-2013 |
| 20130068733 | LASER SYSTEM FOR THE MARKING OF METALLIC AND NON-METALLIC MATERIALS - A laser system for the marking of metallic and non-metallic materials comprising a laser oscillator, characterized in that said laser oscillator comprises: an active optical means of the crystal laser type, a laser pump to provide a pump energy to said active optical means; a mirror disposed upstream said active optical means; an optical switch, apt to provide a pulsed laser beam, disposed downstream said active optical means; a mode adaptor coupled to said optical switch; a predetermined length single-mode optical fibre, coupled to said mode adapter; a Bragg Grating type reflector coupled to said optical fibre. | 03-21-2013 |
| 20130112667 | OPTICAL DESIGN FOR LINE GENERATION USING MICROLENS ARRAY - Embodiments of the invention provide an apparatus including a substrate support, a source of laser radiation emitting laser radiation along an optical path, and an illumination optics disposed along the optical path. The illumination optics includes a set of slow-axis and fast-axis lenses. The apparatus further includes a homogenizer disposed between of the illumination optics and the substrate support along the optical path. The homogenizer includes a first and a second micro-optic lenslet arrays of cylindrical lenses, wherein the second micro-optic lenslet array of cylindrical lenses has a relatively larger lenslet pitch than that of the first micro-optic lenslet array of cylindrical lenses, and lenslet axes of the first micro-optic lenslet array and lenslet axes of the second micro-optic lenslet array are oriented along an axis that is parallel to a fast axis of the source of laser radiation. | 05-09-2013 |
| 20130112668 | Nozzle Holders and Related Systems - A nozzle holder for a nozzle changer that is configured for at least one of mounting nozzles to and demounting nozzles from a processing head of a laser processing machine includes a nozzle storage chamber that widens along a nozzle removal direction to a nozzle removal opening. The nozzle storage chamber includes at least two nozzle storage seats that are offset in steps from each other and that store respective nozzles. A nozzle changer includes such several nozzle holders, and a laser processing machine includes such a nozzle changer. | 05-09-2013 |
| 20130153546 | Apparatus for Laser Processing a Light Guide Plate and Having Constant Light Path Distance of a Laser Beam - Provided is a laser processing apparatus for a light guide plate capable of providing a high-quality light guide plate by maintaining a light path at a constant level. The laser processing apparatus includes a plurality of reflecting mirrors that reflect a laser mirror; and a path adjustment block transported in a direction a distance of the light path is reduced when a laser emitting unit is transported in a direction in which the distance of the light path is increased, wherein at least one of the plurality of reflecting mirrors is installed in the path adjustment block, thereby maintaining the distance of the entire light path on which the laser beam propagates at a constant level. | 06-20-2013 |
| 20130161297 | DEVICE FOR RE-CONTOURING A GAS TURBINE BLADE - A device for recontouring a gas turbine blade includes at least one support configured to rest on an edge of the gas turbine blade during the recontouring, at least one side bearing configured to rest on an intake side or an outlet side of the gas turbine blade during the recontouring and a machining unit for machining the gas turbine blade. The machining unit is configured to fuse at least one partial area of the edge of the gas turbine blade using a beam of energy that is targeted such that material of the blade solidifies into a new contour, substantially without the addition of supplementary material. | 06-27-2013 |
| 20130193119 | LASER MACHINING HEAD - The invention relates to a laser machining head for a laser machining machine, comprising a mount ( | 08-01-2013 |
| 20130240490 | WELDING METHOD - A tack welding method for use with a hybrid laser arc welding process. The method provides a recess on an edge of a first piece. The edge of the first piece is configured to cooperate with a second piece. The method positions the first piece relative to the second piece so as to provide a gap between the first piece and the second piece. Subsequently, the method provides a tack weld within the recess of the first piece. The recess is configured to accommodate placing the tack weld at a root of the gap. | 09-19-2013 |
| 20130264316 | LASER NOISE ELIMINATION IN TRANSMISSION THERMOMETRY - Apparatus and methods for measuring the temperature of a substrate are disclosed. The apparatus includes a source of temperature-indicating radiation, a detector for the temperature-indicating radiation, and a decorrelator disposed in an optical path between the source of temperature-indicating radiation and the detector for the temperature-indicating radiation. The decorrelator may be a broadband amplifier and/or a mode scrambler. A broadband amplifier may be a broadband laser, Bragg grating, a fiber Bragg grating, a Raman amplifier, a Brillouin amplifier, or combinations thereof. The decorrelator is selected to emit radiation that is transmitted, at least in part, by the substrate being monitored. The source is matched to the decorrelator such that the emission spectrum of the source is within the gain bandwidth of the decorrelator, if the decorrelator is a gain-driven device. | 10-10-2013 |
| 20130270230 | THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS - A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate. | 10-17-2013 |
| 20130270231 | METHOD FOR DETERMINING LASER SHOCK PEENING APPROACH ACCESSIBILITY - A system for determining accessibility of a tool to an object is provided. The system provides for selecting one or more sections on the object to be laser shock peened, selecting a region of interest on the one or more sections and determining a set of feasible solutions to access the selected region of interest on each of the one or more sections via use of an accessibility system. | 10-17-2013 |
| 20130306605 | MODIFIED LAYER FORMING METHOD - A modified layer forming method of applying a pulsed laser beam having a transmission wavelength to a workpiece through a predetermined beam entrance surface in the condition where the focal point of the pulsed laser beam is set inside the workpiece, thereby forming a desired modified layer inside the workpiece. The modified layer forming method includes the step of reducing the power of the pulsed laser beam to a power that cannot process the workpiece when a surface adjacent to the beam entrance surface of the workpiece is located at the beam entrance position of the pulsed laser beam. | 11-21-2013 |
| 20130319977 | Laser Annealing Device - The present invention relates to an improved laser annealing device, which includes a laser beam, a housing, a laser beam output window formed in a top of the housing, a substrate located at a bottom of the housing for carrying a material to be annealed, and a movable mask arranged between the laser beam output window and the substrate. The mask is set in inclination with respect to a horizontal direction. The mask forms a slit extending through upper and lower surfaces thereof. The laser beam travels vertically down through the laser beam output window and then passes through the slit to irradiate the substrate. The improved laser annealing device of the present invention includes a mask set in inclination with respect to the horizontal direction to prevent scraps from affecting the laser head, reduce replacement of the laser head, and lower down the cost. | 12-05-2013 |
| 20140001162 | BONDING HEAD | 01-02-2014 |
| 20140116995 | GRADIENT-INDEX (GRIN) LENS FABRICATION EMPLOYING LASER PULSE WIDTH DURATION CONTROL, AND RELATED COMPONENTS, SYSTEMS, AND METHODS - Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples. | 05-01-2014 |
| 20140151344 | Movable microchamber system with gas curtain - A movable microchamber system with a gas curtain is disclosed. The microchamber system has a top member with a light-access feature and a stage assembly that supports a substrate to be processed. The stage assembly is disposed relative to the top member to define a microchamber and a peripheral microchamber gap. An inert gas is flowed into the peripheral microchamber gap to form the gas curtain just outside of the microchamber. The gas curtain substantially prevents reactive gas in the ambient environment from entering the microchamber when the stage assembly moves relative to the top member. | 06-05-2014 |
| 20140202994 | COMPACT, COHERENT, HIGH BRIGHTNESS LIGHT SOURCES FOR THE MID AND FAR IR - Compact high brightness light sources for the mid and far IR spectral region, and exemplary applications are disclosed based on passively mode locked Tm fiber comb lasers. In at least one embodiment the coherence of the comb sources is increased in a system utilizing an amplified single-frequency laser to pump the Tm fiber comb laser. The optical bandwidth generated by the passively mode locked Tm fiber comb laser is further decreased by using simultaneous 2 | 07-24-2014 |
| 20140238958 | Systems and methods for material processing using light-emitting diodes - Systems and methods for processing a material layer supported by a substrate using a light-source assembly that includes LED light sources each formed from an array of LEDs. The material layer is capable of undergoing a photo-process having a temperature-dependent reaction rate. Some of the LEDs emit light of a first wavelength that initiate the photo-process while some of the LEDs emit light of a second wavelength that heats the substrate. The heat from the substrate then heats the material layer, which increases the temperature-dependent reaction rate of the photo-process. | 08-28-2014 |
| 20140238959 | PROCESSING SYSTEM - A processing system includes a rotary stage, at least one shaft, a rotation driver, a plurality of loading platforms, and a plurality of processing devices. The rotary stage includes two opposite end surfaces and a plurality of loading surfaces between the end surfaces. The shaft connects the end surfaces of the rotary stage. The rotation driver connects the shaft. The loading platforms are respectively disposed on the loading surfaces of the rotary stage. The processing devices are respectively disposed corresponding to the loading platforms. | 08-28-2014 |
| 20140238960 | LASER PROCESSING HEAD WITH AXIAL CRASH PROTECTION - An upper housing assembly includes a pivot arm having an upper cam surface adjacent a distal end. A cam follower is coupled to a laser head to move up and down with a laser head. The cam follower exerts a downward force on the upper cam surface during normal operation. Thus, as the pivot arm rotates back and forth, the laser head moves up and down. A assist gas hose can be coupled between the upper housing and the laser head which has a spiral configuration permitting relative axial movement between the upper housing and the laser head. Upon an upward axial force being exerted on the laser head, the cam follower moves upwardly away from the upper cam surface. | 08-28-2014 |
| 20140263200 | APPARATUS AND METHOD FOR LASER CLEANING OF COATED MATERIALS PRIOR TO WELDING - A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece. | 09-18-2014 |
| 20140353293 | MOVING A LASER PROCESSING HEAD RELATIVE TO A CLAMPING CLAW - A laser processing device for processing workpieces such as by welding includes a laser processing head and a workpiece clamping claw defining an opening through which the laser beam is focused on the workpiece. Each of the laser processing head and the clamping claw have respective shielding portions and movable relative to each other to selectively form a light-tight housing about a portion of the beam extending between the laser head and the clamping claw. | 12-04-2014 |
| 20150328717 | METHODS OF REPAIRING INTEGRALLY BLADED ROTORS - A method of repairing an integrally bladed rotor includes removing a portion of the integrally bladed rotor to create a void in an airfoil, completely filling the void with a single replacement material, and laser shock peening the replacement material. Laser shock peening the replacement material imparts mechanical properties in the replacement material substantially the same as those in the forged material. | 11-19-2015 |
| 20150336210 | LASER NOZZLE WITH MOBILE ELEMENT OF IMPROVED EXTERNAL PROFILE - The invention relates to a nozzle for laser cutting comprising a nozzle body ( | 11-26-2015 |
| 20160023305 | OPTICAL MASK PLATE AND LASER LIFT-OFF DEVICE - The present invention provides an optical mask plate and a laser lift-off device. The optical mask plate comprises at least one totally-transmissive region and a blocking region surrounding the totally-transmissive region. The totally-transmissive region allows lasers having a predetermined wavelength to completely pass therethrough, while the blocking region does not allow the lasers having the predetermined wavelength to pass therethrough. The laser lift-off device comprises the optical mask plate. During the whole process of scanning a rigid substrate with the laser beam, as a laser emitter for emitting the laser beam can be in an on state all the time, the energy of the laser beam is nearly uniform in the process of scanning the rigid substrate with the laser beam, and in this way, edge portions of a flexible device can be prevented from being burned by the laser beam. | 01-28-2016 |
| 20160062128 | OPTICAL MODULE AND LIGHT EXPOSURE DEVICE - An optical module ( | 03-03-2016 |
| 20160252732 | LASER OPTICAL SYSTEM AND LASER ANNEALING DEVICE INCLUDING THE SAME | 09-01-2016 |
