| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 219121710 | Methods | 85 |
| 20080197120 | Method For Producing a Hole and Associated Device - Conventional methods for producing a hole in a component make use of special lasers with short laser pulse lengths. The aim of the invention is to reduce the time and money required for producing a hole. According to the inventive method, the laser pulse lengths are varied, short laser pulse lengths only being used in the area to be removed in which an influence on the throughflow or exhaust behavior is noticeable. This is, e.g., the inner surface of a diffuser of a hole that can be produced in a very precise manner using short laser pulse lengths. | 08-21-2008 |
| 20080223835 | METHODS OF FORMING FAN-SHAPED EFFUSION HOLES IN COMBUSTORS - Methods are provided of forming a plurality of fan-shaped effusion holes on a combustor having a surface, each hole having an outlet on the combustor surface. The method may include rotating the combustor relative to a laser beam, and positioning the combustor to a first position where the laser beam is at a first predetermined angle relative to the combustor surface. The laser beam is pulsed at the combustor surface to form a first plurality of trepan cuts. The first predetermined angle is adjusted to a second position where the laser beam is at a second predetermined angle relative to the combustor surface. The laser beam is pulsed at each trepan cut of the first plurality of trepan cuts, to thereby form a cut for at least a portion of the fan shape of each effusion hole outlet, wherein each cut overlaps a trepan cut of the first plurality of trepan cuts. | 09-18-2008 |
| 20080237205 | SMALL HOLE LASER MACHINING METHOD - A method of laser machining a small hole with high machining precision in a machined object. The method includes the steps of emitting a laser beam with a fixed optical axis onto a machined object while the machined object is rotated. When the optical axis of the laser beam is fixed in place, the edges of the small hole to be machined are irradiated and the small hole becomes essentially circular even if the cross-sectional shape at the focus of the laser beam is not circular. When the small hole is formed completely through the machined object, a plume is suctioned for removal from a portion of the machined object on a side opposite from the machined hole. | 10-02-2008 |
| 20080272095 | METHOD FOR MACHINING TAPERED MICRO HOLES - A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material. | 11-06-2008 |
| 20080296273 | METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER - A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO | 12-04-2008 |
| 20090001061 | Method For Producing a Hole - There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages. | 01-01-2009 |
| 20090020512 | Laser drilling components - A method of drilling through a wall of a hollow component in which a high energy beam is directed at an outer surface of the wall and emerges into a cavity from an inner surface of the wall, comprising the step of providing in the cavity a medium comprising a ceramic dispersed within a silica sol. | 01-22-2009 |
| 20090032507 | METHOD FOR PRODUCING METAL MASK FOR SCREEN PRINTING - A method for producing a metal mask for screen printing is provided, in which dross that is deposited at the time a boring operation is conducted via a laser beam is removed, without causing warpage or bending. The method for producing a metal mask for screen printing includes steps of: forming openings in the metal plate by melting the metal plate at positions irradiated by the laser beam; and ejecting an abrasive onto the other surface of the metal plate after the openings are formed. The abrasive ejected in the abrasive ejection step is one having a predetermined flat shape (plate-shaped abrasive), so as to form a plate shape having a flat surface, or an elastically deformable abrasive, with an average grain diameter of a dispersed or carried abrasive grain being 1 mm to 0.1 μm, and which is ejected at an incident angle of equal to or less than 80 degrees with respect to the other surface of the metal plate, and at an ejection pressure of 0.01 MPa to 0.7 MPa or at an ejection speed of 5 m/sec to 150 m/sec, so as to slide along the other surface of the metal plate. | 02-05-2009 |
| 20090032508 | PERFORATION METHOD AND PERFORATION APPARATUS - A perforation method and an perforation apparatus in which a hollow member of a fuel injection nozzle is filled with a filler such as a zirconia ball, and a laser light is applied to the hollow member to form an injection hole while vibrating the zirconia ball using an ultrasonic vibrator. After the injection hole is formed, the laser light is introduced through the injection hole to the inside of the fuel injection nozzle, and thereby is applied to the vibrated zirconia ball. | 02-05-2009 |
| 20090057281 | METHOD AND APPARATUS FOR FORMING HOLE - In a method of forming a hole on a work piece, a laser beam is directed from a laser head to a predetermined portion of the work piece to form a pilot hole having a first surface condition, and then the predetermined portion of the work piece is punched using a die and a punch having a cross-section greater than a cross-section of the pilot hole. Thus, a finished hole having a cross-section greater than the cross-section of the pilot hole is formed over the pilot hole. The finished hole has a second surface condition, and the second surface condition is formed by transforming the first surface condition by the punch to have a precise dimension. | 03-05-2009 |
| 20090057282 | Laser machining method utilizing variable inclination angle - A method of laser machining is disclosed. The method of laser machining may include directing a laser beam emitted by an optical device onto a workpiece at an inclination angle to create a cut in the workpiece and varying the inclination angle of the laser beam. | 03-05-2009 |
| 20090127239 | Laser piercing method and processing apparatus - A processing apparatus is provided in which a laser beam L | 05-21-2009 |
| 20090134136 | Apparatus and method to machine holes - The present invention relates to an apparatus for machining holes, especially to machine holes in a surface of a coated gas turbine airfoil, which apparatus comprises a laser device for laser drilling and an electrode for electrical discharge machining. Further the invention relates to a method to machine a hole into a coated surface with an apparatus of the incipiently mentioned type. Known methods make use of a machine with separate machine heads for laser drilling and electrical discharge machining. By combining these two devices in one machine head the invention gives the possibility to save time and obtain very accurate results. | 05-28-2009 |
| 20090173723 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD USING THE SAME TECHNICAL FIELD - A laser processing apparatus is provided in which its XY table is composed of plural divided blocks vertically movable, at least one divided block is stopped while it is moving down, and a through hole is formed by irradiating a workpiece in an area corresponding to a position directly above the divided block with a laser beam. | 07-09-2009 |
| 20090194516 | METHOD AND APPARATUS FOR VIA DRILLING AND SELECTIVE MATERIAL REMOVAL USING AN ULTRAFAST PULSE LASER - A method and apparatus for selective material removal and via drilling for semiconductor applications using an ultrafast laser pulse directly from an ultrafast pulse laser oscillator without amplification are disclosed. The method and apparatus includes techniques to avoid/reduce the cumulative heating effect and to avoid machine quality degrading in multi shot ablation. Also the disclosed method and apparatus provide a technique to change the polarization state of the laser beam to reduce the focused spot size, and to improve the machining efficiency and quality. The disclosed method and apparatus provide a cost effective and stable system for high volume manufacturing and inspection applications. The disclosed method and apparatus have particular applications in, but not limited to, drilling vias for interconnect formation, selective material removal for application specific integrated circuits, selective material removal for flash memory applications, exposing layers for further semiconductor processing such as wire bonding etc. The ultrafast laser oscillator can be a called a femtosecond laser oscillator or a picosecond laser oscillator depending on the pulse width of the laser beam generated. | 08-06-2009 |
| 20090230103 | LASER BEAM PROCESSING MACHINE - A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction). | 09-17-2009 |
| 20090236323 | METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH TAILORED LASER PULSES - An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown. | 09-24-2009 |
| 20090242528 | METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH GAUSSIAN PULSES - An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses. | 10-01-2009 |
| 20090242529 | Method to cut apertures in a material - A method is described for the cutting of apertures in a material using a computer, laser control software, input device, laser and an x-y plotting bed. The method is to preferably form apertures in fluid impermeable material including composite materials. The apertures are used as exhaust valves in positive pressure masks to deliver breathable gas to patients and in garments. | 10-01-2009 |
| 20090283508 | Method for producting a hole - A method for producing a hole with side-delimiting flanks in a component using a laser beam is provided. A laser beam is directed onto the component. A side flank of the hole is traced with the laser beam. A partial volume of the hole is formed by vaporizing the component material. This is repeated until the whole volume is formed. The laser beam may be oriented so that it includes an angle of more than 8° with the traced side flank. | 11-19-2009 |
| 20090294421 | Manufacturing system for producing reverse-tapered orifice - A manufacturing system for producing a reverse-tapered orifice is disclosed. The manufacturing system may have a mount configured to hold a workpiece, and a laser source configured to generate a laser beam. The manufacturing system may also have a delivery media operatively connected to the laser source. The delivery media may be configured to deliver the laser beam into a hollow portion of the workpiece to create the orifice through a wall of the workpiece having a laser beam entrance opening larger than a laser beam exit opening. | 12-03-2009 |
| 20100059489 | Method for Producing a Series of Through Holes in a Layer of Material By Means of a Laser Beam - The present invention relates to the production of a series of holes in a layer of material, in particular to the production of a target rupture line in a first layer of an airbag cover. The radiation of a plasma that forms during the production of each hole is detected from the surface that is being machined. From the signal pattern derived, the time of the beginning of the signal and the time of the appearance of a falling edge that meets a predetermined edge criterion are detected and stored. The point in time at which the falling edge appears is a switching criterion for switching off the laser. The difference between the two points in time stored for each hole constitutes a quality criterion for the respective hole. | 03-11-2010 |
| 20100116799 | ROLLER MACHINING METHOD AND ROLLER MACHINING APPARATUS - A laser beam | 05-13-2010 |
| 20100126973 | LASER CUTTING SHAPED HOLES BY TREPANNING ON THE FLY - A method of forming a plurality of shaped holes on a workpiece. The method may include rotating the workpiece about multiple axes relative to a laser beam, and positioning the laser at a first predetermined angle relative to the workpiece. The laser beam is pulsed to form a first plurality of trepan cuts defining a row of metering holes. The laser beam, after adjusting to a next predetermined angle and adjacent a previous row of trepan cuts, is pulsed to create a plurality of rows of trepan cuts wherein each cut in the previous row of trepan cuts is connected to a cut in said subsequent row of trepan cuts. The plurality of rows of trepan cuts are formed in a side-to-side sweeping formation and define a portion of each of the shaped holes. Next, the laser is pulsed in alignment with the metering hole to remove debris from therein. | 05-27-2010 |
| 20100126974 | METHOD OF PRODUCING DRIP IRRIGATION TUBES - In a method for producing drip irrigation tubes, a tube body is extruded, in which tube body dosing elements are inserted and are connected to the inner surface of the tube body. In the region of the dosing elements, outlet apertures are made in each case in the tube body using a laser boring device with a specified radiation intensity, through which apertures the water can escape in drops. The radiation intensity of the laser boring device is reduced between procedures. Via a laser optical system co-operating with the laser boring device, the laser beam is led in a controlled way over the surface of the drip irrigation tube, and alphanumerical symbols are burned into this surface. Production of drip irrigation tubes and their labeling can thus be carried out in one operation. | 05-27-2010 |
| 20100147812 | Method For Producing A Hole - There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations. | 06-17-2010 |
| 20100219169 | METHOD AND DEVICE FOR PRODUCING NOZZLE-TYPE OPENINGS IN SPRAY ARMS FOR DISHWASHER MACHINES - A device and a method for producing nozzle-type openings in spray arms for dishwasher machines, which enables the form of the nozzle-type openings in spray arms to alter rapidly even if only one spray arm is provided and enable different nozzle geometries to be created during the production process in the event of different spray arms. | 09-02-2010 |
| 20100282726 | MULTIPLE BEAM DRILLING SYSTEM - A method for laser drilling of holes in a substrate ( | 11-11-2010 |
| 20100282727 | LASER WORKING APPARATUS, AND LASER WORKING METHOD - A first laser working method includes a step of irradiating the metallic work held by a rotation holding mechanism, with a nanosecond laser beam from a first laser oscillation mechanism, to form a through hole, and a step of irradiating, when the metallic work is rotated under the action of the rotation holding mechanism, the inner wall of the through hole with a picosecond laser beam from a second laser oscillation mechanism, thereby to finish the same. While forming the through hole, metal vapor is sucked from the outside of the metallic work. Then, the gas is fed from the outside of the metallic work, and the inside of the metallic work is suctioned. In a second laser working method, when a lower hole made through is radially enlarged, the exit side of the lower hole is kept lower in pressure than the laser incident (or entrance) side. | 11-11-2010 |
| 20100294747 | X-RAY MICROSCOPY FOR CHARACTERIZING HOLE SHAPE AND DIMENSIONS IN SURGICAL NEEDLES - A novel method of characterizing laser drilled boreholes is disclosed. The method uses x-ray microscopy for dimensional characterization. The x-ray output may be processed to control manufacturing equipment in automated production systems, including laser drilling systems and swaging apparatus. | 11-25-2010 |
| 20100314366 | APPARATUS AND METHOD FOR ARRANGING THROUGH OPENINGS IN A MOVABLE BAND - An apparatus and a method for arranging through-openings in a flexible, movable band, said through-openings being arranged in series in at least one row, wherein each through-opening is arranged in the bottom of one of a plurality of depressions for receiving electronic components, said depressions being arranged in series in at least one row, wherein a laser device with at least one laser beam is arranged so as to act on sides of bottoms of the depressions facing away from the depressions, wherein the laser device is designed in such a way that, by means of the at least one laser beam, the through-openings can be burned into a predefinable portion of the band at predefinable positions on the bottom sides, within a predefinable period of time. | 12-16-2010 |
| 20110017715 | Systems and Methods For Enhanced Control of Laser Drilling Processes - Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes. | 01-27-2011 |
| 20110036819 | Process for Producing a Hole Using Different Laser Positions - Methods for producing a continuous hole in a substrate are provided. A laser is used for producing an inner proportion and a diffuser of the continuous hole, wherein an angular position of the laser with respect to the substrate is changed at least three times. | 02-17-2011 |
| 20110114610 | Controlling Slag Adhesion When Piercing a Workpiece With a Laser Beam - Piercing a workpiece with a laser beam, while directing multiple gas flows onto the workpiece at angles and locations that cause the gas flows to blow slag away from the piercing location and produce a gas cushion between the blown away slag and the workpiece, thereby reducing adhesion of slag. A laser processing head is accordingly configured with additional gas nozzles. | 05-19-2011 |
| 20110132881 | APPARATUS AND METHODS FOR DRILLING HOLES WITH NO TAPER OR REVERSE TAPER - Apparatus and methods for drilling holes in a material with a laser are disclosed. An apparatus for drilling holes in a material with a laser includes a first steering element, a second steering element, and a lens. The first steering element is positioned to steer a beam from the laser. The second steering element is positioned to steer the beam from the first steering element. The lens focuses the beam from the second steering element. The first and second steering elements are configured to move with respect to the beam. Moving the first and second steering elements changes an angle of the beam where it contacts the material. The apparatus is operable to drill holes having no taper or reverse taper. | 06-09-2011 |
| 20110132882 | Filler for the Drilling of Through-Holes in Hollow Components, a Process and Apparatus Therefor - A filler made of glass beads is provided. The glass improves the absorption and the distribution of the energy of the beam such that an internal wall of the hollow component is not damaged. A process for producing a through-hole in a hollow component is provided. Also, an apparatus for laser drilling is provided. | 06-09-2011 |
| 20110147351 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD - A laser processing apparatus for piercing a workpiece and cutting the pierced workpiece by irradiating the workpiece with a laser beam. The apparatus includes: a laser beam projection unit for projecting the laser beam onto the workpiece with the focus position thereof set to lie within the workpiece and in the vicinity of the surface of the workpiece at least when piercing is started; and a laser oscillator that emits the laser beam as a pulsed laser having a frequency at which plasma is generated when the workpiece is irradiated with the laser beam at the focus position set through the laser beam projection unit when the piercing is started. | 06-23-2011 |
| 20110163078 | DEVICE AND METHOD FOR MACHINING WORKPIECE WITH A LASER BEAM - A laser machining device machines a workpiece having a machining portion where a hole is machined and a non-machining portion positioned on an extension of the hole. The laser machining device includes a nozzle that jets a column of liquid towards the hole of the machining portion and a laser head that introduces a laser beam into the column of liquid jetted towards the hole. The workpiece is held by a holding member. A laser beam blocking member is disposed in the non-machining portion. The laser beam blocking member blocks the laser beam that passes through the hole. Furthermore, a discharge path that discharges the liquid reaching the hole is provided in the laser beam blocking member. | 07-07-2011 |
| 20110198321 | METHOD FOR BORING BOTTLE-LIKE HOLES HAVING A DEFINED GEOMETRY BY MEANS OF PULSED LASER RADIATION - The present invention is a method and system for the drilling of holes in a workpiece within a diameter range of 20 μm to 500 μm by means of laser radiation. The invention utilizes the beam quality of a laser beam as well as: the polarization of the laser radiation; the parameters of the impulses of the laser used; and, the type and pressure of the process gas used. The method and system utilize means for focusing laser radiation, in particular the ratio of the beam diameter at the site of the focusing element and its focal distance, and wherein the focusing is done in coordination with the beam quality number and wave length and other factors. A first working gas supports the formation of the hole shape and accelerates the drilling process; and, a second working gas is utilized to improve the surface quality of the drilling walls. | 08-18-2011 |
| 20110240615 | METHOD AND APPARATUS FOR IMPROVING RELIABILITY OF A MACHINING PROCESS - A process for providing a protection against damages in a machine head, wherein the machine head launches a transparent liquid jet guided laser beam LB by means of a nozzle | 10-06-2011 |
| 20110272387 | Laser drilling without burr formation - A process for making a hole into a substrate by a laser is provided. According to the proposed process, in a first step, at least one intermediate hole is produced into the substrate by at least one laser, the intermediate hole having an intermediate diameter that is smaller than a final diameter of the hole to be made. In a second step, the hole having the final diameter is produced into the substrate by the at least one laser. | 11-10-2011 |
| 20110278270 | LASER DRILLING METHOD AND SYSTEM - A laser drilling system ( | 11-17-2011 |
| 20110309059 | APPARATUS AND METHOD FOR PERFORATING MATERIAL - An apparatus for creating a hole in solid sheet material ( | 12-22-2011 |
| 20120074108 | METHOD FOR DRILLING MICRO-HOLE AND STRUCTURE THEREOF - Disclosed is a micro-hole structure and a method for forming the micro-hole. A working energy source is projected onto a predetermined drilling site on a first surface of a substrate for a given period of time so as to melt a portion of the substrate to form a working energy entering section until the working energy source penetrates through a second surface of the substrate to form a micro-hole. A melt formed by melting a portion of the substrate in the micro-hole next to the second surface is allowed to reflow in a direction opposite to the projection of the working energy source to thereby form a reflow section in the substrate. Further, a two or more stages emission of laser pulses is used to form the micro-hole to control the bore diameter of the micro-hole. | 03-29-2012 |
| 20120080415 | METHOD AND DEVICE FOR PRODUCING A HOLE IN AN OBJECT - A method and device for producing a hole in an object is disclosed. The method includes the generation of a beam for removing material such that a bottom of a borehole is placed in a focus position of the beam, and a removal of material by impingement of the beam on the bottom of the borehole. A repeated placing of the bottom of the borehole in a focus position of the beam in order to compensate for the increased depth of the hole as a result of the removal of material is combined with a step of changing a radiation characteristic of the beam when the bottom of the borehole is repeatedly placed in a focus position. | 04-05-2012 |
| 20120085739 | METHOD FOR PERFORATING MATERIAL - A method of drilling holes through a solid material in such manner as to give holes in a first area a first profile and distribution and holes in a second area a second profile and distribution comprising the steps of: defining a first area in which holes have a first profile and distribution; defining a second area in which holes have a second profile and distribution at least one of which is different from that in the first area; defining a transition zone in which holes have a profile and/or distribution as the case may be which undergo a continuous and gradual transition from that in the first area to that in the second area; drilling holes in all of the first area, the transition zone and the second area via a continuous process. | 04-12-2012 |
| 20120091106 | Method For Producing A Hole - There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations. | 04-19-2012 |
| 20120111841 | METHOD AND APPARATUS FOR DRILLING USING A SERIES OF LASER PULSES - A series of laser pulses, each pulse characterized by one or more predetermined pulse characteristics including wavelength, pulse energy, inter-pulse time interval, pulse width or pulse shape, is provided to drill a hole in a material. Drilling the hole in the material is achieved by placing the series of laser pulse spots at the location wherein the hole is to be drilled. One or more characteristics of one or more laser pulses in the series is changed in order to optimize the drilling process for the hole. The ability to change the characteristics of one or more laser pulses in the series of pulses to optimize the drilling process results in holes with desired attributes and a high drilling rate. | 05-10-2012 |
| 20120152917 | METHOD FOR MAKING AND REPAIRING EFFUSION COOLING HOLES IN CUMBUSTOR LINER - A method for making or repairing a laser drilled hole in a component of gas turbine engines, to meet requirements of air flow through the hole, includes deformation of an excess material melted during the laser drilling process and remaining around an opening end of the hole, thereby causing a marginal reduction in an effective diameter of the hole. | 06-21-2012 |
| 20120205355 | Method for producing an asymmetric diffuser using different laser positions - A process for producing a hole with an asymmetrical diffuser is produced. The angular position of the laser with respect to the substrate is changed discontinuously during the processing. The production of complex holes in a substrate is simplified by using a laser in five different angular positions relative to a substrate to be processed. | 08-16-2012 |
| 20120267350 | METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH GAUSSIAN PULSES - An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses. | 10-25-2012 |
| 20130020291 | LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES - A method for providing a shallow-angled hole through a metal component, such as a turbine combustor, includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a trepanning concept. A further step is conducted to apply the pulse laser beam through the completed section of the hole to further drill through a base metal of the component to complete the formation of the hole extending through the component. | 01-24-2013 |
| 20130020292 | LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES - A method for providing a shallow-angled hole through a thermal barrier coated component in accordance with one aspect thereof, includes a step of applying a pulse laser beam to pre-drill the hole through a base metal of the component. A thermal barrier coating is then applied to the base metal, covering the pre-drilled hole in the base metal. A further step is conducted to apply the pulse laser beam through the thermal barrier coating a location to coincide with pre-drilled hole in the base metal in order to complete the formation of the hole extending through the component. | 01-24-2013 |
| 20130020293 | LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES - A method for drilling a shallow-angled hole through a thermal barrier coated component includes a step of applying a pulse laser beam to drill a section of the hole substantially within a thermal barrier coating of the component in a direction substantially perpendicular to a top surface of the component. A further step is conducted to apply the pulse laser beam to further drill through a base metal of the component to complete the formation of the hole extending through the component. | 01-24-2013 |
| 20130020294 | LASER DRILLING METHODS OF SHALLOW-ANGLED HOLES - A method for drilling a shallow-angled hole through a thermal barrier coated component, in accordance with one aspect thereof, includes a step of applying a pulse laser beam with a first setting to drill a section of the hole substantially within a thermal barrier coating of the component. A further step is conducted to apply the pulse laser beam with a second setting through the initiated hole to further drill through a remainder of the component to complete the formation of the hole extending through the component. | 01-24-2013 |
| 20130026144 | METHOD AND SYSTEM OF LASER PROCESSING FOR PIERCING - A laser processing method including a first step of irradiating a surface of a workpiece with a laser beam with a focal point spaced from the surface, and forming a bottomed hole on the workpiece, which is defined with a tubular inner circumferential face opening at the surface and a bottom face; and a second step of irradiating the bottom face with a laser beam while an assist gas is blown into an opening of the bottomed hole but not blown onto an area surrounding the opening, and forming a through hole penetrating through the workpiece. A laser processing system includes a processing head focusing a laser beam emitted from a laser oscillator so as to irradiate a workpiece with the laser beam and blowing an assist gas onto the workpiece; and a control section controlling the first and second steps as an operation of the processing head. | 01-31-2013 |
| 20130037527 | Fixture for Drilling Vias in Back-Contact Solar Cells - Methods and systems for manufacturing back contact solar cells that have improved efficiency and device electrical properties. the solar cell device described herein includes an Emitter Wrap Through (EWT) solar cell that has plurality of laser drilled vias disposed in a spaced apart relationship to metal gridlines formed on a surface of the substrate. Solar cell structures that may benefit from the invention disclosed herein include back-contact solar cells, such as those in which both positive and negative contacts are formed only on the rear surface of the device. | 02-14-2013 |
| 20130048617 | HOLE FORMING METHOD AND LASER PROCESSING APPARATUS - A hole forming method of forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material. The hole forming method includes a minimum shot number setting step of setting as a minimum value the number of shots of a pulsed laser beam applied to the workpiece at the time the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to the spectral wavelength inherent in the second material, and a maximum shot number setting step of setting as a maximum value the number of shots of the pulsed laser beam at the time the spectral wavelength of the plasma has completely changed. In a hole forming step, the application of the pulsed laser beam is stopped in the case that the number of shots has reached the minimum value and the spectral wavelength of the plasma has changed whereas the application of the pulsed laser beam is continued until the number of shots reaches the maximum value in the case that the spectral wavelength of the plasma has not changed even after the number of shots has reached the minimum value. | 02-28-2013 |
| 20130068736 | SYSTEMS AND PROCESSES THAT SINGULATE MATERIALS - Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects. | 03-21-2013 |
| 20130146570 | METHODS AND SYSTEMS FOR USE IN LASER MACHINING - The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage. | 06-13-2013 |
| 20130153555 | PROCESS FOR LASER MACHINING A LAYER SYSTEM HAVING A CERAMIC LAYER - A process of laser machining a layer system is provided. The layer system has at least one metallic substrate and an outer ceramic layer. After laser machining the layer system, a layer thickness of the outer ceramic layer is reduced by a laser process and/or a smoothing process. The laser machining includes creating a plurality of passage holes using a diffuser. | 06-20-2013 |
| 20130200051 | Workpiece Cutting - In some aspects, methods includes forming intersecting apertures in a workpiece with a laser beam by moving the laser beam along intersecting line paths, and cutting out a portion of a shape from the workpiece by moving the laser beam along a continuous final path extending around an intersection point of the intersecting line paths. | 08-08-2013 |
| 20130206739 | MANUFACTURING METHODS FOR MULTI-LOBED COOLING HOLES - A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof. | 08-15-2013 |
| 20130264318 | Industrial Fabric for Producing Tissue and Towel Products, and Method of Making Thereof - A nonwoven fabric includes a plurality of through voids, where each of the voids has a first opening associated with a top surface of the fabric and a first raised edge circumferentially adjacent to the first opening. The voids may each further include a second opening associated with a bottom surface of the fabric and a second raised edge circumferentially adjacent to the second opening, such that the first opening may have a surface area that is larger than or the same as the second opening. | 10-10-2013 |
| 20130299472 | METHOD FOR PERFORATING A WALL OF A COMBUSTION CHAMBER - A method for perforating a wall, includes calculating mechanical stresses applied on the wall for a use of the wall. The method further includes perforating an orifice in a first determined zone of the wall, the perforation being made using a tool with a cross-section dependent on the mechanical stresses calculated in the first determined zone. | 11-14-2013 |
| 20140014635 | SYSTEM AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES - Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece. | 01-16-2014 |
| 20140048521 | METHOD FOR PRODUCING A HOLE - There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages. | 02-20-2014 |
| 20140151348 | METHOD FOR GENERATING AT LEAST ONE THROUGH-HOLE AND DEVICE FOR CARRYING OUT SUCH A METHOD - The invention relates to a method for generating at least one through-hole ( | 06-05-2014 |
| 20140217075 | METHOD OF FORMING THROUGH HOLE IN INSULATING SUBSTRATE AND METHOD OF MANUFACTURING INSULATING SUBSTRATE FOR INTERPOSER - A method including (a) preparing an insulating substrate, and (b) forming n (n is an integer equal to or greater than 9) through holes on the insulating substrate in a through hole density in a range of 1000 pieces/cm | 08-07-2014 |
| 20140263215 | Laser Systems for Drilling Holes in Medical Devices - Novel laser drilling systems are disclosed. The laser drilling systems are useful for drilling bore holes in medical devices, especially blind bore holes in surgical needles. The laser systems use a low power fiber seed laser to produce a high quality laser beam that is modulated and amplified, and which has precise characteristics to produce precision drilled holes. | 09-18-2014 |
| 20140263216 | Hard Drive Data Destroying Device - Three systems for the destruction of the data storage portion of electronic media storage devices such as hard disk drives, solid state drives and hybrid hard drives. One system utilizes a mill cutter with which the hard drive has relative motion in the direction of the axis of the mill cutter to destroy the data storage portion. A second system utilizes a laser to physically destroy the data storage portion. The third system utilizes a chemical solvent to chemically destroy the data storage portion. | 09-18-2014 |
| 20140312015 | LASER PROCESSING APPARATUS, METHOD OF LASER PROCESSING, METHOD OF FABRICATING SUBSTRATE, AND METHOD OF FABRICATING INKJET HEAD - In the case where the workpiece ( | 10-23-2014 |
| 20140332512 | LASER DRILLING WITHOUT BURR FORMATION - A process for making a hole into a substrate by at least one laser includes a first step which involves producing at least one intermediate hole with a diameter which is smaller than a final diameter of a final hole to be produced. The intermediate hole with the smaller diameter is a through-hole. The intermediate hole is produced by percussion process. The process further includes a second step which involves producing the final hole having the final diameter. The final hole is produced by machining the intermediate through-hole by a trepanning process so that the final diameter of the final hole is achieved. | 11-13-2014 |
| 20140332513 | DEVICE FOR DRILLING A SUBSTRATE AND A METHOD FOR DRILLING A SUBSTRATE - A device is used for drilling a substrate, in particular a device for generating a hole or recess or well in an electrically insulating or semiconducting substrate, more specifically a device for generating a plurality of holes or recesses or wells in an electrically insulating or semiconducting substrate. | 11-13-2014 |
| 20150021304 | LASER MACHINING METHOD, LASER MACHINING APPARATUS, AND LASER MACHINING PROGRAM - Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S | 01-22-2015 |
| 20150298261 | MITIGATING DISTORTION OF COATED PARTS DURING LASER DRILLING - A method for drilling holes in a part includes positioning the part relative to a laser source, applying a first stress to the part, and applying a laser from the laser source to the part to drill a hole therein, wherein the first stress which is present during the application of the laser counteracts a second stress induced by the application of the laser. | 10-22-2015 |
| 20150352671 | LASER CUTTING SAME SIDE SLUG REMOVAL - A method of laser cutting a slug from a workpiece may include angling a laser cutting head other than perpendicular relative to a cutting surface of a layer of the workpiece from which the slug will be cut, laser cutting the slug from the layer, with the slug having a wider portion on the cutting surface than a portion of the slug on a backside surface of the layer, and removing the slug from the layer through the cutting surface side of the layer. | 12-10-2015 |
| 20160067831 | WIRE FOR I-SHAPE OIL RINGS AND PRODUCING METHOD OF THE SAME - Provided is a wire rod for an I-type oil ring, which includes right and left rail portions and a web portion connecting the rail portions, which has an oil hole or a molten through hole formed in the web portion, and which has a circumscribing circle diameter of 10 mm or less in its transverse contour. The molten through hole has such a remolten portion formed on its exit side as encloses the exit of the molten through hole. The remolten portion exceeds such a molten portion in the transverse section along the center of the molten through hole as is formed in the molten through hole, and is formed to have 200 μm or less from the outer circumference of the molten through hole and 100 μm or less in the depth direction of the molten through hole. | 03-10-2016 |
| 20160082549 | LASER DRILLING METHOD AND APPARATUS WITH RADIATION OUTPUT CHANGES IN A RADIAL DIRECTION DURING DRILLING OF A WORKPIECE - A laser drilling method is a laser drilling method for performing drilling on a workpiece by use of a laser beam. The laser drilling method includes, after machining a through hole by radiating the laser beam to the workpiece (S | 03-24-2016 |
| 20160096238 | Method for Removing, by means of a Laser Beam, a Bulge deposited on the Surface of a Workpiece when a Through Hole is formed - Methods and systems are implemented for forming a through hole in a workpiece using a laser beam and a process gas, such as oxygen or nitrogen, coming from a gas nozzle. A hole is formed in the workpiece using the laser beam and a process gas emerging from a gas nozzle, such that the formed hole extends only partially through the workpiece. A bulge deposited while forming the hole partially through the workpiece is removed from the workpiece surface by directing a flow of gas through the nozzle toward the workpiece surface as the nozzle is moved with the laser beam switched off, the flow of gas being delivered to the nozzle at a higher pressure than the process gas is delivered to the nozzle during forming the hole partially through the workpiece. Then, the hole is fully pierced through the workpiece by the laser beam using the process gas. | 04-07-2016 |
| 20160199941 | METHOD AND SYSTEM FOR CONFINED LASER DRILLING | 07-14-2016 |
| 20160199942 | METHOD AND SYSTEM FOR CONFINED LASER DRILLING | 07-14-2016 |
| 20160199943 | METHOD AND SYSTEM FOR CONFINED LASER DRILLING | 07-14-2016 |
| 20160199945 | METHOD AND SYSTEM FOR CONFINED LASER DRILLING | 07-14-2016 |
| 20170232559 | METHOD AND DEVICE FOR PROCESSING COOLING HOLE ON WORKPIECE WITH LASER | 08-17-2017 |
