| Entries |
| Document | Title | Date |
|---|
| 20080217309 | RFID antenna gain and range enhancement - This is an invention which addresses the need of the RFID industry to produce antennas which do not detune due to the proximity of other antennas. This invention also addresses the problem of reading RFID transponders which are not in a perpendicular orientation to the interrogator. This invention also addresses the need of the RFID industry to increase the read range of RFID antennas. Although this invention focuses primarily on the interrogator side of antenna gain and range enhancement it is equally applicable to the antenna portion of the base metal material which comprises the antenna structure of a transponder. The useful, non-obvious and novel steps of this invention include a laser ablation process applied to the base metal material, whether copper or aluminum, for the purpose of creating three dimensional nano structures on the surface of the base metal material. Pursuant to this process the absorption rate of the base metal material is enhanced thereby increasing the gain and range of the manufactured and implanted antennas. | 09-11-2008 |
| 20080217310 | METHOD FOR PROFILING THE PERIMETER BORDER OF A SEMICONDUCTOR WAFER - A method for profiling the perimeter border of a semiconductor chip, characterized by the following steps: the semiconductor chip is supported near to the perimeter border on supporting points which are spaced apart in the perimeter direction of the semiconductor chip, laser beams are directed to the perimeter border with the aid of at least two lasers or of two lens systems coupled with at least one laser, which are arranged on the perimeter of the laser chip, the lasers or lens systems and the semiconductor chip are rotated in relation to each other around the centre of the semiconductor chip, and the lasers or lens systems are moved in a plane vertical to the rotational plane such that portions of the perimeter border between the supporting points are profiled by laser irradiation, subsequently, the supporting points on the semiconductor chip are changed and the remaining border portions of the perimeter border are profiled, and during profiling, the hitting point of the laser beams on the perimeter border is cooled with a fluid. | 09-11-2008 |
| 20080223833 | Machining Apparatus for Drilling Printed Circuit Board - A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved. | 09-18-2008 |
| 20080257873 | Method for Producing Two-Dimensional Periodic Structures in a Polymeric Medium - A method for producing periodic structures at the surface of a sol-gel type, hybrid organic-inorganic or organic material, characterised in that it includes the step of directly illuminating the material with a laser beam having a uniform intensity profile at near-normal incidence, while moving said material and said laser beam relative to each other. | 10-23-2008 |
| 20080302770 | "Machine for removing surfaces of semiconductors and particularly surfaces with integrated circuits" - A machine for removing surfaces of semiconductors with integrated circuits, comprising laser emitters, at least one beam of which strikes at least one semiconductor wafer or at least one fragment thereof, for ablation of a surface layer of preset thickness, supports for the at least one wafer or fragment thereof, and movers for the relative movement of the emitters with respect to the at least one wafer or fragment thereof, the movers being adapted to make the emitters follow a path such that the at least one beam emitted thereby travels over the entire surface to be removed of the at least one wafer or fragment thereof. | 12-11-2008 |
| 20080314881 | SUB-MICRON LASER DIRECT WRITE - A method of directing a pulse of laser energy though a workpiece. The workpiece has: a substrate that transmits the laser energy; focusing elements on a surface of the substrate proximal to the laser that focus the laser energy; and a coating on the substrate distal to the laser that absorbs a portion of the laser energy. Each focusing element focuses the laser energy to a point that removes or ablates a portion of the coating from the substrate to produce a hole in the coating. | 12-25-2008 |
| 20090008372 | Dry Cleaning Apparatus and Method - Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash. | 01-08-2009 |
| 20090020511 | Ablation - Embodiments of a method of ablation are disclosed. | 01-22-2009 |
| 20090032506 | Method of Scale Manufacture - The present invention relates to an apparatus for the manufacture of a metrological scale comprises a scale substrate ( | 02-05-2009 |
| 20090045178 | Laser engraver - A laser engraver comprises a glass laser tube and a modulation mechanism. The glass laser tube is used for outputting laser beam utilized by the laser engraver. The modulation mechanism is provided on the optical path of the output laser beam from the glass laser tube for adjusting the frequency of the output laser beam to achieve optimal engraving effect. | 02-19-2009 |
| 20090107964 | DEBRIS MINIMIZATION AND IMPROVED SPATIAL RESOLUTION IN PULSED LASER ABLATION OF MATERIALS - A method of minimizing the deposition of debris onto a sample being ablated. The method comprises: 1) reducing a laser pulse energy to approximately a threshold level for ablation; 2) focusing the energy using an immersion object lens having a final element and 3) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. | 04-30-2009 |
| 20090114627 | LASER BEAM MACHINING APPARATUS - A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator. The control unit includes a memory for storing coordinates of an arcuate chamfer part formed at the outer periphery of the wafer and coordinates of a flat surface part surrounded by the chamfer part, and controls the repetition frequency setting section so as to set the repetition frequency of the pulses in the laser beam with which to irradiate the flat surface part to a value suitable for machining of the wafer and as to set the repetition frequency of the pulses in the laser beam with which to irradiate the chamfer part to a value higher than the repetition frequency in the pulses of the laser beam with which to irradiate the flat surface part. | 05-07-2009 |
| 20090127238 | SEAMLESS LASER ABLATED ROLL TOOLING - A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser beam image onto the outer surface of the work piece. The system coordinates rotational and translation movements of the work piece with activation of the laser in order to use the laser image for ablating the outer surface of the work piece, creating microstructures within the surface of the work piece to form the cylindrical tool. | 05-21-2009 |
| 20090159580 | BRITTLE NONMETALLIC WORKPIECE AND METHOD AND DEVICE FOR MAKING SAME - An exemplary brittle non-metallic workpiece ( | 06-25-2009 |
| 20090212029 | Air Assist Apparatus and Method for an Engraving Laser - An engraving laser assembly comprises a tubular rail defining a plenum in an interior of the rail. A carriage is operatively associated with to the tubular rail for axial movement along the rail. A focusing optic is mounted to the carriage for focusing a laser beam to a focal point on an engraving plane operatively with the carriage. A gas inlet is operatively associated with the tubular rail and the inlet is configured for attachment to a source of pressurized gas to provide pressurized gas to the plenum. A plurality of holes are provided in the tubular rail in fluid communication with the plenum. The holes are configured so that, with a source of pressurized gas attached to the gas inlet, a stream of pressurized gas is directed from each hole toward the engraving plane. | 08-27-2009 |
| 20090242525 | LASER MACHINING OF FIRED CERAMIC AND OTHER HARD AND/OR THICK MATERIALS - Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf. | 10-01-2009 |
| 20090283506 | Laser processing apparatus - A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section. | 11-19-2009 |
| 20090283507 | MANUFACTURING APPARATUS OF COORDINATE DETECTING DEVICE - A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source. | 11-19-2009 |
| 20090294419 | Scoring of non-flat materials - Disclosed are systems for scoring non-flat materials including non-flat glass sheets ( | 12-03-2009 |
| 20090321397 | LASER-SCRIBING PLATFORM - Laser-scribing systems and translation stages operable to support a workpiece during laser scribing are provided. A laser-scribing system includes a base section, a bed supported by the base section, a laser, a first driving mechanism operable to move a workpiece longitudinally along the bed, and a second driving mechanism. The bed comprises a movable section configured to translate with respect to the base section. The movable section comprises a gap to allow a laser beam to pass through. The laser is positioned to direct the laser beam through the gap. The second driving mechanism is operable to laterally translate the laser and the movable section in order to scribe a pattern on the workpiece. | 12-31-2009 |
| 20100089881 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWS - Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row. The method moves the semiconductor substrate relative to the first and second laser axes in a direction approximately parallel to the rows of structures, so as to pass the first target location along the first row to irradiate for a first time selected structures in the first row, and so as to simultaneously pass the second target location along the second row to irradiate for a second time structures previously irradiated by the first laser beam during a previous pass of the first target location along the second row. | 04-15-2010 |
| 20100096371 | SYSTEM AND METHOD FOR SURFACE CLEANING USING A LASER INDUCED SHOCK WAVE ARRAY - A contamination removal system for continuous cleaning of contamination from an exposed contaminated surface of a substrate by creating and moving a laser induced shock wave array across the contaminated surface includes a laser beam source and laser beam delivery assembly receiving a beam generated at the laser beam source and directing the beam for the generation of a shock wave array. The beam delivery assembly includes mirrors and beam splitters which split the laser beam into many laser beams. The contamination removal system also includes a control assembly composed of an analog or digital controller and a motion controller linked to the operating components of the present system and ensuring proper operation thereof. A substrate motion control/holder assembly supports the substrate adjacent the beam delivery assembly. The substrate motion control/holder assembly is linked to the motion controller of the control assembly for complete and comprehensive operation, wherein the substrate motion control/holder assembly continually translates the substrate in a highly controlled manner to ensure the creation of the shock wave array along the exposed contaminated surface of the substrate in a systematic manner such that the contaminates are moved off of the exposed contaminated surface of the substrate resulting in a clean surface for subsequent use and fabrication. | 04-22-2010 |
| 20100102042 | Non-contact glass shearing device and method for scribing or cutting a moving glass sheet - A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets. | 04-29-2010 |
| 20100116798 | INSTALLATION FOR PERFORMING OPERATIONS OF SHAPING GLASS OR CRYSTAL PIECES - The invention relates to an installation that is used to perform operations for forming glass or crystal pieces ( | 05-13-2010 |
| 20100155379 | ILLUMINATION METHODS AND SYSTEMS FOR LASER SCRIBE DETECTION AND ALIGNMENT IN THIN FILM SOLAR CELL FABRICATION - Combined illumination is used to detect the positions of features such as scribe lines in different layers of a workpiece. Because combinations of layers of different material can scatter, reflect, scatter, and/or transmit light in different ways, combining and adjusting such illumination can allow positions of multiple features to be detected concurrently, such that the position of a feature being formed in one layer can be adjusted to a relative position with respect to a feature in another layer, even where those layers are of different materials with different optical properties. | 06-24-2010 |
| 20100176100 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 07-15-2010 |
| 20100237051 | METHOD AND SYSTEM FOR LASER PROCESSING TARGETS OF DIFFERENT TYPES ON A WORKPIECE - A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed. | 09-23-2010 |
| 20100276404 | LASER MACHINING METHOD AND LASER MACHINING APPARATUS - A laser machining method includes directing pulse laser light onto a surface of a brittle material substrate, and a laser light scanning step for scanning laser light along a scribe-scheduled line. The laser intensity of the pulse laser light is 1.0×10 | 11-04-2010 |
| 20100294745 | Laser Machining Process and Apparatus - A method of thermally treating a surface of workpiece includes training a laser beam upon the surface and supplying a gaseous mixture to the surface. The mixture is configured with a process gas and at least one heat generating gas capable of having its molecules dissociate while generating an additional thermal energy which substantially raises the temperature of the surface. | 11-25-2010 |
| 20100308024 | Writing apparatuses and methods - Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing. | 12-09-2010 |
| 20110011839 | Method and apparatus for laser micromachining a conical surface - Embodiments of the present invention are directed to methods and systems for micromachining a conical surface. In one embodiment, such a system may include a rotating platform for receiving a long line of laser illumination, a mask having a predetermined pattern comprising a sector of a planar ring, the mask being positioned on the rotating platform, a workpiece stage having a rotational axis for rotating a removably-affixed workpiece comprising a conical surface, wherein the sector comprises the planar image of the conical surface, an excimer laser for producing a laser beam, a homogenizer for homogenizing the laser beam in at least a single direction, at least one condenser lens, a turning mirror and at least one projection lens. | 01-20-2011 |
| 20110011840 | APPARATUS FOR FORMING PATTERN ON LIGHT GUIDE PANEL - A pattern forming apparatus for a light guide panel is provided. The apparatus includes a pattern design system, a control system, a header moving unit including an XY moving unit and a header unit, one or more laser systems, and two or more optical units. The pattern design system has an input of data on a pattern. The control system connects with the pattern design system and transmits a position signal. The XY moving unit mechanically moves up/down and left/right in response to the position signal. The header unit is coupled with the XY moving unit and reflects a scanned laser beam. The laser systems output laser beams by a pulse signal. The optical units each reflect and collect the laser beams. | 01-20-2011 |
| 20110031227 | Device For Inscribing Identification Plates - The invention relates to a device for inscribing identification plates ( | 02-10-2011 |
| 20110139756 | DEVICE FOR STRUCTURING A SOLAR MODULE - A device for structuring a solar module. A retainer device arranged above the solar modules to be machined comprises retainer means which retain the solar modules. The retention is achieved in a non-contact manner. In a region beneath the solar module a structuring tool is arranged mounted to be mobile in a longitudinal and a transverse direction. The structuring tool can thus machine the complete surface of the solar module. | 06-16-2011 |
| 20110174788 | LASER ENGRAVER WITH SCANNING FUNCTION - A laser engraver with scanning function includes an engraving table, a control device, and a scanner. The engraving table includes a working platform and an engraving device disposed on the working platform. The engraving device is capable of moving above the working platform to perform an engraving operation. The control device is connected to the engraving device, and is used for controlling the engraving operation of the engraving device. The scanner is mounted on the engraving device and connected to the control device, and is used for scanning a workpiece placed on the working platform and transmitting scanned information to the control device, such that the control device controls the engraving device to perform an accurate engraving operation at a particular position on the workpiece. | 07-21-2011 |
| 20110174789 | PORTABLE ENGRAVING SYSTEM - A portable engraving system comprises an enclosure adapted to operably accommodate an engraving device, wherein the enclosure comprises an adjustment system. The adjustment system comprises one or more adjustable devices, and the adjustable devices are adapted to adjust a distance between the enclosure and a work surface thereby allowing adjustment of the distance between the enclosure and the work surface, whereby the enclosure is adjustable with respect to the work surface. The enclosure further comprises an opening wherein the engraving device is operably positioned thereto, whereby the work surface is accessible to the engraving device therethrough. The enclosure is positionable adjacent the work surface and operably disposed thereto. | 07-21-2011 |
| 20120024829 | LASER MACHINING DEVICE - A laser machining device for forming dots on a substrate includes a light-combining assembly having a first reflection surface and a second reflection surface, a first laser source module, and a second laser source module. The first laser source module emits a first laser beam to the first reflection surface along a first light path. The second laser source module emits a second laser beam to the second reflection surface along a second light path. The light-combining assembly combines the reflected first and second laser beams into a third laser beam to focus on the substrate. The light-combining assembly is moveable between the first laser source module and the second laser source module. The second laser source module is fixed relative to the first laser source module, such that a sum of the length of the first light path and the length of the second light path is maintained constant. | 02-02-2012 |
| 20120103953 | LASER MACHINING OF FIRED CERAMIC AND OTHER HARD AND/OR THICK MATERIALS - Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf. | 05-03-2012 |
| 20120187097 | LASER ENGRAVER CAPABLE OF AUTOMATIC DEFOCUSING - A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing. | 07-26-2012 |
| 20120193333 | LASER ENGRAVERS WITH A MASKING MECHANISM - Laser engravers with a masking mechanism comprise a machine body, a laser-engraving mechanism inside the machine body, a working platform, and an exhauster. The laser-engraving mechanism includes a lens-cart rail that moves back and forth along a working track. The exhauster includes air outlets behind the working platform. The masking mechanism, which includes a reelable curtain-sheet, is installed above the air outlets so that while processing, the curtain-sheet is reeled out above the working platform and an air induction channel is formed to increase the working efficiency of the exhauster. | 08-02-2012 |
| 20130015167 | SUBSTRATE DIVIDING METHOD - A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate | 01-17-2013 |
| 20130075375 | COMPOUND LASER WORKING MACHINE - A compound laser working machine comprises a machine body, an engraving module, a cutting module and a control module. The engraving module is disposed on the machine body and it comprises a metal tube laser for output of engraving operations; the cutting module is disposed on the machine body and it comprises a glass tube laser for output of cutting operations; the control module is disposed on the machine body and it is connected to the engraving module and the cutting module individually, so that the output operations of the engraving module and the cutting module can be controlled by the control module simultaneously or individually. | 03-28-2013 |
| 20130126490 | LARGE-AREA MASK CLEANING APPARATUS USING LASER AND LARGE-AREA MASK CLEANING SYSTEM INCLUDING THE SAME - A laser cleaning apparatus for removing a surface pollutant on a large-area mask uniformly over an entire surface thereof is disclosed. The laser cleaning apparatus includes a laser generator; and a laser scanner for receiving a laser beam from the laser generator and scanning a surface of the mask with the laser beam using a movable end scanning mirror. The laser scanner includes a distance compensation device for maintaining a constant transmission distance of the laser beam between the lager generator and the surface of the mask. | 05-23-2013 |
| 20130206738 | IN SITU INDUCTIVE ABLATION METER - Real time monitoring and detection of the depths of laser scribes used during pulsed laser ablation processes. During a laser scribing process, sensors are used to determine in real time an amount of ablated material from a substrate undergoing the process. Laser scribing can be terminated when the amount of ablated material as detected by the sensors corresponds to a desired scribe depth. | 08-15-2013 |
| 20130270236 | SYSTEM FOR DIRECT ENGRAVING OF FLEXOGRAPHIC PRINTING MEMBERS - A system for engraving a flexographic relief member includes a laser scanning apparatus providing a focused radiation beam. The flexographic relief member includes a laser engravable flexographic member; a thing engravable control layer on top of the flexographic member; and wherein the engravable control layer has an engraving sensitivity lower than the flexographic member. | 10-17-2013 |
| 20130270237 | METHOD FOR MANUFACTURING AND SCRIBING A THIN-FILM SOLAR CELL - A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m | 10-17-2013 |
| 20130313236 | MULTIPLE BEAM LASER SYSTEM FOR FORMING STENTS - A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided. | 11-28-2013 |
| 20140014634 | INFINITE THICKNESS LASER PROCESSING SYSTEM - A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, and a non-telescoping sliding focus mechanism. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber and allows stacking of the system on modular attachments for specialized functions. The focus mechanism includes a carriage mirror subassembly attached to the x-axis carriage, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to the lower end of the sliding member. The carriage mirror subassembly and the focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member. | 01-16-2014 |
| 20140034624 | LASER PROCESSING APPARATUS - A laser processing apparatus has an optical transmitting unit for guiding a laser beam to a focusing unit. The optical transmitting unit includes a focusing lens for focusing the laser beam, an optical fiber unit for inputting the focused laser beam and guiding it to the focusing unit. The optical fiber unit includes an LMA fiber for inputting the focused laser beam. The LMA fiber has a large-diameter core covered with a cladding, a transmitting fiber provided by an SM fiber or a PM fiber. The transmitting fiber has a small-diameter core covered with a cladding, the small-diameter core having a diameter corresponding to the wavelength of the laser beam oscillated by the laser oscillator. A connector connects the LMA fiber and the transmitting fiber so that these fibers are axially aligned with each other. | 02-06-2014 |
| 20140042132 | Laser Marking System and Method - A system for creating marked can tabs may include an isolation mechanism located in the path of the tab material strip between a tab material dereeler and a tab forming press and a system suitable for marking the tab material strip. The isolation mechanism may be configured to convert discontinuous motion of the tab material strip proximate the tab forming press into continuous motion of the tab material strip at the dereeler. The system may be suitable for marking the tab material strip. The marking system may be located between the dereeler and the isolation mechanism such that the laser system acts on the tab material strip while it is moving at a relatively constant speed. | 02-13-2014 |
| 20140048519 | LASER PROCESSING APPARATUS - A laser processing apparatus including a processing head for applying a laser beam to a workpiece. The processing head includes a focusing lens and a collecting unit provided between the focusing lens and the workpiece for collecting debris generated by the application of the laser beam focused by the focusing lens to the workpiece. The collecting unit includes a suction source for sucking the debris and a suction line having one end connected to the suction source and the other end opening to the front side of the workpiece. The laser processing apparatus further includes a cleaning liquid supplying unit for supplying a cleaning liquid to the suction line. | 02-20-2014 |
| 20140061172 | LASER ENGRAVING DEVCIE - A laser engraving device which can adjust its machining position is disclosed. The device includes a laser machine for supplying laser beam, a guide rod adjacent to and parallel to the laser machine, a galvanometric scanner coupled to the guide rod and being movable with the guide rod, and a driver disposed at an end of the guide rod for driving the guide rod. | 03-06-2014 |
| 20140069897 | COLOR SENSING FOR LASER DECOATING - A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device. | 03-13-2014 |
| 20140097162 | LASER PROCESSING APPARATUS - A laser processing apparatus using a laser. The laser processing apparatus includes a light source for generating a hollow laser beam in a first direction; a reflection member for changing a path of the hollow laser beam toward the first direction into a second direction toward the substrate; a lens for collecting the hollow laser beam reflected by the reflection member; and an air supply unit for supplying air toward particles generated while the substrate is processed by the hollow laser beam, wherein the lens has a first hole passing through the lens, the reflection member has a second hole passing through the reflection member, and the first and second holes form a discharge path of the particles. | 04-10-2014 |
| 20140209580 | Marking Apparatus with at Least One Gas Laser and Heat Dissipator - The invention relates to a marking apparatus for marking an object with laser light, which apparatus comprises at least one gas laser for emitting at least one laser beam for marking the object. The at least one gas laser comprises a plurality of resonator tubes ( | 07-31-2014 |
| 20140217072 | Marking Apparatus with a Plurality of Lasers and a Combining Deflection Device - The invention relates to a marking apparatus ( | 08-07-2014 |
| 20140217073 | Marking Apparatus with a Plurality of Lasers and Individually Adjustable Sets of Deflection Means - The invention relates to a marking apparatus for marking an object with laser light, comprising a plurality of lasers and a control unit for individually activating each of the lasers to emit a laser beam ( | 08-07-2014 |
| 20140231397 | HAND-GUIDED MARKING SYSTEM - A hand-guided marking system ( | 08-21-2014 |
| 20140312013 | LASER EMISSION-BASED CONTROL OF BEAM POSITIONER - A laser machining system ( | 10-23-2014 |
| 20150069027 | OPTICAL SCANNING DEVICE AND LASER MACHINING DEVICE - An optical scanning device includes: a projector configured to radiate laser light incident thereon while causing the laser light to make angular movement around a projection center, and a reflector with a parabolic surface, the reflector being configured to reflect the laser light from the projector. The projection center is positioned at a focal point of the parabolic surface. The projector radiates the laser light such that the greater a difference between a rotation angle of the laser light and a reference angle, the lower an angular speed of the laser light, the reference angle being the rotation angle of the laser light when the laser light reflects on a vertex of the parabolic surface. A laser machining device includes the optical scanning device, and is configured to cause the laser light from the reflector to fall on a workpiece to form a machining line. | 03-12-2015 |
| 20150102022 | Laser Scoring to Control Gas-Vapor Transmission in Sealed Packaging - An adjustable system for controlling an amount of gas permeability allowed through multilayer material. A laser is controlled through a controller, and the laser processes the multiple layer material to remove only some of the layers in only an area. The area can be a pattern such as a line, or can just be a pattern of areas. The layers are removed without fully penetrating the material, thus adjusting the gas permeability. This allows gases and vapors to transmit into the package thru the scored area more specifically thru the remaining material at a faster rate than a non-scored material. The pattern can score along a line to allow gases and vapors to pass through more rapidly. The laser beam does not cut through the entire structure, and the package remains sealed. This means, therefore, that the amount of gas/vapor permeability can be changed for a sealed package, e.g., with material therein. | 04-16-2015 |
| 20150136744 | METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES - Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation. | 05-21-2015 |
| 20150290745 | LASER MACHINING APPARATUS CHANGING OPERATION BASED ON LENGTH OF POWER-DOWN TIME - A laser machining apparatus includes: a laser oscillator; a control device controlling the laser oscillator; a power-down detection unit detecting a decrease in supply power; a time measurement unit measuring power-down time until the supply power is returned to a predetermined value from when the supply power is decreased under the predetermined value; an electricity storage unit supplying electric power to the control device upon a power outage; and equipment operating abnormally when the supply power is decreased under the predetermined value, and recovering from an abnormal operation when a state of the supply power being smaller than the predetermined value continues for a first predetermined period or longer, the control device stopping the laser machining apparatus when the power-down time is smaller than the first predetermined period and not stopping the laser machining apparatus when the power-down time is equal to or larger than the first predetermined period. | 10-15-2015 |
| 20150298253 | SYSTEMS AND METHODS FOR PATTERNING USING A LASER - The present invention generally relates to a surface treatment of fabric with a laser and, more specifically, to a system and method for generating a pattern used to process a surface of a fabric through laser irradiation and the fabric resulting from such treatment. The present invention provides small laser spot sizes while operating a laser at large field size by 1) using a laser system with post-objective scanning architecture; 2) using multiple lasers across the width of a fabric roll; and/or 3) increasing the size and weight of the laser scanning mirrors. The spot size normally associated with a smaller laser field size (e.g. 500 mm) may be achieved with a laser having a larger field size (e.g. 950 mm or greater) by practicing the teachings of this invention. | 10-22-2015 |
| 20160008921 | Device For Operating A Machine Tool And Machine Tool | 01-14-2016 |
| 20160031040 | LASER CUTTING METHOD AND APPARATUS THEREOF - The present invention relates to a laser cutting method and apparatus thereof. The method comprises the following steps of fixing a substrate to be cut on a base, processing a first alignment procedure via an image sensor, forming a first cutting channel on a first surface of the substrate by cutting the first surface via laser beams, flipping over the substrate to be cut and fixing the substrate on the base, processing a second alignment procedure via the image sensor, and forming a second cutting channel on a second surface of the substrate by cutting the second surface via laser beams. The method can achieve improvement to laser cutting quality and effectiveness of enhancing production. | 02-04-2016 |
| 20160052085 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser processing device converges laser light at an object to be processed so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. The spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction. | 02-25-2016 |
| 20160096237 | LASER PROCESSING APPARATUS - Disclosed herein is a laser processing apparatus including a beam swinging unit provided between a pulsed laser oscillator and a focusing unit for swinging the optical path of a pulsed laser beam oscillated from the pulsed laser oscillator and then introducing the pulsed laser beam to the focusing unit. The beam swinging unit includes a polygon scanner provided on the upstream side of the focusing unit for scanning the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam scanned to the focusing unit and an acoustooptic deflecting unit provided on the upstream side of the polygon scanner and on the downstream side of the pulsed laser oscillator for deflecting the optical path of the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam deflected to the polygon scanner. | 04-07-2016 |
| 20160129529 | SYSTEM FOR AUTOMATICALLY INSPECTING AND TRIMMING A PATCH ANTENNA - A system for automatically inspecting and trimming a ceramic patch antenna includes an inspection apparatus electrically connected to a radio frequency component testing fixture. The inspection apparatus is inputted standard parameters of electrical characteristics of the ceramic patch antenna. The ceramic patch antenna is arranged on the radio frequency component testing fixture. Then, the inspection apparatus is configured to measure electrical characteristics of the ceramic patch antenna and to judge whether the electrical characteristics of the ceramic patch antenna are the same as the standard parameters or not. The inspection apparatus is configured to drive a trimming machine for trimming a radiation metal surface of the ceramic patch antenna if the electrical characteristics of the ceramic patch antenna are different from the stand parameters. | 05-12-2016 |
| 20160158888 | INFINITE THICKNESS LASER PROCESSING SYSTEM - A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, a non-telescoping focus mechanism, and a camera system that facilitates production of engravings that exceed the xy dimensions of the engraving chamber. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber. The focus mechanism includes a carriage mirror subassembly, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to a lower portion of the sliding member. The carriage mirror subassembly and focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member. | 06-09-2016 |
| 20190143382 | LASER ABLATION SYSTEM HAVING A MOVEABLE CARRIAGE WITH CLAMPING SYSTEM CONFIGURED TO CLAMP AND SEAL AGAINST A WORKPIECE | 05-16-2019 |
