Class / Patent application number | Description | Number of patent applications / Date published |
216020000 | Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.) | 58 |
20080210662 | THICK POROUS ANODIC ALUMINA FILMS AND NANOWIRE ARRAYS GROWN ON A SOLID SUBSTRATE - The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid substrate such as Si is used, the resulting anodic alumina film is more tractable, easily grown on extensive areas in a uniform manner, and manipulated without danger of cracking. The substrate can be manipulated to obtain free-standing alumina templates of high optical quality and substantially flat surfaces. PAA films can also be grown this way on patterned and non-planar surfaces. Furthermore, under certain conditions the resulting PAA is missing the barrier layer (partially or completely) and the bottom of the pores can be readily accessed electrically. The resultant film can be used as a template for forming an array of nanowires wherein the nanowires are deposited electrochemically into the pores of the template. By patterning the electrically conducting adhesion layer, pores in different areas of the template can be addressed independently, and can be filled electrochemically by different materials. Single-stage and multi-stage nanowire-based thermoelectric devices, consisting of both n-type and p-type nanowires, can be assembled on a silicon substrate by this method. | 09-04-2008 |
20080264900 | Metal surface treatment composition - A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile)polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention. | 10-30-2008 |
20080296254 | Multilayer wiring board for an electronic device - To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an inter layer insulating film allows for inter layer connection between plural wiring films insulated from one another with plural inter layer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the inter layer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 μm or smaller, and the multilayer wiring board itself for the electronic device has the flexibility. | 12-04-2008 |
20090020502 | BIOSENSOR AND METHOD OF MAKING - An electrochemical biosensor with electrode elements that possess smooth, high-quality edges. These smooth edges define gaps between electrodes, electrode traces and contact pads. Due to the remarkable edge smoothness achieved with the present invention, the gaps can be quite small, which provides marked advantages in terms of test accuracy, speed and the number of different functionalities that can be packed into a single biosensor. Further, the present invention provides a novel biosensor production method in which entire electrode patterns for the inventive biosensors can be formed all at one, in nanoseconds—without regard to the complexity of the electrode patterns or the amount of conductive material that must be ablated to form them. | 01-22-2009 |
20090107950 | FORMING SURFACE FEATURES USING SELF-ASSEMBLING MASKS - A method for producing surface features and an etch masking method. A combination is provided of a block copolymer and additional material. The block copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the first polymer. A film is formed of the combination directly onto a surface of a first layer. Nanostructures of the additional material self-assemble within the first polymer block. The film of the combination and the first layer are etched. The nanostructures have an etch rate lower than an etch rate of the block copolymer and lower than an etch rate of the first layer. The film is removed and features remain on the surface of the first layer. Also included is an etch masking method where the nanostructures mask portions of the first layer from said etchant. | 04-30-2009 |
20090173713 | Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores - A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a multilayer backlight module is arranged on one side surface of the metallic panel via a hot pressing or adhering process. Finally, a telecommunication module is adhered on one side surface of the backlight module. In this way, the metallic panel having multilayer arrays of micropores can be completed. | 07-09-2009 |
20090294401 | METHOD FOR FABRICATING A PACKAGING SUBSTRATE - A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion. | 12-03-2009 |
20100096358 | LADDER TYPE FILTER - A ladder filter includes a series resonator having a first film laminate in which an upper electrode and a lower electrode face each other across a piezoelectric film, and a first film provided on the first film laminate, and a parallel resonator having a second film laminate having a structure similar to that of the first film laminate, a second film provided on the second film laminate, and another first film identical to the first film. | 04-22-2010 |
20100126958 | TRANSFER FILM AND METHOD FOR FABRICATING A CIRCUIT - A method of fabricating a circuit includes bonding an electrically conductive layer to a donor film, removing selected portions of the electrically conductive layer from the donor film to provide a circuit arrangement, and transferring the circuit arrangement from the donor film to a substrate. | 05-27-2010 |
20100243601 | Multilayer wiring board and manufacturing method thereof - Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil | 09-30-2010 |
20100288726 | Method for manufacturing printed circuit board - A method of manufacturing a printed circuit board including: forming a heat dissipating coating layer on the surface of a heat dissipating layer; forming circuit patterns on the surface of an insulating layer, and forming an inter-layer conductive part joining with the insulating layer by passing through the insulating layer and electrically connected with the circuit patterns; and laminating the insulating layer on the heat dissipating layer such that the inter-layer conductive part is connected with the heat dissipating coating layer. | 11-18-2010 |
20100301006 | Method of Manufacturing an Electrical Component on a Substrate - Electrical components, e.g., a radiator for a cell phone circuit, are manufactured by a method comprising the steps of: (A) providing a substrate, e.g., a polymeric film, having a first facial side that has a metal coating, e.g., copper, and a second facial side that does not have a metal coating; (B) applying a covering material that is impervious to etching and plating, e.g., solder-mask, to the metal coating to define a trace except for its contact spot; (C) applying etch-resist to the metal coating to define the contact spot; (D) etching the metal coating from the substrate that is not covered by the covering material or etch-resist; (E) removing the etch-resist from the metal coating; and (F) plating the uncovered metal coating with a plating material comprising at least one of silver, gold, and nickel. | 12-02-2010 |
20110017704 | METHOD OF ELECTRICALLY CONNECTING A MICROELECTRONIC COMPONENT - A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to one another aligned with the portions of the etch-resistant material. A microelectronic device is provided having one of a front face or a rear face overlying first ends of the posts. Second ends of the posts remote from the first ends face away from the microelectronic device as interconnection terminals for the connection component. At least some of the posts are electrically connected to the microelectronic device. | 01-27-2011 |
20110100952 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP - A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented. | 05-05-2011 |
20110163064 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided. | 07-07-2011 |
20110204021 | METHOD OF MAKING FINE-PITCH CIRCUIT LINES - A method of making fine-pitch circuit lines includes steps of preparing an insulative substrate, disposing a conductive metal layer on the insulative substrate, disposing on a whole or a part of a top surface of the conductive metal layer a hetero layer having an etching rate smaller than that of the conductive metal layer, forming a patterned mask of circuit lines on the hetero layer, wet etching the hetero layer and the conductive metal layer, and removing the patterned mask and the hetero layer so as to form fin-pitch circuit lines having a high etching factor on the insulative substrate. | 08-25-2011 |
20110226731 | CRYSTAL SUBSTRATE ETCHING METHOD, PIEZOELECTRIC VIBRATING REED, A PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a crystal substrate etching method capable of processing with high accuracy, a piezoelectric vibrating reed of which the outer shape is formed by the method, a piezoelectric vibrator having the piezoelectric vibrating reed, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezo-electric vibrator. A crystal substrate and an auxiliary substrate are successively dry-etched from a second surface side of the crystal substrate in a state where the auxiliary substrate having approximately the same etching rate as the crystal substrate is bonded to a first surface of the crystal substrate. | 09-22-2011 |
20110278258 | Device and Method for Indirect Modulation of Detection Environment - A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a first activatable stimulant at the test site, providing an actuator configured to activate the first activatable stimulant at the test site, controlling the actuator to activate the first activatable stimulant, and modifying the local chemical environment at the test site with the first activated stimulant. | 11-17-2011 |
20110284496 | Method of Forming Electronic Circuit - Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper. This invention aims to form a circuit with a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short circuits and defects in the circuit width. | 11-24-2011 |
20110297644 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH CAVITY - A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed. | 12-08-2011 |
20120031874 | METHOD FOR MAKING A CAVITY IN THE THICKNESS OF A SUBSTRATE WHICH MAY FORM A SITE FOR RECEIVING A COMPONENT - A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate. | 02-09-2012 |
20120080401 | METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer. | 04-05-2012 |
20120097636 | ACOUSTIC SUBSTRATE - A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications. | 04-26-2012 |
20120132615 | Manufacturing method of probe card - A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal. | 05-31-2012 |
20120145666 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the copper foil. Openings are formed in the solder resist layer, and a metal conductor portion is formed in each of the openings. By means of sputtering, a dissimilar metal layer is formed over the surface of the metal conductor portion and the entire surface of the solder resist layer. Copper electroplating is performed so as to form connection terminals and a conductor layer on the dissimilar metal layer. After a build-up step, the base material is removed, whereby the copper foil is exposed, and the exposed copper foil and the metal conductor portion are removed through etching, whereby the surfaces of the external connection terminals are exposed from the openings. | 06-14-2012 |
20120160803 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained. | 06-28-2012 |
20120187078 | MANUFACTURING METHOD OF RIGID AND FLEXIBLE COMPOSITE PRINTED CIRCUIT BOARD - In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors. | 07-26-2012 |
20120193324 | METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY A COPPER CERAMIC SUBSTRATE - The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like. | 08-02-2012 |
20120223047 | METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE - Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be preformed using etching or deposition techniques. A photoimageable dielectric is an upper surface of the laminate. Exposing and etching the photoimageable dielectric exposes the space between the copper traces. These spaces are then filled with a capacitor material. Finally, copper is either laminated or deposited atop the structure. This upper copper layer is then etched to provide electrical interconnections to the capacitor elements. Traces may be formed to a height to meet a plane defining the upper surface of the dielectric substrate or thin traces may be formed on the remaining dielectric surface and a secondary copper plating process is utilized to raise the height of the traces. | 09-06-2012 |
20120241408 | METHOD FOR MANUFACTURING TOUCH PANEL AND METHOD FOR MANUFACTURING DISPLAY DEVICE PROVIDED WITH TOUCH PANEL - Provided is a touch panel manufacturing method wherein the number of exposure masks needed for pattern formation is reduced, and a method for manufacturing a display device provided with a touch panel. A transparent conductive film layer ( | 09-27-2012 |
20120273455 | METHODS FOR ALIGNED TRANSFER OF THIN MEMBRANES TO SUBSTRATES - The present invention relates to thin membranes (such as graphene windows) and methods of aligned transfer of such thin membranes to substrates. The present invention further relates to devices that include such thin membranes. | 11-01-2012 |
20120298618 | METHOD FOR MAKING GRAPHENE/CARBON NANOTUBE COMPOSITE STRUCTURE - A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface. | 11-29-2012 |
20120298619 | METHOD FOR MAKING GRAPHENE/CARBON NANOTUBE COMPOSITE STRUCTURE - A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, coating a polymer layer on the at least one carbon nanotube film structure, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface. | 11-29-2012 |
20120298620 | METHOD FOR MAKING GRAPHENE COMPOSITE STRUCTURE - A method for making a graphene composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing a polymer layer on the graphene film and combining the polymer layer with the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface. | 11-29-2012 |
20120312776 | METHOD FOR MAKING TOUCH PANEL - A method for making a plurality of touch panels one time which includes the following steps. A substrate is provided. The substrate has a surface defining a plurality of target areas with each including a touch-view area and a trace area. An adhesive layer is formed on the surface of the substrate. The adhesive layer on the trace areas is solidified. A carbon nanotube layer is formed on the adhesive layer. The adhesive layer on the touch-view area is solidified. The carbon nanotube layer on the trace areas is removed to obtain a plurality of transparent conductive layers spaced from each other. An electrode and a conductive trace are formed on each target area. A plurality of touch panels is obtained by cutting the substrate. | 12-13-2012 |
20120318771 | SUBSTRATE TRAY AND MANUFACTURING METHOD OF A FLEXIBLE ELECTRONIC DEVICE - Provided is a substrate tray for supporting a flexible substrate during manufacturing of a flexible electronic device. The substrate tray comprises a tray baseboard, and the tray baseboard has a groove zone provided with a plurality of grooves. A method for manufacturing a flexible electronic device is also provided, in which the substrate tray is used to support a flexible substrate. | 12-20-2012 |
20130032570 | METHOD OF MANUFACTURING A SWITCH SYSTEM - A method for manufacturing a micro electro-mechanical system (MEMS) switch system ( | 02-07-2013 |
20130056440 | METHOD FOR MANUFACTURING TRANSPARENT PRINTED CIRCUIT AND METHOD FOR MANUFACTURING TRANSPARENT TOUCH PANEL - To peel an etching resist easily and reliably without damaging a transparent conductive layer coated with the etching resist. A method for manufacturing a transparent printed circuit in an embodiment of the present invention includes: providing a transparent conductive sheet | 03-07-2013 |
20130168350 | MULTILAYER COIL COMPONENT - A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound. | 07-04-2013 |
20130175239 | APPARATUS FOR ETCHING SUBSTRATE AND METHOD OF FABRICATING THIN-GLASS SUBSTRATE - Methods of fabricating devices including a TFT array substrate are provided. For example, a method of fabricating a TFT array substrate may comprise adhering a protection film onto an upper surface of a glass substrate containing silicon dioxide as a principal constituent on which a thin film transistor (TFT) array has been fabricated; and etching the glass substrate through a lower surface thereof such that the glass substrate has a thickness greater than 0 micrometer, but equal to or smaller than 200 micrometers. The etching may comprise preparing an apparatus for etching a substrate; and etching said glass substrate at an etching rate equal to or higher than 2 micrometers per a minute by means of the apparatus. | 07-11-2013 |
20130193105 | FABRICATION OF AN INKJET PRINTHEAD MOUNTING SUBSTRATE - A method of fabricating a mounting substrate for a printhead die of an inkjet printhead, the method includes: forming an ink inlet hole in a first layer of a first dielectric material; patterning a plurality of electrical contact pads on a second layer of a second dielectric material; forming a slot through the second layer; forming a window through a third layer of a third dielectric material; aligning and laminating the second layer to the first layer such that the ink inlet hole is aligned with the slot; and aligning and laminating the third layer to the second layer such that the contact pads and the slot are exposed through the window. | 08-01-2013 |
20130206721 | METHOD FOR MANUFACTURING A TOUCH PANEL - A method for manufacturing a touch panel includes the following steps. A mother plate is provided. A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses are disposed on the adhesive materials respectively. The adhesive materials are cured, whereby the cover glasses are attached to the mother plate. A plurality of circuit units are formed on the cover glasses respectively. The cover glass having the circuit unit is removed from the mother plate, wherein the bonding strength of the cured adhesive material is within a range about between 5 g/25 mm and 600 g/25 mm, whereby the adhesive material provides enough adhesive force between the cover glass and the mother plate, and the adhesive material cannot be stayed on a surface of the cover glass during a removing process. | 08-15-2013 |
20130213928 | ELECTRIC SENSOR WEB, SYSTEM AND A METHOD FOR ITS MANUFACTURE - A method for manufacturing a sensor web. A metal foil attached to a surface of a release web is die-cut to form electrically conductive areas and conductors. A first protective film is attached to the release web so that the first protective film covers the electrically conductive areas and conductors. The release web is replaced with a backing film. | 08-22-2013 |
20130228548 | METHOD OF MANUFACTURING A HIGH DEFINITION HEATER SYSTEM - Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed. | 09-05-2013 |
20130270219 | MAKING STACKED PANCAKE MOTORS USING PATTERNED ADHESIVES - A method of making a shaped electrical conductor ( | 10-17-2013 |
20130270220 | HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY - A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks. | 10-17-2013 |
20130313224 | METHOD FOR FORMING ANTENNA AND COMPRESSION HEAD - An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film. | 11-28-2013 |
20130341301 | METHOD FOR MANUFACTURING A CHIP RESISTOR - In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors. | 12-26-2013 |
20140091054 | METHOD OF FABRICATING AN IMPLANTABLE MEDICAL DEVICE THAT INCLUDES ONE OR MORE THIN FILM POLYMER SUPPORT LAYERS - An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached. | 04-03-2014 |
20140103008 | METHOD OF FABRICATING TEST STRIP FOR MEASURING BIOLOGICAL FLUID - The invention provides a method of fabricating test strip for measuring biological fluid. The method comprises steps of: preparing a metallic membrane and an insulating material; adhering the metallic membrane on the insulating material; photolithographing for the metallic membrane; etching the metallic membrane to form a circuit layer; providing a sensing reagent on the circuit layer to form a sensing reagent layer; and adhering an intermediate layer and a cover to the insulating material to cover the circuit layer and expose part of the circuit layer. The circuit layer is provided in an adhering manner to enhance the stability of resistance and the test accuracy. | 04-17-2014 |
20140103009 | METHOD FOR MAKING HEATER - A method for making a heater is provided. A support and a flexible substrate are provided. The flexible substrate is stretched along a first direction and is fixed on a surface of the support. An adhesive layer is coated on a surface of the flexible substrate. One end of a carbon nanotube film is attached on the flexible substrate via the adhesive layer. The carbon nanotube film is wrapped around the support by whirling the support to form a carbon nanotube structure. The flexible substrate is separated from the support and shrinks along the first direction. At least two electrodes are electrically connected with the carbon nanotube structure. A voltage is applied between the at least two electrodes to heat the carbon nanotube structure. The carbon nanotube structure heats and solidifies the adhesive layer. | 04-17-2014 |
20140175049 | PRE-PATTERNED FILM-BASED RESIST - Roll-to-roll processes for manufacturing touch sensors using a sheet of patterned photoresist film are disclosed. The photoresist film can include a sheet of photoresist material, such as DFR, that has been patterned by removing portions of the photoresist film using a die or laser cutting technique. In some examples, the photoresist film can be patterned such that the patterned photoresist film can be laminated to a base film and used as an etching mask or a photoresist layer in a roll-to-roll manufacturing process. In this way, the patterned photoresist film can be used in place of conventional photoresist films in roll-to-roll processes, thereby obviating the need for subsequent exposure and development operations that would otherwise be performed when using conventional photoresist films. As a result, the chance that a defect is introduced into the touch sensors is reduced by reducing the number of operations performed in the roll-to-roll process. | 06-26-2014 |
20140209564 | Method for the Fabrication of Electrolyte Cavities Using Surface Micromachining - The present invention is directed to the fabrication of thin aluminum anode batteries using a highly reproducible process that enables high volume manufacturing of the galvanic cells. A method of fabricating a thin aluminum anode galvanic cell is provided, the method including, depositing a layer of catalytic metal on a surface of a first substrate, depositing and patterning a benzocyclobutene layer to form a reservoir having four sidewalls of benzocyclobutene on the surface of the catalytic layer, depositing a layer of aluminum on a surface of a second substrate and bonding the first substrate to the second substrate to form a galvanic cell bounded by the catalytic metal layer and the aluminum layer and separated by the reservoir walls of benzocyclobutene, the second substrate positioned in overlying relation to contact the four sidewalls of the reservoir with the aluminum layer facing the catalytic layer. | 07-31-2014 |
20140284304 | METHOD OF FABRICATING TEST STRIP OF BIOLOGICAL FLUID - The invention provides a method of fabricating test strips for measuring biological blood. The method comprises steps: preparing an insulating membrane material; printing a metallic circuit layer on the insulating membrane material by a metallic ionic ink; performing a surface treatment for the metallic circuit layer expose metallic ions of the metallic ionic ink; chemical plating for the exposed metallic ions of the metallic circuit layer to form an electrode section on the metallic circuit layer; providing a sensing reagent on the electrode section to form a sensing reagent layer; sequentially adhering an intermediate layer and a cover to the insulating membrane material to cover the metallic circuit layer and expose part of the metallic circuit layer; and cutting the insulating membrane material to form a plurality of insulating sheets. The test strip is provided to enhance the stability of resistance and the test accuracy. | 09-25-2014 |
20150034590 | METHOD FOR PRODUCING PRINTED-WIRING BOARD - The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating | 02-05-2015 |
20150108084 | METHOD OF MAKING A FLEXIBLE CIRCUIT - A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas. | 04-23-2015 |
20150108085 | TOUCH SCREEN AND MANUFACTURING METHOD THEREOF - The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided. | 04-23-2015 |
20150303073 | METHOD OF FABRICATING A PACKAGING SUBSTRATE - A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement. | 10-22-2015 |