| Entries |
| Document | Title | Date |
|---|
| 20080210564 | MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more. | 09-04-2008 |
| 20090188806 | Manufacturing Method of Wiring Board - A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a metal layer forming step of forming a metal layer, so as to cover an upper surface of the resist film and cover a side surface of the resist film and the upper surface of the sticking layer forming the opening for forming the wiring; a plating film forming step of filling with a plating film the opening for forming the wiring; a metal layer and plating film removing step; a resist film removing step; and a sticking layer removing step of removing the sticking layer of an unnecessary part not covered with the metal layer, after the resist film removing step. | 07-30-2009 |
| 20090283412 | ELECTROCHEMICAL DETECTION OF SINGLE MOLECULES USING ABIOTIC NANOPORES HAVING ELECTRICALLY TUNABLE DIMENSIONS - A barrier structure for use in an electrochemical stochastic membrane sensor for single molecule detection. The sensor is based upon inorganic nanopores having electrically tunable dimensions. The inorganic nanopores are formed from inorganic materials and an electrically conductive polymer. Methods of making the barrier structure and sensing single molecules using the barrier structure are also described. | 11-19-2009 |
| 20100032306 | ELECTROCHEMICAL DEPOSITION OF CONDUCTIVE COATINGS ON FUEL CELL BIPOLAR PLATES - One exemplary embodiment includes a method of selectively electroplating an electrically conductive coating on selected portions of lands of a bipolar plate leaving portions of the lands uncoated by the electrically conductive coating. Thus, allowing for reducing cost of bipolar plates for PEM fuel cells considerably. | 02-11-2010 |
| 20100116676 | METHOD OF FABRICATING PROBE PIN FOR PROBE CARD - Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused. | 05-13-2010 |
| 20100155253 | Microprobe Tips and Methods for Making - Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like. | 06-24-2010 |
| 20100163422 | ASSISTED DEPOSITION, NARROW TRENCH DAMASCENE PROCESS FOR MANUFACTURING A WRITE POLE OF A MAGNETIC WRITE HEAD - A method for forming a magnetic write head using a damascene process that does not form voids in the magnetic structure. An opening is formed in an alumina layer, the opening being configured to define a trench. Then a first layer of magnetic material is deposited into the trench. A CMP process is then performed to remove any voids that have formed in the first magnetic layer. Then a second layer of magnetic material is deposited over the first layer of magnetic material. In another embodiment of the invention, a opening is formed in the alumina layer, and a first layer of magnetic material is electroplated into the opening. A thin layer of non-magnetic material is then deposited, and a second layer of magnetic material is deposited over the thin layer of non-magnetic material. The thin layer of alumina advantageously provides a laminate structure that avoids data erasure. | 07-01-2010 |
| 20100187120 | DIRECT ELECTRODEPOSITION OF MAGNETIC RECORDING HEAD FEATURES - A method is described for forming a magnetic recording head substrate. The method includes utilizing a metal feature on the magnetic recording head substrate as a grounding path. The magnetic recording head substrate is submerged in a solution containing ions of a second material, and the ions of the second material are electrodeposited on the magnetic recording head substrate. | 07-29-2010 |
| 20100264035 | REEL-TO-REEL PLATING OF CONDUCTIVE GRIDS FOR FLEXIBLE THIN FILM SOLAR CELLS - The present inventions provide structures and methods for manufacturing high electrical conductivity grid patterns having minimum shadowing effect on the illuminated side of the solar cells. In a particular aspect, a width of an effective channel region is greater than a spacing that exists between conductive elements in adjacent grid patterns that exist along a lengthwise direction of a continuous workpiece. | 10-21-2010 |
| 20110017603 | Anodized Aluminum Cookware with Exposed Copper - Anodized aluminum cookware having an exposed copper base or ring is formed by anodizing the completed vessel using a protective cap to cover most of the copper. The portion of copper that is exposed to the anodizing bath only tarnishes slightly and is preferably polished off after a protective lacquer is applied, creating a clean even margin with the anodized aluminum portion of the vessel. | 01-27-2011 |
| 20110073480 | Process of Manufacturing Low-Profile Connector - A process of manufacturing low-profile connector includes the steps of (a) forming connector main body, (b) laser activation, (c) plating, and (d) post-treatment. The connector main body for low-profile connector so manufactured includes integrally formed pin terminals to effectively reduce the costs for researching and developing production engineering and making molds, to simplify processing procedures and save a lot of time and labors that are otherwise needed to process metal pins and separated half shells, and to effectively reduce the stock of components and save the warehousing management cost. Moreover, the present invention provides simplified and automated manufacturing process to omit manual assembling and accordingly, save labor cost for subsequent assembling and enable mass production. | 03-31-2011 |
| 20110073481 | FOIL PLATING FOR SEMICONDUCTOR PACKAGING - Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution. | 03-31-2011 |
| 20110094889 | METHOD FOR FABRICATING HIGHLY CONDUCTIVE FINE PATTERNS USING SELF-PATTERNED CONDUCTORS AND PLATING - Provided is a method for forming a highly conductive micropattern, including: depositing a polymer material on a substrate; removing a portion of the polymer material to form a mask template having a dent through which a portion of the substrate is exposed to the exterior; depositing conductive ink to the top of the mask; heat treating the conductive ink in order to extract metal nanoclusters from a metallic compound dissolved in the conductive ink, wherein the portion coated with the polymer material is allowed to form an insulating pattern having electrically insulating property, while the conductive ink in the dent forms a conductive pattern having electroconductive property by the fusion of the metal nanoclusters extracted from the conductive ink; and plating a metallic material on the conductive pattern. | 04-28-2011 |
| 20110100828 | THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER AND PRODUCTION METHOD OF HYDROGEN PRODUCTION FILTER - In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas. | 05-05-2011 |
| 20110147220 | ANTI-DISPLACEMENT HARD GOLD COMPOSITIONS - Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold. | 06-23-2011 |
| 20110198228 | MAGNETIC RECORDING MEDIUM AND METHOD OF MANUFACTURING THE SAME - The present invention provides a method of manufacturing a magnetic recording medium having high recording density. The magnetic recording medium manufacturing method of the present invention is directed to a manufacturing method including: disposing at least a silicon layer on a substrate; disposing an uneven structure including regularly arranged projections on the silicon layer; disposing magnetic material on the upper surfaces of the projections and within recessed parts of the uneven structure; and allowing the magnetic material disposed within each recessed part to be changed into silicon compound by heat treatment. | 08-18-2011 |
| 20120024712 | METHOD FOR PRODUCING AN ANTI-INFECTIVE COATING ON IMPLANTS - The invention relates to a method for producing an anti-infective coating on implants that contain titanium or are composed of titanium. The aim of the invention is to provide a coating method with which it is possible, for implants made of titanium or that contain titanium, to combine the optimization of the mechanical properties achieved with the anodic oxidation type II with the optimization of the anti-infective properties. According to the invention, the implants are anodically oxidized in an alkaline solution, then metal having anti-infective properties is electrodeposited on said surface, and afterwards the oxide layer containing metal is solidified. | 02-02-2012 |
| 20120055799 | ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD OF MANUFACTURE - An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm | 03-08-2012 |
| 20120085654 | COATING MASK FOR ELECTROLYTICALLY COATING A PERIPHERAL REGION ON AN OUTER SURFACE OF A CYLINDRICAL BODY - The invention relates to a coating mask ( | 04-12-2012 |
| 20120118751 | MOLECULAR IMPRINTED NANOSENSORS - An apparatus for detecting the presence of a target molecule is disclosed which includes a conductive nanostructure, a non-conductive polymer coating on at least a portion of the nanostructure, and a cavity formed in the polymer coating having a shape corresponding to the shape of the target molecule. A property of the nanostructure depends on the presence of the target molecule at the cavity. | 05-17-2012 |
| 20120118752 | Method for Electrodeposition of an Electrode on a Dielectric Substrate - A method for the electrodeposition of an electrode including a metallic electrode material ( | 05-17-2012 |
| 20120132529 | METHOD FOR PRECISELY CONTROLLED MASKED ANODIZATION - The present invention is related to a method for masked anodization of an anodizable layer on a substrate, for example an aluminum layer present on a sacrificial layer, wherein the sacrificial layer needs to be removed from a cavity comprising a Micro or Nano Electromechanical System (MEMS or NEMS). Anodization of an Al layer leads to the formation of elongate pores, through which the sacrificial layer can be removed. According to the method of the invention, the anodization of the Al layer is done with the help of a first mask which defines the area to be anodized, and a second mask which defines a second area to be anodized, said second area surrounding the first area. Anodization of the areas defined by the first and second mask leads to the formation of an anodized structure in the form of a closed ring around the first area, which forms a barrier against unwanted lateral anodization in the first area. | 05-31-2012 |
| 20120168316 | FABRICATING PROCESS OF EMBEDDED CIRCUIT STRUCTURE - A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two opposite surfaces of the core panel. A conductive material is electroplated into the through hole and the indent patterns, so as to form a conductive channel in the through hole and two circuit patterns in the indent patterns respectively. Portions of the circuit patterns, which exceed the indent patterns respectively, are removed for planarizing the circuit patterns to be level with the two surfaces of the core panel respectively. | 07-05-2012 |
| 20120181181 | Method of reducing main pole corrosion during aluminum oxide etch - A method of removing an alumina layer around a main pole layer during perpendicular magnetic recording head fabrication is disclosed. The alumina etch sequence includes immersing a substrate in a series of aqueous solutions purged with an inert gas to remove oxygen thereby avoiding corrosion of the main pole. Initially, the substrate is soaked and heated in deionized (DI) water. Once heated, the substrate is immersed in an etching bath at about 80° C. and pH 10.5. Bath chemistry is preferably based on Na | 07-19-2012 |
| 20120193239 | SURFACE PROCESSING METHOD FOR CASING - A surface processing method for a casing is disclosed. The method includes the following steps: performing an anodic treatment to a casing material, drying the casing material and printing a pattern on the casing material via digital printing. The method can reduce the surface processing cost and provide the appearance of the object with diverse patterns or colors. | 08-02-2012 |
| 20120211370 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board including forming an insulative resin layer, forming a power-supply layer on the insulative resin layer, forming a conductive layer made of electrolytic plating and having a conductive pattern on the power-supply layer such that the power-supply layer has an exposed portion not covered by a conductive portion of the conductive pattern, and irradiating the exposed portion of the power-supply layer with laser having a wavelength in a range of approximately 350 nm to approximately 600 nm at a pulse width in a range of approximately 0.1 picosecond to approximately 1,000 picoseconds such that the exposed portion of the power-supply layer is removed from the insulative resin layer. | 08-23-2012 |
| 20120273362 | SURFACE CHARGE ENABLED NANOPOROUS SEMI-PERMEABLE MEMBRANE FOR DESALINATION - A filter includes a membrane having a plurality of nanochannels formed therein. A first surface charge material is deposited on an end portion of the nanochannels. The first surface charge material includes a surface charge to electrostatically influence ions in an electrolytic solution such that the nanochannels reflect ions back into the electrolytic solution while passing a fluid of the electrolytic solution. Methods for making and using the filter are also provided. | 11-01-2012 |
| 20120305405 | Metal Trace Fabrication For Optical Element - A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess. | 12-06-2012 |
| 20120318675 | Production of Nano-Organized Electrodes on Porous Substrate - The invention relates to a method for fabricating nanowires and a method for fabricating an electrode of an electro-chemical device. The nanowire fabrication method according to the invention comprises: a) a step of depositing, on one of the faces of the matrix comprising hole openings, at least one porous layer, having a porosity equal to or higher than 26% by volume, of nanoparticles of a conductive material having their smallest dimension at least equal to the diameter of the holes in the matrix, the nanoparticles being in electrical contact with one another, b) growing the nanowires in the holes of the matrix, and c) removing the matrix. The invention has an application in the field of electrochemical devices in particular. | 12-20-2012 |
| 20130020204 | MAGNETIC WRITE HEAD HAVING AN ELECTROPLATED WRITE POLE WITH A LEADING EDGE TAPER - A method for manufacturing a magnetic write head having a tapered leading edge. The method includes depositing a sacrificial non-magnetic layer to a thickness that is at least as great as the thickness of the write pole to be formed. The sacrificial non-magnetic layer is then masked and ion milled so as to form a tapered edge on the sacrificial non-magnetic layer that extends through the thickness of the non-magnetic fill layer. A magnetic material is then deposited and planarized by chemical mechanical polishing. The remaining magnetic material forms the entirety of the magnetic write pole so that there is no need to deposit additional magnetic layers further construct the write pole. | 01-24-2013 |
| 20130043136 | PLANAR COIL AND METHOD OF MAKING THE SAME - A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench. | 02-21-2013 |
| 20130075266 | METHOD OF MANUFACTURING TOUCH PANEL - Disclosed herein is a method of manufacturing a sensing electrode of a touch panel according to a preferred embodiment of the present invention including: forming a non-conductive mesh skeleton on a transparent substrate using an electrospinning solution by an electrospinning method; and forming an electrode layer on the non-conductive mesh skeleton by performing electroless plating processing. The preferred embodiments of the present invention can implement uniform conductivity for all the electrode layers by preventing irregular conductivity between the mesh skeletons by forming a non-conductive mesh skeleton using the electrospinning method and then, forming the electrode layers using the electroless plating. | 03-28-2013 |
| 20130075267 | Metal Treatment - Metal implants ( | 03-28-2013 |
| 20130081953 | METHOD FOR TREATING THE SURFACE OF A DEVICE FOR DISPENSING A FLUID PRODUCT - A treatment method for treating the surface of a fluid dispenser device, said method comprising the step of using chemical grafting to form a thin film on at least one support surface of at least one movable portion of said device that is movable while said device is being actuated, said thin film having anti-friction properties. | 04-04-2013 |
| 20130092547 | MOLECULAR IMPRINTED NANOSENSORS - A molecular recognition sensor system is provided incorporating a molecular imprinted nanosensor device. | 04-18-2013 |
| 20130112565 | METHOD AND APPARATUS FOR FORMING A LAYERED METAL STRUCTURE WITH AN ANODIZED SURFACE - Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum. | 05-09-2013 |
| 20130186763 | METHODS FOR FABRICATING GAS TURBINE ENGINES - Methods and apparatus of fabricating gas turbine engine components are provided. The method includes positioning a non-consumable shield adjacent to an edge of the component such that a gap is defined between the shield and the component, wherein the shield and gap form a fluid flow restriction adjacent to the edge, and inducing an electrical current from an anode to the component through an electrolyte bath such that a coating is applied to the component. | 07-25-2013 |
| 20130220821 | ARTICLE COMPRISING SILICON NANOWIRES ON A METAL SUBSTRATE - Articles of silicon nanowires were synthesized on metal substrates. The preparation minimized the formation of metal silicides and avoided the formation of islands of silicon on the metal substrates. These articles may be used as electrodes of silicon nanowires on current collectors. | 08-29-2013 |
| 20130240367 | METHOD FOR PRODUCING COMPONENTS FOR ELECTRICAL CONTACTS, AND COMPONENTS THEMSELVES - A method for producing electrical components for electrical contacts, and such a component are provided. To achieve simpler production of a partial surface treatment, which likewise exhibits optimal current carrying capacity, with minimum material use of noble metals, the entirety of the components are provided with an electrically insulating passivation layer, and the passivation is then removed chemically or mechanically at the contact points of the components. The entire components are put into an electrolytic bath, and a noble metal is deposited only on the parts of the components from which the passivation layer has been removed. | 09-19-2013 |
| 20140027295 | Amorphous IrOX Film pH Sensor - The present invention provides a pH sensing apparatus that includes a flexible polymer substrate, one or more amorphous iridium oxide film sensor electrodes disposed on the flexible polymer substrate, and a reference electrode corresponding to each amorphous iridium oxide film sensor electrode. Each reference electrode is disposed on the flexible polymer substrate in close proximity to the corresponding amorphous iridium oxide film sensor electrode. The amorphous iridium oxide film sensor electrodes provide a potential in reference to the reference electrodes that varies according to a pH of a substance contacting the amorphous iridium oxide film sensor electrodes and the reference electrodes. | 01-30-2014 |
| 20140069817 | DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON WAFERS - Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers. | 03-13-2014 |
| 20140158546 | ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSI - An electrolytic copper plating solution for filling for forming microwiring for ULSI, is characterized in that it has a pH of from 1.8 to 3.0. The electrolytic copper plating solution preferably contains a saturated carboxylic acid having from 1 to 4 carbon atoms at a concentration from 0.01 to 2.0 mol/L. | 06-12-2014 |
| 20140174939 | ARRANGEMENT WITH AN IMPLANT AND/OR A UNIT BELONGING TO SAID IMPLANT, AND METHOD FOR PRODUCTION OF THE IMPLANT AND/OR UNIT - An implant ( | 06-26-2014 |
| 20140209475 | NANOHAIR STRUCTURE AND AN APPLICATION THEREFOR - There is provided a nanohair structure with the nanowires exposed on a nanotemplate; the method thereof; and a three-dimensional nanostructure-based sensor with ultra-sensitivity and greatly increased three-dimensional surface-to-volume ratio which immobilizes bio-nanoparticles to the nanohair structure and arranges antibodies to the nano surface with the controlled orientation by physical interaction. | 07-31-2014 |
| 20140231264 | Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-21-2014 |
| 20140246325 | FILM-FORMING APPARATUS AND FILM-FORMING METHOD - A film-forming apparatus ( | 09-04-2014 |
| 20140353162 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS - Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps. | 12-04-2014 |
| 20150053565 | BOTTOM-UP FILL IN DAMASCENE FEATURES - The embodiments herein relate to methods and apparatus for filling features with copper by a bottom-up fill mechanism without the use of organic plating additives. In some cases, filling occurs directly on a semi-noble metal layer, without the deposition of a copper seed layer. In other cases, the filling occurs on a copper seed layer. Factors such as the polarization of electrolyte, the use of a complexing agent, electrolyte pH, electrolyte temperature, and the waveform used to deposit material may contribute to promoting the bottom-up fill. | 02-26-2015 |
| 20150053566 | STAMPER, METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING MOLDED MATERIAL, AND PROTOTYPE ALUMINUM MOLD FOR STAMPER - Disclosed herein are a stamper which has anodized alumina formed on the surface thereof and which will not cause macroscopic unevenness or color unevenness on the transcribed surface; a method for producing the same; and a method for producing a molded material without macroscopic unevenness or color unevenness on the transcribed surface thereof by using such a stamper. The stamper includes alumina which has a microasperity structure and which is formed by anodization on the surface of a prototype aluminum mold having an aluminum purity of 99.5% or more, an average crystal-grain diameter of 1 mm or less, and an arithmetic mean surface roughness Ra of 0.05 μm or less. The use of this stamper enables the production of a molded material which does not have macroscopic unevenness or color unevenness on the transcribed surface thereof and which is suitable for use as an antireflection article and the like. | 02-26-2015 |
| 20150083601 | NEAR FIELD TRANSDUCERS INCLUDING ELECTRODEPOSITED PLASMONIC MATERIALS AND METHODS OF FORMING - Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material. | 03-26-2015 |
| 20150108002 | Microprobe Tips and Methods for Making - Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like. | 04-23-2015 |
| 20150345042 | METHOD OF MANUFACTURING MICROSTRUCTURES OF METAL LINES - A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced. | 12-03-2015 |
| 20150357079 | Methods of Coating an Electrically Conductive Substrate and Related Electrodepositable Compositions - A method of producing an electrode for a lithium ion battery is disclosed in which an electrically conductive substrate is immersed into an electrodepositable composition, the substrate serving as the electrode in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes. The electrodepositable composition comprises: (a) an aqueous medium; (b) an ionic (meth)acrylic polymer; and (c) solid particles comprising: (i) lithium-containing particles, and (ii) electrically conductive particles, wherein the composition has a weight ratio of solid particles to ionic (meth)acrylic polymer of at least 4:1. | 12-10-2015 |
| 20150376807 | PLATING METHOD - Copper electroplating baths having a surface tension of ≦40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects. | 12-31-2015 |
| 20160003760 | Electrochemical Sensor Chip - An electrochemical sensor is disposed on a sensor substrate suitable for flip-chip mounting to another substrate. The electrochemical sensor can be fabricated in bulk by patterning sets of electrodes on a common substrate with vias that electrically couple each electrode to a conductive pad on the opposite side of the substrate. The substrate with electrodes thereon can then be diced and the individual electrochemical sensors can be flip-chip mounted in a body-mountable device in which the sensor can be used to obtain analyte concentrations. As a result, fabrication of the electrochemical sensor electrodes can be isolated from fabrication of the other electronics in the device, which can facilitate efficient fabrication of the sensor and allows for other electronics to be fabricated without restrictions associated with the electrode fabrication. | 01-07-2016 |
| 20160060782 | NANO-CATALYST FILTER AND PRODUCTION METHOD FOR SAME - Provided is a method of manufacturing a nano-catalyst filter, which includes depositing through electrodeposition a catalyst precursor inside a porous filter to which an electrode layer is attached. Using this method, a nano-catalyst can be uniformly deposited inside a porous ceramic filter, and high catalyst efficiency can be obtained only using a small amount of the nano-catalyst. | 03-03-2016 |
| 20160105973 | MICRO-FABRICATED GROUP ELECTROPLATING TECHNIQUE - Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes. | 04-14-2016 |
| 20160115612 | METHOD OF MANUFACTURING A THIN-FILM MAGNETIC HEAD INCLUDING A COIL AND A MAGNETIC PATH FORMING SECTION - A thin-film magnetic head includes a coil, a magnetic path forming section, and an insulating film. The magnetic path forming section includes first and second magnetic material portions. The coil includes first and second coil elements located between the first and second magnetic material portions. The insulating film includes an underlying portion located under the first and second coil elements. In a method of manufacturing the thin-film magnetic head, the insulating film is formed to cover the first and second magnetic material portions, and then a seed layer is formed selectively on the underlying portion of the insulating film. The coil is formed by plating using the seed layer. | 04-28-2016 |
| 20160130715 | PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME - A method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described. | 05-12-2016 |
| 20160145757 | WINDING APPARATUS FOR WAVEGUIDE PROTOTYPE MOULD AND WAVEGUIDE MANUFACTURING METHOD - A wiring apparatus includes a substrate, two winding modules, and an axial wire dividing module. The two winding modules are disposed on the substrate. Each winding module includes a clamping mechanism with a chuck, a rotary mechanism having a rotation driving unit driving the chuck; and a reciprocating mechanism with a rail-slider assembly, the rotation driving unit connected to the slider. The axial wire dividing module is disposed on the substrate and located between the two winding modules with a wire supply channel provided with a wire inlet and a wire outlet. The wire outlet is provided with a cutter aligned with the center of the wire supply channel, and a cutting edge of the cutter faces the wire inlet; a waveguide prototype mould is formed by dividing a wire in real time and winding wires in grooves of a waveguide prototype. | 05-26-2016 |
