Class / Patent application number | Description | Number of patent applications / Date published |
205089000 | Utilizing magnet or magnetic field during coating | 11 |
20090050486 | Enhanced Magnetic Plating Method and Apparatus - An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate. | 02-26-2009 |
20090065363 | Electroplating Cell and Tool - An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process. | 03-12-2009 |
20100006444 | Plating apparatus and plating method for forming magnetic film - A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution; an anode vertically disposed in the plating tank at a position to be immersed in the plating solution; a substrate holder for holding a substrate W and positioning the substrate W opposite the anode; and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode. | 01-14-2010 |
20100038252 | METHOD OF PLATING A WAFER - A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer. | 02-18-2010 |
20110042223 | Magnetic Electro-Plating - The present disclosure generally relates to techniques for magnetic electroplating or electro-deposition. Example methods may include utilizing a magnet during electro-deposition to modify kinetics of deposition of plating material on a substrate. | 02-24-2011 |
20130153431 | METHODS AND APPARATUS FOR SORTING AND/OR DEPOSITING NANOTUBES - Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first characteristic and second nanotubes having a second characteristic. The apparatus further includes a sorting unit in the vessel configured to selectively isolate or otherwise sort the first nanotubes from the second nanotubes, and a field unit in the vessel configured to attach the first nanotubes to the workpiece. For example, the field unit can attach the first nanotubes to the workpiece such that the first nanotubes are at least generally parallel to each other and in a desired orientation relative to the workpiece. | 06-20-2013 |
20140262796 | Metal Plating Apparatus and Method Using Solenoid Coil - A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode. | 09-18-2014 |
20150053563 | MAGNETIC STRUCTURE FOR METAL PLATING CONTROL - Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity. | 02-26-2015 |
20150315714 | INTEGRATED FLUIDJET SYSTEM FOR STRIPPING, PREPPING AND COATING A PART - A method of stripping, prepping and coating a surface includes first stripping the exiting coating from a surface, using continuous or pulsed fluid jet, followed by prepping the surface by the same fluid jet. The method also provides entraining particles into a fluid stream, if desired to generate a particle-entrained fluid stream that is directed at the surface to be stripped and prepped. The particles act as abrasive particles for prepping the surface to a prescribed surface roughness required for subsequent application of a coating to the surface. The method then entails coating the surface by electrically charging particles having the same chemical composition as the particles used to prep the surface. Finally, a charged-particle-entrained fluid stream is directed at high speed at the charged surface to coat the surface. The particles form both mechanical and electronic bonds with the surface. | 11-05-2015 |
205090000 | Ferromagnetic material deposited | 2 |
20080197021 | Method to make superior soft (low Hk), high moment magnetic film and its application in writer heads - A process sequence for forming a soft magnetic layer having Hce and Hch of ≦2 Oe, Hk≦5 Oe, and Bs of ≧24 kG is disclosed. A CoFe or CoFe alloy is electroplated in a 10 | 08-21-2008 |
20080237051 | Method and plating bath for depositing a magnetic film - A cobalt-iron-boron (CoFeB) film ( | 10-02-2008 |