Class / Patent application number | Description | Number of patent applications / Date published |
204273000 | With agitator | 19 |
20080202922 | HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS - A hybrid electro-deposition process for soft magnetic cobalt alloy films comprises providing a plating bath that includes cobalt and a reducing agent, providing a cobalt-containing anode in the plating bath coupled to a power supply, providing a substrate in the plating bath coupled to the power supply, wherein the substrate functions as a cathode, applying a magnetic field across the plating bath, and applying an electrical current to the plating bath by way of the power supply to cause the cobalt to deposit onto the substrate and form a soft magnetic film. | 08-28-2008 |
20080271995 | AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION - In a reverse pulse plating of a substrate ( | 11-06-2008 |
20090008243 | CHLORINE GENERATOR - A chlorine generator includes a main water channel for connecting to a pool and a subsidiary water channel connected between two points on the main water channel. A feed valve, a brine tank, a pump and an electrolytic tank are located on the subsidiary water channel. Salt is added into the brine tank and dissolved in water drawn in from the main water channel, and the high concentration saline solution is pumped from the brine tank into the electrolytic tank where chlorine is generated from the saline. The chlorinated solution from the electrolytic tank is then mixed with the water in the main water channel. A stirring device is provided at the bottom of the brine tank to stir the water therein to facilitate the generation of high concentration saline solution. Salt is electrolyzed without being dissolved into the swimming pool directly, thereby reducing harmful effects to swimmers. | 01-08-2009 |
20090014321 | Surface Treatment Electrode - The invention concerns a surface treatment electrode ( | 01-15-2009 |
20090045049 | HYDROGEN-OXYGEN GAS GENERATOR AND HYDROGEN-OXYGEN GAS GENERATING METHOD THEREOF - A hydrogen-oxygen gas generator comprising an electrolytic cell, an electrode group formed from an anode and a cathode mutually installed in that electrolytic cell, a power supply for applying a voltage across the anode and cathode, a gas trapping means for collecting the hydrogen-oxygen gas generated by electrolyzing the electrolyte fluid and a vibration-stirring means. The gas trapping means is comprised of a lid member installed on the electrolytic cell, a hydrogen-gas extraction tube connecting to the hydrogen-oxygen gas extraction outlet of that lid member. A vibration-stirring means for stirring and agitating the electrolytic fluid is supported by support tables. The distance between the adjacent positive electrode and negative electrode within the electrode group is set within a range of 1 to 20 millimeters. The vibration-stirring means is comprised of vibrating motors vibrating at 10 to 200 Hertz, and vibrating blades vibrating within the electrolytic cell and unable to rotate are attached to a vibrating rod linked to the vibrating motors. | 02-19-2009 |
20090205953 | ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ACROSS A WORKPIECE DURING PLATING - An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes. | 08-20-2009 |
20100084265 | CONTINUOUS ELECTROREFINING DEVICE FOR RECOVERING METAL URANIUM - Disclosed is a continuous electrorefining device for recovering metal uranium. The electrorefining device comprises an electrolytic cell | 04-08-2010 |
20100140081 | Method and apparatus for plating a semiconductor package - A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices. | 06-10-2010 |
20110108415 | APPARATUS AND METHOD FOR PLATING A SUBSTRATE - An apparatus for electroplating a substrate includes a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly, an anode electrode disposed at an upper part of the substrate supporting member, a power source for applying a voltage to the anode electrode and the substrate, and a plating solution supply member for supplying a plating solution onto the substrate. | 05-12-2011 |
20120006678 | APPARATUS FOR PROVIDING A SUBSTANCE FOR THE ANALYSIS OF ISOTOPE RATIOS - A method and an apparatus for providing a substance for the analysis of isotope ratios, at least some of the substance being contained in a liquid phase in which the liquid phase is subjected to electrolysis and, in the process, the substance or a pre-product for the latter is formed. | 01-12-2012 |
20120055785 | Equipment for Stirring the Electrolyte in Electrolytic Production Cells - The current systems for stirring electrolyte in the cells for the electrolytic production of metals consists of introducing into the production cells, air or compressed neutral gases at low pressure in ventilators, and distribute them in the cell by means of perforated pipes to stir the electrolyte. These pipes are firmly attached to the structure of the cell or to a supporting structure of insulating material, in the case of the newly designed cells. With use, the crystallization of salts dissolved in the electrolyte, the depositing of solids and of anodic sludge will obstruct the perforations of the pipes, limiting the circulation of the electrolyte stirring air. During the operation of the cell, breakdowns or failures occur in the ventilators, distribution ducts and perforated pipes of this system for different reasons whose reparation or cleaning implies losing production time. | 03-08-2012 |
20120181168 | APPARATUS FOR PRODUCING GASEOUS HYDROGEN AND ENERGY GENERATION SYSTEM UTILISING SUCH APPARATUS - An apparatus is described for producing gaseous hydrogen, including: a container provided with an input for water; an acoustic-wave generator suitable for inducing sonolysis in the water introduced in the container; an electromagnetic radiation source configured to induce photolysis in the water introduced in the container; a device adapted to induce electrolysis and arranged subsequent to the acoustic-wave generator and at the source of the electromagnetic radiation. | 07-19-2012 |
20120199475 | PROCESSING APPARATUS WITH VERTICAL LIQUID AGITATION - A substrate or semiconductor wafer processing apparatus has an agitator plate adjacent to an upper end of a process vessel. A workpiece holder holds a workpiece in the vessel at a processing position above the agitator plate. A vertical actuator assembly supporting the agitator plate oscillates the agitator plate vertically. The agitator plate may also rotate while oscillating vertically. In one design, the agitator plate has a spiral vane and a spiral slot. In a related metal plating apparatus, electrodes and a dielectric field shaping unit are in the vessel, below the agitator plate, and a shield ring is adjacent to the upper end of the vessel, above the agitator plate. | 08-09-2012 |
20130334036 | APPARATUS FOR FLUID PROCESSING A WORKPIECE - A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation. | 12-19-2013 |
20140083845 | APPARATUS FOR GENERATING FINE BUBBLES HAVING A POSITIVE CHARGE AND WATER TREATMENT APPARATUS USING SAME - Provided is a water treatment apparatus using an apparatus for generating fine bubbles having a positive charge. The water treatment apparatus comprises: an apparatus for generating fine bubbles having a positive charge; a treatment bath into which the fine bubbles generated in the apparatus for generating fine bubbles are supplied and in which raw water is stored; and an ultrasonic oscillator for generating ultrasonic waves having a predetermined intensity when power is applied to explode the fine bubbles floating up to a water level after the fine bubbles are supplied into said treatment bath. Thus, germs attached to the fine bubbles may be sterilized by an exploding force generated when the fine bubbles are exploded. | 03-27-2014 |
20140158528 | DISTRIBUTION PLATE IN ELECTROLYTE BATH - An installation ( | 06-12-2014 |
20140251797 | ETCHING DEVICE FOR THE ELECTROLYTIC ETCHING OF COPPER - An etching device for the electrolytic etching of copper on an etching material, includes a first mixing device, which is designed to receive an acid electrolyte containing copper ions, and an oxygen gas or ozone gas in order to form a first liquid-gas mixture which can be channeled from a first outlet of the first mixing device into a connecting line coupled thereto; a container, which contains a container liquid, a second mixing device, which is arranged in the container and is surrounded by the container liquid, wherein the second mixing device includes a suction opening in order to suction in the container liquid present in the region of the suction opening, wherein the second mixing device is connected to the connecting line and is designed to channel the first liquid-gas mixture and the suctioned container liquid into a constricted zone of the second mixing device so that the suctioned container liquid mixes with the first liquid-gas mixture and is thus able to form a second liquid-gas mixture, wherein the second mixing device has a second outlet out of which the second liquid-gas mixture is able to flow and mix with the container liquid present in the region of the second outlet, and a container outlet line, which is designed to feed the container liquid present there to the etching material provided in an etching module. | 09-11-2014 |
20150368825 | SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS AND PADDLE FOR USE IN SUCH SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS - A substrate electrolytic processing apparatus capable of leveling an electric-field shielding rate with no need to increase its size is disclosed. The substrate electrolytic processing apparatus includes a processing bath for holding a processing solution, a substrate holder for holding a substrate and capable of locating the substrate in the processing bath, a counter electrode disposed in the processing bath and serving as an electrode opposite to the substrate, and a paddle disposed between the counter electrode and the substrate and configured to reciprocate parallel to a surface of the substrate so as to agitate the processing solution. The paddle includes agitation rods disposed in an inner region of the paddle and agitation rods disposed in an outer region of the paddle, and gaps between the agitation rods disposed in the outer region is smaller than gaps between the agitation rods disposed in the inner region. | 12-24-2015 |
20160138181 | SUBSTRATE PLATING DEVICE - A plating device includes a pl,ting bath containing therein a plating solution, a substrate holder for detachably holding a substrate, an anode disposed opposite to the substrate held by the substrate holder, a rail part stretched across an upper portion of the plating bath in parallel to the substrate holder, and a paddle suspended by the rail part and capable of reciprocating along the rail part. The paddle is vertically provided with a vane part rotatable round or pivotable on an axis part. The plating device can increase flow rate of a plating solution without installing a circulating pump outside a plating bath, and further can achieve same flow rate of the plating solution from a bottom of the plating bath to a level of the solution, enabling plating that forms a plating film having a uniform thickness on an entire region of a substrate and exhibits a high deposition rate. | 05-19-2016 |