| Entries |
| Document | Title | Date |
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| 20080196935 | Multilayer printed wiring boards with copper filled through-holes - Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment, a printed circuit broad has a plurality of through-holes to connect copper patterns on different layers of the printed circuits broad. Here, at least one of the through-holes is copper plated closed at both ends with at least 70% volume of the through-hole plated with copper to, e.g., enhance thermal characteristics of the through-hole, thereby providing extra reliability to the printed circuit board. In one embodiment, the printed circuit board includes a surface conductor (or cap) that is directly plated over the copper filled barrel plated through-hole. | 08-21-2008 |
| 20080257596 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 10-23-2008 |
| 20080264687 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module. | 10-30-2008 |
| 20080277155 | Wiring substrate and method of manufacturing the same - In a method of manufacturing a wiring substrate of the present invention, a through-hole plating layer is formed from an inner surface of a through hole in a substrate to both surface sides, then a resin is filled in a through hole, and then a first resist in which an opening portion is provided on the through hole is formed. Then, a partial cover plating layer is formed in the opening portion in the first resist, then the first resist is removed, and then a second resist that covers a whole of the partial cover plating layer and has a pattern for patterning the through-hole plating layer is formed. Then, a pad wiring portion containing the partial cover plating layer and a wiring pattern are obtained by etching the through-hole plating layer while using the second resist as a mask. | 11-13-2008 |
| 20080283287 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate. | 11-20-2008 |
| 20080283288 | Printed circuit board using paste bump and manufacturing method thereof - A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 11-20-2008 |
| 20080308315 | Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity. | 12-18-2008 |
| 20080314633 | Printed circuit board - A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer. | 12-25-2008 |
| 20080314634 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 12-25-2008 |
| 20080314635 | Printed circuit board having electromagnetic bandgap structure - A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size. | 12-25-2008 |
| 20090008145 | EMBEDDED CIRCUIT STRUCTURE AND FABRICATING PROCESS OF THE SAME - A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two opposite surfaces of the core panel. A conductive material is electroplated into the through hole and the indent patterns, so as to form a conductive channel in the through hole and two circuit patterns in the indent patterns respectively. Portions of the circuit patterns, which exceed the indent patterns respectively, are removed for planarizing the circuit patterns to be level with the two surfaces of the core panel respectively. | 01-08-2009 |
| 20090020327 | Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus - A wiring unit includes a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer; a second insulating layer which is formed on the one surface of the first insulating layer and which covers the wire; an adhesive layer which is formed on a surface, of the second insulating layer, not facing the first insulating layer; a through hole which is formed through the adhesive layer and the second insulating layer and in which the electrode is exposed; a protective sheet which is detachably adhered on a surface, of the adhesive layer, not facing the second insulating layer, and; and a liquid electroconductive material which is filled in a space defined by the through hole, the electrode exposed in the through hole, and the protective sheet. | 01-22-2009 |
| 20090038838 | CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME - A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer. | 02-12-2009 |
| 20090057001 | INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF - An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a core insulating layer of the plurality of the insulating layers to be embedded in the multi-layered PCB and including a plurality of input/output pads on their surface. The input/output pads disposed at an outermost area of the IC chip are coupled to outer terminals by connection members without passing through said via-hole, the remaining input/output pads except for the input/output pads disposed at the outermost area of the IC chip are coupled to the outer terminals through the via-hole. | 03-05-2009 |
| 20090065246 | Circuit board structure and method for manufacturing the same - A circuit board disclosed in the present invention includes a core board on which a first circuit layer is placed, wherein the first circuit layer has a plurality of conductive pads; and at least one built-up structure covering the surface of the circuit board, which comprises a dielectric layer, a second circuit layer, and a plurality of conductive vias without being surrounded by annular metal rings. The conductive vias are conducted with the conductive pads of the first circuit layer and the second circuit layer. Besides, the surface of the second circuit layer is in the same height as the surface of the dielectric layer. Also, the present invention provides a method for manufacturing the above-mentioned circuit board structure. Therefore, a circuit board having fine circuits can be formed, and the shape of the circuit can be ensured efficiently. Moreover, electric performances of the circuit board can be improved. | 03-12-2009 |
| 20090133919 | MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING BUILDUP PRINTED WIRING BOARD, AND ELECTRONIC APPARATUS - A multilayer printed wiring board includes: an insulating base including an indentation section formed thereon; a conductor pattern formed on the insulating base, the conductor pattern including a thick film section formed by embedding a conductor in the indentation section; and a via hole section formed in an upper layer of the insulating base, the via hole section including a bottom portion that is in contact with the thick film section. | 05-28-2009 |
| 20090139760 | Multilayer printed wiring board and method of manufacturing the same - A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals, and second via conductors that electrically connect the second layered electrode to the second external terminals. | 06-04-2009 |
| 20090178838 | CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME - A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided. | 07-16-2009 |
| 20090218126 | PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body. | 09-03-2009 |
| 20090255722 | Printed circuit board having landless via hole and method of manufacturing the same - This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern. | 10-15-2009 |
| 20090294166 | PRINTED WIRING BOARD - Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer. | 12-03-2009 |
| 20090294167 | MULTILAYER WIRING BOARD - A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic material layers and the constraining layers that are alternately stacked. In the material layer, a via-hole conductor is connected to an intermediate conductor pattern. An extended portion is defined by extending an end of the via-hole conductor beyond the intermediate conductor pattern inside the basic material layer. | 12-03-2009 |
| 20090308651 | WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole. | 12-17-2009 |
| 20090308652 | PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF - A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first electrical contact pads, and a first solder mask layer formed on the core board. A first wiring layer and a second wiring layer are disposed on two opposite surfaces of the core board, respectively, and electrically connected to the plated through hole. A portion of the first wiring layer is exposed from a first opening formed in the first solder mask layer. The first electrical contact pads are disposed on the exposed portion of the first wiring layer. The top surface of the first electrical contact pads is higher than that of the first wiring layer to thereby allow a semiconductor chip to be mounted on the electrical contact pads for improving electrical connection. | 12-17-2009 |
| 20100018764 | SUBSTRATE-PENETRATING ELECTRICAL CONNECTIONS - A wafer assembly ( | 01-28-2010 |
| 20100025099 | Circuit board and method of manufacturing the same - A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability. | 02-04-2010 |
| 20100032202 | Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate - A wiring substrate of the invention comprises electrical insulation substrate ( | 02-11-2010 |
| 20100038126 | INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME - Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 μm. | 02-18-2010 |
| 20100044093 | LAYOUT GEOMETRIES FOR DIFFERENTIAL SIGNALS - In one embodiment the present invention includes an electrical arrangement comprising conductive elements such as electrical traces. The conductive elements carry differential signals. The conductive elements extend horizontally and have alternating sections around one or more center lines. Ground lines may be included the further enhance signal integrity. In one embodiment, magnetic field cancellation may be achieved by providing an offset between pairs of alternating differential elements. | 02-25-2010 |
| 20100044094 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - The printed wiring board | 02-25-2010 |
| 20100059265 | CONTACT OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A contact of semiconductor device and manufacturing method thereof prevent generation or inlet of noise through a contact plug which connects wires in different layers. The contact includes a lower wire, an insulating layer covering the lower wire, a contact plug connected to the lower wire through the insulating layer, a conductive tube encircling the contact plug and having the insulating layer in between, and an upper wire connected to the contact plug. | 03-11-2010 |
| 20100096177 | Coreless substrate having filled via pad and method of manufacturing the same - Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy. | 04-22-2010 |
| 20100096178 | NON-SHIRINKAGE CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF - A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via electrode; and an interface part formed between the ceramic laminated body and the electrode part to prevent an electrical connection between the electrodes from weakening. | 04-22-2010 |
| 20100155130 | Multilayer Printed Wiring Board - A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof. | 06-24-2010 |
| 20100163297 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a substrate having a first surface, a second surface on the opposite side of the first surface and a through-hole extending between the first and second surfaces, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor filling the through-hole and connecting the first and second conductive circuits. The through-hole has a first opening portion tapering from the first surface toward the second surface and a second opening portion tapering from the second surface toward the first surface. The substrate is made of a resin and a reinforcing material portion in the resin. The reinforcing material portion has a protruding portion protruding into the through-hole at the intersection of the first and second opening portions. The protruding portion encroaches into the through-hole conductor. | 07-01-2010 |
| 20100307807 | DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R | 12-09-2010 |
| 20100307808 | WIRING BOARD - A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors. | 12-09-2010 |
| 20110036626 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer. | 02-17-2011 |
| 20110042131 | Ceramic substrate and manufacturing method thereof - The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof. | 02-24-2011 |
| 20110067913 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer. | 03-24-2011 |
| 20110100698 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole, and a first wiring layer formed on the first insulation layer, a second rigid wiring board having a second wiring layer on a main surface and being accommodated in the penetrating hole, a first connection conductor which connects the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer. | 05-05-2011 |
| 20110120762 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively. | 05-26-2011 |
| 20110132652 | STRUCTURE OF VERY HIGH INSERTION LOSS OF THE SUBSTRATE NOISE DECOUPLING - A structure includes a substrate comprising a region having a circuit or device which is sensitive to electrical noise. Additionally, the structure includes a first isolation structure extending through an entire thickness of the substrate and surrounding the region and a second isolation structure extending through the entire thickness of the substrate and surrounding the region. | 06-09-2011 |
| 20110155439 | MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring substrate includes: a first insulating layer comprising a first surface and a second surface opposite to the first surface; a second insulating layer on the first surface of the first insulating layer; a first wiring pattern on the second surface of the first insulating layer; a second wiring pattern on a surface of the second insulating layer; a first via formed through the first insulating layer; a second via formed through the second insulating layer; and a third wiring pattern formed on the first surface of the first insulating layer and embedded in the second insulating layer, the third wiring pattern having a hole therethrough. A diameter of the hole is smaller than each diameter of the first and second vias. The first via and the second via are connected to each other through a metal filled in the hole of the third wiring pattern. | 06-30-2011 |
| 20110168439 | MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack. | 07-14-2011 |
| 20110209911 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion. | 09-01-2011 |
| 20110214915 | PRINTED WIRING BOARD - A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. | 09-08-2011 |
| 20110220405 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in a second insulating substrate that has the same shape and the same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having the same shape and the same size as a shape and a size, respectively, of the first through holes and being formed at the same positions as positions at which the first through holes are formed. At least one of the first through holes is filled with a first conductive member and at least one of the second through holes is filled with a second conductive member. And stacking the first insulating substrate and the second insulating substrate together. | 09-15-2011 |
| 20110220406 | ELECTRODE PORTION STRUCTURE - In an electrode portion structure in which an electrode is formed in an end portion of a through-wiring, disconnection is prevented in an electrode portion. A through-hole that vertically pierces a substrate is made in the substrate, and a through-electrode is provided in the through-hole. The through-electrode is projected in s curved-surface manner from an upper surface of the substrate. The upper surface of the substrate | 09-15-2011 |
| 20110240356 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate. | 10-06-2011 |
| 20110259631 | METHOD AND APPARATUS FOR LASER MACHINING RELATIVELY NARROW AND RELATIVELY WIDE STRUCTURES - The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern. | 10-27-2011 |
| 20110284281 | LAMINATED HIGH-FREQUENCY MODULE - In a laminated high-frequency module, a laminate includes a plurality of dielectric layers. In a lower layer region including some of the plurality of dielectric layers, a digital circuit is provided. In an interlayer region including some of the plurality of dielectric layers, a digital circuit and an analog circuit are arranged so that they do not overlap in plan view of the laminate. In an upper layer region including some of the plurality of dielectric layers, a digital circuit is provided. Digital ICs are mounted on the surface of the uppermost dielectric layer in the upper layer region. An inner-layer ground electrode is provided on substantially an entire boundary surface between the lower layer region and the interlayer region and on substantially an entire boundary surface between the interlayer region and the upper layer region. In the interlayer region, a digital line and an inner-layer ground electrode are alternately arranged in the lamination direction. | 11-24-2011 |
| 20110290549 | WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE - A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another. | 12-01-2011 |
| 20110303453 | LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD - A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole through which the first land is connected to the second land, wherein a diameter of the through-hole of the plate is larger than a diameter of a component that is made by filling the conducting material. | 12-15-2011 |
| 20110303454 | LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD - A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; anda plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking. | 12-15-2011 |
| 20120012380 | Back Drill Verification Feature - A back drill verification feature is provided on a layer of a circuit board. Before a back drill operation is performed, an electrical connection exists between conductive material in a via hole and the back drill verification feature. After the back drill operation, the electrical connection is severed. | 01-19-2012 |
| 20120024586 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT - A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate; and thermal-expansion adjusting portions produced by filling prepared-holes with the dielectric material, the prepared-holes being produced at a surface of the substrate. The surface is partitioned into predetermined blocks, in each of which the thermal-expansion adjusting portions are placed in a layout that minimizes a difference between a thermal expansion coefficient in the block in a length direction and a thermal expansion coefficient in the block in a width direction according to a placement of the wiring through-hole portions in the block. | 02-02-2012 |
| 20120055708 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate. | 03-08-2012 |
| 20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
| 20120103679 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section. | 05-03-2012 |
| 20120111625 | Printed circuit board and method for filling via hole thereof - Disclosed herein is a method for filling a via hole of a printed circuit board, the method including: a dividing step of dividing a via hole that is to be formed in a base substrate into a predetermined number; a first via forming step of forming a first divided via by primarily processing portions of the divided via hole; a first filling step of filling the formed first divided via with a metal; a second via forming step of forming a second divided via by secondarily processing other portions of the divided via hole; and a second filling step of filling the formed second divided via with a metal to fill the via hole, thereby making it possible to fill the via hole without a dimple. | 05-10-2012 |
| 20120138352 | SUBSTRATE FOR ELECTRICAL COMPONENT AND METHOD - Insulating substrates may be selectively removed to form electrical connections between conductive patterns on different faces of the insulating substrate or between conductive patterns on the insulating substrate and external circuits. | 06-07-2012 |
| 20120145447 | Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board - Disclosed herein is a via structure with a conductive via. There is provided a via structure, including: a substrate laminate having a multilayer structure and a via hole penetrating through the multilayer structure; a first circuit pattern formed on one surface of the substrate laminate; a second circuit pattern formed on the other surface of the substrate laminate; and a conductive via formed in the via hole and having one end connected to the first circuit pattern and the other end connected to the second circuit pattern, wherein the multilayer structure includes resin layers having different etching rates using an alkaline solution. | 06-14-2012 |
| 20120168220 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multi-layer printed circuit board and a method of manufacturing the same. In the multi-layer printed circuit board and the method of manufacturing the same, circuit layers formed in a plurality of insulating layers are electrically interconnected through vias formed in a lump, thereby making it possible to secure bonding reliability of an interlayer circuit layer and more stably secure performance of the printed circuit board. In addition, since a stacked type via structure may be implemented by performing a via hole drilling process, a desmear process, and a copper plating process only one time after an insulating layer and an circuit layer are stacked, a manufacturing process, a manufacturing time, and manufacturing costs of the stacked type via structure may be reduced. | 07-05-2012 |
| 20120168221 | RELAY BOARD FOR TRANSMISSION CONNECTOR USE - A relay board for relaying plurality of electric wires to a transmission connector, the relay board provided with first and second front ground pads | 07-05-2012 |
| 20120199389 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections. | 08-09-2012 |
| 20120247824 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion. | 10-04-2012 |
| 20120261179 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid. | 10-18-2012 |
| 20120298410 | Interposer Testing Using Dummy Connections - An interconnection component includes a substrate, and an active through-substrate via (TSV) penetrating through the substrate. Active metal connections are formed over the substrate and electrically connected to the active TSV. At least one of a dummy pad and a dummy solder bump are formed at surfaces of the interconnection component. The dummy pad is over the substrate and electrically connected to the active TSV and the active metal connections. The dummy solder bump is under the substrate and electrically connected to the active metal connections. The dummy pad and the dummy solder bump are open ended. | 11-29-2012 |
| 20120298411 | ON-CHIP INTERCONNECTS WITH REDUCED CAPACITANCE AND METHOD OF AFBRICATION - An electronics interconnection system is provided with reduced capacitance between a signal line and the surrounding dielectric material. By using a non-homogenous dielectric, the effective dielectric constant of the material is reduced. This reduction results in less power loss from the signal line to the dielectric material, and therefore reduces the number of buffers needed on the signal line. This increases the speed of the signal, and reduces the power consumed by the interconnection system. The fabrication techniques provided are advantageous because they can be preformed using today's standard IC fabrication techniques. | 11-29-2012 |
| 20130032389 | CONNECTION SUBSTRATE - A connection substrate | 02-07-2013 |
| 20130075147 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer. | 03-28-2013 |
| 20130092429 | CROSS TALK REDUCTION FOR HIGH-SPEED ELECTRICAL CONNECTORS - An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary electrical connector. The printed circuit board includes a ground coupling assembly that electrically connects at least a pair of the ground conductors. | 04-18-2013 |
| 20130098670 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - Embodiments of the present invention provide a wiring substrate that includes a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among the plurality of projection electrodes has a larger outer diameter than an outer diameter of a via conductor and is a variant projection electrode which has a roughened upper surface. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode. | 04-25-2013 |
| 20130105212 | MULTILAYER INSULATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
| 20130118793 | METHOD FOR FILLING THROUGH HOLE OF SUBSTRATE WITH METAL AND SUBSTRATE - The present invention relates to a method for filling a through hole of a substrate with a metal. The method includes a step of preparing a bonded substrate including a first substrate having conductivity in at least a surface thereof and a second substrate having a through hole, both substrates being bonded to each other through a nonionic surfactant; a step of exposing, in the bonded surface of the bonded substrate, the conductive surface of the first substrate, which is positioned at the bottom of the through hole, by removing the nonionic surfactant positioned at the bottom of the through hole of the second substrate; and a step of filling the through hole with a metal by applying an electric field to the conductive surface of the first substrate. | 05-16-2013 |
| 20130140073 | ROUTING STRUCTURE FOR CONNECTING SENSOR ELECTRODES USING BLACK ARTWORK ON TOUCH-PANEL GLASS - A structure and method is disclosed for a routing structure for connecting the transparent conductive oxide (TCO) electrodes of a touch-sensor panel to a touch controller while providing the requisite cross-over routing. Routing is confined to the border area of a single glass panel where there is no need for transparency. By applying the TCO electrodes to the glass surface, first, and then applying the non-conducting artwork layer above them, there is no need to extend the TCO electrodes above the glass surface and, thereby, subject these thin and brittle electrodes to mechanical stress. Instead, vias are positioned in the artwork then filled with conductive plugs. These provide the connectivity between the TCO electrodes and metal traces above them. | 06-06-2013 |
| 20130175078 | PRINTED CIRCUIT BOARD - The printed circuit board comprises two first signal traces, a first grounding layer, two first signal traces, a second grounding layer, two signal conductive pillars and two grounding conductive pillars. The first signal traces are formed on a first surface of a substrate. The first grounding layer is formed on the first surface. The second signal traces are formed on a second surface of the substrate. The second grounding layer is formed on the second surface. The signal conductive pillars are extended to the second surface from the first surface and each signal conductive pillar connects the corresponding first signal trace and second signal trace. The grounding conductive pillars are extended to the second surface from the first surface and each grounding conductive pillar connects the first grounding layer and the second grounding layer. Each grounding conductive pillar and the corresponding signal conductive pillar are disposed in pairs. | 07-11-2013 |
| 20130199833 | CIRCUIT BOARD - Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power. | 08-08-2013 |
| 20130233608 | Physical Unclonable Interconnect Function Array - A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer. | 09-12-2013 |
| 20130248236 | Circuit board having holes to increase resonant frequency of via stubs - A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. | 09-26-2013 |
| 20130313011 | INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer. | 11-28-2013 |
| 20130319750 | CARBON-FIBER-REINFORCED PLASTIC STRUCTURE AND METHOD FOR PRODUCING SAME - A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg. | 12-05-2013 |
| 20130341077 | METHOD FOR REPAIRING DISCONNECTION IN WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR FORMING WIRING IN WIRING BOARD AND WIRING BOARD - A method for repairing a disconnection in a wiring board includes positioning a substrate including an insulation layer and a conductive layer formed on the insulation layer, the conductive layer having a wiring line disconnected such that the wiring line has a disconnected portion formed between conductive patterns forming the wiring line, applying in the disconnected portion between the conductive patterns a conductive paste including a non-conductive material and conductive particles such that the conductive paste fills the disconnected portion between the conductive patterns and joins the conductive patterns forming the wiring line in the conductive layer, and irradiating laser upon the conductive paste applied in the disconnected portion such that at least a portion of the conductive paste in the disconnected portion is sintered and forms a sintered portion connecting the conductive patterns of the wiring line in the conductive layer. | 12-26-2013 |
| 20140034374 | GLASS INTERPOSER PANELS AND METHODS FOR MAKING THE SAME - Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D | 02-06-2014 |
| 20140041922 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities and the through holes. A conductive material filling up the vias is formed to define plural conductive posts. An insulation layer having a top surface and plural blind vias extending from the top surface to the conductive posts is formed on the upper surface. A patterned circuit layer filling up the blind vias, being connected to the conductive posts and exposing a portion of the top surface is formed on the top surface. A solder mask layer is formed on the patterned circuit layer and has plural openings exposing a portion of the patterned circuit layer to define plural pads. | 02-13-2014 |
| 20140076623 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps. | 03-20-2014 |
| 20140138142 | INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer. | 05-22-2014 |
| 20140166355 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, the method including: (a) performing a hole processing process on one surface of a core layer to process a first via hole having a predetermined height hl; (b) performing a plating process on one surface of the core layer to form a first via electrode in the first via hole and form a first metal layer on one surface of the core layer; (c) performing a hole processing process on the other surface of the core layer to process a second via hole having a predetermined height h2 exposing a lower surface of the first via electrode to the outside; and (d) performing a plating process on the other surface of the core layer to form a second via electrode in the second via hole and form a second metal layer on the other surface of the core layer. | 06-19-2014 |
| 20140190733 | PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF - Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB. The method further comprises: filling the formed through holes with a plating resist ink to prevent the through holes from being plated with a conductive material; laminating the target prepregs and core boards so as to form a multi-layer printed circuit board PCB, wherein some or all of the prepregs are the target prepregs; drilling the multi-layer PCB to perforate the preset holes in the target prepregs; and plating inner walls of holes formed by drilling the multi-layer PCB. | 07-10-2014 |
| 20140202754 | MICRO ELECTRONIC COMPONENT STRUCTURE - A micro electronic component structure includes an insulating body, at least one conductive through hole, at least one conductive material, and at least one micro terminal. The insulating body has a top surface and a bottom surface. The conductive through hole penetrates the top surface and the bottom surface. The conductive material is formed in the conductive through hole. The micro terminal is disposed above the conductive material. | 07-24-2014 |
| 20140231126 | STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES - Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom. | 08-21-2014 |
| 20140332262 | OPTICALLY TRANSPARENT ELECTRODE - Provided is an optically transparent electrode of which the visibility of the electrode pattern is low. The optically transparent electrode is produced by joining two optically transparent conductive materials each having, on one side of the optically transparent base material, a large lattice | 11-13-2014 |
| 20140353027 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate, and a through-hole conductor formed in the penetrating hole through the insulative substrate such that the through-hole conductor is connecting the first conductive layer and second conductive layer. The penetrating hole has a first opening portion formed on a first-surface side of the insulative substrate and a second opening portion formed on a second-surface side of the insulative substrate such that the second opening portion has a depth which is greater than a depth of the first opening portion and the second opening portion has a volume which is greater than a volume of the first opening portion, and the through-hole conductor formed in the second opening portion includes a void portion. | 12-04-2014 |
| 20140374153 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A PCB includes at least three single layer circuit boards laminated together. The single layer circuit boards include two outer circuit boards and at least one inner circuit board. Each single layer circuit board includes a dielectric layer and a conductive layer on a surface of the dielectric layer. The dielectric layer is selected from a material of thermoplastic resin. Each single layer circuit board defines at least one blind hole passing through the dielectric layer and is ended at the conductive layer. Each blind hole is filled with a filler material electrically connected to the conductive layer. The conductive layer of the at least one inner circuit board forms a first conductive circuit pattern, and the conductive layers of the outer circuit boards each form a second conductive circuit pattern. The second conductive circuit pattern is electrically connected to the first conductive circuit pattern by the filler material. | 12-25-2014 |
| 20150034377 | GLASS CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a glass core substrate and a method for manufacturing the same. According to an embodiment of the present invention, there is provided the glass core substrate including: a glass core laminate including a glass layer and insulating layers which are stacked on upper and lower portions of the glass layer; a through hole formed by penetrating through the glass core laminate and provided with at least one crack which is formed at a penetrating inner wall by penetrating into the glass layer; and a conductive material filled in the through hole and the crack. Further, the method for manufacturing a glass core substrate is provided. | 02-05-2015 |
| 20150041205 | THIN PACKAGE STRUCTURE WITH ENHANCED STRENGTH - A thin package structure with enhanced strength includes a support carrier plate and a thin circuit board. The thin circuit board is formed on the support carrier plate and includes a first circuit layer, a dielectric layer and a second circuit layer. The first circuit layer includes the first circuit patterns and the first connection pads. The dielectric layer covers the first circuit layer. The second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes the second circuit patterns and the second connection pads. Connection plugs are formed in the dielectric layer to connect the first and second connection pads. The support carrier plate provides mechanical strength to avoid warping or deforming. It is feasible to direct test the package structure without disassembling so as to improve the convenience in testing. | 02-12-2015 |
| 20150083480 | INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base substrate; a circuit pattern formed on the base substrate; and a through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern. | 03-26-2015 |
| 20150114707 | NANO-COPPER SOLDER FOR FILLING THERMAL VIAS - A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pull. The push/pull can be performed by using a mechanical device or by a person. A capping layer can be on both side of the via. The vias formed by using the nanomaterials provides a high efficient vertical heat transferring path from one side of the electronic board to the other side of the electronic board. | 04-30-2015 |
| 20150319847 | WIRING SUBSTRATE - A wiring substrate may include an insulating layer; a differential signal transmission line including a first wiring formed on a first surface of the insulating layer and a second wiring formed on a second surface of the insulating layer, the first wiring and the second wiring transmitting differential signals; and a ground part including a first ground layer and a second ground layer disposed to be spaced apart from the first wiring by the predetermined distance on the first surface of the insulating layer and a third ground layer and a fourth ground layer disposed to be spaced apart from the second wiring by the predetermined distance on the second surface of the insulating layer. | 11-05-2015 |
| 20150366060 | CIRCUIT STRUCTURE AND FABRICATION METHOD THEREOF - A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand. | 12-17-2015 |
| 20160021736 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a first insulating layer; a second insulating layer formed below the first insulating layer; a via pad formed on an upper surface of the second insulating layer and formed so as to be buried in the second insulating layer; a double via formed on an upper surface of the via pad, formed so as to penetrate through the first insulating layer, and including an auxiliary via and a first via; and a second via formed on a lower surface of the via pad and formed so as to penetrate through the second insulating layer. | 01-21-2016 |
| 20160044787 | WIRING SUBSTRATE - A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor. | 02-11-2016 |
| 20160057857 | CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES - A method of forming a circuit board includes forming a conductive pattern on a substrate; forming a first negative resist on the substrate after formation of the conductive pattern; partially exposing the first negative resist on the surface of the conductive pattern to form a first via exposure portion; forming a second negative resist on the substrate after formation of the first via exposure portion; partially exposing the second negative resist on the first via exposure portion to form a second via exposure portion larger than the first via exposure portion; developing the first negative resist and the second negative resist after formation of the second via exposure portion to form a via opening reaching the conductive pattern; and filling the via opening with a conductive material. | 02-25-2016 |
| 20160064317 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above. | 03-03-2016 |
| 20160079148 | SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A substrate structure is provided, including: a carrier having at least a wiring area defined and positioned on a portion of a surface of the carrier; a first insulating layer formed on the wiring area; a wiring layer formed on the first insulating layer formed on the wiring area; and a second insulating layer formed on the wiring area. Therefore, a contact surface between the carrier and the first and second insulating layers is reduced by reducing the areas of the first and second insulating layers, whereby a substrate warpage due to mismatch of coefficients of thermal expansion (CTE) is avoided. The present invention further provides a method of manufacturing the substrate structure as described above. | 03-17-2016 |
| 20160100485 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground. | 04-07-2016 |
| 20160165722 | INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME - A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the first conductive pillars being exposed from the first insulating layer; forming on the first conductive pillars a second wiring layer that is electrically connected to the first conductive pillars; forming a plurality of second conductive pillars on the second wiring layer; forming on the first insulating layer a second insulating layer that covers the second wiring layer and the second conductive pillars, with terminal surfaces of the second conductive pillars being exposed from the second insulating layer; and removing the carrier. The first conductive pillars have terminal surfaces in geometric shapes, except for a circle. Therefore, the interposer substrate can have a layout on demands, and can be designed at a designer's will. The present invention also provides the interposer substrate. | 06-09-2016 |
| 20160181189 | GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION | 06-23-2016 |
| 20160181191 | SUBSTRATE CORE VIA STRUCTURE | 06-23-2016 |
| 20160192507 | ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTOR OR SEMICONDUCTOR PACKAGING SUBSTRATE - An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. The resulting terminal shape is defined by the shape of the cavity created in the resist layers. Complex terminal shapes are possible. The present conductive terminals are particularly useful for electrical interconnects and semiconductor packaging substrates. | 06-30-2016 |
| 20160205778 | WIRING BOARD WITH EMBEDDED INTERPOSER INTEGRATED WITH STIFFENER AND METHOD OF MAKING THE SAME | 07-14-2016 |
