Class / Patent application number | Description | Number of patent applications / Date published |
073719000 | Resistive | 83 |
20110185817 | SENSOR MEMBRANE - A pressure or force sensor has a sensor housing, a measuring element in the housing, and a sensor membrane. The membrane is delimited by an inner edge and an outer edge, which is connected in a pressure-resistant manner to the sensor housing. The inner edge transitions in a pressure-resistant manner into a movable plunger, the travel of which can be detected by the measuring element. The membrane has one or more elastic regions between the outer edge and the inner edge, each region having a thinnest point, wherein the material thickness inside the elastic region increases steadily on both sides of this thinnest point. The cross-section of the membrane has an arched shape in each elastic region, and the arched shape has a convex outer and concave inner contour relative to the arch orientation. | 08-04-2011 |
20110303016 | FLEXIBLE POLYMER-BASED ENCAPSULATED-FLUID DEVICES - Embodiments of the present disclosure are directed to MEMS-based medical devices including a flexible housing that forms a chamber for encapsulating a fluid or liquid. The devices also include encapsulated electrodes, portions of which are exposed to the fluid or liquid within the chamber for sensing and/or physical actuation (controlled movement). Such medical devices can function specifically as: contact force sensors; and/or out-of-plane actuators. Device function is enabled by the encapsulation of liquid within the microchamber. Depending on the kind of electrical input applied, the encapsulated electrodes can function as electrochemical sensing elements; and/or electrolytic generation electrodes. Devices according to the present disclosure can have a fluidic coupling to the external environment or can be isolated. Fluidic isolation from the surrounding environment can be accomplished by the inclusion of an annular-plate stiction valve within the device. Related methods of use and fabrication are also described. | 12-15-2011 |
20120118066 | STRETCHABLE TWO-DIMENSIONAL PRESSURE SENSOR - A pressure sensor for measuring the location and intensity of an applied pressure, including an elastomeric sheet; and a plurality of micro-channels embedded in the elastomeric sheet. | 05-17-2012 |
20130019688 | MEASUREMENT SYSTEM FOR MEASURING PRESSURE OF FLUID AND MANUFACTURE METHOD THEREOF - A measurement system for measuring a pressure of a fluid is provided. The measurement system includes a sensing module and a liquid electrical circuit. The sensing module includes a flexible film and a liquid electronic device. The flexible film has a first side and a second side opposite to the first side. The fluid is disposed on the first side of the flexible film, and the liquid electronic device is disposed on the second side of the flexible film. The flexible film converts the pressure of the fluid into a parameter of the liquid electronic device. The liquid electrical circuit is electrically coupled to the liquid electronic device. The liquid electronic device and the liquid electrical circuit output a measurement signal corresponding to the parameter in response to an applied electrical energy. A manufacture method of a measurement system is also provided. | 01-24-2013 |
20140020473 | SENSOR FOR PRESSURE MEASUREMENTS - A sensor for pressure measurement may include a fabric support, an electrically conductive structure including tracks on the fabric support having resistance variations in response to deformations thereof, and a processor coupled to the electrically conductive structure and configured to sense resistance values of respective tracks of the electrically conductive structure and to provide a signal representative of a pressure difference across opposite faces of the fabric support. | 01-23-2014 |
20140260646 | Noise Reduction In Infrasound Detection - Provided are methods, circuits and apparatuses for detecting pressure variations. The circuit can comprise at least two pressure sensors electrically coupled in parallel. At least one pressure sensor can have a differential input and a differential output. The circuit can also comprise a first switching mechanism electrically coupled to the differential input of the at least one pressure sensor. The first switching mechanism can be configured to electrically couple a first current source to the at least one pressure sensor according to a first reference signal. The circuit can also comprise a second switching mechanism electrically coupled to the differential output of the at least one pressure sensor. The second switching mechanism can be configured to electrically couple a second current source to the at least one pressure sensor according to a second reference signal. | 09-18-2014 |
20160146687 | SYSTEM FOR MEASURING PRESSURE ABLE TO DISCRIMINATE A FAILURE FROM AN OVER PRESSURE OR UNDER PRESSURE - The invention relates to a system for measuring pressure, including a pressure sensor comprising: a deformable membrane on which is placed a resistive bridge able to deliver a bridge voltage representative of a deformation of the deformable membrane caused by a pressure applied to said deformable membrane; a system for limiting the deformation of the deformable membrane, able to limit the bridge voltage in the case of an over-pressure or an under-pressure on the deformable membrane; and an amplifying electronic circuit connected to the resistive bridge, able to deliver an output voltage depending on the bridge voltage; the limiting system and the electronic circuit are conjointly configured so that the output voltage makes it possible to distinguish the case of failure of the pressure sensor and/or of the electronic circuit from the case of an over-pressure or under-pressure on the deformable membrane. | 05-26-2016 |
20160187192 | NOISE REDUCTION IN INFRASOUND DETECTION - Provided are methods, circuits and apparatuses for detecting pressure variations. The circuit can comprise at least two pressure sensors electrically coupled in parallel. At least one pressure sensor can have a differential input and a differential output. The circuit can also comprise a first switching mechanism electrically coupled to the differential input of the at least one pressure sensor. The first switching mechanism can be configured to electrically couple a first current source to the at least one pressure sensor according to a first reference signal. The circuit can also comprise a second switching mechanism electrically coupled to the differential output of the at least one pressure sensor. The second switching mechanism can be configured to electrically couple a second current source to the at least one pressure sensor according to a second reference signal. | 06-30-2016 |
073720000 | Strain gauge | 75 |
20080229838 | WELDED HEADER FOR PRESSURE TRANSMITTER - A pressure transmitter comprises a metal wall separating a process pressure chamber from an electronics compartment. The metal wall has a stepped bore with a bore shelf facing the process pressure chamber. A metal header has a stepped outer rim with a header shelf that contacts the bore shelf. The metal header includes at least one electrical feedthrough with a glass-to-metal seal adjacent the stepped outer rim. A welded seal seals the stepped outer rim to the stepped bore. | 09-25-2008 |
20090056462 | MANUFACTURING METHOD OF PRESSURE SENSOR AND PRESSURE SENSOR - A manufacturing method of a pressure sensor that includes a pressure detector having a bottomed cylindrical member with a bottom including a thin-wall portion and a strain detecting mechanism provided on one side of the bottom for detecting a strain of the bottom and a pressure-introducing joint for introducing the fluid to be measured into the bottomed cylindrical member is provided. The method includes: first welding for butt-welding an end of the cylindrical portion of the bottomed cylindrical member and an end of the pressure-introducing joint; and second welding for welding the pressure-introducing joint in parallel to a first weld bead formed by the first welding. | 03-05-2009 |
20110167918 | PRESSURE SENSOR ASSEMBLY - A pressure sensor assembly having a pressure tube, in which a diaphragm is situated as a pressure pickup, and having means for detecting the diaphragm deformations, which allow a spatial separation between the measuring medium acting on the diaphragm and the means for detecting the diaphragm deformations. The diaphragm of this pressure sensor assembly includes at least two diaphragm sections oriented at an angle to one another. A first diaphragm section is situated as a partition diaphragm in the cross-section of the pressure tube, while at least one second diaphragm section forms an area of the wall of the pressure tube as a side wall diaphragm. The means for detecting diaphragm deformations are situated on the outer side of the pressure tube on the side wall diaphragm. | 07-14-2011 |
20110290029 | PRESSURE SENSOR - A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor. | 12-01-2011 |
20110290030 | PRESSURE SENSOR - A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor. | 12-01-2011 |
20110303017 | INTEGRATION OF STRAIN GAUGES AT INNER- AND OUTER LINER OF A HIGH PRESSURE TANK TO INDICATE DISCHARGE LIMIT POINT - A high pressure tank that has particular application for storing hydrogen gas on a vehicle for a fuel cell system. The tank includes a gas tight inner liner layer and a fiber bundle outer composite structural layer. A first strain gauge is provided in the outer layer and a second strain gauge is provided in the inner liner layer both proximate a transition between the layers. The strain gauges are calibrated relative to each other to identify the pressure where the inner liner layer begins to shrink and separate from the outer composite layer. | 12-15-2011 |
20120060618 | TORQUE INSENSITIVE HEADER ASSEMBLY - There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header generally includes an outer torque isolating shell which has a “C” shaped cross section with the cylindrical shell surrounding an inner “H” section header. The inner “H” section header has a thick diaphragm and is at least partially surrounded by the torque isolating shell. In this manner, when the header is installed, the installation force is absorbed by the outer shell and there is relatively no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. | 03-15-2012 |
20120297886 | Vertical Pressure Sensor - A vertical pressure sensor having a fluid deforming pressure application unit, a sensor housing, a socket, a circuit board, a plurality of electrode terminals, and a plurality of electrical signal transmitting electrode rods. The pressure application unit includes a diaphragm to which strain gauges are attached. The socket surrounds a circumference of the diaphragm of the pressure application unit and includes a receiving passageway. The plurality of electrode terminals are provided at the upper end of the socket in a Wheatstone bridge circuit pattern. The plurality of electrode terminals protrude from the upper end of the socket to constitute an electrode tip. The circuit board connects to the plurality of electrode terminals to convert a pressure value into an electrical signal, and the plurality of electrode rods are connected to the circuit board to transmit the electrical signal outside. | 11-29-2012 |
20130036825 | HIGH TEMPERATURE GAGE PRESSURE SENSOR - A pressure sensor for measuring gage pressure in relatively high temperature environments is provided. The sensor includes a housing that is configured to couple to a source of pressurized fluid and has an inner surface that defines a inner volume. A pressure sensitive device is coupled to the sensor housing and is configured define a reference chamber in at least a portion of the inner volume. The reference chamber is fluidly isolated from the source of pressurized fluid. An atmospheric reference port is formed in the sensor housing and is in fluid communication with the reference chamber for maintaining the reference chamber at ambient atmospheric pressure. A porous metallic plug is disposed within the atmospheric reference pressure port. | 02-14-2013 |
20130036826 | MULTIPLE HYDRAULIC CIRCUIT PRESSURE SENSOR - A hydraulic solenoid assembly for complex vehicle-borne control systems, such as automatic transmissions, includes a solenoid body or unitary housing operatively enclosing two or more solenoid valves. Each valve has a pressure port extending to an outer surface of the housing, emerging in a spaced-apart matrix. A metal (stainless steel or aluminum) sensor plate is mounted to the outer surface of the housing so as to sealingly overlay the pressure ports. A diaphragm is formed in the sensor plate for each solenoid valve and registers with its associated pressure port. Electrical components, such as thick file resistors arranged in a Wheatstone bridge network are printed or mounted to an outer surface of each diaphragm. The bridge networks are electrically connected to a control circuit and function to output signals as a function of hydraulic pressure induced displacement of the associated diaphragm. | 02-14-2013 |
20130145854 | LINKED BRIDGE PRESSURE TRANSDUCER ASSEMBLIES - A gage/differential pressure transducer assembly having enhanced output capabilities, comprising a first pressure port adapted to communicate a first pressure to a first sensor, the first sensor comprising a first Wheatstone bridge adapted to output a first signal indicative of the first pressure, wherein the first pressure is a main pressure; and a second pressure port adapted to communicate a second pressure to a second sensor, the second sensor comprising a second Wheatstone bridge adapted to output a second signal indicative of the second pressure, wherein the second pressure is a reference pressure; and an output port connected to the first Wheatstone bridge and the second Wheatstone bridge for outputting a third signal representative of the difference between the first and second pressures. | 06-13-2013 |
20130239694 | PRESSURE SENSOR CHIP - A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm. | 09-19-2013 |
20140251020 | METHOD AND APPARATUS FOR PIPE PRESSURE MEASUREMENTS - A strain gauge collar includes at least one strain gauge installed on a base and at least one clamp on the base. The at least one clamp is configured to attach the strain gauge collar to a main steam line (MSL) as a single unit. | 09-11-2014 |
20150135843 | PRESSURE MEASUREMENT SENSOR HEAD - Device for measurement of fluid pressure by means of an arrangement of strain gauges provided on a sensor head arranged on an item arranged to be exposed to a pressurized fluid against an external sensor head surface, where the sensor head comprises a fastening portion attached to the item, and a centre portion connected to the fastening portion by means of at least one flexible connecting element, the arrangement of strain gauges is attached to the centre portion of the sensor head on an internal assembly surface arranged in close proximity to a contact face on an end stopper which in an active condition encircles the arrangement of strain gauges, and the assembly surface is inexposable for the pressurized fluid. | 05-21-2015 |
20160091377 | PHYSICAL QUANTITY MEASURING DEVICE - A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member. | 03-31-2016 |
20160187216 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULE - A detector provided on a flat portion of a diaphragm includes a plurality of strain gauges, resistor element connectors connecting adjacent ones of the strain gauges, and an electric conductor covering a part of the resistor element connectors. First linear portions and second linear portions of the resistor element connectors exposed from the electric conductor are orthogonal to the edges of the electric conductor extending across the first linear portions and the second linear portions. Even when a pattern of the resistor element connector and a pattern of electric conductor are misaligned in X direction or in Y direction, an area of the resistor element connector exposed from the electric conductor does not change. | 06-30-2016 |
073721000 | Piezoresistive | 59 |
20080202248 | PRESSURE SENSOR - In a pressure sensor comprising a diaphragm formed on a portion of a chip made of semiconductor material and that senses pressure on the diaphragm by electrically converting the displacement corresponding to that pressure, the provision of the diaphragm with an aspect ratio of at least a size such that the derivative of the characteristic curve of the allowable pressure resistance of the pressure sensor, defined by setting the aspect ratio obtained by dividing the length of one side of the diaphragm by the thickness of the diaphragm as the horizontal axis and by setting the allowable pressure resistance of the pressure sensor as the vertical axis, becomes nearly zero, enables a pressure sensor having high sensitivity and high pressure resistance. | 08-28-2008 |
20080223141 | Pressure measurement device and system, and method for manufacturing and using the same - The present invention discloses a pressure measurement device comprising: a substrate that includes at least one pressure sensing module and at least one fluid-conductive channel, wherein each channel has a first aperture and a second aperture. The substrate is flexible such that the pressure measurement device is conformably adjustable onto an object's surface. The first aperture is located on the substrate such that when the substrate is suitably adjusted onto the object's surface, the first aperture is open to the exterior of the object's surface. The pressure sensors module is operatively connected to at least one of the second apertures, such that the at least one pressure sensing module is generally being subjected to the pressure being present at the first aperture. | 09-18-2008 |
20090205433 | Low differential pressure transducer - A pressure transducer has an H-shaped header having a front and a back section. The front and back sections are of equal diameter and are circular. Each front and back section has a depression with a diaphragm covering the depression. Each diaphragm is of equal size and the depressions communicate one with the other via a central channel in the central arm of the H. A pressure sensor communicates with the channel, where the pressure sensor responds to a first pressure applied to the first diaphragm and a second pressure applied to the second diaphragm. The pressure sensor produces an output equal to the difference in pressure. The differential pressure inducer having both diaphragms of the same size and still enabling leads from the sensor to be brought out. | 08-20-2009 |
20090205434 | Low differential pressure transducer - A pressure transducer has an H-shaped cross-sectional header having a front and a back section. The front and back sections are of equal diameter and are circular. Each front and back section has a depression with an isolation diaphragm covering the depression. Each diaphragm is of equal size and the depressions communicate one with the other via a central channel in the central arm of the H. A pressure sensor communicates with the channel, where the pressure sensor responds to a first pressure applied to the first isolation diaphragm and a second pressure applied to the second isolation diaphragm. The pressure sensor produces an output equal to the difference in pressure. The differential pressure transducer having both diaphragms of the same size and still enabling leads from the sensor to be brought out. | 08-20-2009 |
20090260446 | Header for a differential pressure transducer - There is disclosed a header for a differential pressure transducer. The header has a cylindrical sensor housing section which has a front and a back surface. The front surface has a sensor accommodating recess. There is a plurality of terminal pins extending from the front surface and directed through the housing to extend from said back surface. The pins are arranged in a semi-circular pattern, said sensor housing having a stem aperture and cylindrical wall. A stem housing is positioned in the stem aperture and is brazed thereto. The stem housing has a stem passageway directed through the housing which communicates with a passageway in the cylindrical sensor housing. The cylindrical sensor recess contains a sensing device which receives a first input pressure on one diaphragm surface of the sensing device and a second input pressure on a second surface of the diaphragm to produce a differential output pressure. The header, as indicated, is rugged and simple to use and produce. | 10-22-2009 |
20090293627 | Pressure-Measuring Cell - A pressure sensor comprises a sensor platform; a measuring membrane, or diaphragm, which is held by the sensor platform, and can have a pressure applied to it and is deformable as a function of pressure; and at least two resistance elements having an A1 | 12-03-2009 |
20090314094 | COMPACT ABSOLUTE AND GAGE PRESSURE TRANSDUCER - A compact absolute and gage pressure transducer consists of two sensors made from the same silicon wafer and selected to be adjacent to each other on the wafer. The transducer contains a common header which has a first input port for receiving a first pressure and a second input port for receiving a second pressure. The second input port is directed through a reference tube into the hollow of the housing to apply the pressure from the reference tube to the common sensor arrangement. The first input port is directed from another surface of the housing to direct that pressure to both sensor devices. One sensor device operates as a gage sensor which produces an output proportional to the difference between one input pressure and the other input pressure while the other sensor on the same chip produces an absolute output. The sensor chip is associated with a sensor header, which header is positioned in the housing and which header is fabricated from glass. Positioned on the header is a guide plate also fabricated from glass. The header has extending therefrom an alignment pin, while the guide plate has an aperture which accommodates the alignment pin. The guide plate also has a central aperture which conforms to the size of the sensor chip. In this manner, once the alignment or guide plate is positioned within the alignment pin, the exact position of the sensor chip is determined. This enables contact areas from the sensor chip to make conductive contact with terminal pins associated with the glass header. These terminal pins are then directed to a connector or other device associated with the header. | 12-24-2009 |
20100018319 | APPARATUS AND METHOD FOR ELIMINATING VARYING PRESSURE FLUCTUATIONS IN A PRESSURE TRANSDUCER - A single pressure sensing capsule has a reference pressure ported to the rear side of a silicon sensing die. The front side of the silicon sensing die receives a main pressure at another port. The silicon sensing die contains a full Wheatstone bridge on one of the surfaces and within the active area designated as the diaphragm area. Thus, the difference of the main and reference pressure results in the sensor providing an output equivalent to the differential pressure, namely the main pressure minus the reference pressure which is the stress induced in a sensing diaphragm. In any event, the reference pressure or main pressure may be derived from a pump pressure which is being monitored. The pump pressure output is subjected to a pump ripple or a sinusoidally varying pressure. In order to compensate for pump ripple, one employs a coiled tube. The tube length is selected to suppress the pump ripple as applied to the sensor die. In this manner, the pump ripple cannot cause resonance which would result in pressure amplification and which pressure amplification would destroy the sensor. | 01-28-2010 |
20100083764 | Redundant self compensating leadless pressure sensor - There is disclosed a redundant pressure sensing chip which includes first and second redundant devices. Each pressure sensing device produces an output proportional to applied pressure irrespective of vibration/acceleration of the device. Each device also provides an output proportional to pressure and because of the nature of the devices, thermal effects as well as acceleration and the vibration are canceled. Based on chip operation and subtracting the signals from the two diaphragms, acceleration/vibration is canceled but also the effects of absolute pressure and differential pressure is also canceled. Therefore the chip can be used as a redundant absolute pressure sensor as well as a differential pressure sensor. | 04-08-2010 |
20100083765 | PRESSURE SENSOR - A pressure sensor according to the present invention comprises: a differential pressure diaphragm; a static pressure diaphragm, which is provided to an outer perimeter part of the differential pressure diaphragm; a first static pressure gauge pair that is formed in the end part of the static pressure diaphragm and comprises two static pressure gauges, which are disposed such that they sandwich the differential pressure diaphragm; and a second static pressure gauge pair that is formed in the center part of the static pressure diaphragm and comprises two static pressure gauges which are disposed such that they sandwich the differential pressure diaphragm. | 04-08-2010 |
20100083766 | PRESSURE SENSOR - A pressure sensor according to the present invention comprises: a differential pressure diaphragm, which is provided to a center part of a sensor chip; a differential pressure gauge, which is provided to a perimeter edge part of the differential pressure diaphragm and is formed in radial directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the first differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in perimeter directions, which are perpendicular to the radial directions; a differential pressure gauge, which is provided in the vicinity of the differential pressure gauge and is provided in the perimeter directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in the radial directions; a static pressure diaphragm, which is disposed at a position that lies in the perimeter directions between the differential pressure gauge and the differential pressure gauge; and a static pressure diaphragm, which is disposed at a position at which it opposes the static pressure diaphragm and, together with the static pressure diaphragm, sandwiches the differential pressure diaphragm. | 04-08-2010 |
20100107771 | SENSOR ARRAY FOR A HIGH TEMPERATURE PRESSURE TRANSDUCER EMPLOYING A METAL DIAPHRAGM - A sensor array for a pressure transducer having a diaphragm with an active region, and capable of deflecting when a force is applied to the diaphragm. The sensor array disposed on a single substrate, the substrate secured to the diaphragm. The sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm. The sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors dielectrically isolated from the substrate. | 05-06-2010 |
20100139410 | Micromechanical Pressure Sensing Device - A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms. | 06-10-2010 |
20100147082 | COMBINED WET-WET DIFFERENTIAL AND GAGE TRANSDUCER EMPLOYING A COMMON HOUSING - A combined wet-wet differential transducer and a gage pressure transducer are located in the same housing. A semiconductor chip which is formed from a single substrate, has located thereon an absolute or gage sensor chip on one section and a delta or differential sensor chip on a second section. Each sensor chip has a Wheatstone bridge arrangement comprising piezoresistors and responsive to an applied pressure. The absolute or gage chip, as well as the differential or delta chip are placed in a header having a front section and a back section. Each section has an outer surface with a central section joining the front and back sections to form an H shaped header. The front section outer surface has a depression of a given area with a first flexible isolation diaphragm covering the depression. The back section outer surface has a second depression of a given area with a second flexible isolation diaphragm covering the second depression, where the first and second diaphragms are relatively of the same size and area. A channel positioned within the central area and extending and communicating with the first and second depressions. The header described above, has a first sensor chip indicative of an absolute or gage sensor and a second sensor chip indicative of a differential sensor. Both sensors, as indicated, receive a first pressure at a corresponding diaphragm surface. The housing which contains the above noted header has a tube which communicates with the bottom diaphragm side of the differential chip section. The top side of the both the differential chip section and the absolute chip section receives the same pressure via a pressure port in the header. The differential portion of the chip receives a pressure via a curved tube which is directed to the second isolation diaphragm and which pressure propagates from the diaphragm through the channel and therefore applies that pressure to the underside of the differential sensor section. | 06-17-2010 |
20100199777 | Exposed Pad Backside Pressure Sensor Package - A method and apparatus are described for fabricating an exposed backside pressure sensor ( | 08-12-2010 |
20100251825 | COMBINED WET-WET DIFFERENTIAL AND GAGE TRANSDUCER EMPLOYING A COMMON HOUSING - A combined wet-wet differential transducer and a gage pressure transducer located in the same housing, comprising a semiconductor chip which comprises a gage sensor chip on one section and a differential sensor chip on a second section. Each sensor chip has a Wheatstone bridge comprising piezoresistors and is responsive to an applied pressure. The gage chip and the differential chip are placed in a header having a front section and a back section adapted to receive a first and second pressure, respectively. The sensors are in communication with first and second pressure ports such that the absolute sensor provides an output indicative of a pressure applied to a first port and the differential sensor provides an output indicative of the pressure difference between the first and second pressure ports. | 10-07-2010 |
20100257936 | Internally switched multiple range transducer - There is disclosed an internally switched multiple range transducer. The transducer employs a plurality of individual pressure sensors or Wheatstone bridges fabricated from semiconductor materials and utilizing piezoresistors. Each sensor is designed to accommodate accurately a given pressure range, therefore, each sensor is selected to provide an output when an applied pressure is within its accommodated range. As soon as the pressure exceeds the range, then another sensor is employed to produce an output. Each of the sensors, or each separate transducer, is coupled to a switch or other device to enable the selection of one of the plurality of sensors to operate within its given pressure range when the applied pressure is in that range. In this manner one obtains pressure measurements with a high degree of accuracy across a relatively large pressure range. | 10-14-2010 |
20100257937 | Leadless oil filled pressure transducer - An oil filled pressure transducer which exhibits reduced backpressure and utilizes a smaller volume of oil employs a glass pre-form which has a plurality of pin accommodating apertures and has an oil tube accommodating aperture. There are a plurality of contact pins inserted into the pin accommodating apertures and which extend from the top to the bottom surfaces of the pre-form. There is an oil fill tube inserted into the oil tube accommodating aperture, which oil fill tube extends from the bottom to the top surface of the pre-form with one end of the tube extending above the top surface of the pre-form. There is a glass alignment plate which has an alignment aperture for encircling the extended oil fill tube and has a sensor accommodating shaped aperture located at a predetermined position from said alignment aperture. When the glass alignment plate is being accommodated on the top surface of the pre-form by inserting the alignment aperture about the oil tube, the position of a sensor module is accurately determined based on the position of the sensor accommodating aperture. A sensor module is now placed in the shaped aperture of the alignment plate and makes contact with the pins to enable the sensor contacts to contact the pins. A header surrounds the sensor as positioned on the glass pre-form and a diaphragm is then placed to cover the top surface of the header to create a space between the top surface and the sensor. This space contains oil which is placed in the space by the oil fill tube. Due to the presence of the glass alignment plate, which has a given thickness, the volume of oil now required is much less than the volume required in the prior art, thus substantially reducing backpressure and further assuring that the sensor device is always properly aligned with respect to the pins. | 10-14-2010 |
20100300207 | PRESSURE SENSOR FOR HARSH MEDIA SENSING AND FLEXIBLE PACKAGING - MEMS pressure sensing elements, the fabrication methods of the sensing elements, and the packaging methods using the new sensing elements are introduced to provide a way for a harsh media absolute pressure sensing and eliminating the negative effects caused by the gel used in the prior art. The invention uses vertical conductive vias to electrically connect the enclosed circuit to the outside, and uses a fusion bond method to attach a cap with the embedded conductive vias over a device die having a circuit for example a piezoresistive Wheatstone bridge to sense pressure. New packaging methods comprise a) a two-pocket housing structure and using a surface mounting method to attach a new sensing element into one pocket by a ball grid array (BGA), and b) a single pocket structure and using conventional die attach and wire bonding. Both methods can be used for harsh media pressure sensing but without the negative effects caused by the gel in prior art. | 12-02-2010 |
20100326199 | LOW DIFFERENTIAL PRESSURE TRANSDUCER - It is an object of the present invention to provide a pressure transducer having a header wherein the header is comprised of a first section and a second section that are offset from each other. Each first and second section has a flexible diaphragm adapted to receive a first and second pressure, respectively. A central channel connects the diaphragms and a pressure sensor, located within the central channel, communicates with the channel and produces an output equal to the difference between the first and second pressures. The resultant device is a low differential pressure transducer which enables one to bring leads from the sensor out while having diaphragms of substantially the same size and diameter, therefore enabling the diaphragms to exhibit the same back pressure and be equally compliant. | 12-30-2010 |
20110005324 | Torque output differential pressure sensor - A fluid pressure differential measuring instrument comprises a diaphragm that is displaced by a pressure differential between two environmental pressure zones. Diaphragm displacement induced by the pressure differential between the two zones is converted to a torsional strain upon a cylindrical element in a third environmental zone. The torsional strain is measured by calibrated electrical sensing means positioned physically in the third environmental zone. | 01-13-2011 |
20110048138 | MEMS STRESS CONCENTRATING STRUCTURE FOR MEMS SENSORS - A stress concentrating apparatus and a method for a MicroElectroMechanical System (MEMS) sensors is provided. The apparatus includes a plate having an inner region and outer region, the inner region being separated from the outer region by slits defined in the plate. A stress concentrator bridge connects the inner region to the outer region, and to mechanically amplify stress applied on the inner region of the plate. At least one stress sensor is operatively connected to the stress concentrator bridge, whereby the at least one stress sensor converts the mechanically amplified stress applied on the inner region into an electrical signal. | 03-03-2011 |
20110061467 | LOW PASS FILTER SEMICONDUCTOR STRUCTURES FOR USE IN TRANSDUCERS FOR MEASURING LOW DYNAMIC PRESSURES IN THE PRESENCE OF HIGH STATIC PRESSURES - A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. The filter receives a high and very low frequency static pressure attendant with a high frequency low dynamic pressure at one end, the filter operates to filter said high frequency dynamic pressure to provide only the static pressure at the other filter end. A differential transducer receives both dynamic and static pressure at one input port and receives said filtered static pressure at the other port where said transducer provides an output solely indicative of dynamic pressure. The filter in one embodiment has a series of etched channels directed from an input end to an output end. The channels are etched pores of extremely small diameter and operate to attenuate or filter the dynamic pressure. In another embodiment, a spiral tubular groove is found between a silicon wafer and a glass cover wafer, an input port of the groove receives both the static and dynamic pressure with an output port of the groove providing only static pressure. The groove filters attenuate dynamic pressure to enable the differential transducer to provide an output only indicative of dynamic pressure by cancellation of the static pressure. | 03-17-2011 |
20110113890 | TORQUE INSENSITIVE HEADER ASSEMBLY - There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header comprises an outer torque isolating shell which surround an inner “H” section header. The inner “H” section header has a thick diaphragm and is surrounded by the torque isolating shell which is secured to the “H” section header at a peripheral flange of the “H” section header. In this manner when the header is installed, the installation force is absorbed by the outer shell and there is no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. The torque isolating shell also contains a top surface which has a counterbore that accommodates a crush ring. When the unit is installed, the crush ring is crushed against an installation wall to enable the inner header to receive pressure without experiencing significant installation force. | 05-19-2011 |
20110185818 | APPARATUS AND METHOD FOR ELIMINATING VARYING PRESSURE FLUCTUATIONS IN A PRESSURE TRANSDUCER - A single pressure sensing capsule has a reference pressure ported to the rear side of a silicon sensing die. The front side of the silicon sensing die receives a main pressure at another port. The difference between the main and reference pressure results in the sensor providing an differential pressure output. The reference pressure or main pressure may be derived from a pump pressure which is being monitored. The pump pressure output is subjected to a pump ripple or a sinusoidally varying pressure. In order to compensate for pump ripple, a coiled tube or an adjustable dampening chamber comprising a spiral inlet tube and a volume cavity can be used. The tube length is selected to suppress the pump ripple as applied to the sensor die. In this manner, the pump ripple cannot cause resonance which would result in pressure amplification and which pressure amplification would destroy the sensor. | 08-04-2011 |
20110209553 | Apparatus and method for minimizing drift of a piezo-resistive pressure sensors due to progressive release of mechanical stress over time - An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element. | 09-01-2011 |
20110232389 | Grooved Structure For Die-Mount And Media Sealing - Dual piezoresistive transducers formed into a single silicon die, are anodically bonded to a pedestal. Two separate pressure ports extend through a plastic housing. The port openings inside the housing are surrounded by a groove having a shape and size that accepts the pedestal. A thin, liquid adhesive is deposited into the groove and allowed to level out. The pedestal is placed into the adhesive and embeds itself therein. Adhesive overflow into the ports is avoided by dimensioning the groove and depositing an amount of adhesive that will fill the groove but not overflow when the pedestal is placed therein. Once the adhesive cures, the adhesive bond strength is greater due to the adhesive being in shear relative to the groove side walls and pedestal sidewalls. The grooved structure provides an apparatus and methodology for precise die mounting and media sealing. | 09-29-2011 |
20110239772 | DIFFERENTIAL TEMPERATURE AND ACCELERATION COMPENSATED PRESSURE TRANSDUCER - A dual diaphragm pressure transducer, or sensor, with compensation for non-pressure effects is disclosed. The pressure sensor can include two pressure transducers located on separate portions of a chip. The first pressure transducer can be a differential pressure transducer, which produces a signal proportional to one or more applied pressures and includes other non-pressure effects. The second pressure transducer can be sealed in a hermetic chamber and thus can produce a signal proportional only to non-pressure effects. The signals can be combined to produce a signal proportional to the applied pressures with no non-pressure effects. The first and second pressure transducers can be physically and/or electrically isolated to improve sealing between the two pressure transducers and prevent pressure leaks therebetween. | 10-06-2011 |
20110308323 | PIEZO-RESISTIVE PRESSURE SENSOR - Provided is a piezo-resistive pressure sensor that realizes sensitive and accurate measurement of pressure, by reducing the variation of electrical conduction due to thermal variation in piezo resistance elements, without lowering the sensitivity of measurement. Piezo-resistance sections R | 12-22-2011 |
20120125113 | PRESSURE TRANSDUCER HAVING STRUCTURE FOR MONITORING SURFACE CHARGE - A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure. | 05-24-2012 |
20120125114 | PRESSURE SENSOR - The present disclosure relates to sensors including pressure sensors. In some cases, the pressure sensor may include a membrane or diaphragm, multiple sense elements connected to one another in a bridge configuration and positioned on the membrane, and an amplifier coupled to an output of the bridge configuration and having an output, where the diaphragm, sense elements and amplifier may be formed on a singled substrate or formed integrally therewith, or both. In one example, the pressure sensor may sense a particular range of pressures applied to the sensor, and/or may include an amplifier that has a selectable gain for amplifying an output of the bridge. | 05-24-2012 |
20120152026 | GAGE PRESSURE TRANSDUCER AND METHOD FOR MAKING THE SAME - A gage pressure transducer comprising a first pressure sensing assembly exposed to a main pressure and a second pressure sensing assembly exposed to a reference pressure. The pressure sensing assemblies comprise half-bridge sensors and means for using an alignment glass plate with each sensor which reduces the amount of oil required for operation, which consequently reduces the back pressures caused by large volumes of oil. The pressure sensor assemblies are hermetically sealed using glass frits, therefore enabling the gage pressure transducer to robustly and accurately measure pressure in harsh environments. | 06-21-2012 |
20120174680 | PRESSURE SENSOR WITH LOW COST PACKAGING - A pressure sensor is disclosed that may include a minimum amount of fluid coupling packaging. In one illustrative embodiment, a pressure sensor assembly may include a pressure sensor die having a front side and a back side, and a pressure sensing diaphragm. The pressure sensor assembly may further include a housing having a mounting side and a sensing side. The sensing side may define a pressure port. The pressure sensor die may be secured to the housing such that the pressure sensing diaphragm is exposed to the pressure port, and such that front side of the pressure sense die is accessible from outside of the housing. | 07-12-2012 |
20120216622 | ROBUST DESIGN OF HIGH PRESSURE SENSOR DEVICE - In a pressure sensing element made of piezoresistors formed into a silicon substrate, thermally-induced stresses on the piezoresistors and thermally-induced voltage offsets can be reduced by thinning the substrate prior to forming the resistors and then forming the resistors into the thinned-out recess. Forming a circular or disk-shaped recess in the substrate and then forming the resistors therein is believed to cause thermally-induced stresses to be evenly distributed and/or cancelled out on all four piezoresistors of a Wheatstone bridge circuit. | 08-30-2012 |
20120234098 | GAGE PRESSURE TRANSDUCER AND METHOD FOR MAKING THE SAME - A gage pressure transducer comprising a first pressure sensing assembly exposed to a main pressure and a second pressure sensing assembly exposed to a reference pressure. The pressure sensing assemblies comprise half-bridge sensors and means for using an alignment glass plate with each sensor which reduces the amount of oil required for operation, which consequently reduces the back pressures caused by large volumes of oil. The pressure sensor assemblies are hermetically sealed using glass frits, therefore enabling the gage pressure transducer to robustly and accurately measure pressure in harsh environments. | 09-20-2012 |
20120266684 | SENSOR DEVICE WITH SEALING STRUCTURE - Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure. | 10-25-2012 |
20120318068 | TORQUE INSENSITIVE HEADER ASSEMBLY - There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header comprises an outer torque isolating shell which surrounds an inner “H” section header. The inner “H” section header has a thick diaphragm and is surrounded by the torque isolating shell which is secured to the “H” section header at a peripheral flange of the “H” section header. In this manner when the header is installed, the installation force is absorbed by the outer shell and there is no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. The torque isolating shell also contains a top surface which has a counterbore that accommodates a crush ring. When the unit is installed, the crush ring is crushed against an installation wall to enable the inner header to receive pressure without experiencing significant installation force. | 12-20-2012 |
20130055821 | PACKAGED SENSOR WITH MULTIPLE SENSORS ELEMENTS - The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired. | 03-07-2013 |
20130098159 | LOW PASS FILTER SEMICONDUCTOR STRUCTURES FOR USE IN TRANSDUCERS FOR MEASURING LOW DYNAMIC PRESSURES IN THE PRESENCE OF HIGH STATIC PRESSURES - A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the filter, at least the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; receiving, at a first surface of a diaphragm, the pressure; receiving, at a second surface of the diaphragm, the filtered pressure, wherein the second surface of the diaphragm is operatively coupled to the filter; and measuring, at a sensor operatively coupled to the diaphragm, a difference between the pressure and the filtered pressure. | 04-25-2013 |
20130125659 | Apparatus and Method for Minimizing Drift of a Piezo-Resistive Pressure Sensor Due to the Progressive Release of Mechanical Stress Over Time - An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element. | 05-23-2013 |
20130192378 | SEMICONDUCTOR SENSING DEVICE TO MINIMIZE THERMAL NOISE - An MEMS pressure sensor is designed to reduce or eliminate thermal noise, such as temperature offset voltage output. The pressure sensor includes a pressure sensing element having a diaphragm, and a cavity formed as part of the pressure sensing element, where the cavity receives a fluid such that the diaphragm at least partially deflects. The pressure sensing element also includes a plurality of piezoresistors, which are operable to generate a signal based on the amount of deflection in the diaphragm. At least one trench is integrally formed as part of the pressure sensing element, and an adhesive connects the pressure sensing element to the at least one substrate such that at least a portion of the adhesive is attached to the trench and redistributes thermally induced stresses on the pressure sensing element such that the thermally induced noise is substantially eliminated. | 08-01-2013 |
20130247676 | PRESSURE SENSOR - A pressure sensor includes a detecting circuit configured to detect the difference between outputs from a first pressure variation sensor and a second pressure variation sensor. The first pressure variation sensor and the second pressure variation sensor have a lower limit frequency which provides sensitivity equal to or higher than a predetermined value as the effectively same frequency characteristics in accordance at least with a capacity of a cavity or a distance of a gap. The gap of the first pressure variation sensor communicates the exterior of the pressure sensor and the interior of the cavity of the first pressure variation sensor, and the gap of the second pressure variation sensor communicates the interior of the cavity of the first pressure variation sensor and the interior of the cavity of the second pressure variation sensor. | 09-26-2013 |
20130247677 | PRESSURE SENSOR - A pressure sensor includes a detecting circuit configured to detect the difference between outputs from a first pressure variation sensor and a second pressure variation sensor. The first pressure variation sensor and the second pressure variation sensor have the same distance of a gap, and have frequency characteristics different from each other, that is, cutoff frequencies different from each other by setting the value of a capacity of the cavity of the first pressure variation sensor to be larger than the value of a capacity of the cavity of the second pressure variation sensor. | 09-26-2013 |
20140053652 | Gage Pressure Transducer and Method for Making the Same - A method, device and system for a gage pressure transducer including the making thereof are provided. In one embodiment, a method comprises receiving, at a first diaphragm, a first pressure, wherein the first diaphragm is composed of metal; transferring, from the first diaphragm, to a first sensor, the first pressure using a first oil region, wherein the first oil region is disposed between the first diaphragm and the first sensor; receiving, at the first sensor, the first pressure; measuring, by the first sensor, the first pressure to generate a first pressure signal; and outputting, from the first sensor, to a first header pin, the first pressure signal, wherein the first header pin is electrically coupled to the first sensor using a first conductive glass frit. | 02-27-2014 |
20140102207 | TORQUE INSENSITIVE HEADER ASSEMBLY - This disclosure provides example methods, devices and systems associated with a torque-insensitive header assembly. In one embodiment, a method comprises receiving, by a sensor, from an aperture defined by a shell, an environmental condition, wherein the sensor is coupled to a header and the header is coupled to the shell such that the sensor is isolated from a torque stress applied to the shell; measuring, by the sensor, the environmental condition to determine an environmental condition signal; and outputting, from the sensor, the environmental condition signal. | 04-17-2014 |
20140137653 | PIEZORESISTIVE TRANSDUCER WITH LOW THERMAL NOISE - In a MEMS PRT having a diaphragm that is located offset from the center of the die, thermally-induced thermal noise in the output of a Wheatstone bridge circuit is reduced by locating the Wheatstone bridge circuit away from the largest area of the die and supporting pedestal. | 05-22-2014 |
20140196546 | Pressure Sensor - A pressure sensor is claimed for measuring the pressure of a fluid. The pressure sensor comprises two or more half bridges, an analog-to-digital converter, a microcontroller, an output generator, and one or more redundancy circuits. Each half bridge comprises two resistive pressure sensing elements (RSPE) electrically coupled to the analog-to-digital converter. Each redundancy circuit comprises a switch and resistor electrically in series. A redundancy circuit may be disposed electrically in parallel with any or all of the RSPEs of the half bridges such that when an RSPE fails open, its corresponding redundancy circuit may be activated in order to permit the resistor of the redundancy circuit to take the place of the RSPE. This permits the analog-to-digital converter to continue to operate normally, even with a failed RSPE. The pressure sensor may then base its calculated pressure on the remaining half bridges which do not have a failed RSPE. | 07-17-2014 |
20140238142 | CATHETER DIE AND METHOD OF FABRICATING THE SAME - A catheter die is provided and includes a device layer defining a cavity and including a piezoresistive pressure sensor operably disposed proximate to the cavity and an insulator having an opening and being disposed on an upper surface of the device layer such that a portion of the piezoresistive pressure sensor is exposed through the opening. The catheter die further includes an insulation layer bonded to a lower surface of the device layer and first and second bond pads, the first bond pad being electrically coupled to the portion of the piezoresistive pressure sensor via the opening and the second bond pad being disposed on the insulation layer. | 08-28-2014 |
20140331775 | LOW PASS FILTER SEMICONDUCTOR STRUCTURES FOR USE IN TRANSDUCERS FOR MEASURING LOW DYNAMIC PRESSURES IN THE PRESENCE OF HIGH STATIC PRESSURES - A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter having a plurality of apertures, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the plurality of apertures, at least a portion of the dynamic pressure component of the pressure, wherein a diameter of each of the plurality of apertures is such that the plurality of apertures filters at least the portion of the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; and wherein the filtered pressure is used to determine the dynamic pressure component of the pressure. | 11-13-2014 |
20150075289 | CERAMIC PRESSURE SENSOR AND METHOD FOR PRODUCTION THEREOF - A method for production of a pressure sensor including a flat flexible membrane made of a ceramic material and a flat rigid support thereof made of a ceramic material is provided. Steps include: —establishing an electric circuit on the membrane; —establishing an electric contact with the outside on the support; —depositing an electrically conductive material on the support; —establishing an electrical and mechanical coupling between the membrane and the support. The electrical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of an electrically conductive sinterable electrical connection material. The mechanical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of sinterable mechanical connection material that is electrically insulating and/or isolated from the layer of sinterable electrical connection material. The layer of sinterable electrical connection material and the layer of sinterable mechanical connection material undergo re flow together in a single step in a sintering furnace. | 03-19-2015 |
20150114129 | DIAPHRAGM PIEZORESISTIVE PRESSURE SENSOR - A diaphragm piezoresistive pressure sensor includes: a base member; a diaphragm including a middle portion and a surrounding portion surrounding the middle portion; a spacer disposed between and cooperating with the base member and the diaphragm to define a cavity thereamong; an inner abutment member disposed in the cavity and spaced apart from the base member by a clearance; and a piezoresistive sensor unit embedded in the diaphragm. The spacer surrounds and is spaced apart from the inner abutment member. At least one of the inner abutment member and the middle portion of the diaphragm defines a chamber therebetween. | 04-30-2015 |
20150122039 | SILICON ON NOTHING PRESSURE SENSOR - A method of making a pressure sensing apparatus is provided herein. A plurality of trenches are etched on a first surface of a substrate. The substrate is annealed to form a diaphragm and an embedded cavity from the plurality of trenches, the diaphragm formed of a portion of the substrate wherein an exterior surface of the diaphragm is the first surface of the substrate and an interior surface of the diaphragm is a surface defining the embedded cavity. Piezoresistors are fabricated on the exterior surface of the diaphragm, the piezoresistors configured to change resistivity in response to strain resulting from deflection of the diaphragm. The substrate is mounted, including the diaphragm, in a housing such that a media can apply pressure to the diaphragm and such that the pressure can be sensed by determining a change in the resistivity of the piezoresistors. | 05-07-2015 |
20150128713 | PRESSURE SENSOR - A pressure sensor includes: a sensor section having one fixed end and first to four gauge resistors arranged on a diaphragm; and a support member fixing the sensor section. A first pair to fourth pair of piezoresistive elements are arranged on the diaphragm. Two piezoresistive elements of each pair have opposite resistance value change directions, and distances to the support member are equal to each other. A distances between each piezoresistive element of the third pair and the fourth pair and the support member is longer than a distance between each piezoresistive element of the first pair and the second pair and the support member. Each gauge resistor includes a combined resistance, which is provided by serially connecting two corresponding piezoresistive elements. The two corresponding piezoresistive elements have a same resistance value change direction. | 05-14-2015 |
20160011065 | Ultra-Miniature Multi-Hole Flow Angle Probes | 01-14-2016 |
20160025581 | PRESSURE SENSOR - An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction. | 01-28-2016 |
20160041053 | SENSOR CO-LOCATED WITH AN ELECTRONIC CIRCUIT - This disclosure provides example methods, devices, and systems for a sensor co-located with an electronic circuit. In one embodiment, a sensor assembly may comprise a semiconductor device configured to include a sensor having a sensing element, an electronic circuit and wherein the sensing element and the electronic circuit are hermetically sealed in the same sensor assembly; and wherein the sensor assembly is capable of outputting an environmental condition signal associated with an environmental condition measured by the sensor. | 02-11-2016 |
20160084722 | Differential Pressure Sensor Assembly - A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance. | 03-24-2016 |
20160161353 | INTERNALLY SWITCHED MULTIPLE RANGE TRANSDUCERS - Systems and methods for an internally switched multiple range transducer are provided. In one embodiment, a method comprises receiving, at a first sensor, a pressure, wherein the first sensor is associated with a first pressure range; measuring, at the first sensor, the pressure to generate a first pressure signal; in response to determining that the first pressure signal is not associated with the first pressure range, activating a second sensor, wherein the second sensor is associated with a second pressure range that is different from the first pressure range; and measuring, at the second sensor, the pressure to generate a second pressure signal. | 06-09-2016 |
20180024020 | LOW-STRESS FLOATING-CHIP PRESSURE SENSORS | 01-25-2018 |