| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 062300700 | Including specific circuitry or heat exchanger material | 70 |
| 20080216485 | Magnetic Refrigerator - A magnetic refrigerator includes independent hot heat exchange unit and cold heat exchange unit wherein separate heat transfer fluids are circulated. | 09-11-2008 |
| 20080271463 | HEAT PIPE MEASURING SYSTEM - The present invention provides a measuring system to determine the quality of the heat pipe, comprising a heat pipe comprising a first end connected to a first temperature sensor and a second end connected to a second temperature sensor, a heater being connected to said first end and being connected to a multi-function heater controller; a multi-function heater controller being electrically connected to said heater and said one of the first or second temperature sensor, a thermal-electric cooler (TEC) module being connected to said second end; and a TEC controller being electrically connected to said TEC module and said one of the first or second temperature sensor, wherein said TEC controller comprises a proportional-integral-derivative controller, and said multi-function heater controller comprises both constant heating power and constant temperature control modes. | 11-06-2008 |
| 20080271464 | AIR RE-COOL FOR ELECTRONIC EQUIPMENT - Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system. | 11-06-2008 |
| 20080276624 | THERMOELECTRIC MODULE AND OPTICAL TRANSMISSION APPARATUS - A thermoelectric module includes a first insulated substrate having a first opposing surface, a second insulated substrate having a second opposing surface, the second opposing surface faces the first opposing surface, a plurality of electrodes formed on the first and second opposing surfaces, a plurality of thermoelectric transducers provided between the first insulated substrate and the second insulated substrate, the plurality of thermoelectric transducers electrically connected with one another in series and/or in parallel via each electrode, and a conducting circuit electrically connecting the plurality of electrodes with an external power source, wherein the first insulated substrate includes a substrate body having the first opposing surface and a projecting portion being formed continuously from the substrate body and extending in a direction that intersects the substrate body, and the projecting portion includes a fixing surface extending in the direction that intersects the substrate body. | 11-13-2008 |
| 20080282706 | Stirling cycle cryogenic cooler with dual coil single magnetic circuit motor - A method and mechanism for eliminating one of the magnetic circuits in a conventional two motor Stirling cryocooler. The inventive cooler is a Stirling cycle cryogenic cooler with a magnetic circuit for generating a field of magnetic flux in two separate magnetic gaps; a first coil disposed in the flux field of one gap; and a second coil disposed in the flux field of the second gap. The second coil is mounted for independent movement relative to the first coil. In a specific embodiment, the first coil is a compressor coil and the second coil is a displacer coil. The coils are energized with first and second variable sources of electrical energy in response to signals from a controller. | 11-20-2008 |
| 20090000310 | SYSTEM AND METHOD FOR DISTRIBUTED THERMOELECTRIC HEATING AND COOLING - A thermoelectric system and method provides distributed localized heating, cooling, or both heating and cooling. The thermoelectric system includes a plurality of thermoelectric assemblies. Each thermoelectric assembly comprises a plurality of thermoelectric elements, and each thermoelectric assembly is in thermal communication with a first working fluid and in thermal communication with a region corresponding to the thermoelectric assembly. Each thermoelectric assembly is selectively operable either to heat the region corresponding to the thermoelectric assembly by transferring heat from the first working fluid to the region corresponding to the thermoelectric assembly or to cool the region corresponding to the thermoelectric assembly by transferring heat from the region corresponding to the thermoelectric assembly to the first working fluid. Each thermoelectric assembly is operable independently from operation of other thermoelectric assemblies of the plurality of thermoelectric assemblies. | 01-01-2009 |
| 20090007571 | Peltier Cooling Systems with High Aspect Ratio - New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shapes are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier called side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such ‘high aspect ratio’ Peltier systems promote ‘focused’ cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling fact of the Peltier device is brought to the small space approximated by a point. Thus a ‘point’ heat source such as a semiconductor laser are high-performance light emitting diode is more effectively cooled by these systems. | 01-08-2009 |
| 20090007572 | THERMOELECTRICS UTILIZING CONVECTIVE HEAT FLOW - An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system. | 01-08-2009 |
| 20090031734 | CIRCUIT ARRANGEMENT FOR A PELTIER MODULE - A circuit arrangement for a Peltier module for use in a Peltier heat pump for a tumble dryer with the circuit arrangement including a Peltier module having at least one series arrangement of Peltier elements, with each series arrangement of Peltier elements being configured to receive voltage; and a two-position transfer switch wherein at a first position voltage is applied to the Peltier module and at a second position voltage is not applied to the Peltier module and the Peltier module is connected to another electrical device. | 02-05-2009 |
| 20090049844 | Circuit Arrangement for a Peltier Module - A circuit arrangement for a Peltier module for use in a Peltier heat pump for a tumble dryer with the circuit arrangement including a Peltier module having at least one series arrangement of Peltier elements actuable by a DC voltage. Also included is a rectifier operatively associated with a power supply and at least one series arrangement of Peltier elements for producing a rectified DC voltage for use by said Peltier elements. The number of Peltier elements and the manufacturer type of Peltier elements are selected in a manner wherein the Peltier elements of the series arrangement are operated by actuating the series arrangement with the rectified power supply at an operating voltage that is suitable for the use of the Peltier module in a Peltier heat pump. | 02-26-2009 |
| 20090056345 | NANOSCALE THERMOELECTRIC REFRIGERATOR - A nanoscale thermoelectric device, which may be operated as a refrigerator or as a thermoelectric generator includes N-type and p-type active areas connected to a central terminal and end electrodes made of interconnect metal. Reducing lateral dimensions of the active areas reduces vertical thermal conduction, thus improving the efficiency of the thermoelectric device. The thermoelectric device may be integrated into the fabrication process sequence of an IC without adding process cost or complexity. Operated as a refrigerator, the central terminal may be configured to cool a selected component in the IC, such as a transistor. Operated as a thermoelectric generator with a heat source applied to the central terminal, the end terminals may provide power to a circuit in the IC. | 03-05-2009 |
| 20090071169 | MICRO-HEATPIPE BASED COLD AND HOT PAD - The present invention provides a micro-heatpipe based cold and holt microtube, including a cold chip, hot chip and a power-controller. | 03-19-2009 |
| 20090077981 | Topping Cycle for a Sub-Ambient Cooling System - According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger. The condenser heat exchanger receives a flow of the fluid coolant at least partially in the form of a vapor from the heat exchanger and transfers at least a portion of the thermal energy within the fluid coolant to a heat sink. The second condenser assists the condenser heat exchanger in transferring at least a portion of the thermal energy within the fluid coolant away from the fluid coolant. The second condenser is selectively activated when the heat sink reaches an undesirable temperature. | 03-26-2009 |
| 20090100843 | PORTABLE MEDICINE COOLER HAVING AN ELECTRONIC COOLING CONTROLLER AND MEDICINE EFFICACY INDICATION CIRCUITRY AND METHOD OF OPERATION THEREOF - A portable medicine cooler and a method of operating the same. In one embodiment, the portable medicine cooler includes: (1) a shell having a grille and further having a door configured to provide access to a cavity within the shell for containing a medicine to be cooled, (2) a cooling and receiver structure coupled to the shell and including a thermoelectric cooler interposing a heat sink and a vial receiver and (3) electronic cooling control and medicine efficacy indication circuitry coupled to the cooling and receiving structure and including a processor, at least one temperature sensor configured to provide a signal to the processor indicating a temperature associated with the portable medicine cooler, a battery configured to provide power to the processor and an indicator selected from the group consisting of at least one light-emitting diode and a liquid-crystal display and configured to provide an indication of an operation of the portable medicine cooler. | 04-23-2009 |
| 20090165466 | TEMPERATURE CONTROL DEVICE - A temperature control device for controlling temperature of an object substance, the temperature control device includes: a pulse width modulator for changeably providing current directions of a providing current; a low pass filter; a Peltier device electrically connected to the pulse width modulator via the low pass filter; and a diode placed the low pass filter in parallel. | 07-02-2009 |
| 20090249796 | Thermally-Balanced Solid State Cooling - Apparatus, systems, and methods provide for the cooling of a system on an aircraft or other platform. According to embodiments described herein, a first coolant is routed through a heat-producing system to absorb heat and maintain the system at a desired temperature. The first coolant is routed through a thermoelectric chiller for cooling before returning to absorb further heat from the system. Thermoelectric cooler modules within the chiller transfer heat from cold plates containing the first coolant to hot plates containing a second coolant. The second coolant absorbs the transferred heat and is routed to a radiator, where the heat is discharged into an ambient air stream. The second coolant is routed back to the hot plates to absorb further heat. | 10-08-2009 |
| 20090272125 | THERMAL PUMP MODULE AND TEMPERATURE REGULATION - A voltage regulator is configured to receive an input voltage from a power supply, measure a temperature associated with a heat transfer medium, produce an output voltage to drive a thermo-electric cooler, and vary the output voltage in accordance with changes in the measured temperature. Varying the output voltage results in: 1) extracting of heat from the heat transfer medium when the measured temperature is above a threshold value, or 2) supplying of heat to the heat transfer medium when the measured temperature is below a threshold value. The voltage regulator can cap upper and lower bounds of the output voltage to prevent the thermo-electric cooler from reaching its saturation point. The voltage regulator can be configured to produce an output voltage having reduced voltage ripple. | 11-05-2009 |
| 20090293500 | Device for Controlling a Thermo-Electric System - A control device for a thermo-electric device having a heat source side and a heat sink side. The control device has a detector for detecting a temperature difference between the heat source side and the heat sink side. The detector modulates a current for providing an optimal current to the thermo-electric device. | 12-03-2009 |
| 20090301103 | THERMOELECTRIC HEAT PUMP - In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels. | 12-10-2009 |
| 20100000231 | THERMAL VISION AND HEAT SEEKING MISSILE COUNTERMEASURE SYSTEM - The present invention relates to an infrared detection countermeasure system for enabling concealment of objects from identification by thermal imaging night vision systems and/or for deception of heat seeking missiles. The system comprises a screen formed of at least one thermoelectric module, couplable to a target object, a controller for controlling the thermoelectric module, at least two temperature sensors for measuring ambient temperature and temperature of one side of the thermoelectric module and providing an indication of the temperature to the controller, and a power source coupled to the thermoelectric module. The controller is coupled to the power source for causing the power source to provide a level of power, selected in accordance with the temperature indications, to the thermoelectric module so as to generate a selected temperature in at least part of said screen. | 01-07-2010 |
| 20100011781 | HEAT EXCHANGER ASSEMBLY FOR AN AIRCRAFT CONTROL - A heat exchanger assembly for an aircraft control has an aircraft control for controlling an operation of an aircraft. The aircraft control is in thermal communication with a first fluid. A first thermoelectric device is configured to transfer heat between the first fluid and the second fluid against a temperature gradient of the first fluid and the second fluid. A temperature sensor is provided for sensing a temperature of the first fluid. A temperature control is also configured to control the first thermoelectric device based on an input from the temperature sensor. | 01-21-2010 |
| 20100018222 | Thermoelectric Module and Method for Manufacturing the Same - Disclosed is a thermoelectric module, including: a first substrate; a plurality of thermoelectric elements arranged on a first surface of the first substrate; and a temperature detector disposed on the first surface or a second surface of the first substrate via a thermal transfer member. | 01-28-2010 |
| 20100058778 | Thermoelectrically powered indirect evaporative cooling system with desiccant dehumidification - Disclosed is a system for cooling using indirect evaporative cooling, dehumidification using desiccant, and a thermoelectrically powered heat exchanger. The thermoelectric heat exchanger pulls heat from the working air exiting the indirect evaporative cooler and injects that heat energy into ambient air that is then forced through a portion of the rotating desiccant wheel to regenerate the desiccant by removing water molecules from the desiccant material. Liquid water that is condensed by cooling the working air with the thermoelectric heat exchanger is saved and provided to the indirect evaporative cooler for use to cool via evaporation. | 03-11-2010 |
| 20100139291 | Field-deployable electronics platform having thermoelectric power source and interchangeable power management electronics and application modules - A wrapped thermoelectric power source having an inner and an outer insulator is provided within a housing formed, at least partially, by an upper and lower thermal transfer elements. The thermoelectric power source including a plurality of coupled pairs of thin film materials possessing thermoelectric properties, the pairs disposed on a flexible substrate and electrically coupled in any series/parallel combination, with the flexible substrate wrapped around an inner thermal insulator. The thermoelectric power source may be sized such that at least a portion of an electronics module may be disposed at least partly within the inner thermal insulator. The electronics module is electrically coupled to the thermoelectric power source, and includes components for voltage regulation and/or power conditioning. A mechanical means, connected to both the upper and the lower thermal transfer elements, holds those elements substantially adjacent opposite sides of the thermoelectric power source while preventing thermal shorting between the upper and lower thermal transfer elements. In one aspect, the electronics module further includes applications circuitry such as, but not limited to, one or more of sensors, data storage, signal processing, computational resources and wireless communication circuitry. | 06-10-2010 |
| 20100186424 | HEAT EXCHANGE UNIT - A heat exchange unit is constituted of a thermoelectric module and a heat exchanger. The thermoelectric module includes an upper electrode, a lower electrode, and a plurality of thermoelectric elements interposed between the upper electrode and the lower electrode, wherein the heat exchanger composed of aluminum or aluminum alloy having high thermal conductivity is attached to the upper electrode and/or the lower electrode via an insulating layer. The surface roughness of the heat exchanger adjoined to the insulating layer is controlled to be less than 4.7 μm and greater than 0.1 μm. This prevents cracks and fractures from being formed in the insulating layer, which is thus improved in adhesion with the heat exchanger. Thus, it is possible to demonstrate high heat-absorption/dissipation performance and high reliability in the heat exchange unit due to a reduced thermal resistance between the thermoelectric module and the heat exchanger. | 07-29-2010 |
| 20100199687 | Temperature control device - A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad. | 08-12-2010 |
| 20100205978 | Pipe Freezing - Pipe freezing equipment ( | 08-19-2010 |
| 20100257871 | Thin film thermoelectric devices for power conversion and cooling - A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header coupled to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a thermal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header. | 10-14-2010 |
| 20100269517 | MODULE FOR COOLING SEMICONDUCTOR DEVICE - A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler. | 10-28-2010 |
| 20100326092 | HEAT EXCHANGER TUBE HAVING INTEGRATED THERMOELECTRIC DEVICES - A heat exchanger for a vehicle is shown, wherein the heat exchanger includes a plurality of tubes having integrated thermoelectric devices disposed thereon to facilitate heat transfer between the tubes and an atmosphere surrounding the tubes. | 12-30-2010 |
| 20110000224 | METAL-CORE THERMOELECTRIC COOLING AND POWER GENERATION DEVICE - In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements provided for transferring heat across the ends of the thermoelectric device. A method for making the thermoelectric device includes forming a metal substrate, and depositing one or more thermoelectric films on the metal substrate. Thereafter, one or more bumps are provided on one of the one or more thermoelectric films. Deposition of the one or more thermoelectric films on the metal substrate and the provision of the one or more bumps on the thermoelectric film result in the formation of a thermoelement. | 01-06-2011 |
| 20110016889 | HEATING APPARATUS HAVING AT LEAST TWO THERMOELECTRIC MODULES WHICH ARE CONNECTED IN SERIES - A heating apparatus including at least two thermoelectric modules connected in series, and at least one switching arrangement connected in parallel with one of the at least two thermoelectric modules such that electrical current flows via the at least one switching arrangement in an event of a failure of the one of the at least two thermoelectric modules. | 01-27-2011 |
| 20110030389 | HEAT EXCHANGER - A heat exchanger includes a thermoelectric module. A first fluid passage is arranged at a heat dissipation side of the thermoelectric module and a second fluid passage is arranged at a heat absorption side of the thermoelectric module. The thermoelectric module includes P type and N type thermoelectric semiconductor elements. An electrical insulator couples the P type and N type thermoelectric semiconductor elements. Heat dissipation side electrodes are exposed in the first fluid passage and heat absorption side electrodes are exposed in the second fluid passage. At least the heat dissipation side of the thermoelectric module includes valleys and ridges with the heat dissipation side electrode being free from projections. | 02-10-2011 |
| 20110056215 | WIRELESS POWER FOR HEATING OR COOLING - Exemplary embodiments are directed to heating or cooling with wireless power. A device may comprise a wireless power receiver having at least one associated receive antenna. The device may further include a thermoelectric element operably coupled to the wireless power receiver and configured to heat or cool at least a portion of the device upon receipt of wireless power. | 03-10-2011 |
| 20110132001 | Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners - This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow. | 06-09-2011 |
| 20110132002 | CORE-SHELL NANOWIRE WITH UNEVEN STRUCTURE AND THERMOELECTRIC DEVICE USING THE SAME - A core-shell nanowire with an uneven surface structure can be advantageously used in thermoelectric devices. The core-shell nanowire with the uneven surface structure includes a core region and a shell region, wherein the uneven surface structure is formed in the shell region. | 06-09-2011 |
| 20110225982 | CPU COOLING CIRCUIT HAVING THERMOELECTRIC ELEMENT - A CPU cooling circuit for a CPU includes a thermoelectric element and a current source circuit. The thermoelectric element includes a first thermoelectric substrate attached to the CPU, a second thermoelectric substrate opposite to the first thermoelectric substrate, a plurality of n-type semiconductor units and p-type semiconductor units alternately sandwiched between the first and the second thermoelectric substrates and electrically connected in series between a positive power supply input and a negative power supply input. The current source circuit is configured for providing driving current to flow through the n-type semiconductor units and the p-type semiconductor units of the thermoelectric element according to a temperature of the CPU. | 09-22-2011 |
| 20110225983 | COOLING DEVICE - An object of the present invention is to provide a cooling device that is easy to attach and that ensures intimate contact at a contact surface between a heat absorbing surface of a Peltier element and an object to be cooled and a contact surface between a heat radiating surface of the Peltier element and a cooling part. A cooling device according to the present invention includes a Peltier element having a heat absorbing surface and a heat radiating surface that are opposite each other; a heat absorbing plate having a first Peltier element attaching surface and located with the first Peltier element attaching surface facing the heat absorbing surface of the Peltier element; a heat radiating plate having a second Peltier element attaching surface and located with the second Peltier element attaching surface facing the heat radiating surface of the Peltier element; heat conducting members having viscosity or elasticity and provided between the heat absorbing surface and the first Peltier element attaching surface and between the heat radiating surface and the second Peltier element attaching surface; and a spacer provided between the heat absorbing plate and the heat radiating plate in parallel with the Peltier element and defining an opposing distance between the first and second Peltier element attaching surfaces. | 09-22-2011 |
| 20110232302 | BATTERY TEST RIG - The present invention relates to a battery test rig, comprising a test cell ( | 09-29-2011 |
| 20110252814 | Thermal insulator for construction using thermoelectric module - The present invention provides a thermal insulator for construction including: a thermoelectric module inserted in a wall or floor of a building and including a plurality of thermoelectric elements; a power supply module for supplying power to the thermoelectric module; and a power control module for controlling size and polarity of the power supplied to the thermoelectric module from the power supply module. This thermal insulator for construction can provide much better thermal insulation performance in comparison with a conventional thermal insulator, and it is possible to reduce thickness of the wall or floor in comparison with when using the conventional thermal insulator since the thermoelectric element has very small size. Further, it is possible to implement a cooling or heating effect only by changing polarity and size of applied current. | 10-20-2011 |
| 20110283715 | TEMPERATURE ADJUSTMENT APPARATUS - A temperature adjustment apparatus suppresses decline in temperature adjustment performance by avoiding even partial impairment of the function of a thermoelectric module in respective zones, which is accomplished due to the presence of terminals. A terminal is provided via an electrode extension section on a heat exchange plate side electrode of the thermoelectric module of inner zones apart from an outermost zone, of four zones. The electrode extension section is disposed at a position which is sandwiched between adjacent thermoelectric elements and over which a temperature adjustment side electrode spans. The terminals are disposed outside the thermoelectric module in the outermost zone. | 11-24-2011 |
| 20120111028 | THERMOELECTRIC-ENHANCED, REFRIGERATION COOLING OF AN ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component of varying heat load. The apparatus includes a refrigerant evaporator coupled in thermal communication with the electronic component, a refrigerant loop coupled in fluid communication with the refrigerant evaporator for facilitating flow of refrigerant through the evaporator, and a thermoelectric array disposed in thermal communication with the evaporator. The thermoelectric array includes one or more thermoelectric elements, and is powered by a voltage and by a current of switchable polarity, which are controlled to maintain heat load on refrigerant flowing through the refrigerant evaporator within a steady state range, notwithstanding varying of the heat load applied to the refrigerant flowing through the refrigerant by the at least one electronic component. | 05-10-2012 |
| 20120111029 | AC POWERED THERMOELECTRIC DEVICE - Disclosed herein is an AC powered thermoelectric device, including: a power supplier outputting AC power; a plurality of thermoelectric modules; and a plurality of rectifiers connected to each of the plurality of thermoelectric modules in series and applying the AC power having different polarities to each of the plurality of thermoelectric modules, whereby the positions of the hot side and the cold side are fixed to function as a heater and a cooler, while using the AC power. | 05-10-2012 |
| 20120125015 | THERMOELECTRIC MODULES FOR AN EXHAUST SYSTEM - In a thermoelectric module consisting of p- and n-conducting thermoelectric material pieces which are alternately connected to one another via electrically conductive contacts, the thermoelectric module ( | 05-24-2012 |
| 20120151939 | COOLING CONTROL CIRCUIT FOR PELTIER DEVICE - A cooling control circuit for a Peltier device comprises: a switching device | 06-21-2012 |
| 20120151940 | COOLING CONTROL CIRCUIT FOR PELTIER ELEMENT - A Peltier element cooling control circuit that accurately controls a small number of elements with a simple structure. First and second amplification circuits are connected between a current detection resistor detecting current of a Peltier element and a current control circuit performing current control on the Peltier element based on voltage proportional to the current. One of two resistors determines the amplification rate of the first amplification circuit includes a thermistor. When the ambient temperature is equal to a predetermined temperature or greater, the output voltage of the second amplification circuit is supplied to the current control circuit to control the current of the Peltier element so as to be constant. When the ambient temperature is less than the predetermined temperature, the output voltage of the first amplification circuit is supplied to the current control circuit to control the current of the Peltier element in accordance with the temperature characteristics. | 06-21-2012 |
| 20120234022 | Method for testing a peltier element as well as a small electrical appliance with a peltier element and a safety device - A method with the following steps is described for testing a Peltier element: applying a voltage to the Peltier element; switching off the voltage at the end of a defined period of time; measuring the voltage at the Peltier element; and comparing the measured voltage with a reference value. | 09-20-2012 |
| 20120240598 | HEAT PUMP SYSTEM - One aspect of the present invention may include a heat pump system having a Peltier unit in an outdoor space and an outdoor heat exchange unit in the outdoor space. The Peltier unit has a Peltier element with a heat-absorbing portion and a heat-radiating portion, a first substrate in contact with the heat-absorbing portion, a second substrate in contact with the heat-radiating portion, a metal case and a resin case. The metal case covers the first substrate and forms a first flow path between itself and the first substrate. The first flow path is connected in a loop-like fashion to the outdoor heat exchange unit by an outdoor piping. The resin case covers the second substrate and forms a second flow path between itself and the second substrate. The second flow path is connected in a loop-like fashion to the indoor heat exchange unit by an indoor piping. | 09-27-2012 |
| 20120291454 | Thermoelectric Devices Using Sintered Bonding - A device for conducting heat from a source to a sink is provided that, in one embodiment, includes a thermoelectric element coupled to a substrate via sintered material that includes nano and/or micro particles. In one aspect, the sintered material includes silver particles and in another aspect the sintered material also includes an additive to control the coefficient of thermal expansion of the sintered material. | 11-22-2012 |
| 20120297796 | THIN FILM PELTIER THERMAL LIGHT POWER BARRIER COOLER - A light powered barrier for cooling a substrate includes a thermo-conductive layer for contacting the substrate, a first P-type layer disposed atop the thermo-conductive layer, a first N-type layer disposed over the first P-type layer and a thermoelectrically conductive insert that conducts heat from the thermo-conductive layer and electrically conducts electrons and holes from the first P-type layer and the first N-type layer. | 11-29-2012 |
| 20130014516 | THERMOELECTRIC MODULEAANM Yang; Ju HwanAACI Gyeonggi-doAACO KRAAGP Yang; Ju Hwan Gyeonggi-do KRAANM Choi; Dong HyeokAACI Gyeonggi-doAACO KRAAGP Choi; Dong Hyeok Gyeonggi-do KRAANM Lee; Sung HoAACI Gyeonggi-doAACO KRAAGP Lee; Sung Ho Gyeonggi-do KRAANM Wi; Sung KwonAACI SeoulAACO KRAAGP Wi; Sung Kwon Seoul KR - Disclosed herein is a thermoelectric module. The thermoelectric module includes a first substrate, a second substrate, a diffusion prevention layer, and a thermoelectric device, wherein each of the first and second substrates is stacked with: a heat radiation layer performing heat generation reaction or heat adsorption reaction when power is applied to the thermoelectric module; an insulating layer formed on one surface of the heat radiation layer and formed in a first square wave pattern having a first protrusion part and a first groove part; and an electrode layer buried into the first groove part formed on a surface of the insulating layer. | 01-17-2013 |
| 20130139524 | THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF - Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature. | 06-06-2013 |
| 20130239591 | THERMAL ELECTRIC COOLER AND METHOD - According to an embodiment of the disclosure, a thermal electric cooler is provided that includes a plurality of segments and a plurality of couplers. The segments are coupled in series to form a ladder-configuration string of P-channel chips and N-channel chips. Each segment comprises at least two substrings coupled in parallel. Each substring comprises at least one of the chips. Each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips. | 09-19-2013 |
| 20140060087 | HEAT RADIATION-THERMOELECTRIC FIN, AND THERMOELECTRIC MODULE AND THERMOELECTRIC APPARATUS INCLUDING THE HEAT RADIATION-THERMOELECTRIC FIN - A heat radiation-thermoelectric fin includes a thermoelectric inorganic material on a heterogeneous laminate of graphene. The heterogeneous laminate may be tube-shaped or plate-shaped, and a metal conductor may be coupled to one or more of the heterogeneous laminate. A thermoelectric module may be formed to include the fin, and a thermoelectric apparatus may include a heat supplier connected to the thermoelectric module. | 03-06-2014 |
| 20140150463 | THERMOELECTRIC MODULE - A thermoelectric module includes a thermoelectric element and an electrode. The thermoelectric element has a rectangular end face. The electrode includes a first joint portion joined to a center portion of the end face; and a second joint portion joined to one end and a third joint portion joined to the other end. Each of the second joint portion and the third joint portion is disposed at a distance from each of four corners of the end face. A joint length in the second direction orthogonal to the first direction between the first joint portion and the end face is longer than each of a joint length in the second direction between the second joint portion and the end face, and a joint length in the second direction between the third joint portion and the end face. | 06-05-2014 |
| 20140260334 | SECURE THERMOELECTRIC DEVICE - The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume: a first deformation position in which the first and second legs are electrically connected in series solely by means of the connecting element; and a second deformation position in which the connecting element is in electrical contact with a shunt contact pad of the device, said shunt contact pad being made of a material, the electrical conductivity of which is greater than the electric conductivity of the connecting element and of the first and second legs. The device also includes a load, the electrical resistance of which is lower than the electrical resistance of the thermoelectric module, said load being electrically connected to the shunt contact pad. | 09-18-2014 |
| 20150040584 | DRIVER FOR THERMO-ELECTRIC COOLER - A TEC-driver that saves the power consumption is disclosed. The TEC-driver includes the H-bridge to supply the driving current to the TEC in the analog mode. The power supply voltage for the H-bridge is dynamically varied as following the voltage applied to the TEC to set the high side transistor in the H-bridge under the minimum bias condition necessary for the stable operation. | 02-12-2015 |
| 20150059362 | COOLING SYSTEM FOR 3D IC - A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler. | 03-05-2015 |
| 20150075186 | METHOD OF AND AN APPARATUS FOR MAINTAINING CONSTANT PHONE SKIN TEMPERATURE WITH A THERMOELECTRIC COOLER AND INCREASING ALLOWABLE POWER/PERFORMANCE LIMIT FOR DIE IN A MOBILE SEGMENT - A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus determines whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature. The apparatus provides power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device. | 03-19-2015 |
| 20150082811 | Adaptive Thermoelectric Cooling In A Processor - In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed. | 03-26-2015 |
| 20150101356 | HEAT EXCHANGER HAVING THERMOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME - A heat exchanger with a thermoelectric element having a tubular fluid channel extending in a longitudinal direction is provided. In particular, the fluid channel is bent at a middle portion to have a first portion and a second portion on both sides of the middle portion, and has an inlet and an outlet for entry and exit of fluid. Also included is a thermoelectric element that has a first surface of which is attached to a first section of a first surface of a flat portion of the first portion and the second portion of the fluid channel, and a radiant heat fin attached to the first surface and a second surface of each of the first portion and the second portion of the fluid channel, respectively. Further disclosed is a method for manufacturing the heat exchanger. | 04-16-2015 |
| 20150316298 | Thermoelectric Device And Method For Fabrication Thereof - A thermoelectric device and a method for fabrication thereof are disclosed. The thermoelectric device includes one or more thermocouples electrically connected in series. Each thermocouple includes at least one first thermoelectric element and at least one second thermoelectric element, wherein the thermoelectric elements are maintained in a spaced apart relationship forming an internal cavity there between. | 11-05-2015 |
| 20150323228 | Heat Exchanger Having a Plurality of Thermoelectric Modules Connected in Series - A thermoelectric heat exchanger includes a tube, a fin, and a thermoelectric assembly. The tube is configured to contain coolant flowing therethrough and thermally couple the coolant to a surface of the tube. The fin is configured to transfer heat from the fin to air passing across the fin. The thermoelectric assembly is thermally coupled to the tube and the fin. The assembly is configured to heat the fin relative to the tube in response to a voltage source applied to the assembly. The assembly includes a plurality of thermoelectric modules. Each of the thermoelectric modules is electrically interconnected into a group of series connected modules. The number of modules in each group that are electrically connected in series is determined based on a voltage value of the voltage source and a local temperature difference between the tube and the fin proximate to the group. | 11-12-2015 |
| 20150354866 | HIGH-EFFICIENCY POWER CONVERSION ARCHITECTURE FOR DRIVING A THERMOELECTRIC COOLER IN ENERGY CONSCIOUS APPLICATIONS - Systems and methods are disclosed herein relating to an Alternating Current-Direct Current (AC-DC) power conversion system for supplying power to one or more Thermoelectric Coolers (TECs). In some embodiments, a system comprises one or more TECs and an AC-DC power conversion system configured to supply power to the one or more TECs for a high efficiency mode of operation and a high heat pumping mode of operation. The AC-DC power conversion system comprises a first AC-DC power converter configured to convert an AC input to a DC output at a first output power level for the high efficiency mode of operation of the one or more TECs. The AC-DC power conversion system further comprises a second AC-DC power converter configured to convert the AC input to a DC output at a second output power level for the high heat pumping mode of operation of the one or more TECs. | 12-10-2015 |
| 20160084542 | THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF - A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board. | 03-24-2016 |
| 20160124167 | TEC INTEGRATED WITH SUBSTRATE - This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to thermoelectric coolers (TECs) and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a TEC having a TEC top, a top layer of an optoelectronic subassembly substrate, and a plurality of pillars extending between the TEC top and the top layer, such that the TEC is devoid of a TEC base between the pillars and optoelectronic subassembly substrate. | 05-05-2016 |
| 20160169564 | METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER | 06-16-2016 |
| 20180023823 | SEMICONDUCTOR-BASED AIR CONDITIONING DEVICE | 01-25-2018 |
| 20180023864 | BENT PIPE AND SEMICONDUCTOR REFRIGERATION REFRIGERATOR WITH BENT PIPE | 01-25-2018 |
| 20220137685 | HEAT TRANSFER APPARATUS FOR A COMPUTER ENVIRONMENT - Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC. | 05-05-2022 |
