| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029740000 | Chip component | 47 |
| 20080201940 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than α, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than β, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position. | 08-28-2008 |
| 20080250630 | Back-up table for chip mounter - A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that supports a printed circuit board, and at least one set of link units installed between the base plate and the back-up plate and facing opposite to each other. The back-up table further comprises a first driving part installed between the opposite facing link units and operating the link units to raise and lower the back-up plate, and a second driving part serially connected to the first driving part. | 10-16-2008 |
| 20080263856 | Tape feeder for chip mounter - A tape feeder for a chip mounter is provided. The tape feeder includes a frame, a first link, a second link, and a middle link. A tape is fed along the frame. The first link includes a guide unit guiding the tape and a first end rotatably connected to the frame. The first link is capable of being rotated between a closed position in which the guide unit couples with the frame to guide the tape and an open position in which the guide unit is placed away from the frame. The second link is rotatably connected to the frame and includes a first end supported relative to the frame. The middle link includes a first end rotatably connected to a second end of the first link and a second end rotatably connected to a second end of the second link. | 10-30-2008 |
| 20080301930 | Apparatus for Manufacture of electronic Assemblies - A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side. | 12-11-2008 |
| 20080301931 | Method And Apparatus For Mounting Semiconductor Chips - A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises:
| 12-11-2008 |
| 20080313890 | COMPONENT MOUNTER AND COMPONENT SUPPLY METHOD - A component mounter includes a board transfer rail for positioning a board at a predetermined position on a base, and a transfer head for picking up a component supplied and mounting it on the board positioned by the board transfer rail. The component mounter further includes multiple dish-like members inserted to the base for supplying components placed on them to a movement area of the transfer head. These dish-like members are independently removable from the base. | 12-25-2008 |
| 20090000109 | Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus - To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. | 01-01-2009 |
| 20090007420 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position. | 01-08-2009 |
| 20090031558 | MOUNTING APPARATUS MOUNTING SURFACE-MOUNTED DEVICE ON RECEIVING DEVICE USING ULTRASONIC VIBRATION - A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit. | 02-05-2009 |
| 20090044401 | COMPONENT MOUNTING CONDITION DETERMINATION METHOD - A component mounting condition determination method is used in a component mounter of mounting components onto a board using a mounting head having plural suction nozzles, and includes: a maximum suction component number determination step (Loop A, S | 02-19-2009 |
| 20090049680 | COMPONENT MOUNTER CONTROL METHOD AND COMPONENT MOUNTER - The present invention is a method of controlling a component mounter which includes a mobile unit for mounting a component onto a circuit board, and includes judging (S | 02-26-2009 |
| 20090049681 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility. | 02-26-2009 |
| 20090049682 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility. | 02-26-2009 |
| 20090056113 | STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME - Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1. | 03-05-2009 |
| 20090056114 | NOZZLE MECHANISM, MOUNTING HEAD AND ELECTRONIC COMPONENT MOUNTING APPARATUS - In an electronic component mounting apparatus, nozzle mechanisms are formed slender by providing shaft-type linear motors vertically upward of nozzle units and providing linear encoders vertical upward of the shaft-type linear motors, respectively. Thus, it becomes implementable to reduce the occupational area of the individual nozzle mechanisms in XY directions (horizontal direction), allowing the pitch of neighboring nozzles to be narrowed. It also becomes achievable to keep up with increasingly narrowing mounting pitches of electronic components in boards of increasingly smaller-size and higher-integration. | 03-05-2009 |
| 20090133249 | METHOD AND APPARATUS FOR EVALUATING A COMPONENT PICK ACTION IN AN ELECTRONICS ASSEMBLY MACHINE - An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view. | 05-28-2009 |
| 20090249615 | COMPONENT SUPPLY UNIT AND SURFACE MOUNTER - It is intended to allow for readily performing a cover tape setting operation. In the present invention, a tape guide | 10-08-2009 |
| 20090293266 | Linked Chip Attach And Underfill - An integrated circuit packaging method, system and apparatus for maintaining a predetermined temperature between reflow and underfill dispense are disclosed. | 12-03-2009 |
| 20090313817 | SENSOR MODULE - A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. | 12-24-2009 |
| 20100011569 | APPARATUS AND METHOD FOR ASSEMBLING SEVERAL SEMICONDUCTOR DEVICES ONTO A TARGET SUBSTRATE - A method and apparatus are provided for assembly of several semiconductor components on a target substrate. At least two semiconductor components are removed from a dispenser by a transfer device and simultaneously mounted in predefined target positions on the target substrate. The apparatus includes positioning units for positioning of the semiconductor components relative to the target substrate. Feed of the target substrate occurs by a first positioning unit into an assembly area where the semiconductor components are mounted on the target substrate in a first X direction, and feed of the transfer device with the semiconductor components occurs by a second positioning unit into the assembly area in a second Y direction. Both directions deviate from each other and the assembly area represents vicinity of the intersection point of the X and Y directions. Removal of the process target substrate from the assembly area continues its feed movement. | 01-21-2010 |
| 20100024207 | SURFACE-MOUNT TECHNOLOGY NOZZLE - AN SMT nozzle is provided for picking up an SMD. The nozzle includes a suction portion and a supporting arm extending from a side of the suction portion. The suction portion forms an engaging end configured for abutting against the SMD, and defines a suction passage with an opening in the engaging end. The supporting arm form at least one supporting end spaced from the engaging end of the suction portion and configured for abutting against the SMD. | 02-04-2010 |
| 20100043214 | INTEGRATED CIRCUIT DICE PICK AND LIFT HEAD - The invention provides for a dice pick and lift head for an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The dice pick and lift head includes a first translation stage mounted to the die picking assembly, said first translation stage operatively displaceable along a vertical axis relative to the support assembly. The dice pick and lift head also includes a second translation stage mounted to the first translation stage, said second translation stage operatively displaceable along a horizontal axis relative to the support assembly. Further included is a die picker head mounted to the second translation stage, the picker head defining a vacuum chamber and a dice contact surface having vacuum apertures in fluid communication with the vacuum chamber. | 02-25-2010 |
| 20100043215 | CLAMP ASSEMBLY FOR AN ASSEMBLER FOR ASSEMBLING PRINTHEAD INTEGRATED CIRCUITRY ON A CARRIER - The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates. | 02-25-2010 |
| 20100058580 | Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via - Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser/deserialiser blocks, using the TSVs. | 03-11-2010 |
| 20100107405 | Die-Ejector - A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The pin is guided through the path-like opening of each of the plates. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path. | 05-06-2010 |
| 20100115763 | CIRCUIT MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR CIRCUIT - A module apparatus includes a first unit and a second unit adjacent to the first unit. The first unit includes a chip transfer unit mounting semiconductor chips on a printed circuit board and a heat unit applying heat on a solder ball of the semiconductor chip. The second unit includes a tester testing an electrical connection state between the printed circuit board and the semiconductor chip, a bad board storage storing the printed circuit board on which a semiconductor chip determined as bad in the tester is mounted, and a board moving member moving the printed circuit board stored in the bad board storage into the first unit. | 05-13-2010 |
| 20100180435 | ELECTRONIC COMPONENT FEEDER AND CHIP MOUNTER HAVING THE SAME - An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes. | 07-22-2010 |
| 20100186223 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component. | 07-29-2010 |
| 20100299916 | COMPONENTS PACKAGING SYSTEM - A tools holding member | 12-02-2010 |
| 20110214282 | ACTUATOR FOR MAINTAINING ALIGNMENT OF DIE DETACHMENT TOOLS - A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis. | 09-08-2011 |
| 20110232082 | APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE - An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component. | 09-29-2011 |
| 20110258849 | Semiconductor device fabricating method and fabricating apparatus - Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions. | 10-27-2011 |
| 20120159775 | PICK-UP JIG - A pick-up jig is adapted to be dismountably mounted to an electronic component which has two buckling blocks. The pick-up jig includes a pick-up board and two buckling arms. The pick-up board is against a top of the electronic component. The pick-up board has a flat top surface for the convenience of the pick-up jig being picked up by a SMT machine. The two buckling arms perpendicularly extend downward from two opposite ends of a bottom surface of the pick-up board. An inside of each of the buckling arms protrude inward to form two blocking pillars spaced from each other to define a fastening groove therebetween. A buckling hook is protruded at a bottom of the buckling arm. The buckling blocks slide over the corresponding buckling hooks to be buckled in the corresponding fastening grooves and the buckling hook grappling a bottom of the corresponding buckling block. | 06-28-2012 |
| 20130074327 | MOUNTING SYSTEM FOR APPLYING AN RFID CHIP MODULE TO A SUBSTRATE, IN PARTICULAR A LABEL - A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label, has the following features:
| 03-28-2013 |
| 20130133188 | Apparatus For Mounting Semiconductor Chips - An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate. | 05-30-2013 |
| 20130167369 | APPARATUSES FOR MOUNTING SEMICONDUCTOR CHIPS - A delivering unit for a semiconductor chip provided with a solder bump may include a shuttle configured to move translationally along a direction; at least one chip supporting plate provided on the shuttle to support the semiconductor chip; a pick-up head configured to pick up the semiconductor chip from the at least one chip supporting plate; and at least one buffering member supporting the at least one chip supporting plate and relieving an impact between the pick-up head and the semiconductor chip. A semiconductor chip mounting apparatus may include a chip providing unit configured to provide semiconductor chips having one or more solder bumps; a mounting unit configured to mount the semiconductor chips on printed circuit boards in a surface mounting manner; and a chip delivering unit configured to deliver the semiconductor chips from the chip providing unit to the mounting unit. | 07-04-2013 |
| 20140196279 | ELECTRONIC COMPONENT MOUNTING APPARATUS - An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit which moves the printed circuit board, loaded by the loading unit, in the Y-direction. This apparatus includes a substrate holding unit which temporarily holds the printed circuit board moved by the first substrate moving unit. This apparatus includes a component mounting unit which mounts an electronic component on the printed circuit board. This apparatus includes a second substrate moving unit which moves the printed circuit board with the electronic component mounted thereon in the Y-direction. This apparatus includes an unloading unit which moves the printed circuit board, moved by the second substrate moving unit, in the X-direction to unload it. This invention can provide an electronic component mounting apparatus which is compact in its conveyance direction for conveying a printed circuit board. | 07-17-2014 |
| 20140196280 | METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD - A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed. | 07-17-2014 |
| 20140259648 | BONDING SYSTEM - A bonding system | 09-18-2014 |
| 20140352141 | BONDING DEVICE - A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part. | 12-04-2014 |
| 20150059166 | CHIP ATTACH FRAME - A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads. | 03-05-2015 |
| 20150082621 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member. | 03-26-2015 |
| 20150121689 | Component Supply Device and Component Installation Device - The invention provides a component supply device which is small and can supply electronic components efficiently. The component supply device | 05-07-2015 |
| 20150296668 | ELECTRONIC CIRCUIT COMPONENT MOUNTING HEAD - An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle. | 10-15-2015 |
| 20160007479 | CHIP SPACING MAINTAINING APPARATUS - A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, the expand sheet being supported at its peripheral portion to an annular frame is provided. The chip spacing maintaining apparatus includes a far-infrared radiation applying unit for applying far-infrared radiation toward the expand sheet expanded in a target area between the outer circumference of the workpiece and the inner circumference of the annular frame, thereby shrinking the expand sheet in the target area, and an air layer forming unit provided adjacent to the far-infrared radiation applying unit, the air layer forming unit having a nozzle hole for discharging a gas toward the workpiece in applying the far-infrared radiation from the far-infrared radiation applying unit toward the expand sheet, thereby forming an air layer above the workpiece. | 01-07-2016 |
| 20160050765 | MOTION-BASED RECONFIGURABLE MICROELECTRONICS SYSTEM - A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit. | 02-18-2016 |
| 20160192551 | MANUFACTURING DEVICE, MANUFACTURING MANAGEMENT SYSTEM, AND MANUFACTURING CONTROL PROGRAM - Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged. The manufacturing apparatus is provided with: a component information reading unit that reads component information per unit of electronic component or per unit of package in the packaged components; a manufacturing control unit that controls, using the read component information, the manufacturing treatment of product into which electronic components indicated in the component information are incorporated; and an incorporation information generating unit that generates incorporation information regarding a state of incorporation of each electronic component in the product. | 06-30-2016 |
