| Entries |
| Document | Title | Date |
|---|
| 20090056111 | ALIGNMENT JIG FOR ELECTRONIC COMPONENT - A jig securing alignment and positional accuracy in all directions (x, y, z) for an electrical component to be soldered to a PCB is provided. The jig positions the IC in the x and y directions, and keeps the IC from rotating. The jig also holds the IC down during the soldering process to make sure that the IC remains parallel to the PCB before, during and after soldering. The jig attaches to mounting holes on the PCB and its placement can be automated or performed manually. | 03-05-2009 |
| 20090056112 | ELECTROSTATIC CHUCK MEMBER, METHOD OF MANUFACTURING THE SAME, AND ELECTROSTATIC CHUCK DEVICE - A plurality of protruded portions is formed through embossing and is distributed and arranged regularly or irregularly on an electrostatic chuck surface, and has a circular or almost circular top surface shape and a roundness (R) of 0.01 mm or more is applied to an edge part defined by an intersection of the top surface and a side surface and a portion to which the roundness is applied occupies a quarter of a height h of the protruded portion or more. | 03-05-2009 |
| 20090064489 | ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD - In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process. | 03-12-2009 |
| 20090113698 | APPARATUS FOR ELECTRICALLY COUPLING A SEMICONDUCTOR PACKAGE TO A PRINTED CIRCUIT BOARD - An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate. | 05-07-2009 |
| 20090133248 | DEVICE FOR MOUNTING LIGHT EMITTING ELEMENT - A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element. A suction head is inserted between a first camera and a second camera having relatively fixed optic axes, a head reference mark of the suction head is captured with the first camera, the end face of a light emitting element suctioned by the suction head is captured with the second camera, the light axis emitted by the light emitting element is captured with a third camera, a stage is inserted between the first camera and the second camera, a board held on the stage is captured with the first camera, a stage reference mark of the stage is captured with the second camera, the relative position between the light emitting element and the suction head and the relative position between the board and the stage are calculated using the image information from both cameras, the suction head and the stage are moved to a mounting position, the head reference mark and the stage reference mark are recognized with the first and second cameras, and the suction head and the stage are subjected to position correction based on the relative position information. | 05-28-2009 |
| 20090183361 | INSTALLATION HEAD ACTUATOR FOR ELECTRONIC PARTS AND INSTALLATION DEVICE FOR ELECTRONIC PARTS - In an electronic parts installation device, increasing throughput by brining parallel operation of motors, etc., to the maximum, and having high reliability by reducing contacts and/or interferences generating the parallel operations, an electronic parts installation head actuator | 07-23-2009 |
| 20090193650 | ACF ATTACHMENT DEVICE AND ACF ATTACHMENT METHOD - There is provided an ACF attachment device that attaches ACFs to an electronic component for saving installation space, improving mounting tact time, and reducing costs in a liquid crystal driver mounting stage. A preliminary press bonding device ( | 08-06-2009 |
| 20090205197 | Method of providing flexible heat sink installations for early blade board manufacturing - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 08-20-2009 |
| 20090217514 | Component mounting apparatus, vibration controlling apparatus, and vibration controlling method - A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information. | 09-03-2009 |
| 20090241325 | HAND PRESS - A hand press having an operation member provided at a main body with a pressure head section including a pressure head movable up and down relative to the main body and the pressure head section is configured to be pushed down by the operation member and to apply a pressing force, further, an elastic member is provided at the main body, and configured to apply an elastic force to the pressure head section such that a position of the pressure head located below a top dead center by a predetermined distance serves as an operation origin of the pressure head, and a switch is configured to turn ON when the pressure head section is located at a position above the operation origin. | 10-01-2009 |
| 20090241326 | MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS - An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head. | 10-01-2009 |
| 20090241327 | MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS - In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H | 10-01-2009 |
| 20090260226 | DEVICE FOR ASSEMBLING AN ELECTRONIC COMPONENT - The invention concerns a device ( | 10-22-2009 |
| 20090265924 | Electronic Component Mounting Head, and Apparatus and Method for Mounting Electronic Component - In an electronic component mounting apparatus including an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even under the condition that the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant. | 10-29-2009 |
| 20090265925 | Temporarily Fixing Device - A temporarily fixing device includes a frame-shaped structure member having a hole in its central part and a stepped portion around the hole; a board mounted on the stepped portion of the frame-shaped structure member; a simultaneously-pressing member into which a base pressing the board to the stepped portion and a pressing portion pressing at least one or more circuit components onto the board are unitized in its connection part; a shaft provided on the frame-shaped structure member so as to rotatably and vertically movably support the base of the simultaneously-pressing member; and a pressure member normally pressing the simultaneously-pressing member to the surface of the frame-shaped structure member. | 10-29-2009 |
| 20090277002 | SURFACE MOUNTING APPARATUS - [Problems] To provide a surface mounting apparatus in which abutting members will not abut on a printed wiring board when the abutting members are lowered. | 11-12-2009 |
| 20090288292 | SURFACE MOUNTING APPARATUS - A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base. | 11-26-2009 |
| 20090293265 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. | 12-03-2009 |
| 20090300908 | ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD - It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. | 12-10-2009 |
| 20090307899 | METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures. | 12-17-2009 |
| 20090313816 | DEVICE FOR ASSEMBLING COMPONENTS HAVING METAL BONDING PADS - A device for assembling components having metal bonding pads includes plates that can move relative to each other, bearing metal components respectively and leaving between them a flat chamber surrounding the components when the latter are in contact with each other. The flat chambers can be saturated with deoxidizing gaseous fluid. | 12-24-2009 |
| 20100000081 | ELECTRONIC COMPONENT BONDING MACHINE - In a construction in which the intermediate stage | 01-07-2010 |
| 20100037456 | Vacuum Suction Nozzle and Electric Component Mounting Apparatus - A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceramic body causes static electricity generated on the vacuum suction nozzle to be dissipated to an electronic component mounting device. Dissipation of the static electricity reduces or eliminates electrostatic damage to the electronic component and electrostatic repulsion induced blow off during suction by the vacuum suction nozzle. | 02-18-2010 |
| 20100050423 | Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects - An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads. | 03-04-2010 |
| 20100050424 | ASSEMBLING APPARATUS - An assembling apparatus for assembling an electronic component to a printed circuit board (PCB) includes a base, a fixing member fixed to the base, a sliding member slidably mounted to the base, and a driving device mounted to the base. The fixing member is configured for fixing the PCB. The sliding member is configured for supporting the electronic component. The driving device is capable of driving the sliding member to move relative to the fixing member to assemble the electronic component to the PCB. | 03-04-2010 |
| 20100050425 | ROTARY POSITIONING MECHANISM - A rotary positioning mechanism used for positioning a circuit board to a bottom plate of a chassis is disclosed, which has a plurality of positioning holes concentrically formed on the circuit board and a plurality of positioning columns disposed on the bottom plate of the chassis corresponding to the positioning holes respectively. Each of the positioning holes has an inserting portion and a positioning portion, and each of the positioning columns has a head portion capable of passing through the inserting portion of the corresponding positioning hole and a neck portion connected to the head portion and capable of engaging with the positioning portion of the corresponding positioning hole. By rotating the circuit board relative to the bottom plate of the chassis, the neck portion of each of the positioning columns is engaged with the positioning portion of the corresponding positioning hole, thereby positioning the circuit board to the bottom plate of the chassis. | 03-04-2010 |
| 20100050426 | SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - Disclosed is a component mounting apparatus including two board transfer devices for respectively transferring circuit boards in respective directions parallel to each other and a component placing device provided with at least one component placing head for mounting the components on the boards positioned at predetermined mounting positions on the board transfer devices. Where two component placing heads are provided, they pick up components from two component supply devices and mount the picked-up components respectively on the boards loaded by the two board transfer devices. In this way, the component placing device mounts components simultaneously or alternately on two boards loaded respectively by the two board transfer devices. While one of the two board transfer devices is transferring a board thereon or while the one board transfer device is being adjusted to alter its transfer way width, one of the component placing heads for performing component mountings at the one board transfer device helps the other component placing head in performing component mountings at the other board transfer device. In a modified form, either one of the two transfer devices is used as bypass conveyor or return conveyor. | 03-04-2010 |
| 20100058579 | ARRANGEMENT AND SYSTEM AT A COMPONENT MOUNTING MACHINE - A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine or in the component mounting machine to engage with the arrangement for feeding the components towards the picking position. | 03-11-2010 |
| 20100064510 | COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE - A suction nozzle ( | 03-18-2010 |
| 20100071200 | COMPONENT SUPPLY APPARATUS AND SURFACE MOUNTER - It is intended to allow for efficiently performing a feeder replacement operation. A feeder | 03-25-2010 |
| 20100071201 | Component Placement Apparatus, Component Placement Setting Calculation Apparatus, Program, and Component Placement Setting Calculation Method - The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part | 03-25-2010 |
| 20100083488 | ELECTRONIC COMPONENT TAKING OUT APPARATUS, SURFACE MOUNTING APPARATUS AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT - A plurality of reference electronic components (M | 04-08-2010 |
| 20100132187 | PART MOUNTING APPARATUS AND METHOD - A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath. | 06-03-2010 |
| 20100139085 | TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL - A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together. | 06-10-2010 |
| 20100180434 | ELECTRONIC COMPONENT MOUNTING APPARATUS - Before a user starts the operation of an electronic component mounting apparatus, user's input representing as to whether the user is an operator, a programmer or a manager/maintenance person is accepted and further user level information representing degree of skill of the user as to the safety measures is accepted. The power supply of a mechanical portion operating a head portion is interrupted in accordance with the state of the apparatus including at least the user level information and the open/close state of a safety cover for covering the movable range of the head portion. | 07-22-2010 |
| 20100186221 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 07-29-2010 |
| 20100186222 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 07-29-2010 |
| 20100192365 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 08-05-2010 |
| 20100218371 | MANUFACTURING METHOD FOR A WIRELESS COMMUNICATION DEVICE AND MANUFACTURING APPARATUS - A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements. | 09-02-2010 |
| 20100223781 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In an electronic component mounting system constituted by interconnecting a plurality of mounting apparatuses, a board ID code attached by digital data to the board is read in a board supply apparatus located in the uppermost stream and transmitted to the mounting apparatuses on the downstream side via communication means. By comparing the transmitted board ID code with mounting nonrequirement board code data (defective board code, read error code, dummy board code, etc.) preparatorily stored in a storage section in the mounting apparatus, it is determined whether or not execution of mounting operation of the board is required, and the board determined to be not required to be subjected to mounting is unloaded to the downstream side without carrying out mounting works and without line stop. | 09-09-2010 |
| 20100223782 | COMPONENT MOUNTING CONDITION DETERMINING METHOD - In a component mounter of so-called alternate mounting, a component mounting condition determining method of determining a component mounting condition that equalizes operating times of a plurality of mounting heads is a component mounting condition determining method of determining a component mounting condition for the component mounter which includes the plurality of mounting heads that alternately mount components onto one board, the method including determining (S | 09-09-2010 |
| 20100229378 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity. | 09-16-2010 |
| 20100229379 | ASSEMBLY AID FOR PRINTED BOARD CONNECTORS - In order to simplify the assembly of printed board connectors, the invention proposes an assembly aid that features one or more recesses in accordance with the dimensions of the printed board connectors, wherein one or more printed board connectors to be assembled on a printed board can be inserted into said recesses. In this case, the contact spacing on the printed board corresponds with the arrangement of the printed board connectors in the assembly aid such that an exact alignment of the printed board connectors is realized. | 09-16-2010 |
| 20100242267 | TAPE FEEDER AND MOUNTING APPARATUS - When a component (X) is fed to a pickup position ( | 09-30-2010 |
| 20100242268 | ELECTRONIC PARTS MOUNTING DEVICE - A paste supply unit that is located in a side opposed to an electronic parts supply table | 09-30-2010 |
| 20100257728 | ELECTRONIC COMPONENT MOUNTING APPARATUS - Two concentrically-arranged annular reservoirs | 10-14-2010 |
| 20110030202 | ELECTRICAL CABLE WIRING HEAD DEVICE AND ELECTRICAL CABLE WIRING APPARATUS - An electrical cable wiring head apparatus is provided to rapidly wire an electrical cable while more effectively restraining the electrical cable from floating. An electrical cable wiring head device of the electrical cable wiring head apparatus moves along a wiring surface of a wiring plate to wire an electrical cable on the wiring surface. The electrical cable wiring head device comprises: a head section supported rotatably about a rotary axis and provided with a guide recess for leading the electrical cable to the wiring surface, the guide recess being offset from the rotary axis; a head rotating mechanism for rotating the head section; a guide pushing member including a shaft portion and a roller portion provided rotatably on a distal end of the shaft portion, the guide pushing member being supported movably along the rotary axis; and a guide pushing member drive mechanism for reciprocating the guide pushing member. | 02-10-2011 |
| 20110030203 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively. | 02-10-2011 |
| 20110056071 | Component mounting apparatus, vibration controlling apparatus, and vibration controlling method - A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information. | 03-10-2011 |
| 20110061229 | SYSTEM FOR FASTENING A RAIL, AND FASTENING OF A RAIL ON A SUBSTRATE - The present invention relates to a system and to a fastening of a rail on a substrate, with a guide plate for laterally guiding the rail that has a standing surface associated with the substrate, a support element to support the guide plate in the assembly position, a spring element supported on the guide plate and at least one spring arm for exerting a resilient holding force onto the foot of the rail, and a tensioning means for tensioning the spring element. The fastening can be assembled in that the support element has a support lug supported on the substrate in the assembly position to reach under the standing surface of the guide plate in a way that the guide plate is supported on the substrate via the support lug in the region where the guide plate and support lug overlap. | 03-17-2011 |
| 20110067231 | ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL - An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material. | 03-24-2011 |
| 20110192021 | ELECTRONIC COMPONENT MOUNTING MACHINE AND ELECTRONIC COMPONENT LOADING HEAD - A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L | 08-11-2011 |
| 20110225811 | Substrate-related-operation performing apparatus and substrate-related-operation performing system - A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion. | 09-22-2011 |
| 20110258848 | COMPONENT MOUNTING APPARATUS - In a component mounting apparatus, a picking member picks components and mounts them on a board through movements of a plurality of moving members driven by motors. The apparatus is provided with a regenerative electric power control section for controlling regenerative electric power produced by regenerating a motion energy when each of the motors is decelerated; power supply sections for the motors each for exchanging electric power with the regenerative electric power control section; and a control section. When two moving members are moved, the control section begins to start and accelerate one of the two moving members in synchronized relation with a timing of beginning to decelerate and stop the other moving member and controls the regenerative electric power control section to utilize a regenerative electric power which is obtained from the motor driving the other moving member, in starting the motor which drives the one moving member. | 10-27-2011 |
| 20110283530 | COMPONENT MOUNTING SYSTEM - An inspection camera unit that images an inspection target part of a circuit board can be mounted, replaceably with a mounting head, on a moving mechanism of any one of a plurality of mounting machine modules arranged in alignment along a direction of conveying the circuit board. Also, an inspection image processing unit that processes an image signal output from the inspection camera unit to inspect the inspection target part of the circuit board can be mounted, replaceably with a feeder, on a feeder mount base of any one of the mounting machine modules. The inspection image processing unit is provided with a computer for image processing, a display panel that displays inspection information, and others. | 11-24-2011 |
| 20110289768 | QUICK CIRCUIT BOARD PRESS-MOUNT DEVICE - A quick circuit board press-mount device comprises: a positioning device, having a positioning board and a back board, and the positioning board having an adjusting knob with a screw rod portion, and the back board having an adjusting notch; an adjusting device, having a combining board, an insert board extended forward from the front end of the combining board, and the insert board having a screw hole for securing the screw rod portion, and the insert board being inserted into the adjusting notch, and the insert board having a lateral connecting board extended from a side from the combining board, and the lateral connecting board having an elliptic adjusting slot for securing a position screw hole of the back board by a screw rod; and a press-mount element, coupled to the combining board, so that the circuit board module and the interface card can be mounted conveniently and quickly. | 12-01-2011 |
| 20120005883 | METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL - An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket. | 01-12-2012 |
| 20120073127 | Alignment and Lead Insertion Device for an Electronic Component - An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts. | 03-29-2012 |
| 20120117794 | SURFACE MOUNT MACHINE NOZZLE - An exemplary surface mount machine nozzle includes a mounting element, a pneumatic suction nozzle and a fixing pin. The mounting element defines one of a pivot hole and an elongated perforation in a sidewall thereof. The pneumatic suction nozzle defines another one of the pivot hole and the elongated perforation therein. The fixing pin horizontally extends through the pivot hole and the perforation for connecting the mounting element and the pneumatic suction nozzle together. The fixing pin is slidable along the elongated perforation such that the pneumatic suction nozzle is telescopically slidable relative to the mounting element. | 05-17-2012 |
| 20120167380 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING MACHINE - An electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of the machines, an operation section placed to one direction side from a center in the board conveying direction of the machine on a machine side face is placed in an attitude in which the normal direction of an operation face is inclined toward the center line. A signal tower placed on one direction side from the center line on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle β toward the center line. | 07-05-2012 |
| 20120186076 | GEARED INSERTION APPARATUS FOR A PCA - A apparatus for mounting an interposer PCA into a chassis is disclosed. The apparatus comprises a bracket attached to the PCA. A geared handle is rotatably attached to one end of the bracket. The geared handle is configured to rotate between an open position and a closed position. Two geared segments are rotatably attached to the opposite end of the bracket and are meshed with the geared handle. A slot is formed in each geared segment and two slots are formed in the geared handle. The slots engage with insertion/ejection flanges on the chassis. The engaged slots force the PCA down into mating connectors in the chassis when the handle is rotated from the open position to the closed position. | 07-26-2012 |
| 20120227255 | SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions. | 09-13-2012 |
| 20120233852 | ELECTRONIC COMPONENT MOUNTING APPARATUS - An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle. | 09-20-2012 |
| 20120233853 | SOCKET FOR SEMICONDUCTOR DEVICE PROVIDED WITH CONTACT BLOCK - In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device. | 09-20-2012 |
| 20120255164 | ROTATION ANGLE DETECTION DEVICE, ROTATION ANGLE DETECTION METHOD, AND PART MOUNTING APPARATUS - A rotation angle detection device of the present invention includes: a support body; a rotating body that can rotate with respect to the support body about a rotation axis and move in a rotation axis direction; a rotation angle detection unit that has a magnet attached to either of the support body and the rotating body, and a magnetic sensor attached to the other of the support body and the rotating body and facing the magnet in the rotation axis direction, and that detects a rotation angle of the rotating body on the basis of an output signal of the magnetic sensor; and a position detection unit that detects that the rotating body is positioned at a detection position in which a distance between the magnet and the magnetic sensor in the rotation axis direction becomes a predetermined detection distance. The rotation angle detection unit reads the output signal of the magnetic sensor and determines the rotation angle of the rotating body with respect to the support body from the output signal when the position detection unit detects that the rotating body is positioned at the detection position. | 10-11-2012 |
| 20120266457 | COMPONENT SUPPLYING APPARATUS AND SURFACE MOUNTING APPARATUS - Maintenance of an electronic component working apparatus which carries out prescribed work using components is facilitated. A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulating means. The movement range regulating means allows the component storing section to move between a supply position P | 10-25-2012 |
| 20120317798 | COMPONENT MOUNTING DEVICE - An electric power supplying circuit ( | 12-20-2012 |
| 20130014383 | MANIPULATOR, LOADER, AND POSITIONING STRUCTURE FOR PRODUCTION LINEAANM LIU; YU-CHINGAACI Tu-ChengAACO TWAAGP LIU; YU-CHING Tu-Cheng TWAANM YANG; FU-CHIAACI Tu-ChengAACO TWAAGP YANG; FU-CHI Tu-Cheng TWAANM YU; CHI-ANAACI Tu-Cheng, New TaipeiAACO TWAAGP YU; CHI-AN Tu-Cheng, New Taipei TWAANM LI; YAN-HAOAACI Shenzhen CityAACO CNAAGP LI; YAN-HAO Shenzhen City CNAANM XIA; XINGAACI Shenzhen CityAACO CNAAGP XIA; XING Shenzhen City CNAANM WU; WEN-ZHAOAACI Shenzhen CityAACO CNAAGP WU; WEN-ZHAO Shenzhen City CN - A manipulator includes a main body, and a grasping device mounted to the main body. The grasping device includes a mounting board and two grasping members secured on the mounting board. The two grasping members move towards and away from each other, each grasping member is able to grasp a loader at a specific position of the loader. | 01-17-2013 |
| 20130025118 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a second memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information. | 01-31-2013 |
| 20130074326 | SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND SURFACE MOUNTER - A substrate stopped at a first position is transferred toward a second position and is stopped at the second position in an accurate and stable manner. An intermediate position arrival time AT is measured while the substrate is being transferred from a substrate stop position toward a mounting work position, and a transfer status of the substrate (whether or not an unexpected factor has occurred) is assessed based on the intermediate position arrival time AT. Before the substrate reaches the second position, a deceleration pattern is controlled by altering a deceleration start timing T | 03-28-2013 |
| 20130118006 | ELECTRONIC COMPONENT MOUNTING DEVICE - In the substrate-bottom receiving mechanism | 05-16-2013 |
| 20130133187 | POSITIONING SYSTEM FOR POSITIONING A POSITIONING UNIT ALONG A LONGITUDINAL AXIS - A positioning system for positioning a positioning unit along a longitudinal axis includes: a linear guide arrangement for enabling a linearly guided motion parallel to the axis; a motor includes a moving motor member operatively connected to the linear guide arrangement and an elongated stationary motor member extending parallel to the axis; and a force transmission arrangement operatively connecting the moving motor member to the positioning unit, wherein the force transmission arrangement is arranged to provide a semi-rigid engagement between the positioning unit and the moving motor member, wherein the positioning unit and the moving motor member, respectively, are operatively connected to the linear guide arrangement by at least two guide engaging carriages, and wherein the positioning unit is attached to the guide engaging carriages by rigid or resilient positioning unit holders. | 05-30-2013 |
| 20130139380 | CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME - A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board. | 06-06-2013 |
| 20130180103 | BOARD PROCESSING APPARATUS - Provided is a board processing apparatus which includes a head unit for performing a predetermined operation for a board, and a moving device for moving the head unit in a uniaxial direction, wherein the moving device includes a guide rail and a sliding member that is moved along the guide rail. The head unit is fixed to the sliding member in such a manner that at least a portion of the head unit protrudes outwardly from an edge face of the sliding member oriented in a moving direction thereof. | 07-18-2013 |
| 20130192061 | LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD IN LED PACKAGE MANUFACTURING SYSTEM - In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member | 08-01-2013 |
| 20130212876 | SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions. | 08-22-2013 |
| 20130219708 | MOUNTING HEAD UNIT, COMPONENT MOUNTING APPARATUS, AND METHOD OF MANUFACTURING A SUBSTRATE - A mounting head unit includes a rotating body, a nozzle, and a valve mechanism. The rotating body includes a rotating shaft, a negative-pressure path provided within the rotating shaft to flow negative-pressure gas therethrough, a non-negative-pressure path for flowing non-negative-pressure gas therethrough, which is provided within the rotating shaft to be aligned with the negative-pressure path in an axial direction of the rotating shaft, and a partition provided within the rotating shaft to partition the negative-pressure and non-negative-pressure paths. The nozzle includes a flow path for flowing gas therethrough, is connected to the rotating body such that the flow path is in communication with the negative-pressure and non-negative-pressure paths of the rotating body, and is capable of sucking a component by being supplied with the negative-pressure gas from the negative-pressure path. The valve mechanism switches between negative-pressure and non-negative-pressure states of the gas to be supplied into the nozzle. | 08-29-2013 |
| 20130269179 | INVERTING HEAD - A nozzle holder | 10-17-2013 |
| 20130333207 | APPARATUS FOR MANUFACTURING CAMERA MODULE - Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB. | 12-19-2013 |
| 20130340247 | WORKING MACHINE POWERED IN A NON-CONTACTMANNER - There is provided a working machine including a guide beam having a power transmitter; at least one working head comprising a power receiver and configured to move along the guide beam, wherein the power receiver receives power from the power transmitter in a non-contact manner in which the power receiver and the power transmitter are not physically connected, and wherein the working head operates by the received power in the non-contact manner. | 12-26-2013 |
| 20140033518 | VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD - A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure. A vacuum chamber is evacuated to vacuum, and the lower plate member and an intermediate member are relatively moved in an approaching direction, so that an outer peripheral portion of the pressurizing release film is gas-tightly held between the upper face of the substrate-placing table of the lower plate member and a lower face of an inner frame body. | 02-06-2014 |
| 20140068928 | COMPONENT MOUNTING APPARATUS - A inverting head | 03-13-2014 |
| 20140157591 | ELECTRONIC COMPONENT MOUNTING SYSTEM - A substrate standby unit that is capable of keeping only one substrate | 06-12-2014 |
| 20140215812 | MOUNTING HEAD AND COMPONENT MOUNTING APPARATUS - A mounting head | 08-07-2014 |
| 20140215813 | SUBSTRATE FIXING APPARATUS, SUBSTRATE WORKING APPARATUS AND SUBSTRATE FIXING METHOD - A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate. | 08-07-2014 |
| 20140230241 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - After a reel of an MSD which is a moisture management target component is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, exposure time for which the MSD is in an atmospheric exposure state is timed in a reel unit, and the exposure time is compared with exposure limit time set for the MSD and stored in a storage part, and an electronic component mounting apparatus equipped with the reel of the MSD whose exposure time exceeds the exposure limit time is specified and work by the apparatus is stopped. | 08-21-2014 |
| 20140304984 | DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-FORMING MASS - A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation. | 10-16-2014 |
| 20140373345 | VEHICLE VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR - A system for assembling a camera for a vision system of a vehicle includes a circuit board having an imaging array sensor disposed thereat, with the circuit board having connector circuitry at a side thereof. A lens barrel is provided and the circuit board is attached at the lens barrel. Solder pads are provided at the connector circuitry. A coaxial connector is provided and the coaxial connector is aligned with the connector circuitry at the circuit board. The system includes determining when the coaxial connector is aligned with the connector circuitry at the circuit board. When the coaxial connector is determined to be aligned with the connector circuitry, the coaxial connector is attached at the connector circuitry, with attaching the coaxial connector at the connector circuitry including soldering the coaxial connector at the connector circuitry via the solder pads. | 12-25-2014 |
| 20150013152 | COMPONENT MOUNTING SYSTEM - A component mounting system includes: a component mounter that moves a mounting head and allows a suction nozzle mounted in the mounting head to suck a component supplied by a parts feeder to mount the component on a substrate; a head maintenance device that executes maintenance of the mounting head; an inspection section that inspects a state of the mounting head undergone the maintenance; a use suitability determination section that determines whether or not use of the mounting head undergone the maintenance is suitable based on a result of the inspection; and a registration section that registers the mounting head determined to be not suitable for use. | 01-15-2015 |
| 20150040384 | COMPONENT MOUNTING MACHINE - When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor. | 02-12-2015 |
| 20150113799 | ELECTRONIC COMPONENT ASSEMBLY APPARATUS - An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate. | 04-30-2015 |
| 20150296629 | ELECTRONIC COMPONENT MOUNTING SYSTEM - Component information including operating parameters for numerical determination of an operation mode of an electronic component mounting operation unit and a change history of the component information are stored in a component information change history storage unit. A mounting error occurring during an electronic component mounting operation is detected, mounting error information relating to an occurrence situation of the mounting error is recorded, and a transition of the mounting error is displayed on a display unit. When the component information is changed, the past mounting error information in which the mounting error information relating to the mounting error occurring during the electronic component mounting operation for the electronic component as changed is associated with the past component information immediately before the change is stored in the past mounting error storage unit and displayed on a display screen. | 10-15-2015 |
| 20150334889 | ELECTRONIC-COMPONENT MOUNTING SYSTEM - An electronic-component mounting system includes: mounting lines each including an electronic-component mounting apparatus; an operation information processor which collects operation information of the electronic-component mounting apparatus, applies a statistical process on the operation information, and produces operation quality information of the mounting lines; and a portable information terminal accessible to the operation information processor by wireless communication. An identification information transmission section which transmits identification information for identifying each of the mounting lines is disposed in each mounting line, and a reception section which receives the identification information is disposed in the portable information terminal. The portable information terminal displays on a display section thereof the operation quality information of one of the mounting lines located near the portable information terminal based on the identification information transmitted from the mounting lines. | 11-19-2015 |
| 20150373885 | COMPONENT MOUNTING SYSTEM AND COMPONENT DATA CREATION METHOD - A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component. | 12-24-2015 |
| 20150382521 | COMPONENT MOUNTING SYSTEM, AND BULK COMPONENT DETERMINING METHOD USED IN THE SAME - A component mounting system that efficiently determines a component as a bulk component to be mounted on a bulk feeder through a simulation, and a bulk component determining method. The component mounting system includes a printed-circuit-board conveyance section that includes conveyance lanes and which convey a plurality of different types of printed circuit boards, a component supply section, a mounting head, a bulk feeder, and a bulk component determining section that performs a simulation in which operation times when the components supplied from the component supply section are moved on the printed circuit boards on the conveyance lanes are calculated for all the components and determines the bulk component to be mounted on the bulk feeder based on the calculated operation times. | 12-31-2015 |
| 20160021802 | COMPONENT MOUNTING RELATED APPARATUS AND COMPONENT MOUNTING RELATED SYSTEM - A component mounting related system is provided with a control unit that outputs a first control signal for controlling a first component mounting related apparatus and a second control signal for controlling a second component mounting related apparatus, a first signal transmission line that transmits the first control signal and the second control signal in the first component mounting related apparatus, and a signal transmission connector that outputs the second control signal transmitted by the first signal transmission line to the second component mounting related apparatus. | 01-21-2016 |
| 20160021804 | COMPONENT MOUNTING RELATED APPARATUS AND COMPONENT MOUNTING RELATED SYSTEM - A component mounting related system is provided with a first component mounting related apparatus, a second component mounting related apparatus, an electric power source provided in the first component mounting related apparatus, a first power transmission line provided in the first component mounting related apparatus, a power transmission connector, and a second power transmission line. The electric power source supplies an electric power for actuating the first component mounting related apparatus. The first power transmission line transmits the electric power in the first component mounting related apparatus. The power transmission connector transmits the electric power transmitted by the first power transmission line to the second component mounting related apparatus. The second power transmission line transmit, in the second component mounting related apparatus, the electric power supplied from the first component mounting related apparatus through the power transmission connector. | 01-21-2016 |
| 20160037693 | PRODUCTION MANAGEMENT SYSTEM FOR COMPONENT MOUNTING MACHINE - A production management system is configured so as to make it possible to produce component mounting boards to the same specifications in two lanes of a component mounting machine using one set of NC data by arranging feeders of two feeder set bases in the same manner and setting the mounting order of the components to the circuit boards in the two lanes to be the same in a same-direction production mode in which circuit boards are conveyed in the same front/back direction in the two lanes. In addition, the arrangement of the feeders and the mounting order of the components are optimized so that the difference in production times in the two lanes in the same-direction production mode is minimized. | 02-04-2016 |
| 20160037694 | ELECTRONIC CIRCUIT COMPONENT MOUNTING SYSTEM - An electronic circuit component mounting machine including a suction nozzle lowered by a first linear motor and a second linear motor by two stages A drive circuit of the second linear motor includes a reaction force detecting section and a damage detecting section that detects damage of an electronic circuit component. A controller that controls the drive circuit includes an appropriate operation parameter determining section that determines an appropriate value of an operation parameter of the second linear motor using the reaction force detecting section and the damage detecting section. | 02-04-2016 |
| 20160066462 | LINEAR MOTION DEVICE AND ELECTRONIC COMPONENT MOUNTING APPARATUS - A linear motion device includes: a linear motion mechanism having: a beam elongated in one horizontal direction; a guide member disposed in the beam to extend in the one direction; a moving member disposed to be movable along the guide member; and a moving mechanism that moves the moving member. The beam includes a metallic tubular body formed with an opening portion penetrating the metallic tubular body in the one direction and a tubular reinforcing portion formed of a carbon fiber reinforced plastic and formed in close contact with an inner surface of the metallic tubular body. | 03-03-2016 |
| 20160066484 | PRESSURE CONTROL DEVICE, SURFACE MOUNT MACHINE AND PRESSURE CONTROL METHOD - The pressure of a gas supplied to a nozzle is stably controlled over a wide range. A first positive pressure supply pathway supplies the gas at a first positive pressure. A second positive pressure supply pathway supplies the gas at a second positive pressure that is lower than the first positive pressure. A nozzle connecting pathway is connected to the nozzle. A switch-over valve selectively switches between a first connected state in which the first positive pressure supply pathway is connected to the nozzle connecting pathway and a second connected state in which the second positive pressure supply pathway is connected to the nozzle connecting pathway. A valve controller controls the connected state of the switch-over valve and adjusts the pressure of the gas supplied to the nozzle within the range from the first positive pressure to the second positive pressure. | 03-03-2016 |
| 20160073511 | INSERTION HEAD, COMPONENT INSERTION DEVICE, AND COMPONENT MOUNTING LINE - An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A gripping force of the leaded component by the one pair of gripping claws is changed by performing an interval changing control of the one pair of gripping claws via the interval changing mechanism. | 03-10-2016 |
| 20160113165 | COMPONENT MOUNTING MACHINE - A negative pressure supply system | 04-21-2016 |
| 20160120037 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus includes a carriage that holds a part feeder for supplying a component in a state of being attached to a base and attaches the part feeder to the base in a state of being coupled to the base; a mounting head that mounts the component to a substrate after the component is taken out of the part feeder held by the carriage coupled to the base through an opening formed between the base and a cover member formed so as to cover an upward side of the base; and a shutter moved from an opened position in which the opening is opened to a closed position in which the opening is closed when the carriage is separated from the base. | 04-28-2016 |
| 20160128204 | COMPONENT MOUNTING MACHINE - A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components. | 05-05-2016 |
| 20160128205 | ELECTRONIC COMPONENT MOUNTING SYSTEM - An electronic component mounting system includes: mounting line management apparatuses disposed in each of mounting lines and an integrated management apparatus connected to the mounting line management apparatuses. The integrated management apparatus includes a first collation unit which performs collation of an electronic component based on identification information for identifying the electronic component. The mounting line management apparatus includes a second collation unit which performs collation of the electronic component. When the identification information is read out by the identification information reading-out unit, the collation of the electronic component is performed by the first collation unit if the mounting line management apparatus can access the integrated management apparatus, and the collation of the electronic component is performed by the second collation unit if the mounting line management apparatus cannot access the integrated management apparatus. | 05-05-2016 |
| 20160128246 | ELECTRONIC CIRCUIT COMPONENT MOUNTING SYSTEM - A method using an electronic circuit component mounter including a circuit substrate conveying and holding device, and a bulk feeder that is a head-side feeder which can be moved to any position on a plane inside the mounter. An electronic circuit component mounting system including a control device that performs control such that that the component holding tool positioned at a component pickup position for a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate. | 05-05-2016 |
| 20160128247 | FEEDER AND MOUNTING MACHINE - A feeder, which is used through installation in a mounting machine and which is configured to supply components that a mounting machine mounts on a printed circuit board. The feeder is a second type of feeder which is capable of performing a second aspect component supply operation, and is interchangeable with a first type of feeder which performs a first aspect component supply operation. The feeder is configured to transmit feeder information indicating that the feeder is the first type of feeder and perform the first aspect component supply operation when a request for feeder information is received from the mounting machine by a first command, and transmit feeder information indicating that the feeder is the second type of feeder and perform the second aspect component supply operation when a request for feeder information is received from the mounting machine by a second command. | 05-05-2016 |
| 20160143154 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus crimps a component to a transparent substrate. The component is mounted on the transparent substrate through a photo-modifiable resin portion. The component mounting apparatus includes a receiving portion that receives a surface of the substrate by an upper surface of a transparent member, a pressing portion that presses the component against the substrate, an emission portion that emits light to the photo-modifiable resin portion through the transparent member, and a control portion that controls a timing when the pressing portion starts pressing of the component and a timing when the emission portion starts emission of the light so that the emission of the light is started a predetermined differential time earlier or later than the start of the pressing of the component. | 05-19-2016 |
| 20160150688 | METHOD FOR ALLOCATING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING SYSTEM - A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions. | 05-26-2016 |
| 20160150689 | COMPONENT HOLDING STATE DETECTION METHOD AND COMPONENT MOUNTING MACHINE - A component mounting machine includes a part camera in which a suction nozzle for sucking a component P and a fiducial mark are provided on a head, a sub-lens is installed in a visual field of a lens, the component is imaged through a main lens, and it is possible to image the fiducial mark through the lens and the sub-lens. Distortion correction values of the main lens portion are measured, distortion correction values of the sub-lens portion are measured, and the distortion correction values are stored in advance as a distortion correction table. During component mounting, when the component P which is sucked by the suction nozzle and the fiducial mark are imaged at the same time by the part camera, the obtained image is corrected using the distortion correction table, and a suction state of the component P is detected based on the corrected image. | 05-26-2016 |
| 20160165770 | WORK MACHINE - A work machine provided with slider that moves in a specified direction, and two mounting heads and attached to the slider is provided. The slider has holding, and first and second attachment sections to which a mounting head is attached. The first attachment section is provided on the holding plate, and the second attachment section is provided on the holding plate so as to be changeable between any distance which is a distance between the first and second attachment sections. Accordingly, it is possible to change the distance between attachment sections and two wide work heads may be mounted on the slider. In a case in which the types of the two work heads are not to be changed, it is possible to change the spacing between the two work heads. By changing the spacing between the two work heads, interference between the work heads may be prevented. | 06-09-2016 |
| 20160174426 | ELECTRONIC COMPONENT MOUNTING SYSTEM | 06-16-2016 |
| 20160183419 | ELECTRONIC APPARATUS ASSEMBLY MACHINE AND SIMILAR ASSEMBLY MACHINE | 06-23-2016 |
| 20160192552 | ELECTRONIC COMPONENT MOUNTING MACHINE AND TRANSFER CONFIRMATION METHOD - In an electronic component mounting machine which mounts electronic components, to an electrode of which a viscous fluid is transferred, on a circuit board, a height of the electrode before transferring the viscous fluid (dotted line) and the height of the electrode after transferring the viscous fluid (solid line) are detected by a height sensor. The transferring of the viscous fluid to the electrode is confirmed by comparing the height of the electrode before the transferring of the viscous fluid and the height of the electrode after the transferring of the viscous fluid. If the difference between the height of the electrode before the transferring of the viscous fluid and the height of the electrode after the transferring of the viscous fluid is greater than or equal to a predetermined value, it is determined that the transferring of the viscous fluid to the electrode is appropriately performed. | 06-30-2016 |
| 20160192553 | MOUNTING MACHINE AND COMPONENT DETECTION METHOD - A mounting machine which mounts one or more components on a substrate includes: a mounting head which has a fiducial mark, holds the component, and moves the component onto the substrate; an imaging section which images the mounting head; setting means for setting, out of image data of the fiducial mark and component held by the moving mounting head captured by the imaging section, a processing region containing the component, based on the position of the fiducial mark; and detection means for detecting a state of the component which is held by the mounting head by processing the image data of the set processing region. | 06-30-2016 |
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| 20160381844 | APPARATUS AND METHOD FOR THE MANUFACTURING OF PRINTED WIRING BOARDS AND COMPONENT ATTACHMENT - An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non- conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data. | 12-29-2016 |
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