| Entries |
| Document | Title | Date |
|---|
| 20080196226 | TRANSFER MASK IN MICRO BALL MOUNTER - The objective of this invention is to provide a transfer mask that is able to accurately pass micro-balls onto terminal areas on a substrate. A thin plate transfer mask | 08-21-2008 |
| 20080235926 | SUBSTRATE PROCESSING APPARATUS FOR PROCESSING PLURALITY OF SUBSTRATES IN SUCCESSION - An indexer robot includes two transport arms. The indexer robot simultaneously transports two unprocessed substrates from a cassette to a substrate transfer part in such a manner that each of the two transport arms holds a single unprocessed substrate. Also, the indexer robot simultaneously receives two processed substrates from the substrate transfer part and simultaneously transports the two processed substrate to a cassette in such a manner that each of the two transport arms holds a single processed substrate. The provision of three sending substrate rest parts and three returning substrate rest parts in the substrate transfer part enables the indexer robot to smoothly accomplish the simultaneous two-substrate transport, thereby reducing the time required for the transport of substrates in an entire substrate processing apparatus. | 10-02-2008 |
| 20080250619 | Vertical type semiconductor device producing apparatus - A semiconductor device is produced by providing a reaction chamber with a substrate and sequentially repeating steps of: supplying a first kind of gas into the reaction chamber, exhausting the first kind of gas from the reaction chamber, supplying a second kind of gas into the reaction chamber, and exhausting the second kind of gas from the reaction chamber to process the substrate disposed in the reaction chamber. The first kind of gas is pre-reserved in an intermediate portion of a supply path through which the first kind of gas flows, and is supplied into the reaction chamber with exhaust of the reaction chamber being substantially stopped. | 10-16-2008 |
| 20090056092 | METHOD OF FORMING ISOLATION LAYER IN SEMICONDUCTOR DEVICE - A method of forming an isolation layer in a semiconductor device is disclosed, by which breakdown voltage and PN junction leakage characteristics of the isolation layer are enhanced. Embodiments include depositing a pad nitride layer over a semiconductor substrate, reducing the thickness of the pad nitride layer by etching a portion of the pad nitride layer, forming a tetraethyl orthosilicate (TEOS) oxide layer over the remaining pad nitride layer, forming a trench by selectively removing the tetraethyl orthosilicate oxide layer and the pad nitride layer over an isolation area of the semiconductor substrate, depositing an high density plasma oxide layer over the substrate to fill the trench, and forming an isolation layer by planarizing the high density plasma oxide layer and the tetraethyl orthosilicate oxide layer. | 03-05-2009 |
| 20090106959 | Group III nitride semiconductor manufacturing system - The invention provides a group III nitride semiconductor manufacturing system which is free from interruption to rotation of a rotational shaft. The group III nitride semiconductor manufacturing system has a reacting vessel having an opening, a crucible disposed in an interior of the reaction vessel and containing a melt including at least a group III metal and an alkali metal, a holding unit supporting the crucible and having a rotational shaft extending from the interior of the reaction vessel to an exterior of the reaction vessel through the opening, a rotational shaft cover covering a part of the rotational shaft positioned at the exterior of the reacting vessel and connected to the reacting vessel at the opening, a rotational driving unit disposed at an outside of the reacting vessel and regulating the rotational shaft and a supply pipe connected to the rotational shaft cover and supplying a gas including at least nitrogen into a gap between the rotational shaft and the rotational shaft cover, wherein the gas and the melt react to grow a group III nitride semiconductor crystal. | 04-30-2009 |
| 20090113684 | Uniformly Compressed Process Chamber Gate Seal for Semiconductor Processing Chamber - Techniques for a door system for sealing an opening between two chambers in a semiconductor processing system are described. The opening has at least one angled corner. The door system includes a door, actuator, and sealing member. The door is moveable in the plane and has at least one angled corner to align the door with the opening. The actuator moves the door to selectively open and close the opening. The sealing member seals the opening when the door is in a closed position. The door is sized to apply substantially uniform seal compression to the sealing member when in the closed position. | 05-07-2009 |
| 20090158564 | ELECTRONIC COMPONENT MANUFACTURING APPARATUS - To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers. | 06-25-2009 |
| 20090211071 | METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CONNECTION ON A SOLAR CELL - Embodiments of the present invention provide a module and process for forming electrical connections on a solar cell substrate in a solar cell production line. The module generally provides a substrate handling system, a substrate positioning system, a cross-buss attachment assembly, and a side-buss attachment assembly. The module may provide adaptations for automatically adjusting the module to receive and process various sizes of solar cell substrates. | 08-27-2009 |
| 20090241310 | RLSA CVD DEPOSITION CONTROL USING HALOGEN GAS FOR HYDROGEN SCAVENGING - Film thickness uniformity and stoichiometry are controlled and deposition rate is increased in the chemical vapor deposition (CVD) of silicon nitride from complex gas mixtures in microwave plasmas. In Si | 10-01-2009 |
| 20090313797 | Mounting apparatus and method for accurately positioning and aligning a leadless semiconductor chip on an associated header - There is disclosed a method and apparatus for mounting a leadless semiconductor chip on a header. The semiconductor chip has contacts on a surface and the chip is of a specified geometric shape. The header has a contact surface for receiving the chip with the contact surface of the header containing header contact pins, which pins have to contact the contacts on the semiconductor chip. The header has a guide pin extending from the contact surface and there is a guide plate which has an aperture adapted to be placed over the guide pin, the guide plate further has a chip accommodating aperture of the same geometric shape as the chip. The guide plate, when placed over the guide pin enables the chip to be placed in the chip accommodating aperture so that the contacts of the header pin are properly and accurately aligned with respect to the contacts on the semiconductor chip. | 12-24-2009 |
| 20100071178 | Method for Manufacturing Semiconductor Device - To reduce current consumption in a frequency-division circuit, particularly in a multistage frequency-division circuit, in a multistage frequency-division circuit, an inputted signal has a higher frequency in a preceding stage, and an inputted signal has a lower frequency in a following stage. Thus, placement is performed preferentially from the basic cell corresponding to the frequency-division circuit into which a signal having a higher frequency is inputted, and then wiring connection is performed. In other words, the layout of a plurality of basic cells corresponding to a multistage frequency-division circuit is performed so that, as compared to a wiring into which a signal having a lower frequency is inputted, a wiring into which a signal having a higher frequency is inputted has a shorter wiring length and has less intersection with other wirings, so that parasitic capacitance and parasitic resistance of the wiring are reduced. | 03-25-2010 |
| 20100223767 | APPARATUS FOR ALIGNING AN OPTICAL DEVICE AN OBJECT, AN OPTICAL INSTRUMENT AND A SEMICONDUCTOR PROCESS SYSTEM - The present invention relates to an apparatus ( | 09-09-2010 |
| 20100236035 | SYSTEM AND METHOD FOR DETECTING DEFECTS IN A SOLAR CELL AND REPAIRING AND CHARACTERIZING A SOLAR CELL - A system and method for detecting a defect in a solar cell and repairing and characterizing a solar cell includes applying a test signal to the solar cell, monitoring the response of solar cell, detecting a defect associated with its location during the monitoring step, removing or isolating the defect from a solar cell and characterizing solar cell performance. The defect may be a short between the emitter and the base of solar cell. The system and method also detect a precise location of the defect based on the use of light valve panel (LVP), which can control the input beam to or output beam from the solar cell in terms of size, position, gray level, and wavelength of the transmitted light. The LVP may be realized in any one of a variety of ways. For example, the active matrix liquid crystal display (AMLCD) such as Thin Film Transistor driven LCD (TFT-LCD) may be used as the LVP. | 09-23-2010 |
| 20100313397 | APPARATUS FOR MANUFACTURING POLYCRYSTALLINE SILICON THIN FILM - Provided is an apparatus for manufacturing a polysilicon thin film by depositing an amorphous silicon thin film and an upper silicon dioxide substrate on a lower silicon dioxide substrate, forming a conductive thin film on the upper silicon dioxide substrate, and applying an electric field and performing Joule heating to crystallize the amorphous silicon thin film, the apparatus comprising power terminals for elastically contacting both upper ends of the conductive thin film and supplying power to the conductive thin film, and support members for elastically supporting the substrate such that the power terminals closely contact both upper ends of the conductive thin film to form a uniform electric field at the conductive thin film. Therefore, it is possible to apply an electric field to a conductive thin film and perform Joule heating to crystallize an amorphous silicon thin film, and support members are installed at both lower surfaces of a silicon dioxide substrate to elastically support the silicon dioxide substrate such that power terminals closely contact both upper ends of the conductive thin film, thereby forming a uniform electric field at the conductive thin film to efficiently perform crystallization within a short time. | 12-16-2010 |
| 20110094074 | Pick-and-place device for ICs - A pick-and-place device for ICs according to the present invention comprises a base, a plurality of rotational structures, a plurality of pick-and-place structures, a transmission structure, and a driving structure. The pick-and-place structures are mounted on the base, and individually have one nozzle. The nozzles can move up-and-down respectively. The rotational structures are mounted on the base, and drive the nozzles to rotate. The transmission structure is assembled with the rotational structures, and drives the rotational structures to rotate. The driving structure is mounted on the base. The driving structure drives the transmission structure. The transmission structure further drives the rotational structures to rotate so that the nozzles are rotated. The nozzles are rotated driven by the rotational structures, ICs can be rotated following up the rotation of the nozzles during the pick-and-place process. Therefore, an advantage of the present invention is to enhance the convenience during the pick-and-place process. | 04-28-2011 |
| 20110203082 | Press apparatus and method for manufacturing semiconductor device - A press apparatus includes a bolster, a lower die holder that is mounted on the bolster to which a lower die (for example, die plate and die) is to be provided, a guide post that is vertically provided in the lower die holder, a guide bush that slides along the guide post, an upper die holder that is fixed to the guide bush to which an upper die (for example, punch plate and punch) is to be provided, and a heat transfer accelerating portion that contacts the guide post and the bolster and accelerates the transfer of heat from the guide post to the bolster. | 08-25-2011 |
| 20110232054 | Semiconductor device manufacturing method, semiconductor device manufacturing equipment, and computer readable medium - A semiconductor device manufacturing equipment includes a plurality of heat treatment plates for performing a post-exposure bake (PEB), a first storage section for storing a first relation, said first relation being an association relation between post-development resist pattern dimensions and a preset temperature during the PEB, a second storage section for storing a second relation, the second relation being an association relation between post-etching pattern dimensions and the preset temperature during the PEB, a primary correction section for obtaining post-development resist pattern dimension data for each of a plurality of first substrates processed separately by the plurality of heat treatment plates, and for primarily correcting the preset temperature for each of the plurality of heat treatment plates based on the first relation; and a secondary correction section for obtaining post-etching pattern dimension data for each of a plurality of second substrates. | 09-29-2011 |
| 20110239421 | LASER BEAM POSITIONING SYSTEM - A method and apparatus for targeting a beam of radiation is provided. A beam steering mirror and a beam capture mirror are movably disposed along an optical pathway. A controller moves the beam steering mirror and the beam capture mirror in an x-y plane, and rotates the mirrors, to target the beam to a target location on a surface, while keeping the optical path length substantially constant for all target locations on the surface. The surface is rotated by a rotational actuator to bring all target locations to positions accessible by the beam targeting optics. Imprecision in targeting and optical path length may be compensated by providing an actuated aperture at the beam entry point and/or a variable focus lens with an optical range finding detector, all in communication with the controller. | 10-06-2011 |
| 20120110806 | DEVICE FOR ANALYZING SIZE AND LOCATION OF CONDUCTIVE ITEM - A matrix analyzer for determining the size and location of a conductive item placed thereon. The matrix analyzer includes plural row conductors and column conductors with a corresponding grid of conductive areas exposed on the surface of the matrix analyzer. When a conductive item, such as an ink droplet, is jetted onto the matrix analyzer, the intersection of various row conductors and column conductors exhibit a low resistance. The rows and columns of the matrix analyzer can be sequentially accessed to find those intersections where the low resistance exists. From such data, the size and location of the ink droplets can be determined. | 05-10-2012 |
| 20120131776 | DESIGN STRUCTURE, STRUCTURE AND METHOD FOR PROVIDING AN ON-CHIP VARIABLE DELAY TRANSMISSION LINE WITH FIXED CHARACTERISTIC IMPEDANCE - A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance. | 05-31-2012 |
| 20120144634 | METAL OXIDE VARISTOR DESIGN AND ASSEMBLY - Spacing of metal oxide varistors (“MOVs”) when used for surge suppression or surge protection will determine the number that can be used and the amount of protection achieved in a limited space. By changing the way the leads are attached to the metal oxide varistors (“MOVs”), tighter spacing, higher densities, and more surge suppression and protection can be placed in the same sized location. Leads are attached to metal oxide varistors (“MOVs”) to allow the metal oxide varistors (“MOVs”) to be placed side by side without the lead of one metal oxide varistor (“MOV”) interfering with the lead of a different metal oxide varistor (“MOV”) | 06-14-2012 |
| 20120174359 | SEMICONDUCTOR DEVICE HAVING FUNCTION OF IMPROVED ELECTROSTATIC DISCHARGE PROTECTION - A semiconductor device includes a diode region having a plurality of protection diodes and a pad region overlapped with an upper part of the diode region. The pad region having a pad installed corresponding to an external connection terminal. The semiconductor device further includes a contact plug unit which connects at least one of a plurality of active regions constituting the diode region and the pad within the diode region. | 07-12-2012 |
| 20120186052 | System and Method for Producing Devices Including a Semiconductor Part and a Non-Semiconductor Part - A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end. | 07-26-2012 |
| 20120192392 | Compression Clamping of Semiconductor Components - The present invention relates to a method of clamping a semiconductor assembly with a desired compression force equally distributed across the opposing surfaces of the devices and associated components of the semiconductor assembly. | 08-02-2012 |
| 20120227229 | Surface Mount Multi-Layer Electrical Circuit Protection Device with Active Element Between PPTC Layers - A surface-mountable electrical circuit protection device includes layers defining a first PPTC resistive element, a second PPTC resistive element, and at least one heat-generating electrical component such as a planar zener diode chip positioned between, and in thermal contact with, the first and second PPTC elements, such that an electrical current above a threshold level passing through the component causes the component to heat, the heat being transferred to the PPTC resistive elements and tripping at least one, and preferably both of the first or second PPTC elements to a high resistance state. A series of edge-formed terminal electrodes enable surface-mount connection of the first and second PPTC elements and the electrical component to an electrical circuit substrate, such as a printed circuit board. A method for making the device is also disclosed. | 09-13-2012 |
| 20120260477 | Method of Manufacturing an Electrostatic Protection Device - One embodiment of an electrostatic protection diode in an integrated circuit includes a base area having at least two bends therein. | 10-18-2012 |
| 20120266425 | THERMAL PROCESSING SYSTEM AND METHOD OF USING - Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers. | 10-25-2012 |
| 20120284977 | System and Method for Producing Devices Including a Semiconductor Part and a Non-Semiconductor Part - A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end. | 11-15-2012 |
| 20130014360 | STAGE APPARATUS AND PROCESS APPARATUSAANM INANAMI; RyoichiAACI Yokohama-shiAACO JPAAGP INANAMI; Ryoichi Yokohama-shi JPAANM ITO; ShinichiAACI Yokohama-shiAACO JPAAGP ITO; Shinichi Yokohama-shi JPAANM KOIZUMI; HiroshiAACI Hiratsuka-shiAACO JPAAGP KOIZUMI; Hiroshi Hiratsuka-shi JPAANM KOJIMA; AkihiroAACI Yokohama-shiAACO JPAAGP KOJIMA; Akihiro Yokohama-shi JP - According to one embodiment, a stage apparatus includes a height control unit includes height control elements each which is drove in an upward/downward direction independently, a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas. The control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in a allowable range, and set the height of the area out of the allowable range again by the height control elements. | 01-17-2013 |
| 20130145587 | VERTICALLY RETRACTABLE FLOW CELL SYSTEM - A system for combinatorial processing is provided. The system includes a plurality of reactor cells. Each of the plurality of reactor cells includes a vertical recess extending along a length of the outer surface of the plurality of reactor cells. The vertical recess is operable to receive a vertical rail. The system also includes a plurality of horizontal rails extending between rows of the plurality of reactor cells. Each of the plurality of horizontal rails has a member slidably mounted thereon. The member is coupled to the vertical rail thereby enabling independent horizontal and vertical movement for each of the plurality of reactor cells. | 06-13-2013 |
| 20130145588 | WOVEN MESH SUBSTRATE WITH SEMICONDUCTOR ELEMENTS, AND METHOD AND DEVICE FOR MANUFACTURING THE SAME - A woven mesh substrate with semiconductor elements and a method and a device for manufacturing such a substrate, and more particularly a technique that makes it possible to exploit a woven mesh substrate with semiconductor elements in which a plurality of spherical semiconductor elements having a light receiving function or a light-emitting function are installed on a woven mesh substrate in net form that is made up from a plurality of vertical strands that are insulating and a plurality of horizontal strands that are conductive. | 06-13-2013 |
| 20130152349 | Method for Making a Nano-Composite Gas Sensor - There is disclosed a method for making a nano-composite gas sensor. At first, there is provided a substrate. Then, electrodes are provided on the substrate in an array. Finally, a gas-sensing membrane is provided on the electrodes. The gas-sensing membrane includes a nano-conductive film and a peptide film. | 06-20-2013 |
| 20130160260 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device and method for processing wafer-shaped articles comprises a process chamber and a rotary chuck located within the process chamber. The rotary chuck is adapted to be driven without physical contact through a magnetic bearing. The rotary chuck comprises a series of gripping pins adapted to hold a wafer shaped article in a position depending downwardly from the rotary chuck. The rotary chuck further comprises a plate that rotates together with the rotary chuck. The plate is positioned above an area occupied by the wafer-shaped article, and shields upper surfaces of the process chamber from liquids flung off of a wafer-shaped article during use of the rotary chuck. | 06-27-2013 |
| 20130160261 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER - The present invention provides an apparatus for manufacturing semiconductor wafer comprising at least two manipulators, at least one set of chemical gas/liquid distribution unit and an air circulating and filtering unit. The air circulating and filtering unit is separated into three regions, including the front region, the middle region, and the side region, which are controlled by respective control electric motors to achieve uniform air flow and uniform pressure in the respective regions. The cleaning degree in the internal of the apparatus can be improved by the regional control of the air circulating and filtering unit; the wafer transport efficiency can be enhanced by the double-armed manipulators having multiple degrees of freedom; and the product yield per unit area can be increased by the chemical gas/liquid distribution unit providing stable and uniform gas/liquid flow and pressure. | 06-27-2013 |
| 20130167338 | Electrical Device, System and Method for Operating with Reduced Acoustic Noise Generation - Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device. | 07-04-2013 |
| 20130167339 | DEVICE MANUFACTURING APPARATUS AND METHOD FOR THE SAME - A device manufacturing method and a device manufacturing apparatus in a single wafer processing system with wafers in 0.5 inch size. A large number of sealed-type unit process apparatuses are arranged to form a manufacturing line. The unit process apparatus is portable and processes a single process in the manufacturing process. When the number of a unit of manufacturing is more than the number of the unit process apparatuses, the unit process apparatuses are arranged as a flow shop system, corresponding to the order of processes for the device. When the number of the units is nearly equal to the number of processes, the apparatuses are arranged as a class shop system for classified arrangement at every major division of orders of processes. When the number of the units is far less than the number of processes, the apparatuses are arranged as a multicell shop system. | 07-04-2013 |
| 20130247342 | CAPPING SYSTEM - A capping system includes: a moving portion moving a stem, on which an optical semiconductor element is mounted, horizontally; a fixer fixing a cap having a window, on the stem; a camera taking an image of the cap and the stem from above the cap and the stem; a detector detecting whether the optical semiconductor element is present within a visual field of the camera; and a searching action controller controlling the moving portion to move the stem so the detector searches the optical semiconductor element. The searching action controller causes searching radially and outwardly from a search starting point. | 09-26-2013 |
| 20130283579 | ASSEMBLY DEVICE FOR SEMICONDUCTORS - An exemplary assembly device includes a first loading plate, a movable pole, a driving element, a first camera module, a transparent fetching element, a first processor, a first adjusting element, and a controller. The first loading plate loads a first workpiece. The movable pole is positioned above the first loading plate. The driving element drives the movable pole. The first camera module is positioned on the movable pole, and captures an image of the first workpiece to obtain a first pre-compared image. The fetching element is positioned on the movable pole. The first processor determines whether the first workpiece deviates from a standard position through comparing the first pre-compared image with a first standard image. The first adjusting element adjusts the first workpiece to the standard position. The controller controls the fetching element and the driving element cooperatively to assemble the first workpiece to a second workpiece. | 10-31-2013 |
| 20130333174 | TRANSPORT SYSTEM - A semiconductor workpiece processing system including at least one substrate processing tool that has a common housing with a first side having a first substrate holding container interface and a second side having a second substrate holding container interface having a different orientation than the first substrate holding container interface, a first transport section disposed corresponding to the first side of the tool, a second transport section being separate and distinct from the first transport section and interfacing with the first transport section and being configured to transport the substrate holding container between the first transport section and the tool and between the first side and the second side of the tool, the second transport section including at least one overhead gantry disposed above the tool, where the second transfer section is capable of interfacing with at least the second substrate holding container interface. | 12-19-2013 |
| 20140013556 | Method and Apparatus for a Cleanspace Fabricator - A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a non-segmented cleanspace or have its tools vertically stacked. | 01-16-2014 |
| 20140041173 | TRANSFORMER WITH BYPASS CAPACITOR - An electronic device comprises first, second and third inductors connected in series and formed in a metal layer over a semiconductor substrate. The first and second inductors have a mutual inductance with each other. The second and third inductors having a mutual inductance with each other. A first capacitor has a first electrode connected to a first node. The first node is conductively coupled between the first and second inductors. A second capacitor has a second electrode connected to a second node. The second node is conductively coupled between the second and third inductors. | 02-13-2014 |
| 20140053382 | Methods and apparatus for separating a substrate - This invention relates to slicing a thin semiconductor substrate from side wall into two substrates of half thickness. The substrate slicing process involves a laser irradiation step. The apparatus for substrate slicing comprises two opposite-facing substrate chucks, with a gap in between for the substrate to pass through. | 02-27-2014 |
| 20140082906 | WELDED BELLOWS FOR SEMICONDUCTOR MANUFACTURING DEVICE - An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate. | 03-27-2014 |
| 20140189989 | METHODS OF PROTOTYPING AND MANUFACTURING WITH CLEANSPACE FABRICATORS - The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. | 07-10-2014 |
| 20140208554 | SEMICONDUCTOR DEVICE AND CONTROL METHOD OF THE SAME - The present invention provides a semiconductor memory and a control method therefor, the semiconductor device including a first current-voltage conversion circuit connected to a core cell provided in a nonvolatile memory cell array, a second current-voltage conversion circuit connected to a reference cell through a reference cell data line, a sense amplifier sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened. | 07-31-2014 |
| 20140317896 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MOUNTING JIG - A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig. | 10-30-2014 |
| 20140331462 | Packaging Process Tools and Packaging Methods for Semiconductor Devices - Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | 11-13-2014 |
| 20150101161 | OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING OPTICAL MODULE - An optical semiconductor device includes: a resonator end face; an optical waveguide; a window structure located between the resonator end face and the optical waveguide; and a vernier on the window structure and allowing measurement of length of the window structure along an optical axis direction. | 04-16-2015 |
| 20150143677 | SEMICONDUCTOR PROCESSING APPARATUS WITH A CERAMIC-COMPRISING SURFACE WHICH EXHIBITS FRACTURE TOUGHNESS AND HALOGEN PLASMA RESISTANCE - A solid solution-comprising ceramic article useful in semiconductor processing, which article may be in the form of a solid, bulk ceramic, or may be in the form of a substrate having a ceramic coating of the same composition as the bulk ceramic material on at least one outer surface. The ceramic article is resistant to erosion by halogen-containing plasmas and provides advantageous mechanical properties. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide and zirconium oxide. The ceramic-comprising article includes ceramic which is formed from zirconium oxide at a molar concentration ranging from about 96 mole % to about 91 mole %, and yttrium oxide at a molar concentration ranging from about 4 mole % to about 9 mole %. | 05-28-2015 |
| 20150143678 | Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method - The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit. | 05-28-2015 |
| 20150348807 | ELECTRODE LAYER BENDING DEVICE FOR SENSING DEVICE - An electrode layer bending device for a sensing device is provided. The electrode layer bending device includes an accommodation part, a pushing part, and a pressing part. The sensing part is accommodated within the accommodation part. The sensing device includes a first electrode layer and a second electrode layer. The second electrode layer has a wiring part. When the pushing part is driven to push the wiring part of the sensing device which is accommodated within the accommodation part, the wiring part is bent. When the pressing part is driven to press the bent wiring part, the wiring part is bent again and contacted with a first surface of the first electrode layer. Consequently, the electrical connection between the first electrode layer and the second electrode layer is established. | 12-03-2015 |
| 20150357217 | WARPED SILICON-CHIP ADSORPTION DEVICE AND ADSORPTION METHOD THEREOF - An apparatus and method for adsorbing a wafer are disclosed. The apparatus includes a chuck ( | 12-10-2015 |
| 20150366078 | OVERVOLTAGE PROTECTION CIRCUIT - Universal Serial Bus (USB) protection circuits are provided. A circuit includes a plurality of first transistors connected in series between a pad and ground. The circuit also includes a plurality of second transistors connected in series between the pad and a supply voltage. The circuit further includes a control circuit that applies respective bias voltages to each one of the plurality of first transistors and to each one of the plurality of second transistors. The bias voltages are configured to: turn off the plurality of first transistors and turn off the plurality of second transistors when a pad voltage of the pad is within a nominal voltage range; sequentially turn on the plurality of first transistors when the pad voltage increases above the nominal voltage range; and sequentially turn on the plurality of second transistors when the pad voltage decreases below the nominal voltage range. | 12-17-2015 |
| 20160099285 | METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING CAMERA MODULE - Certain embodiments provide a method for manufacturing a solid-state imaging device including: forming a sensor chip fixed to a supporting substrate by a first adhesive; peeling off the sensor chip from the supporting substrate by softening the first adhesive; and fixing the peeled off sensor chip onto a curved surface of a mounting body to allow the sensor chip to be curved along the curved surface. | 04-07-2016 |
| 20160163909 | SYSTEMS AND METHODS FOR CASCADING PHOTOVOLTAIC STRUCTURES - A string-forming system is described. The string-forming system may include at least a first cell-lifting mechanism and a second cell-lifting mechanism that can automatically arrange a set of strips of a photovoltaic structure into a cascaded formation. During operation, a controller can cause the first cell-lifting mechanism to lift a first strip from a first platform, and can cause the second cell-lifting mechanism to lift, from the first platform, a second strip that may follow the first strip on the first platform. The controller may then activate a first shifting actuator of the first cell-lifting mechanism or a second shifting actuator of the second cell-lifting mechanism to place a leading edge of the second strip above a trailing edge of the first strip. | 06-09-2016 |
| 20180026620 | OVERVOLTAGE PROTECTION CIRCUIT | 01-25-2018 |
