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Patent application title: HEAT DISSIPATING DEVICE

Inventors:  A-Sheng Liu (Yunlin County, TW)
Assignees:  C.C. LATHE ENTERPRISE CO., LTD
IPC8 Class: AF28F124FI
USPC Class: 165181
Class name: Heat exchange tubular structure with discrete heat transfer means
Publication date: 2013-07-25
Patent application number: 20130186608



Abstract:

The instant disclosure relates to a heat dissipating device capable of mounting on at least one heat conducting pipe. The heat dissipating device includes a heat dissipating fin having a main body. At least one through hole is formed on the main body. At least one set of ribs is formed on the main body and around the through hole. A slot is defined between any two adjacent ribs. The through hole of the main body is for insertion of the heat conducting pipe in allowing the ribs to grip resiliently against the heat conducting pipe. Thus, the heat dissipating device of the instant disclosure enables multiple heat dissipating fins to be stacked on the heat conducting pipe in one run. In saving assembly time, the heat dissipating fins need not be mounted on the heat conducting pipe one piece after another.

Claims:

1. A heat dissipating device, for mounting on at least one heat conducting pipe having a contacting portion abutting a heat generating unit, wherein a surface of the contacting portion in abutment with the heat generating unit is substantially a flat surface, comprising: a heat dissipating fin, comprising: a main body having at least one through hole formed thereon; at least a set of ribs vertically formed on the main body and around the through hole, wherein a slot is defined between every two adjacent ribs; a stacking portion defined by at least one rectangular-shaped via hole formed on the main body and a ridge vertically formed adjacent to the via hole; wherein the through hole of the heat dissipating fin is for insertion of the heat conducting pipe and allow the ribs to grip resiliently therewith.

2. The heat dissipating device according to claim 1, wherein multiple through holes are formed on the main body in correspondence to the equal number of heat conducting pipes, and wherein the heat conducting pipes are arranged in parallel and penetrate the through holes.

3. The heat dissipating device according to claim 1, wherein the heat dissipating fin has a bent portion defined by a plurality of tabs arranged on the periphery of the main body.

4. The heat dissipating device according to claim 1, wherein the heat dissipating fin has at least one engaging member, wherein the engaging member has an engaging body in defining an engaging slot, and wherein the engaging body is formed by stamping and kinking of the main body.

5. The heat dissipating device according to claim 1, further comprising a base and a cover plate, wherein the base has a supporting portion and a fastening portion, wherein an opening is defined on the supporting portion, while the fastening portion is extended from the supporting portion, wherein the cover plate has a restricting portion for mounting to the fastening portion, and wherein the contacting portion of the heat conducting pipe is arranged between the base and the cover plate.

6. The heat dissipating device according to claim 5, wherein the supporting portion includes at least one ramp arranged adjoining the opening and in the axial direction of the contacting portion of the heat conducting pipe.

7. The heat dissipating device according to claim 6, wherein the heat conducting pipe abuts the ramp of the supporting portion.

8. The heat dissipating device according to claim 5, wherein the fastening portion of the base has at least one protrusion, and the restricting portion of the cover plate is defined by at least one restricting notch, wherein the protrusion of the base is engaged to the restricting notch of the cover plate.

9. The heat dissipating device according to claim 8, wherein the restricting notch is formed concavely on the periphery of the cover plate.

10. The heat dissipating device according to claim 5, wherein the contacting portions of multiple heat conducting pipes are arranged in parallel in the opening of the supporting portion and abutting the sidewalls of the opening.

11. A heat dissipating device, for mounting on at least one heat conducting pipe having a contacting portion abutting a heat generating unit, wherein a surface of the contacting portion in abutment with the heat generating unit is substantially a flat surface, comprising: a set of heat dissipating fins including a plurality of stacked heat dissipating fins, wherein each heat dissipating fin has: a main body having at least one through hole formed thereon; at least a set of ribs vertically formed on the main body and around the through hole, wherein a slot is defined between every two adjacent ribs; a stacking portion defined by at least one rectangular-shaped via hole formed on the main body and a ridge formed on the main body adjacent to the via hole; wherein the heat dissipating fins are parallelly mounted on the heat conducting pipe by the respective through holes, with the ribs of the heat dissipating fins griping resiliently on the heat conducting pipe, wherein the stacking portions between adjacent heat dissipating fins abut against one another.

12. The heat dissipating device according to claim 11, wherein each of the heat dissipating fins has a bent portion defined by a plurality of extensions formed on the periphery of the main body, and wherein the bent portions between adjacent heat dissipating fins abut against one another.

13. The heat dissipating device according to claim 11, wherein each of the heat dissipating fins has at least one engaging member, wherein the engaging member has an engaging body in defining an engaging slot, and wherein the engaging body is formed by stamping and kinking of the main body.

14. The heat dissipating device according to claim 13, wherein for the stacked heat dissipating fin, the engaging slot of each heat dissipating fin is engaged by the engaging body of the adjacent heat dissipating fin.

15. The heat dissipating device according to claim 11, further comprising a base and a cover plate, wherein the base has a supporting portion and a fastening portion, wherein an opening is defined on the supporting portion, and the fastening portion is extended from the supporting portion, wherein the cover plate has a restricting portion for mounting to the fastening portion, and wherein the contacting portion of the heat conducting pipe is arranged between the base and cover plate.

16. The heat dissipating device according to claim 15, wherein the supporting portion has at least one ramp arranged adjoining the opening and in the axial direction of the contacting portion of the heat conducting pipe, and wherein the heat conducting pipe abuts the ramp.

17. The heat dissipating device according to claim 15, wherein the cover plate is fixed to the base.

18. The heat dissipating device according to claim 17, wherein the fastening portion of the base includes at least one protrusion and the restricting portion of the cover plate is defined by at least one restricting notch for engaging the protrusion.

19. The heat dissipating device according to claim 18, wherein the restricting notch is formed concavely on the periphery of the cover plate.

20. The heat dissipating device according to claim 15, wherein the contacting portions of multiple heat conducting pipes are arranged in parallel in the opening and abut the sidewalls of the opening.

Description:

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The instant disclosure relates to a heat dissipating device; in particular, to a heat dissipating device which is mountable on a heat conducting pipe and works cooperatively therewith for heat dissipation.

[0003] 2. Description of Related Art

[0004] Along with the enhanced living standard, people are becoming more fastidious about their life quality. Particularly, to the demands of better quality electronic devices and mechanical products are increasing rapidly. Owing to the advanced electrical appliances and technological products, people are leading a more convenient lifestyle with significant changes to their working efficiency. However, this has also brought about the issue of researching a stronger power supply and products with higher energy-conserving capabilities which are in desperate need of resolutions. Generally, the use of electrical power often generates lots of heat during normal operation. If not properly removed, such heat can adversely affect the operational stability of the electrical appliances, resulting in malfunction or damages to the mechanical products. Therefore, most of the present electrical appliances are equipped with heat dissipating devices to remove heat therefrom.

[0005] Generally, the types of heat dissipating devices are many having varying structural designs and providing identical or great diversity of functional capabilities. And conventional heat dissipating fins have at least one through hole defined therein, where the heat dissipating fins are mounted on the heat conducting pipes one piece after another. However, the repeating procedure of mounting the heat dissipating fins may cause deformation to the through holes. Thereby, resulting in unstable mounting of the heat dissipating fins to the heat conducting pipes which further reduces the heat dissipating efficiency.

[0006] To address the above issues, the inventor strives via industrial experience and academic research to present the instant disclosure, which can effectively improve the limitations described above.

SUMMARY OF THE INVENTION

[0007] The object of the instant disclosure is to provide a heat dissipating device where the structural design of the heat dissipating fins of the heat dissipating device can avoid deformation of the through holes when the heat dissipating fins are mounted on the heat conducting pipes. Furthermore, the concurrent mounting of the heat dissipating fins on the heat conducting pipes can also reduce time consumption to further facilitate the mounting procedure.

[0008] A heat dissipating device is provided to mount on at least one heat conducting pipe which has a contacting portion that abuts against a heat generating unit. And the surface of the contacting portion in abutment with the heat generating unit is substantially a flat surface. The heat dissipating device includes a heat dissipating fin which has a main body, where at least one through hole is defined on the main body. At least a set of ribs is vertically formed on the main body in a trumpet-like structure around the through hole, where a slot is defined between every two adjacent ribs. The heat dissipating fin further has a stacking portion defined by at least one rectangular via hole formed on the base and at least one ridge formed adjacently to via hole. At least one heat conducting pipe is inserted into the through hole of the heat dissipating fin with the ribs gripping resiliently against the pipe.

[0009] A heat dissipating device is further provided to mount on at least one heat conducting pipe which has a contacting portion that abuts against a heat generating unit. And the surface of the contacting portion in abutment with the heat generating unit is substantially a flat surface. The heat dissipating device includes a plurality of stacked heat dissipating fins. Each of the heat dissipating fins has a main body, where at least one through hole is defined on the main body. At least a set of ribs is vertically formed on the main body in a trumpet-like structure around the through hole, where a slot is defined between every two adjacent ribs. The heat dissipating fin further has a stacking portion defined by at least one rectangular via hole formed on the main body and at least one ridge formed adjacently to the via hole. Notably, the heat dissipating fins are arranged in parallel to each other and at least one heat conducting pipe is inserted into the through holes of the heat dissipating fins with the ribs gripping resiliently against the pipe. The stacking portion of each of the heat dissipating fins abuts against the stacking portion of the adjacent heat dissipating fin.

[0010] Based on the above, the instant disclosure has the following advantages:

[0011] The heat dissipating fins of the instant disclosure can be attached to and stacked along the heat conducting pipes through a single process which reduces a vast amount of time and cost spend in the stacking procedure. The heat dissipating fins are also prevented from bending or even deforming during the process. A distance is kept between every two adjacent heat dissipating fins during stacking to dissipate heat. The stacking portions of the heat dissipating fins in the instant disclosure help to provide structural stability for the heat dissipating fins when stacked and reduce the material cost.

[0012] In order to further appreciate the characteristics and technical contents of the instant disclosure, references are hereunder made to the detailed descriptions and appended drawings in connection with the instant disclosure. However, the appended drawings are merely shown for exemplary purposes, rather than being used to restrict the scope of the instant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG. 1 shows a perspective view of a heat dissipating device for an embodiment according to the instant disclosure.

[0014] FIG. 2 shows a perspective view of a heat dissipating device for another embodiment according to the instant disclosure.

[0015] FIG. 3 shows an assembled view of the heat dissipating device of the instant disclosure mounted to the heat conducting pipes.

[0016] FIG. 4 shows another assembled view of the heat dissipating device of the instant disclosure in FIG. 3.

[0017] FIGS. 5-7 show the assembling steps of the base and the cover plate to the heat conducting pipes.

[0018] FIG. 8 shows a partially amplified view of the heat dissipating device according to the instant disclosure;

[0019] FIG. 9 shows a perspective view of yet another heat dissipating device according to the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The First Embodiment

[0020] Please refer to FIGS. 1-8. A heat dissipating device is provided by the instant disclosure. For in use, the heat dissipating device of the instant disclosure dissipates heat produced from a heat generating unit 5, where the heat generating unit 5 may be, but not limited to, a central processing unit (CPU) or other electronic devices, etc. Furthermore, the heat dissipating device is adaptable with three heat conducting pipes 3, where each of the heat conducting pipes 3 has a contacting portion 31.

[0021] Referring to FIG. 1, the heat dissipating device includes a plurality a heat dissipating fins 4 stacked on top of each other. Each of the heat dissipating fins 4 has a sheet-like shape and a main body 41, three through holes 42 formed on the main body 41, three sets of ribs 43 vertically formed on the main body 41 each forming a trumpet-like structure, a stacking portion 44 formed on the main body 1, and a bent portion 45 formed on the main body 1. For the instant embodiment, the number of through holes 42 on the main body 41 is equal to the number of heat conducting pipes 3. In other words, the quantity of each of these respective components is three. An enlarged view to illustrate the structural features of the heat dissipating fin 4 is shown in FIG. 2.

[0022] Please refer to FIGS. 3-4. The through holes 42 allow the heat conducting pipes 3 to slide through the heat dissipating fins 4. And the ribs 43 are vertically formed on the main body 41 around each through hole 42.

[0023] Each set of ribs 43 is defined by a plurality of slots 431. Namely, every two adjacent ribs 43 are separated by the corresponding slot 431 to increase the flexibility of each rib 43. Thereby, each set of ribs 43 is capable of pressing elastically against the respective heat conducting pipe 3. When the heat dissipating fins 4 are fitted on the heat conducting pipes 3, the flexible ribs 43 prevent the through holes 42 from deforming due to repeated disassembly and reassembly. Each of the heat dissipating fins 4 are enabled to grip tightly against the heat conducting pipes 3 to increase the heat dissipating efficiency.

[0024] For the instant embodiment, the stacking portion 44 is defined by six rectangular via holes 441 and six ribs 442 formed respectively in an adjacent manner on the main body 41. However, the structural design of the stacking portion 44 is not restricted thereto. For the instant embodiment, two via holes 441 are formed around each through hole 42 oppositely, and the ribs 442 are formed bendingly adjacent to respective via holes 441 in a vertically protruding manner on the main body 41.

[0025] Thereby, the ribs 442 of the stacking portion 44 of each of the heat dissipating fins 4 abut against the ribs 442 of the adjacent heat dissipating fins 4. Thus, a spacing is formed between any two adjacent heat dissipating fins 4.

[0026] The bent portion 45 is defined by four tabs 451 arranged on the periphery of the main body 41. For the instant embodiment, four tabs 451 for provided. The bent portion 45 is formed by bending the protrusions (not shown) formed on the periphery of the main body 41 in a right angled manner. Thereby, the bent portion 45 of one of the heat conducting fin 4 will abut against the bent portion 45 of the adjacent heat conducting fin 4, where the physical nature of the bent portion 45 is not restricted.

[0027] Please refer to FIGS. 5-7. The heat dissipating device may further include a base 1 and a cover plate 2, where both components can be made of metallic materials. The base 1 has a supporting portion 11 and a fastening portion 12. The supporting portion 11 is a plate-like structure having an opening 112 formed thereon, while the fastening portion 12 is formed extendingly from the supporting portion 11. Furthermore, the fastening portion 12 has, but not limited to, four protrusions 121. Two ramps 111 are formed oppositely on the supporting portion 11 adjacent to the opening 112. For the instant embodiment, there are two ramps 111. In addition, the physical nature of the base 1 is not restricted.

[0028] The cover plate 2 is a plate-like structure which corresponds to the structural design of the base 1. The cover plate 2 has a restricting portion 21 defined by four restricting notches 211 concavely formed on the periphery of the cover plate 2. For the instant embodiment, there are, but not limited to, four restricting notches 211 available. The restricting notches 211 are engaged by the protrusions 121 of the fastening portion 12 accordingly.

[0029] Please refer to FIG. 8. The contacting portions 31 of the heat conducting pipes 3 are arranged in parallel within the opening 112 of the supporting portion 11. More specifically, the contacting portions 31 abut against the sidewalls that define the opening 112 of the supporting portion 11. The surface of each contacting portion 31 touching the heat generating unit 5 is substantially a flat surface to achieve an enhanced heat dissipating effect. Furthermore, the physical nature of the heat conducting pipes 3 is not restricted.

The Second Embodiment

[0030] Please refer to FIG. 9 which shows a second embodiment of the instant disclosure. For the instant embodiment, at least one engaging member 46 is provided on each heat dissipating fin 4 in replacing the bent portion 45 of the previous embodiment. More specific descriptions will be provided hereinbelow.

[0031] The engaging member 46 includes an engaging body 461 and an engaging slot 462. The engaging body 461 is formed by stamping and kinking of the main body 41 to reduce the consumption of materials. The engaging slot 462 is formed accordingly by the engaging body 461. The engaging body 461 of one heat dissipating fin 4 is engaged to the engaging slot 462 of adjacent heat dissipating fin 4 to maintain the stacked heat dissipating fins 4 in proper alignment with each other. Furthermore, the structural design of the engaging member 46 is not restricted.

[0032] Based on the above, a plurality of the heat dissipating fins 4 of the instant embodiment can be attached to and stacked along the heat conducting pipes 3 concurrently. Therefore, the heat dissipating fins 4 need not be mounted on the heat conducting pipes 3 one piece after another to reduce time consumption. Furthermore, the base 1 and the cover plate 2 are connectively designed to fasten the three heat conducting pipes 3 therebetween without the utilization of glue and solder paste to reduce cost. The heat conducting pipes 3, moreover, are disposed on the heat generating unit 5 where the surface in contact therewith is substantially a flat surface. Thereby, increasing the heat dissipating efficiency of the heat dissipating device.

[0033] The descriptions illustrated supra set forth simply the preferred embodiments of the instant disclosure; however, the characteristics of the instant disclosure are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the instant disclosure delineated by the following claims.


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