Zhining
Zhining Chen, Goleta, CA US
Patent application number | Description | Published |
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20110181572 | ELECTRONIC DEVICES OPERABLE TO USE ADJUSTED DATA SIGNALS AND PROCESSES OF MAKING AND USING THE SAME - A first electronic device can include a radiation-emitting component; and a processor operable to receive an input data signal for the radiation-emitting component, receive performance information generated from a second electronic device, wherein the first electronic device and the second electronic device were fabricated in a same batch, and generate an adjusted data signal using the input data signal and the performance information. Processes of making and using the electronic devices are also disclosed. | 07-28-2011 |
Zhining Li, Shanghai CN
Patent application number | Description | Published |
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20090233401 | THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS - Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material. | 09-17-2009 |
20100178733 | Thin Quad Flat Package with No Leads (QFN) Fabrication Methods - Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material. | 07-15-2010 |
20110281398 | THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS - Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material. | 11-17-2011 |
Zhining Li, Hangzhou CN
Patent application number | Description | Published |
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20150302515 | METHOD, APPARATUS, AND SYSTEM FOR SIMULATING OBJECTS - Embodiments of the present application relate to a method and system for operating simulation of an object. The method includes receiving, from a first user, a first request to operate a simulation, wherein the first request to operate the simulation has information associated therewith, the information associated with the first request to operate the simulation including an indication of an object, searching for a second user based at least in part on the information associated with the first request to operate the simulation, sending, to the second user, a second request to operate the simulation associated with the object, receiving, from the second user, a result of the simulation in accordance with the second request to operate the simulation, and sending, to the first user, the result of the simulation. | 10-22-2015 |