Patent application number | Description | Published |
20130158198 | EPOXY RESIN COMPOSITION AND ITS PREPARING METHOD - The invention relates to an epoxy resin composition and preparation thereof. The composition comprises the following blended components: 100 weight parts of epoxy resins; 30 to 120 weight parts of anhydride curing agents; 1 to 45 weight parts of powdery nitrile rubbers; no curing accelerator is included in the composition. The composition of the invention has both higher heat resistance and higher toughness, and is suitable for the fields which require high heat resistance, such as circuit board, electronics packaging, binder and electrical insulating coating etc. | 06-20-2013 |
20130225713 | COMPOSITE POWDER, PREPARATION AND USE THEREOF - The present invention relates to a composite powder, preparation and use thereof. The composite powder according to the present invention is prepared by intimately mixing an irradiated or non-irradiated rubber latex with a slurry of inorganic particles in a ratio corresponding to that of rubber particles to inorganic particles in the composite powder according to the present invention, and then drying the resultant mixture. The composite powder according to the present invention comprises agglomerates composed of powdery rubber particles and inorganic particles, with inorganic particles being uniformly distributed either inside the agglomerats or both inside the agglomerates and on the surfaces thereof. The composite powder according to the present invention can be easily dispersed in plastic matrixes and thus can be compounded with plastics to produce toughened plastics and thermoplastic elastomers. | 08-29-2013 |
20140054512 | CONDUCTIVE FULL VULCANIZED THERMOPLASTIC ELASTOMER AND ITS PREPARATION METHOD - The invention provides a conductive full vulcanized thermoplastic elastomer and its preparation method, and relates to the technical field of full vulcanized thermoplastic elastomer. The full vulcanized thermoplastic elastomer is obtained by melt-blending components including rubber particles having crosslinking structure with mean particle diameter of 0.02 to 1 μm, carbon nanotubes as conductive fillers and thermoplastic plastics once, wherein the weight ratio of the rubber particles and the thermoplastic plastics is from 30:70 to 75:25 and the content of conductive fillers is from 0.3 to 10 weight parts based on the total weight of rubber particles and thermoplastic plastics of 100 weight parts. The resulting conductive full vulcanized thermoplastic elastomers have low content of conductive fillers and excellent combination performances. It can be prepared by conventional rubber processing methods and can be used to produce electronic production equipment, means, electronic instrument, instrument housing and decorative materials of clean production workshop having static resistance, electro magnetic interference resistance and clean requirement. | 02-27-2014 |
20140296439 | MODIFIED RUBBER MASTERBATCH, AND RUBBER COMPOSITION AND VULCANIZED RUBBER PRODUCED THEREFROM, AND THE PREPARATION PROCESSES FOR THEM - The present application relates to a modified rubber masterbatch and preparation method thereof, rubber composition prepared therewith and vulcanized rubber and preparation method thereof. The modified rubber component comprises uncrosslinked rubber and rubber particles having crosslinked structure dispersed therein, wherein the rubber particles having crosslinked structure are synthetic rubber particles and/or natural rubber particles, have an average particle size of 20-500 nm and a gel content of 60% by weight or higher, and wherein the uncrosslinked rubber is styrene-butadiene rubber. The weight ratio of the rubber particles having crosslinked structure to the uncrosslinked rubber is greater than 20:80 and less than or equal to 80:20. The rubber composition comprises a blend of modified rubber component and base rubber, in which the modified rubber masterbatch is present in an amount of 1 to 70 parts by weight, relative to per 100 parts by weight of the base rubber. The vulcanized rubber of the rubber composition has not only low rolling resistance and excellent wet skid resistance, but also excellent wear resistance, and thus can be used for producing high performance tread rubber. | 10-02-2014 |
20150105490 | RUBBER COMPOSTION, PREPARATION METHOD AND VULCANIZED RUBBER THEREOF - The present application relates to a rubber composition, preparation method and vulcanized rubber thereof. The rubber composition comprises uncrosslinked rubber and rubber particles having crosslinked structure dispersed therein, wherein the rubber particles having crosslinked structure are synthetic rubber particles and/or natural rubber particles, e.g. one or more selected from the group consisting of natural rubber particles, styrene-butadiene rubber particles, carboxylated styrene-butadiene rubber particles, nitrile butadiene rubber particles, carboxylated nitrile butadiene rubber particles, chloroprene rubber particles, polybutadiene rubber particles, silicone rubber particles or acrylic rubber particles, styrene-butadiene-vinylpyridine rubber particles and the like, with an average particle size of 20 to 500 nm and a gel content of 60% by weight or higher, and the uncrosslinked rubber is styrene-butadiene rubber, and wherein the weight ratio of the rubber particles having crosslinked structure to the uncrosslinked rubber is 1:99-20:80. The rubber composition is obtained by mixing the components comprising uncrosslinked rubber latex and latex of rubber particles having crosslinked structure and then coagulating them. The latex of rubber particles having crosslinked structure is a rubber latex after radiation crosslinking. The vulcanized rubber of the rubber composition can be improved simultaneously in rolling resistance, wet skid resistance and wear resistance and thus can be used as high performance vehicle tread rubber. | 04-16-2015 |
Patent application number | Description | Published |
20120187280 | LIGHT SENSOR HAVING IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE - Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. | 07-26-2012 |
20120187281 | LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS - Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers. | 07-26-2012 |
20120187512 | LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP - Techniques are described to furnish a light sensor that includes a patterned IR cut interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR cut interference filter configured to block infrared light is formed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR cut interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. In an implementation, a buffer layer is formed over the surface and configured to encapsulate the plurality of color pass filters to facilitate formation of the IR cut interference filter. In another implementation, the buffer layer is formed over the IR cut interference filter to function as a quasi-sacrificial buffer layer to facilitate formation of the color pass filters. | 07-26-2012 |
20120187513 | LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEGRATED ON-CHIP - A light sensor is described that includes an IR cut interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are formed in the substrate proximate to the surface of the substrate. An IR cut interference filter is disposed over the photodetectors. The IR cut interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR cut interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors. | 07-26-2012 |
20120187515 | LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE WITH LENS FORMED THEREIN - Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter. | 07-26-2012 |
20140027876 | LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEGRATED ON-CHIP - A light sensor is described that includes an IR interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are disposed proximate to the surface of the substrate. An IR interference filter is disposed over the photodetectors. The IR interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors. | 01-30-2014 |
20140035012 | LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP - Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. | 02-06-2014 |
20140284748 | LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND DIFFUSER FORMED THEREIN - A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is configured to filter light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to the photodetector. A glass substrate is positioned over the substrate and includes a diffuser. The diffuser is configured to diffuse light incident on the diffuser and to pass the diffused light to the at least one color filter for further filtering. | 09-25-2014 |
Patent application number | Description | Published |
20120033602 | Method and system for obtaining access information and accounting in multimedia broadcast/multicast service - The present invention discloses a method and system for obtaining access information in a Multimedia Broadcast/Multicast Service (MBMS). The method includes the following steps: during an eMBMS session, a broadcast/multicast service center (BM-SC) configures access information in one or more MBMS session signaling, and sends the MBMS session signaling to an MBMS gateway within a service area of the BM-SC; wherein the access information at least includes radio access technology type information. The present invention also discloses a method and system for charging in an MBMS. The methods and systems of the present invention can take the access information including the radio access technology type as the basis of charging, supply communication operators with a charging manner of distinguishing radio access technology types, and adopt different rates corresponding to the MBMS service areas of different radio access technology types, and thus charging can be further detailed. | 02-09-2012 |
20120220326 | METHOD AND SYSTEM FOR ACQUIRING INFORMATION OF MACHINE TYPE COMMUNICATION USER EQUIPMENT - A method and a system for acquiring information of Machine Type Communication (MTC) user equipment (UE) are provided. The method comprises the steps of: an MTC GateWay (MTC GW) acquiring the information of the MTC UE which currently requests to attach to a network or has attached to a network from a mobility management network element; the MTC GW sending the information of the MTC UE acquired from the mobility management network element to an MTC Server. The method and the system can control the MTC UE in real time and intelligently. | 08-30-2012 |
20120269117 | METHOD AND SYSTEM FOR IMPLEMENTING DOMAIN SELECTION DURING THE TERMINATED CALL - The present invention discloses a method and a system for implementing domain selection during a terminated call, wherein, the method comprises: an application server (AS) sending, according to a received call request message, a query request message to a home subscriber server (HSS); the HSS querying, according to the query request message, a packet switching (PS) domain mobility management network element to obtain information of a called terminal and/or a network accessed by the called terminal in the call request message; the HSS feeding back the obtained information of the called terminal and/or the network accessed by the called terminal to the AS; and the AS selecting a domain to which a call message is to be routed according to the information of the called terminal and/or the network accessed by the called terminal. The present invention can greatly reduce the number of the signalings between the PS domain mobility management element and the HSS, avoids various limitations of the signaling loads generated by the HSS on network deployment, is convenient for the network deployment, and ensures the implementation of services. | 10-25-2012 |