Patent application number | Description | Published |
20080259195 | SOLID-STATE IMAGING APPARATUS - A solid-state imaging apparatus including: a pixel section having unit pixels arranged into a two-dimensional matrix, each unit pixel containing a photoelectric conversion section for effecting a photoelectric conversion and an amplification section for amplifying and reading signal charges generated at the photoelectric conversion section; a current supply provided for each column for flowing a bias current to the amplification section; a column processing section provided for each column for processing a signal from the amplification section column by column; an output section for sequentially reading signals processed column by column at the column processing section and outputting them to an external signal processing circuit; and a bias current controlling section for controlling the bias current of the current supply in accordance with a gain setting at the external signal processing circuit. | 10-23-2008 |
20080297637 | SOLID-STATE IMAGING APPARATUS AND IMAGING SYSTEM USING THE SAME - A solid-state imaging apparatus including: a pixel section having pixels arranged into a matrix, each pixel containing an electric charge retaining section with a first accumulation capacitance for retaining a signal electric charge, a photoelectric conversion device with a second accumulation capacitance greater than the first accumulation capacitance where a light signal is converted into signal electric charges and then accumulated, a transfer means for controlling a transfer of the signal electric charges from the photoelectric conversion device to the electric charge retaining section, a signal amplification means for amplifying the signal electric charges retained at the electric charge retaining section and outputting them as a pixel signal, and a reset means for controlling a connection between the photoelectric conversion device and a pixel power supply; a horizontal and vertical scanning means for outputting the pixel signal; and a control section for, after transfer of the signal electric charges by the transfer means, executing the connection between the photoelectric conversion device and the pixel power supply by the reset means before a start of an exposure. | 12-04-2008 |
20090086069 | SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING SYSTEM USING THE SAME - A solid-state imaging device having within a pixel region where pixels containing photoelectric conversion device are two-dimensionally arranged, a plurality of noise extracting pixels for outputting a noise signal not depending on incident light amount provided in an effective pixel region from which image signal associated with object image is outputted, disposed in a manner scattered into two dimensions so that, taking N×N (N being an integer of 2 or more) pixels within the effective pixel region as unit block, at least one is provided in each row and in each column within that unit block. | 04-02-2009 |
20090290056 | IMAGE PICK-UP DEVICE - A image pick-up device includes a pseudo signal generating circuit which generates a pseudo video signal, a pseudo signal reading circuit which reads and outputs the pseudo signal from the pseudo signal generating circuit, and a level control circuit which controls the level of a signal outputted by the pseudo signal generating circuit or read into a pseudo signal reader. The image pick-up device can detect the property difference in signal lines. | 11-26-2009 |
20100140454 | SOLID STATE IMAGING DEVICE - A solid state imaging device comprises a pixel unit, a first controller, and a second controller. The pixel unit has a two dimensional matrix of pixels and each of the pixels is arrayed in the matrix. The first controller independently controls the output unit row by row. The second controller independently controls the first reset unit row by row. The each of pixels comprises a photoelectric conversion element, a first reset unit, a charge retention unit, a transmitter, a second reset unit, and an output unit. The element converts incident light into a signal charge and accumulates the converted signal charge. The first reset unit resets the signal charge. The charge retention unit retains a signal charge output from the photoelectric conversion element. The transmitter transmits the signal charge to the charge retention unit. The second reset unit resets the signal charge. The output unit outputs a pixel signal in response to the signal charge to a vertical signal line. | 06-10-2010 |
20100194922 | IMAGE PICKUP APPARATUS AND IMAGE PICKUP METHOD - The present invention is an image pickup apparatus provided with a pixel section in which pixels each including a photoelectric conversion section and a signal storage section that temporarily stores a signal charge of the photoelectric conversion section are two-dimensionally arrayed, that resets the signal storage sections before exposing a still image and reads reset data used to remove reset noise of a still image, configured to divide the pixel section into a plurality of pixel groups and sequentially reset the signal storage sections of the respective pixel groups by a transistor, sequentially read reset signals by a selection transistor and cause the selection transistor to read one or more times an LV signal charge generated by exposure of a predetermined pixel group within a time segment during which the signal storage sections are sequentially reset before the signal storage sections of the predetermined pixel group are reset. | 08-05-2010 |
20100194958 | IMAGING PICKUP APPARATUS AND IMAGE PICKUP METHOD - The present invention is an image pickup apparatus including a pixel section in which pixels each including a photoelectric conversion section are two-dimensionally arrayed, a transistor that collectively resets the photoelectric conversion sections, an exposure control section that performs control so as to perform exposure for a predetermined time after reset, a signal charge storage section that is light-shielded and stores signal charge generated by the photoelectric conversion sections, a transistor that collectively transfers signal charge from the photoelectric conversion sections to the signal storage section, and a selection transistor that reads still image signal charge for an LV pixel group before signal charge of other pixel groups, then reads signal charge for a live view generated by the LV pixel group one or more times within a time segment during which the still image signal charge of the other pixel groups is read. | 08-05-2010 |
20110074987 | IMAGING DEVICE - An A/D conversion section ( | 03-31-2011 |
20120182455 | SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE - A solid-state image pickup device includes a pixel unit in which pixels are arranged in a two-dimensional manner, the pixels including a photoelectric conversion element, a charge holding unit, a transmission unit, and a first output unit and a second output unit; a second processing unit; and a control unit configured to control exposure of the pixels such that exposure periods for still images of all pixels constituting an area to be read are equal to one another, and control reading of the still image signal and reading of the moving image signal in units of fields, the all pixels constituting the area to be read being divided into a plurality of fields, in such a manner that the still image signal is to be read from both the first output unit and the second output unit in units of fields. | 07-19-2012 |
20130181316 | SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE - A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate. | 07-18-2013 |
20130256889 | SUBSTRATE AND SEMICONDUCTOR DEVICE - A substrate includes a base member having a predetermined thickness, and an electrode array provided in one surface in a thickness direction of the base member and having a plurality of electrodes arranged two-dimensionally in a plan view, and the electrode array includes a central portion and an incremental region provided around the central portion in the planar view and is formed so that a height of the electrodes in the incremental region gradually increase as approaching toward the central portion. | 10-03-2013 |
20140103481 | SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUSTRATE - A semiconductor substrate according to the present invention includes: a substrate; an electrode array which is provided on the surface on one side in a thickness direction of the substrate and in which a plurality of electrodes is two-dimensionally arranged in a plan view; and a resin layer which is provided on the surface on one side and seals peripheries of the plurality of electrodes. The plurality of electrodes protrudes by greater than or equal to 5% of its own height on the resin layer and is capable of being accommodated in the resin layer by being compressed in the thickness direction. | 04-17-2014 |
20140139713 | SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, AND SIGNAL READING METHOD - This solid-state imaging device includes a first substrate and a second substrate which have circuit elements constituting pixels disposed therein are electrically connected to each other. The pixels includes: a photoelectric conversion element disposed in the first substrate; an amplifier circuit that amplifies a signal generated in the photoelectric conversion element to output the amplified signal; a signal accumulation circuit which is disposed in the second substrate and accumulates the amplified signal which is output from the amplifier circuit; and an output circuit that outputs the amplified signal accumulated in the signal accumulation circuit from the pixel. | 05-22-2014 |
20140146208 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC CAMERA - In a solid-state imaging device and an electronic camera, a first substrate of the solid-state imaging device includes first and second photoelectric converting units, a transfer unit that transfers signal charges of the first and second photoelectric converting units to a connector, and a microlens that causes light to be incident on the first and second photoelectric converting unit. A second substrate of the solid-state imaging device includes first and second memory units that hold signal charges transferred from one or the other of the first and second photoelectric converting unit to the connector and an averaging unit that averages the signal charges held in the first memory unit and the signal charge held in the second memory unit. | 05-29-2014 |
20140367853 | SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE - A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate. | 12-18-2014 |