Patent application number | Description | Published |
20090016024 | MOTHERBOARD - A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented. | 01-15-2009 |
20090071698 | CIRCUIT BOARD - A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board. | 03-19-2009 |
20090071702 | CIRCUIT BOARD - A circuit board ( | 03-19-2009 |
20090166062 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier. | 07-02-2009 |
20090166164 | BUTTON ASSEMBLY - A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch. | 07-02-2009 |
20090168330 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure ( | 07-02-2009 |
20090168361 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base. | 07-02-2009 |
20090171604 | METHOD AND APPARATUS FOR COMPENSATING S-PARAMETERS OF PASSIVE CIRCUITS - The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S′], wherein matrix S′ is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S′], and choosing an eigenvalue Ψ whose real part real(Ψ) is the biggest; (4) computing a compensating value ξ, the compensating value ξ being equal to real(Ψ) | 07-02-2009 |
20090185351 | MOUNTING APPARATUS FOR HEAT SINK - A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board. | 07-23-2009 |
20090188699 | PRINTED CIRCUIT BOARD - A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers. | 07-30-2009 |
20090190309 | ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT - An electronic apparatus includes an enclosure ( | 07-30-2009 |
20090213549 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body. | 08-27-2009 |
20090294152 | PRINTED CIRCUIT BOARD - A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid. | 12-03-2009 |
20100001806 | SIGNAL TRANSMISSION LINES - A pair of signal transmission lines includes an aggressor line and a victim line parallel to the aggressor line. A plurality of time delay modules is linked in the aggressor line. A plurality of time delay modules is linked in the victim line. A total delay time of the time delay modules of the victim line is equal to a total delay time of the time delay modules of the aggressor line. | 01-07-2010 |
20100002373 | HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE - A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile. | 01-07-2010 |
20100014244 | THERMAL DEVICE FOR HEAT GENERATING SOURCE - A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins. | 01-21-2010 |
20100097754 | COMPUTER ENCLOSURE WITH AIRFLOW GUIDE - A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis. | 04-22-2010 |
20100128442 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. | 05-27-2010 |
20100134971 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades. | 06-03-2010 |
20100165579 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies. | 07-01-2010 |
20100288476 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. A slantwise slot is formed in the fins, an edge of the slot bent to form a slantwise deflecting portion. The fan is configured to generate airflow through the fins in such a manner that some of the airflow is deflected by the deflecting portion towards the second of the two heat sources. | 11-18-2010 |
20100307795 | CIRCUIT BOARD - A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area. | 12-09-2010 |