Patent application number | Description | Published |
20100132998 | Substrate having metal post and method of manufacturing the same - The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post. | 06-03-2010 |
20100139960 | Printed circuit board having plating pattern buried in via and method of manufacturing the same - Disclosed is a printed circuit board having a plating pattern buried in a via and a method of manufacturing the same. The method of manufacturing the printed circuit board includes forming a negative pattern for forming a plating pattern, thus remarkably reducing the generation of plating thickness deviation in a plating process for forming a circuit pattern, and the printed circuit board has improved electrical signal transmission properties. | 06-10-2010 |
20100264549 | Trench Substrate and Method Of Manufacturing The Same - Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon. | 10-21-2010 |
20110253431 | Printed circuit substrate and method of manufacturing the same - Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same. | 10-20-2011 |
20120077333 | TRENCH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon. | 03-29-2012 |
20120111609 | PRINTED CIRCUIT BOARD HAVING PLATING PATTERN BURIED IN VIA - A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler. | 05-10-2012 |
20150373841 | CORE AND PRINTED CIRCUIT BOARD - A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer. | 12-24-2015 |
20160007449 | CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof. | 01-07-2016 |