Patent application number | Description | Published |
20140167982 | INTEGRATED REHABILITATION SYSTEM WITH FEEDBACK MECHANISM - An integrated rehabilitation system with feedback mechanism for a rehabilitant includes a computing center, a memory unit, a plurality of screens, a following module, a plurality of rehabilitation machines, and a feedback module. The memory unit, the screens, the following module, the rehabilitation machines and the feedback module are signally connected with the computing center. A target value of the rehabilitant is stored in the memory unit. A movement-indicating image and a movement mark are displayed on each of the screens. A visual following mark displayed on each of the screens is provided by the following module and corresponds to the target value. Each of the rehabilitation machines corresponds to one of the screens respectively, the movement-indicating image displayed on the screen corresponds to the rehabilitation machine, and the movement mark displayed on the screen corresponds to an operation value generated from the rehabilitation machine. | 06-19-2014 |
20140274580 | HIGH KNEES EXERCISE APPARATUS - A high knees exercise apparatus is disclosed. The high knees exercise apparatus includes a base, two actuator members, and two pedals. The base includes a supporting member and a pivot portion. The pivot portion has a pivot axis. The actuator members are pivotally connected to two sides of the pivot portion respectively and moving in response to each other reversely. Each of the actuator members includes a lower portion swinging along an arc path centered on the pivot axis. The arc path includes a first arc extended from a virtual vertical line passing through the pivot axis and an angle of the first arc is 45 degrees to 100 degrees. Each of the pedals is pivotally connected to a free end of each of the lower portions. | 09-18-2014 |
20140274609 | HIGH KNEES EXERCISE APPARATUS - A high knees exercise apparatus includes a base, a driving mechanism, a linkage mechanism and two magnetic resistance. The driving mechanism is located on the base and includes two driving member which is driven swung along arc path. The linkage mechanism is for leading the driving members swung reversely in response to each other. The two magnetic resistance devices are for providing magnetic resistances in accordance with swings of the two driving members respectively. | 09-18-2014 |
20150080195 | EXERCISE EQUIPMENT - An exercise equipment includes a base, an operating device and a magnetic resistance device. The operating device is movably disposed on the base. The magnetic resistance device is connected to the operating device and the base, wherein the magnetic resistance device is for providing a magnetic resistances in accordance with an operation of the operating device. | 03-19-2015 |
20150360078 | HIGH KNEES EXERCISE APPARATUS - A high knees exercise apparatus includes a base, a driving mechanism, a linkage mechanism and two magnetic resistance. The driving mechanism is located on the base and includes two driving member which is driven swung along arc path. The linkage mechanism is for leading the driving members swung reversely in response to each other. The two magnetic resistance devices are for providing magnetic resistances in accordance with swings of the two driving members respectively. | 12-17-2015 |
20160001126 | REHABILITATION EQUIPMENT - A rehabilitation equipment includes a main frame, a rotating mechanism, a linking mechanism and a resistance mechanism. The rotating mechanism is disposed on the main frame. The linking mechanism is linked up with the rotating mechanism. The resistance mechanism is for providing a resistance. | 01-07-2016 |
Patent application number | Description | Published |
20100012987 | Field Effect Transistor Based Sensor - The invention discloses a FET based sensor. The FET based sensor according to an embodiment of the invention includes a substrate, an InN material layer, a source terminal and a drain terminal. The InN material layer is formed over the substrate and has an upper surface. The upper surface thereon provides an analyte sensing region. The InN material layer serves as a current channel between the source terminal and the drain terminal. Thereby, ions adsorbed by the analyte sensing region induce a variation of a current flowing through the current channel, and the variation is further interpreted as a characteristic of the analyte. | 01-21-2010 |
20100079873 | Package structure of liquid lens - The invention discloses a package structure of a liquid lens which includes a first substrate and an electrode on the first substrate. The package structure includes a second substrate, a first sleeve, a second sleeve, a first circular member, and a second circular member. The first substrate is fixed at the first sleeve to form a holding chamber for receiving a first dielectric liquid and a second dielectric liquid. The second substrate is disposed on the liquid lens and fixed at the second sleeve. The first sleeve is fixedly connected inside the first sleeve and the second substrate. The second circular member is disposed on the first circular member. The first and second circular member are located and urged between the first sleeve and the second sleeve to form a reserved expansion chamber. | 04-01-2010 |
20110018038 | ION SENSITIVE FIELD EFFECT TRANSISTOR AND PRODUCTION METHOD THEREOF - The present invention discloses an ion sensitive field effect transistor, comprising: a GaN/sapphire layer, used as a substrate; an a-InN:Mg epilayer, deposited on the GaN/sapphire layer, used to provide a current path; a first metal contact, deposited on the a-InN:Mg epilayer to provide drain contact; and a second metal contact, deposited on the a-InN:Mg epilayer to provide source contact; and a patterned insulating layer, used to cover the first metal contact, the second metal contact and the a-InN:Mg epilayer, wherein the patterned insulating layer has a contact window defining an exposure area of the a-InN:Mg epilayer. | 01-27-2011 |
20130259748 | ACETONE GAS SENSOR APPARATUS - An acetone gas sensor apparatus, including: a chamber, used for containing a gas sample taken from a breath of a person; and an acetone gas sensor, placed in the chamber for generating an output current in response to an acetone concentration of the gas sample, the acetone gas sensor including: a substrate; a buffer layer, deposited on the substrate; an InN epilayer, deposited on the buffer layer for providing a current path for the output current; a first conductive contact, deposited on the InN epilayer for providing a drain contact; and a second conductive contact, deposited on the InN epilayer for providing a source contact. | 10-03-2013 |
Patent application number | Description | Published |
20150035163 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced. | 02-05-2015 |
20150035164 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced. | 02-05-2015 |
20150069628 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided. | 03-12-2015 |
20150325556 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement. | 11-12-2015 |
Patent application number | Description | Published |
20140191393 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, including a carrier having electrical connecting pads, a semiconductor element disposed on the carrier and having electrode pads, conductive elements electrically connected to the electrode pads and the electrical connecting pads, fluorine ions formed between the conductive elements and the electrode pads or between the conductive elements and the electrical connecting pads, and an encapsulant formed on the carrier and the conductive elements, wherein the electrode pads or the electrical connecting pads are formed by aluminum materials to form fluorine aluminum by way of packaging the fluorine ions after the completion of the packaging process. Accordingly, the corrosion resistance of the semiconductor package is increased. | 07-10-2014 |
20150028081 | METHOD FOR FABRICATING WIRE BONDING STRUCTURE - A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad. | 01-29-2015 |
20160079198 | WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE - A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency. | 03-17-2016 |
Patent application number | Description | Published |
20090031447 | Use of a tospoviral nucleid acid molecule for broad-spectrum transgenic resistance against different tospoviruses - A use of a tospoviral nucleic acid molecule of the sequence of nt (nucleotide) 3975-4928 in accordance with GenBank Accession No. AF133128 or a full complement thereof comprising the steps of: (a) obtaining at least one fragment made from the tospoviral nucleic acid molecule; (b) obtaining a transgene from the at least one fragment; (c) introducing the transgene into a plant to generate a transgenic plant; (d) culturing the transgenic plant; (e) selecting a transgenic plant with broad-spectrum resistance; and (f) obtaining the transgenic plant with broad-spectrum resistance. | 01-29-2009 |
20090275013 | Method for preparing a monoclonal antibody to the common epitope of nonstructural NSs protein of watermelon silver mottle virus and assay for detection of serological related species in the genus tospovirus with the monoclonal antibody - The invention is an assay for detection of Watermelon silver mottle virus (WSMoV)-serogroup tospoviruses using a monoclonal antibody and a method for preparing the monoclonal antibody. A hybridoma cell line that produces a monoclonal antibody against the NSs proteins of WSMoV-serogroup tospoviruses was produced. The hybridoma cell line produces a monoclonal antibody binding with peptide SEQ ID No. 19. | 11-05-2009 |
20110098458 | Isolated Nucleic Acid Molecules From Transgenic Papaya Line 16-0-1 Resistant To Papaya Ringspot Virus And Use Thereof - Provided is an isolated nucleic acid molecule having a right border flanking region, a left border flanking region and a transgene sequence between the right border flanking region and the left border flanking region, wherein the right border flanking region having at least 90% homology with the sequence set forth in SEQ ID NO: 29; the left border flanking region having at least 90% homology with the sequence set forth in SEQ ID NO: 31; and the transgene sequence having a papaya ringspot virus coat protein gene and a promoter operably linked to the papaya ringspot virus coat protein gene. Primers, probes and kit derived from the isolated nucleic acid molecule are proved to be useful for identifying the transgenic papaya line 16-0-1 in a specific, reproducible, sensitive and reliable way. | 04-28-2011 |
20110098459 | Isolated Nucleic Acid Molecules From Transgenic Papaya Line 18-2-4 Resistant To Papaya Ringspot Virus And Use Thereof - Provided is an isolated nucleic acid molecule having a right border flanking region, a left border flanking region and a transgene sequence between the right border flanking region and the left border flanking region, wherein the right border flanking region having at least 90% homology with the sequence set forth in SEQ ID NO: 30; the left border flanking region having at least 90% homology with the sequence set forth in SEQ ID NO: 32; and the transgene sequence having a | 04-28-2011 |
20110289624 | GENE-TRANSFER VECTOR COMPRISING HELPER-COMPONENT PROTEASE GENE OF PAPAYA RINGSPOT VIRUS FOR BROAD-SPECTRUM VIRUS RESISTANCE IN CROPS AND USE THEREOF - Provided is a recombinant plasmid having a control sequence and a coding sequence fragment of Papaya ringspot virus (PRSV) helper-component protease gene (HC-Pro gene) operably linked to the control sequence. A recombinant microorganism derived therefrom is also provided. A method for providing plants with resistance against virus is also provided. Use of PRSV HC-Pro gene or fragment thereof in generating plants with resistance against virus is also provided. It is proven that the PRSV HC-Pro transgenic plants can solve the problem resulting from breakdown by gene silencing suppression and provide broad-spectrum resistance to various PRSV strains of different geographical origins. | 11-24-2011 |
20150125849 | Eukaryotic Expression System And Use Thereof - Provided are a eukaryotic expression system and its applications. The eukaryotic expression system has a recombinant plant cell. The recombinant plant cell includes a first vector and a second vector. The first vector expresses a fusion protein containing an Asia tospoviral common epitope. The fusion protein containing Asia tospoviral common epitope consists of an amino acid sequence as set forth in SEQ ID NO. 1, and a predetermined protein fragment connecting to the Asia tospoviral common epitope. The above eukaryotic expression system is useful for monitoring the interaction between proteins via use of a specific peptide to tag the predetermined protein and demonstrates high sensitivity and stability. | 05-07-2015 |
Patent application number | Description | Published |
20160116170 | IGNITION CONTROLLING DEVICE OF GAS APPLIANCE - An ignition controlling device of a gas appliance includes a high-voltage provider, a controller, and a flame sensor. The gas appliance includes an ignition electrode and a burner, and the ignition electrode is beside burner. The high-voltage provider has an output terminal, and the output terminal is electrically connected to the ignition electrode to provide high-voltage pulses to the ignition electrode. The controller controls the high-voltage provider to provide the high-voltage pulses. The flame sensor is electrically connected to the output terminal of the high-voltage provider to detect a flame around the ignition electrode and the burner. After a flame is detected by the flame sensor, the controller controls the high-voltage provider to stop the high-voltage pulses. | 04-28-2016 |
20160116228 | WATER HEATER HAVING SECONDARY HEAT EXCHANGER - A water heater includes a combustion device, a primary heat exchanger, and a secondary heat exchanger. The combustion device burns gas to generate high-temperature air. The primary and the secondary heat exchangers are provided sequentially above the combustion device. When the high-temperature air passes through the primary heat exchanger, part of thermal energy is absorbed by exchange plates and a water pipe therein. When the high-temperature air continues to pass through the secondary heat exchanger, part of the rest thermal energy is absorbed by a heat tube set therein to preheat water flowing through the heat tube set. The preheated water then flows into the water pipe of the primary heat exchanger. The secondary heat exchanger includes a case and a cover board which detachably seals a bore on the case. Whereby, it's convenient for a user to clean pipes inside the secondary heat exchanger. | 04-28-2016 |
20160118173 | REMOTE CONTROL KIT - A remote control kit includes a magnetic holder and a remote control, wherein the magnetic holder includes a magnet and a non-slip member which covers the magnet. The remote control includes a case and a ferromagnetic member therein. The magnetic holder is fixed on a wall where the remote control is ready to be placed. The ferromagnetic member of the remote control is made of a material selected form the group consisting of iron, cobalt, and nickel, and therefore the remote control can be attached onto the magnetic holder via magnetic force. | 04-28-2016 |