Patent application number | Description | Published |
20110263058 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT - A method of manufacturing the semiconductor light emitting element comprises a semiconductor layer forming step of forming the multilayered nitride semiconductor layer on the first wafer having a transparent property; a bonding step of bonding the multilayered nitride semiconductor layer to the first wafer; a groove forming step of forming the groove extending from the lower surface of the first wafer to the multilayered nitride semiconductor layer; a light applying step of applying a first light to the lower surface of the multilayered nitride semiconductor layer through the first wafer to reduce a bonding force between the multilayered nitride semiconductor layer and the first wafer; a separating step of separating the first wafer from the multilayered nitride semiconductor layer; and a cutting step of cutting the second wafer along the groove to divide into a plurality of the semiconductor light emitting element. | 10-27-2011 |
20110297989 | LIGHT EMITTING DEVICE - The light emitting device comprises a mounting substrate and an LED chip which comprises an n-type nitride semiconductor layer, a nitride light emission layer on the n-type nitride semiconductor layer, p-type nitride semiconductor layer on the nitride light emission layer, an anode electrode opposite of the nitride light emission layer from the p-type nitride semiconductor layer, and a cathode electrode on the n-type nitride semiconductor layer. The mounting substrate has a patterned conductor which is connected to the cathode electrode through a bump and also connected to the anode electrode through a bump. The LED chip further comprises one or more dielectric layer between the p-type nitride semiconductor layer and the anode electrode to have an arrangement which resembles an island. The p-type nitride semiconductor layer has a first region which is overlapped with the bump. The dielectric layer is not formed within the first region. | 12-08-2011 |
20120292652 | SURFACE LIGHT EMITTING DEVICE - The surface light emitting device includes an organic EL element, a protection substrate, a protection part, and a light extraction structure part. The element has a first face and a second face opposite to the first face, and emits light from the first face. The substrate has transparency for light emitted from the element, and is placed facing the first face, and has a primary surface facing the first face of the element. The protection part is placed facing the second face of the element, and constitutes a housing in combination with the substrate and accommodates the element so as to protect the element from water. The structure part is interposed between the first face of the element and the substrate, and suppresses reflection of light emitted from the element on at least one of the first face of the element and the primary surface of the substrate. | 11-22-2012 |
20130306952 | PLANAR LIGHT EMITTING DEVICE - A planar light emitting device includes an organic EL element module unit in which plural organic EL elements are arranged side by side, each of the organic EL elements including an anode, a light emitting layer and a cathode that are formed on a first surface side of a first transparent substrate, and a second transparent substrate disposed on a light extraction side of the organic EL element module unit. The organic EL element includes a first through hole wire that is electrically connected to a first part of the anode formed outside a light emitting portion, and a second through hole wire that is electrically connected to a second part of the cathode that extends on the first surface of the first transparent substrate. External connection electrodes for supplying power to the organic EL element module are disposed on a first surface side of the second transparent substrate so as to avoid a projection region of the light emitting portion. | 11-21-2013 |
20140191226 | ORGANIC ELECTROLUMINESCENT ELEMENT - An organic electroluminescent element having a structure in which a plurality of light-emitting layers stacked between a first electrode with light reflectivity and a second electrode with optical transparency while one or more interlayers with a light transmissive property are interposed between the plurality of light-emitting layers. A first interlayer is formed as the interlayer closest to the first electrode. A first light-emitting unit is formed between the first electrode and the first interlayer to include a first light-emitting layer which has a first light-emitting source, and a second light-emitting unit is formed on a side of the first interlayer close to the second electrode to include a second light-emitting layer which has a second light-emitting source. The first interlayer is a semi-transmissive layer which has both of optical transparency and light reflectivity and has a total light absorption ratio of 10% or less. | 07-10-2014 |
20150014672 | COMPOSITE SUBSTRATE, MANUFACTURING METHOD OF THE SAME AND ORGANIC ELECTROLUMINESCENCE DEVICE - A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed. | 01-15-2015 |
20150021622 | LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME - In a light emitting element, a semiconductor layer including a light emitting layer is stacked on a GaN substrate | 01-22-2015 |
20150034929 | ORGANIC ELECTROLUMINESCENCE ELEMENT - The organic electroluminescence element in accordance with the present invention includes: a substrate; a light-outcoupling layer situated on a surface of the substrate; a light-emitting layer situated on a face on an opposite side of the light-outcoupling layer from the substrate; a sealing base situated facing the face of the light-outcoupling layer; and a sealing bond formed to enclose the light-emitting layer and bond the sealing base to the face of the light-outcoupling layer. The light-outcoupling layer includes: a first portion where the light-emitting layer is situated; a second portion where the sealing bond is situated; and a groove spatially separating the first portion from the second portion. | 02-05-2015 |
20150041783 | ORGANIC ELECTROLUMINESCENCE ELEMENT - The organic electroluminescence element in accordance with the present invention, includes: a substrate; a light-emitting stack on a face of the substrate; a covering substrate provided so as to face the face of the substrate; and a sealing bond surrounding the light-emitting stack and bonding the substrate and the covering substrate to enclose the light-emitting stack together with the covering substrate and the substrate. The sealing bond includes a bonding layer and a low moisture permeable layer, and the low moisture permeable layer is lower in moisture permeability and thicker than the bonding layer. | 02-12-2015 |
20150069349 | METHOD OF PREPARING ORGANIC ELECTROLUMINESCENT ELEMENT AND ORGANIC ELECTROLUMINESCENT ELEMENT - Provided is a method of preparing an organic electroluminescent element. The method includes: a roughening step of roughening a surface of a moisture-proof substrate; a composite substrate-forming step of placing a resin film on the roughened surface of the moisture-proof substrate to form a composite substrate; an electroluminescent laminate-forming step of forming an organic electroluminescent laminate on a surface of the composite substrate; and a covering step of covering the organic electroluminescent laminate with a covering substrate that is larger than the resin film in a plan view. It gives a highly reliable organic electroluminescent element superior in light-outcoupling efficiency that is effectively resistant to water penetration and to degradation. | 03-12-2015 |