Patent application number | Description | Published |
20080283989 | Wafer level package and wafer level packaging method - Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads. The getter provided in the sealed space defined by the sealing/attaching members can prevent the devices of the device region from being contaminated by moisture or foreign particles generated during the fabrication process, and the sealing/attaching process can be performed at a lower temperature compared with a typical sealing/attaching process using a metal. | 11-20-2008 |
20080296577 | Camera module package - There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability. | 12-04-2008 |
20080304821 | Camera module package and method of manufacturing the same - The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus. | 12-11-2008 |
20090014827 | Image sensor module at wafer level, method of manufacturing the same, and camera module - Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer. | 01-15-2009 |
20090072335 | Image sensor package - An image sensor package is provided. The image sensor package may include a semiconductor substrate, an image sensor stacked over an upper surface of the semiconductor substrate, a pad formed on a lower surface of the semiconductor substrate and electrically connected with the image sensor, and a passive component formed by a thin film process on a lower surface of the semiconductor substrate and electrically connected with the pad. | 03-19-2009 |
20090305105 | Fuel cell and method for manufacturing the same - Disclosed are a fuel cell and a method for manufacturing the fuel cell. The fuel cell can include forming a channel on one surface of a first wafer and one surface of a second wafer, respectively; stacking a membrane electrode assembly on one surface of the first wafer; and coupling the second wafer to the first wafer to allow one surface of the second wafer to cover the membrane electrode assembly, to thereby manufacture the fuel cell in a small size at low cost, precisely form the membrane electrode assembly, and prevent a damage of the membrane electrode assembly. | 12-10-2009 |
20090308640 | Wafer level package and method of manufacturing the same - Provided is a wafer level package including a first substrate that has circuit patterns provided on the top surface thereof and first vias formed therein, the first vias being electrically connected to the circuit patterns; and a second substrate that is bonded to the bottom surface of the first substrate through anodic bonding and has second vias formed therein. | 12-17-2009 |
20090309177 | Wafer level camera module and method of manufacturing the same - The present invention relates to a wafer level camera module and a method of manufacturing the same and provides a wafer level camera module including a wafer provided with an image sensor on a top surface; a transparent member bonded to the wafer through anodic bonding to seal the image sensor; a spacer bonded to the transparent member through the anodic bonding by including a window to expose the image sensor; and a wafer lens bonded to the spacer through the anodic bonding to cover the window of the spacer and further a method of manufacturing the same. | 12-17-2009 |
20110146404 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor, which includes a diaphragm having a piezoelectric element or a piezoresistive element formed on one surface thereof, a mass element integrated with the center of the other surface of the diaphragm in which the distal end of the mass element has a larger width than the width of the proximal end in contact with the diaphragm, and a supporter formed along the edge of the other surface of the diaphragm, so that the use of the mass element having the above shape results in decreased spring constant and increased distance from the center of the diaphragm to the center of the mass element, thereby simultaneously realizing a reduction in the size of the inertial sensor and an increase in performance thereof. A method of manufacturing the inertial sensor is also provided. | 06-23-2011 |
20110290022 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor | 12-01-2011 |
20120125096 | INERTIAL SENSOR - Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values. | 05-24-2012 |
20120267825 | METHOD OF MANUFACTURING INERTIAL SENSOR - The method of manufacturing an inertial sensor includes: (A) disposing a first mold | 10-25-2012 |
20120270355 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor, which includes a diaphragm having a piezoelectric element or a piezoresistive element formed on one surface thereof, a mass element integrated with the center of the other surface of the diaphragm in which the distal end of the mass element has a larger width than the width of the proximal end in contact with the diaphragm, and a supporter formed along the edge of the other surface of the diaphragm, so that the use of the mass element having the above shape results in decreased spring constant and increased distance from the center of the diaphragm to the center of the mass element, thereby simultaneously realizing a reduction in the size of the inertial sensor and an increase in performance thereof. A method of manufacturing the inertial sensor is also provided. | 10-25-2012 |
20120272734 | Inertial Sensor - Disclosed herein is an inertial sensor. An inertial sensor | 11-01-2012 |
20120291547 | ANGULAR VELOCITY SENSOR - There is provided an angular velocity sensor, including: a flexible part connecting a fixing part to an oscillation unit; a driving unit formed on the flexible part or the oscillation unit to oscillate the oscillation unit; a sensing unit formed on the flexible part or the oscillation unit to sense a displacement of the oscillation unit according to an angular velocity input; a control piezoelectric element formed on the flexible part to control rigidity of a motion of the oscillation unit; and an impedance element electrically connected to the control piezoelectric element to apply impedance to the control piezoelectric element. | 11-22-2012 |
20120297874 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. An inertial sensor | 11-29-2012 |
20130019679 | INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME - Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other. | 01-24-2013 |
20130036818 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor | 02-14-2013 |
20130068022 | MICRO ELECTRO MECHANICAL SYSTEMS COMPONENT - Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane | 03-21-2013 |
20130081465 | INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME - Disclosed herein is an inertial sensor. The inertial sensor includes: a plurality of driving masses; support bodies supporting the driving masses so as to freely move in a state in which the driving masses float; a connection bridge connecting the plurality of driving masses and connecting the plurality of driving masses with the support bodies; and an electrode pattern part including driving electrodes simultaneously driving the driving masses and sensing electrode detecting axial Coriolis force of each of the driving masses. | 04-04-2013 |
20130152687 | INERTIAL SENSOR AND METHOD FOR MEASURING ACCELERATION USING THE SAME - Disclosed herein is an inertial sensor, including: a membrane; a mass body disposed under the membrane; a sensing unit formed on the membrane and including a piezoelectric body; and a spring constant control unit formed to be spaced apart from the sensing unit and including a piezoelectric body. According to the preferred embodiment of the present invention, the DC acceleration (in particular, gravity acceleration) can be measured by using the change in the spring constant without changing the structure of the inertial sensor including the piezoelectric material of the prior art. | 06-20-2013 |