Patent application number | Description | Published |
20090232336 | Component Comprising a MEMS Microphone and Method for the Production of Said Component - A component with a housing for a MEMS microphone is proposed that has a cavity with terminals arranged in the cavity, a sound inlet opening, and SMT contacts on an outer side. The MEMS chip installed in this housing closes the sound inlet opening from the inside and is connected by means of electrically conductive connections to the terminals of the housing. Opposite the electrically conductive connections, the MEMS chip is in mechanically intimate contact with the housing. The dimensioning of the housing relative to the MEMS chip allows the cavity at the sides of the MEMS chip to be used as an acoustic rear volume. | 09-17-2009 |
20100187949 | Component with Reduced Temperature Response, and Method for Production - A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography. | 07-29-2010 |
20110018076 | MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component - A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side. | 01-27-2011 |
20110133315 | SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF | 06-09-2011 |
20110180885 | METHOD FOR ENCAPSULATING AN MEMS COMPONENT - Method for producing an MST device, and MST device | 07-28-2011 |
20110230068 | COMPONENT COMPRISING A CHIP IN A CAVITY AND A STRESS-REDUCED ATTACHMENT - A mechanically improved component comprising a chip in a cavity and a stress-reduced attachment is specified. A component comprises an opening in a housing, an opaque cover or a mechanically flexible line connector, which is attached to two locations. | 09-22-2011 |
20110298064 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES - Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout. | 12-08-2011 |
20120093346 | MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package. | 04-19-2012 |
20120224726 | MEMS-MICROPHONE - A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided. | 09-06-2012 |
20120275634 | MEMS MICROPHONE - A microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed. | 11-01-2012 |
20130119492 | Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method - The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip. | 05-16-2013 |
20130140656 | MEMS Microphone And Method For Producing The MEMS Microphone - The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO | 06-06-2013 |
20140111062 | Wafer-Level Package and Method for Production Thereof - A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers. | 04-24-2014 |
Patent application number | Description | Published |
20080247585 | Electrical Module Comprising a Mems Microphone - An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip. | 10-09-2008 |
20080267431 | Mems Microphone - A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm. | 10-30-2008 |
20080279407 | Mems Microphone, Production Method and Method for Installing - A microphone in a miniaturized form is described herein. The microphone includes a flat carrier substrate having a first recess extending through the carrier substrate. The microphone includes a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess. The microphone also includes a cap on a second surface opposite the first surface having a tight seal with the second surface and spanning the first recess. The cap includes at least one metallic layer for electromagnetic shielding. | 11-13-2008 |
20090001553 | Mems Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 01-01-2009 |
20090127697 | Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production - An element includes a hollow space for a mechanically sensitive electrical element. The element includes a first housing part and a second housing part rigidly connected to the first housing part via joint surfaces. The element also includes connection surfaces on a base of a recess in the first housing the first housing part being covered by the second housing part to form an enclosed hollow space. | 05-21-2009 |
20090129611 | Microphone Membrane And Microphone Comprising The Same - The invention relates to a microphone membrane (M | 05-21-2009 |
20110186943 | MEMS Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 08-04-2011 |
20110214905 | Circuit Board with Flexible Region and Method for Production Thereof - A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region. | 09-08-2011 |
20130121523 | ELECTRIC COMPONENT HAVING A SHALLOW PHYSICAL SHAPE, AND METHOD OF MANUFACTURE - Electric components and methods of manufacture are specified. An electric component comprises a carrier having a recess which penetrates the carrier and also a first chip and external contact area. The first chip is arranged in the recess in the carrier. The external contact area is provided for connecting up the first chip to an external circuit environment. | 05-16-2013 |