Patent application number | Description | Published |
20100090874 | Digital-Analog conversion circuit and output data correction method of the same - A digital-analog conversion circuit includes a correction unit that adds a correction bit to a lower-order bit of externally input first digital input data and outputs second digital input data, and a conversion unit that receives the second digital input data and outputs an analog value, and the correction unit generates the second digital input data by manipulating data of a lower-order bit of the second digital input data around a point at which an error between the analog value and an expected value set for the first digital input data becomes larger than a preset value. | 04-15-2010 |
20110053651 | Electronic apparatus - Electronic apparatus which may include a main body portion having a back surface and a keyboard located at a part of the main body portion other than the main body portion back surface, a display portion having a back surface and a display screen on a display surface opposite the display portion back surface, and a coupling portion that rotatably couples the main body portion and the display portion. In a closed state, the main body portion back surface and the display portion back surface may face each other and the electronic apparatus may be operable as a portable apparatus in which all of the display surface having the display screen except for a relatively small perimeter portion thereof may be usable as a display in at least a direction corresponding to the width thereof. In an open state, the electronic apparatus may be operable as a personal computer. | 03-03-2011 |
20120187452 | SEMICONDUCTOR ELEMENT - According to one embodiment, the semiconductor element includes a first semiconductor layer. The first semiconductor layer contains Al | 07-26-2012 |
20130240899 | NITRIDE SEMICONDUCTOR DEVICE - According to one embodiment a nitride semiconductor device includes a first, a second and a third semiconductor layer, a first and a second main electrode and a control electrode. The first layer made of a nitride semiconductor of a first conductivity type is provided on a substrate. The second layer made of a nitride semiconductor of a second conductivity type is provided on the first layer. The third layer made of a nitride semiconductor is provided on the second layer. The first electrode is electrically connected with the second layer. The second electrode is provided at a distance from the first electrode and electrically connected with the second layer. The control electrode is provided within a first trench via an insulating film. The first trench is disposed between the first and the second main electrodes, penetrates the third and the second layers, and reaches the first layer. | 09-19-2013 |
20130277763 | POWER SEMICONDUCTOR DEVICE - In general, according to one embodiment, a power semiconductor device includes a first pillar region, a second pillar region, and an epitaxial layer of a first conductivity type on a first semiconductor layer. The first pillar region is composed of a plurality of first pillar layers of a second conductivity type and a plurality of second pillar layers of the first conductivity type alternately arranged along a first direction. The second pillar region is adjacent to the first pillar region along the first direction and includes a third pillar layer of the second conductivity type, a fourth pillar layer of the first conductivity type, and a fifth pillar layer of the second conductivity type in this order along the first direction. A plurality of second base layers of the second conductivity type electrically connected, respectively, onto the third pillar layer and the fifth pillar layer and spaced from each other. | 10-24-2013 |
20140015044 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to an embodiment, a semiconductor device includes a second semiconductor layer provided on a first semiconductor layer and including first pillars and second pillars. A first control electrode is provided in a trench of the second semiconductor layer and a second control electrode is provided on the second semiconductor layer and connected to the first control electrode. A first semiconductor region is provided on a surface of the second semiconductor layer except for a portion under the second control electrode. A second semiconductor region is provided on a surface of the first semiconductor region, the second semiconductor region being apart from the portion under the second control electrode and a third semiconductor region is provided on the first semiconductor region. A first major electrode is connected electrically to the first semiconductor layer and a second major electrode is connected electrically to the second and the third semiconductor region. | 01-16-2014 |
20140070852 | POWER SEMICONDUCTOR DEVICE - According to one or more embodiments of the present invention, a power semiconductor device comprise a plurality of gate electrodes, first to third electrodes, and first to fifth semiconductor layers The second semiconductor layer is formed on the first semiconductor layer. A plurality of the third semiconductor layers are formed in the second semiconductor layer and arranged in a direction perpendicular to the stacking direction. The fourth semiconductor layer is formed on the second semiconductor layer. The fifth semiconductor layer is formed on the fourth semiconductor layer. The gate electrodes are formed above the second semiconductor layer and each gate electrode is arranged between the adjacent third semiconductor layers. The first electrodes are formed below the gate electrodes. One of the first electrodes is connected to the gate electrode. One of the first electrodes is connected to the third electrode. | 03-13-2014 |
20140084361 | POWER SEMICONDUCTOR DEVICE - A power semiconductor device includes first to fifth electrodes, first to sixth semiconductor layers, and several first pillar layers. The first semiconductor layer is formed on the first electrode. The second semiconductor layer is formed on the first semiconductor layer. Several first pillar layers are arranged parallel with the second semiconductor layer. The third and fourth semiconductor layers are formed on the second semiconductor layer. The fourth electrode is formed on the first pillar layer adjacent to the third semiconductor layer. The fifth electrode is formed on the first pillar layer adjacent to the fourth semiconductor layer. The concentration of dopant of the first pillar layer positioning between the first pillar layer under the fourth electrode and the first pillar layer under the fifth electrode is lower than the concentration of dopant of the first pillar layer under the fourth electrode and the first pillar layer under the fifth electrode. | 03-27-2014 |
20140103425 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor layer of a first conductivity type. A second semiconductor layer of a second conductivity type is on the first semiconductor layer. A third semiconductor layer is on the second semiconductor layer. A fourth semiconductor layer is selectively in the first semiconductor layer. A first trench and second trench penetrate from a surface of the third layer through the second layer to reach the first layer. An embedded electrode is in the first trench. A control electrode is above the embedded electrode via an insulating film. A lower end of the second trench is connected to the fourth semiconductor layer. A first main electrode is electrically connected to the first layer. A second main electrode is provided in the second trench. A Schottky junction is formed by the first layer and the second main electrode at a sidewall of the second trench. | 04-17-2014 |
20140167838 | POWER SEMICONDUCTOR DEVICE - According to one or more embodiments of the present invention, a method for driving a power semiconductor device that has a source electrode, a drain electrode, a semiconductor layer formed between the source electrode and the drain electrode, a plurality of gate electrodes formed within the semiconductor layer, and a plurality of conductive layers that are formed between the gate electrodes and the drain electrode and in electrical communication with the gate electrodes. The method comprises providing a first electric potential to the source electrode, providing a second electric potential to the drain electrode, providing a third electric potential to the gate electrodes, providing a first electric potential to at least one of the conductive layers, and providing a third electric potential to at least another one of the conductive layers. | 06-19-2014 |
20140246700 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a nitride semiconductor device includes a first semiconductor, a second semiconductor layer, a third semiconductor layer, a fourth semiconductor layer, a first electrode, a second electrode and a third electrode. The first, second and fourth semiconductor layers include a nitride semiconductor. The second semiconductor layer is provided on the first semiconductor layer, has a band gap not less than that of the first semiconductor layer. The third semiconductor layer is provided on the second semiconductor layer. The third semiconductor layer is GaN. The fourth semiconductor layer is provided on the third semiconductor layer to have an interspace on a part of the third semiconductor layer, has a band gap not less than that of the second semiconductor layer. The first electrode is provided on a portion of the third semiconductor layer. The fourth semiconductor layer is not provided on the portion. | 09-04-2014 |