Victor Y.
Victor Y. Lee, San Jose, CA US
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20110243848 | STAR POLYMERS, METHODS OF PREPARATION THEREOF, AND USES THEREOF - A composition of matter comprising an amphiphilic star polymer, the star polymer comprising a crosslinked microgel core and 6 or more independent polymer arms covalently linked to the core, the 6 or more arms each comprising a hydrophilic polymer chain segment and a hydrophobic polymer chain segment; wherein each individual metal selected from the group consisting of beryllium, magnesium, calcium, strontium, barium, radium, aluminum, gallium, indium, thallium, germanium, tin, lead, arsenic, antimony, bismuth, tellurium, polonium, and metals of Groups 3 to 12 of the Periodic Table has a concentration in the star polymer of greater than or equal to 0 parts per million and less than or equal to 100 parts per million. | 10-06-2011 |
20140370064 | FILM-FORMING COMPOSITIONS OF SELF-CROSSLINKABLE NANOGEL STAR POLYMERS - A film-forming composition comprises a solvent and unimolecular nanoparticles of a self-crosslinkable nanogel star polymer. The nanogel star polymer comprises i) a crosslinked polymer core (nanogel core) and ii) 6 or more independent polymer arms covalently linked to the core by respective first end groups. A plurality of the arms comprise reactive groups for effecting crosslinking of the nanoparticles. An essentially solvent-free film layer comprising the nanoparticles self-crosslinks, optionally assisted by subjecting the film layer to a thermal treatment and/or a photochemical treatment. A surface treated article comprising the crosslinked film layer can effectively inhibit growth of and/or kill Gram-negative microbes, Gram-positive microbes, fungi, and/or yeasts. | 12-18-2014 |
Victor Y. Lu, Hsinchu City TW
Patent application number | Description | Published |
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20150053550 | INSULATOR PLATE FOR METAL PLATING CONTROL - Among other things, one or more systems and techniques for promoting metal plating uniformity are provided. An insulator plate is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. The insulator plate comprises an insulator ring that provides a resistance to electrical plating current passing through the insulator ring to the semiconductor wafer. The insulator plate comprises one or more porous regions, such as holes, that introduce little to no additional resistance to electrical plating current passing through such porous regions to the semiconductor wafer. The insulator plate influences electrical plating current so that edge plating current has a current value similar to a center plating current. The similarity in plating current promotes metal plating uniformity for the semiconductor wafer. | 02-26-2015 |
20150053563 | MAGNETIC STRUCTURE FOR METAL PLATING CONTROL - Among other things, one or more systems and techniques for promoting metal plating profile uniformity are provided. A magnetic structure is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. In an embodiment, the magnetic structure applies a force that decreases an edge plating current by moving metal ions away from a wafer edge of the semiconductor wafer. In an embodiment, the magnetic structure applies a force that increases a center plating current by moving metal ions towards a center portion of the semiconductor wafer. In this way, the edge plating current has a current value that is similar to a current value of the center plating current. The similarity between the center plating current and the edge plating current promotes metal plating uniformity. | 02-26-2015 |
Victor Y. Lu, Foster City, CA US
Patent application number | Description | Published |
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20150107273 | Ultra High Vacuum Cryogenic Pumping Apparatus with Nanostructure Material - Cryogenic pump apparatuses include nanostructure material to achieve an ultra-high vacuum level. The nanostructure material can be mixed with either an adsorbent material or a fixed glue layer which is utilized to fix the adsorbent material. The nanostructure material's good thermal conductivity and adsorption properties help to lower working temperature and extend regeneration cycle of the cryogenic pumps. | 04-23-2015 |