Verheijden
Greja Verheijden, Riethoven NL
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20120091561 | MEMS DEVICES - A method of manufacturing a MEMS device comprises forming a MEMS device element ( | 04-19-2012 |
Greja Johanna Adriana Verheijden, Riethoven NL
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20110210435 | MEMS DEVICES - A method of manufacturing a MEMS device comprises forming a MEMS device element | 09-01-2011 |
Greja Johanna Adriana Maria Verheijden, Bc Riethoven NL
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20090267166 | METHOD OF MANUFACTURING A DEVICE WITH A CAVITY - The invention relates to a micro-device with a cavity ( | 10-29-2009 |
20100006957 | MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE - A method of packaging a micro electromechanical structure is disclosed. The method comprises the steps of forming the structure on a substrate, depositing a sacrificial layer over the structure, patterning the sacrificial layer, depositing a porous layer over the patterned sacrificial layer, removing the patterned sacrificial layer through the porous layer, treating the porous layer with a plasma and depositing a capping layer over the plasma-treated porous layer. The plasma treatment step ensures that the capping layer material cannot enter the cavity formed by the removal of the sacrificial layer through the porous layer. A device formed by this method is also disclosed. | 01-14-2010 |
20130069178 | Method of Manufacturing a Device with a Cavity - The invention relates to a micro-device with a cavity, the micro-device comprising a substrate, the method comprising steps of: A) providing the substrate, having a surface and comprising a sacrificial oxide region at the surface; B) covering the sacrificial oxide region with a porous layer being permeable to a vapor HF etchant, and C) selectively etching the sacrificial oxide region through the porous layer using the vapor HF etchant to obtain the cavity. This method may be used in the manufacture of various micro-devices with a cavity, i.e. MEMS devices, and in particular in the encapsulation part thereof, and semiconductor devices, and in particular the BEOL-part thereof. | 03-21-2013 |
Greja Johanna Adriana Maria Verheijden, Leuven BE
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20080315440 | Method of Manufacturing a Plurality of Semiconductor Devices and Carrier Substrate - Individual devices ( | 12-25-2008 |
Greja Johanna Adriana Maria Verheijden, Valkenswaard NL
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20110147944 | PLANARISING DAMASCENE STRUCTURES - Manufacturing a damascene structure involves: forming a sacrificial layer ( | 06-23-2011 |
Greja Johanna Adriana Maria Verheijden, Riethoven NL
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20110175178 | MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE - A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed. | 07-21-2011 |
20110186941 | DEVICE WITH MICROSTRUCTURE AND METHOD OF FORMING SUCH A DEVICE - Disclosed is a device comprising a substrate carrying a microscopic structure in a cavity capped by a capping layer including a material of formula SiN | 08-04-2011 |